A three-dimensional thermal analysis sensor

Abstract

The utility model relates to a kind of three-dimensional thermal analysis sensors, belong to thermal analysis technical field.The three-dimensional thermal analysis sensor, including: sequentially stacked setting bottom layer substrate, bottom thermoelectric layer, middle layer substrate, first thermoelectric layer and top layer substrate;Bottom thermoelectric layer includes two bottom thermoelectric piles, first thermoelectric layer includes two through holes and two first thermoelectric piles, and each first thermoelectric pile is respectively distributed in the periphery of one through hole of first thermoelectric layer;Top layer substrate includes two through holes;The two through holes of first thermoelectric layer and the two through holes of top layer substrate position correspond;And the two bottom thermoelectric piles of bottom thermoelectric layer also with the two through holes of first thermoelectric layer position correspond;Wherein, when measuring, to be measured crucible and empty crucible are placed on middle layer substrate, and are located in the through hole of first thermoelectric layer and top layer substrate. The three-dimensional thermal analysis sensor provides a kind of three-dimensional thermal distribution measurement mode, and then can improve thermal analysis sensor detection accuracy and thermal measurement efficiency.

Description

Technical Field

[0001] This utility model relates to the field of thermal analysis technology, and in particular to a three-dimensional thermal analysis sensor. Background Technology

[0002] Currently, differential scanning calorimetry (DSC) is widely used in polymer, pharmaceutical, metal, and ceramic fields. It can accurately measure the melting point, phase transition temperature, thermal effect (enthalpy change), and thermal stability of materials, providing key data support for materials research and process optimization.

[0003] Thermocouples, as the core component of differential scanning calorimeters, are used to detect the temperature difference between the sample and a reference object and convert it into a heat flow signal. Research on existing differential scanning calorimeters has revealed that their internal thermocouple structures typically employ thermocouples of different materials within the same insulating layer to detect the internal and external temperature differences. This approach suffers from drawbacks such as low accuracy and low detection sensitivity. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides a three-dimensional thermal analysis sensor.

[0005] In a first aspect, embodiments of this application provide a three-dimensional thermal analysis sensor, comprising a bottom substrate, a bottom thermoelectric layer, a middle substrate, a first thermoelectric layer, and a top substrate stacked sequentially; the bottom thermoelectric layer includes two bottom thermoelectric stacks, the first thermoelectric layer includes two through holes and two first thermoelectric stacks, and each first thermoelectric stack is distributed around one of the through holes of the first thermoelectric layer; the top substrate includes two through holes; the two through holes of the first thermoelectric layer correspond to the positions of the two through holes of the top substrate; and the two bottom thermoelectric stacks of the bottom thermoelectric layer also correspond to the positions of the two through holes of the first thermoelectric layer; the outermost edge of the bottom thermoelectric stack is aligned with the outermost edge of the corresponding first thermoelectric stack; wherein, during measurement, both the test crucible and the empty crucible are placed on the middle substrate and are located in the through holes of the first thermoelectric layer and the top substrate.

[0006] Optionally, the bottom thermopile is positioned such that when the crucible is placed on the middle substrate, the bottom thermopile is located directly below the crucible.

[0007] Optionally, the bottom thermoelectric layer includes: a bottom thermoelectric substrate; N thermocouple units of a first material, disposed through the bottom thermoelectric substrate; the first ends of the N thermocouple units of the first material are located on the first surface of the bottom thermoelectric substrate, and the second ends of the N thermocouple units of the first material are located on the second surface of the bottom thermoelectric substrate; N is a positive integer; N thermocouple units of a second material, disposed through the bottom thermoelectric substrate; the first ends of the N thermocouple units of the second material are located on the first surface of the bottom thermoelectric substrate, and the second ends of the N thermocouple units of the second material are located on the second surface of the bottom thermoelectric substrate; wherein, the N thermocouple units of the first material and the N thermocouple units of the second material are staggered, connected in series and radially reduced to form multiple concentric circles with different radii; for the thermocouple units in the middle of the series connection: the first end of each thermocouple unit of the first material is connected to the first end of an adjacent thermocouple unit of the second material, and the second end of each thermocouple unit of the first material is connected to the second end of another adjacent thermocouple unit of the second material.

[0008] Optionally, the circumferential directions between two adjacent concentric circles are opposite; one end of the outermost concentric circle is used to connect to the first pin; one end of the innermost concentric circle extends radially to the outermost concentric circle and is used to connect to the second pin, so that the first pin and the second pin are adjacent.

[0009] Optionally, the first thermoelectric layer includes a third substrate and a fourth substrate; the third substrate includes N thermocouple units of a first material; the N thermocouple units of the first material are arranged in a ring and spaced apart; each thermocouple unit of the first material includes a first end and a second end; N is a positive integer; the fourth substrate includes N thermocouple units of a second material; the N thermocouple units of the second material are arranged in a ring and spaced apart; each thermocouple unit of the second material includes a first end and a second end; wherein, the first end of each thermocouple unit of the first material is connected to the first end of a thermocouple unit of the second material through a metal post, and the second end of each thermocouple unit of the first material is connected to the second end of another thermocouple unit of the second material through a metal post, so that the thermocouple units of the first material on the third substrate and the thermocouple units of the second material on the fourth substrate are connected in series; N pairs of thermocouples form the first thermoelectric stack.

[0010] Optionally, the bottom thermoelectric layer includes a first substrate and a second substrate stacked sequentially; the first substrate includes N thermocouple units of a first material; the N thermocouple units of the first material are arranged in a ring and spaced apart; each thermocouple unit of the first material includes a first end and a second end; N is a positive integer; the second substrate includes N thermocouple units of a second material; the N thermocouple units of the second material are arranged in a ring and spaced apart; each thermocouple unit of the second material includes a first end and a second end; wherein, the first end of each thermocouple unit of the first material is connected to the first end of a thermocouple unit of the second material through a metal post, and the second end of each thermocouple unit of the first material is connected to the second end of another thermocouple unit of the second material through a metal post, so that the thermocouple units of the first material on the first substrate and the thermocouple units of the second material on the second substrate are connected in series sequentially; N pairs of thermocouples form the bottom thermoelectric stack.

[0011] Optionally, the first thermoelectric layer includes a third substrate and a fourth substrate; the third substrate includes N thermocouple units of a first material; the N thermocouple units of the first material are arranged in a ring and spaced apart; each thermocouple unit of the first material includes a first end and a second end; N is a positive integer; the fourth substrate includes N thermocouple units of a second material; the N thermocouple units of the second material are arranged in a ring and spaced apart; each thermocouple unit of the second material includes a first end and a second end; wherein, the first end of each thermocouple unit of the first material is connected to the first end of a thermocouple unit of the second material through a metal post, and the second end of each thermocouple unit of the first material is connected to the second end of another thermocouple unit of the second material through a metal post, so that the thermocouple units of the first material on the third substrate and the thermocouple units of the second material on the fourth substrate are connected in series; N pairs of thermocouples form the first thermoelectric stack.

[0012] Optionally, the positional relationship between the first thermopile and the bottom thermopile satisfies the following condition: the individual thermocouples in the first thermopile are inserted into the thermocouples in the bottom thermopile.

[0013] Optionally, the three-dimensional thermal analysis sensor further includes a second thermoelectric layer; the second thermoelectric layer is disposed between the first thermoelectric layer and the top substrate; the second thermoelectric layer includes two through holes and two second thermoelectric stacks, and each second thermoelectric stack is distributed around one of the through holes of the second thermoelectric layer; the two through holes of the second thermoelectric layer correspond to the positions of the two through holes of the first thermoelectric layer.

[0014] Optionally, the three-dimensional thermal analysis sensor further includes a temperature sensing layer; the temperature sensing layer is stacked between the bottom substrate and the bottom thermoelectric layer.

[0015] The beneficial effects of this utility model include: This application provides a three-dimensional thermal analysis sensor configured with a two-layer thermopile structure. When a crucible is placed on a middle substrate, the first thermopile of the first thermopile layer is distributed around the crucible, while the bottom thermopile of the bottom thermopile layer is distributed at the bottom of the crucible. This allows the sidewall and bottom thermopiles to simultaneously measure the temperature distribution of the crucible. For example, the bottom thermopile can measure the temperature distribution in different areas, and the first thermopile can measure the temperature distribution at different depths. This enables three-dimensional sensing of the heat source gradient (including temperature differences in the vertical and horizontal directions). In other words, this three-dimensional thermal analysis sensor provides a method for measuring three-dimensional heat distribution, thereby improving the detection accuracy and thermal measurement efficiency of the thermal analysis sensor. Simultaneously, the groove-shaped measurement area reduces heat diffusion loss, making it easier for the sidewall thermopile to capture heat flow conducted along the groove wall, thus improving the overall performance of the three-dimensional thermal analysis sensor.

[0016] Secondly, in this application, the positions of the bottom thermopile and the first thermopile are aligned such that the outermost edge of the bottom thermopile is aligned with the outermost edge of the first thermopile. This ensures that the edge coverage of the bottom thermopile and the first thermopile on the sidewall is consistent after alignment, and that the temperature difference detection range in the vertical direction (sidewall and bottom) is consistent, forming a continuous closed loop and ensuring the consistency of thermal field measurement. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the first three-dimensional thermal analysis sensor provided in the embodiments of this application; Figure 2 This is a schematic diagram of the structure of the second type of three-dimensional thermal analysis sensor provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the first bottom thermoelectric layer provided in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of the first bottom thermopile provided in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the second bottom thermoelectric layer provided in the embodiments of this application; Figure 6 This is a schematic diagram of the structure of the second type of bottom thermopile provided in the embodiments of this application; Figure 7 A plan view of the second type of bottom thermopile provided in the embodiments of this application; Figure 8 This is a schematic diagram of the structure of a first thermoelectric layer provided in an embodiment of this application; Figure 9 This is a schematic diagram of the structure of a first thermopile provided in an embodiment of this application; Figure 10This is a schematic diagram of another first thermoelectric layer structure provided in an embodiment of this application; Figure 11 This is a schematic diagram of the structure of the third type of three-dimensional thermal analysis sensor provided in the embodiments of this application; Figure 12 This is a schematic diagram of the structure of a second thermoelectric layer provided in an embodiment of this application; Figure 13 This is a schematic diagram of the structure of the fourth three-dimensional thermal analysis sensor provided in the embodiments of this application; Figure 14 This is a schematic diagram of the structure of the temperature sensing layer provided in the embodiments of this application; Figure 15 This is a planar schematic diagram of a substrate provided in an embodiment of this application; Figure 16 This is a plan view of a temperature measuring layer provided in an embodiment of this application; Figure 17 This is a planar schematic diagram of a second substrate provided in an embodiment of this application; Figure 18 This is a planar schematic diagram of a first substrate provided in an embodiment of this application; Figure 19 A planar schematic diagram of a middle layer substrate provided in an embodiment of this application; Figure 20 A planar schematic diagram of a fourth substrate provided in an embodiment of this application; Figure 21 This is a planar schematic diagram of a third substrate provided in an embodiment of this application; Figure 22 A planar schematic diagram of a sixth substrate provided in an embodiment of this application; Figure 23 A planar schematic diagram of a fifth substrate provided in an embodiment of this application; Figure 24 This is a planar schematic diagram of a top substrate provided in an embodiment of this application.

[0018] Figure label: 100 - Three-dimensional thermal analysis sensor; 10 - Bottom substrate; 101 - First pin; 102 - Second pin; 20 - Bottom thermoelectric layer; 21 - Bottom thermopile; 22 - First substrate; 23 - Second substrate; 24 - Bottom thermoelectric substrate; 30 - Middle substrate; 40 - First thermoelectric layer; 41 - First thermopile; 42 - Third substrate; 43 - Fourth substrate; 44 - Sub-substrate; 50 - Top substrate; 60 - Second thermoelectric layer; 61 - Second thermopile; 62 - Fifth substrate; 63 - Sixth substrate; 70 - Temperature sensing layer; 71 - Temperature sensing metal area; 200 - Thermocouple unit of first material; 300 - Thermocouple unit of second material; 400 - Metal pillar. Detailed Implementation

[0019] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application can also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0020] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] Research on existing differential scanning calorimeters has revealed that their internal thermocouple structures are typically arranged with thermocouples of different materials in the same insulation layer to detect the temperature difference between the inside and outside. This results in shortcomings such as low accuracy and low detection sensitivity.

[0022] In view of the above problems, this application proposes the following embodiments to solve the above technical problems.

[0023] Please see Figures 1-2 This application provides a three-dimensional thermal analysis sensor 100, including: a bottom substrate 10, a bottom thermoelectric layer 20, a middle substrate 30, a first thermoelectric layer 40 and a top substrate 50 stacked sequentially.

[0024] The bottom thermoelectric layer 20 includes two bottom thermopile 21. The first thermoelectric layer 40 includes two through holes and two first thermopile 41, with each first thermopile 41 distributed around one of the through holes in the first thermoelectric layer 40. The top substrate 50 includes two through holes. The two through holes in the first thermoelectric layer 40 correspond to the positions of the two through holes in the top substrate 50. The two bottom thermopile 21 in the bottom thermoelectric layer 20 also correspond to the positions of the two through holes in the first thermoelectric layer 40.

[0025] This can be understood as follows: the three-dimensional thermal analysis sensor 100 has two recesses in its layout (corresponding to two through holes connecting the first thermoelectric layer 40 and the top substrate 50). These two recesses correspond to the sample measurement area and the reference area of ​​the three-dimensional thermal analysis sensor 100, respectively. The sample measurement area has a first thermopile 41 on its side and a bottom thermopile 21 on its bottom. Correspondingly, the reference area also has a first thermopile 41 on its side and a bottom thermopile 21 on its bottom.

[0026] In this embodiment, both the bottom thermopile 21 and the first thermopile 41 are composed of multiple pairs of thermocouples. During measurement, both the test crucible and the empty crucible are placed on the middle substrate 30 and are located in the through-holes of the first thermoelectric layer 40 and the top substrate 50. This results in one large through-hole (comprising a through-hole at the same position in the first thermoelectric layer 40 and the top substrate 50) corresponding to the sample measurement area, while the other large through-hole (comprising another through-hole at the same position in the first thermoelectric layer 40 and the top substrate 50) corresponds to the reference area, and the two large through-holes are symmetrically distributed.

[0027] In this embodiment of the application, the positions of the bottom thermopile 21 and the first thermopile 41 are such that the outermost edge of the bottom thermopile 21 is aligned with the outermost edge of the first thermopile 41.

[0028] In actual measurement operations, the sample is placed in the crucible to be tested, and then the crucible to be tested is placed in the sample measurement area. After placing the empty crucible in the reference area, the measurement can begin.

[0029] Considering that existing thermal analysis sensors can only detect the temperature difference between the inside and outside at the bottom, which suffers from low accuracy and low detection sensitivity, this application provides a three-dimensional thermal analysis sensor 100 configured as a two-layer thermopile structure. When the crucible is placed on the middle substrate 30, the first thermopile 41 of the first thermoelectric layer 40 is distributed around the crucible, while the bottom thermopile 21 of the bottom thermoelectric layer 20 is distributed at the bottom of the crucible. This allows the thermopile on the sidewalls and the bottom to simultaneously measure the temperature distribution of the crucible. For example, the bottom thermopile 21 can measure the temperature distribution in different areas, and the first thermopile 41 can measure the temperature distribution at different depths. This enables three-dimensional perception of the heat source gradient (including temperature differences in the vertical and horizontal directions). In other words, this three-dimensional thermal analysis sensor 100 provides a three-dimensional heat distribution measurement method, thereby improving the detection accuracy and thermal measurement efficiency of the thermal analysis sensor. Meanwhile, the measurement area in the form of a groove can reduce heat loss through diffusion, making it easier for the sidewall thermopile to capture the heat flow conducted along the groove wall, thereby improving the overall performance of the three-dimensional thermal analysis sensor 100.

[0030] Secondly, in this embodiment, the positions of the bottom thermopile 21 and the first thermopile 41 are such that the outermost edge of the bottom thermopile 21 is aligned with the outermost edge of the first thermopile 41, thereby making the edge coverage of the bottom thermopile 21 and the first thermopile 41 on the sidewall consistent after alignment, so that the temperature difference detection range in the vertical direction (sidewall and bottom) is consistent, forming a continuous closed loop and ensuring the consistency of thermal field measurement.

[0031] Optionally, in one embodiment, the bottom thermopile 21 is positioned such that when the crucible is placed on the middle substrate 30, the bottom thermopile 21 is located directly below the crucible.

[0032] It should be noted that the core function of the bottom thermoelectric layer 20 is to detect the temperature distribution at the bottom of the crucible. Heat is preferentially conducted vertically downwards through the bottom of the crucible, forming a heat flow path centered on the crucible's center. When the bottom thermopile 21 is located directly below the crucible, it can be directly aligned with the main channel of this heat flow path, avoiding diffusion losses caused by path deviation. This allows the bottom thermopile 21 to capture thermal signals more efficiently, enhance the thermoelectric potential output intensity, and thus improve the sensitivity of thermal measurements.

[0033] The structure of the bottom thermoelectric layer 20 is described below.

[0034] In the first implementation, please refer to Figure 3 and Figure 4 The bottom thermoelectric layer 20 includes a first substrate 22 and a second substrate 23 stacked sequentially.

[0035] The first substrate 22 includes N thermocouple units 200 of a first material. The N thermocouple units 200 of the first material are arranged in a ring and spaced apart; each thermocouple unit 200 of the first material includes a first end and a second end; N is a positive integer. N can be set according to the standard, size and structure of the required three-dimensional thermal analysis sensor 100, such as N can be 17, 30, etc., which is not limited here.

[0036] The second substrate 23 includes N thermocouple units 300 made of a second material. The N thermocouple units 300 made of the second material are arranged in a ring and spaced apart; each thermocouple unit 300 made of the second material includes a first end and a second end.

[0037] In this configuration, the first end of each thermocouple unit 200 of the first material is connected to the first end of a thermocouple unit 300 of the second material via a metal post 400, and the second end of each thermocouple unit 200 of the first material is connected to the second end of another thermocouple unit 300 of the second material via a metal post 400, so that the thermocouple units 200 of the first material on the first substrate 22 and the thermocouple units 300 of the second material on the second substrate 23 are connected in series; N pairs of thermocouples form a bottom thermopile 21.

[0038] It should be noted that the thermocouple unit 200 of the first material has the same structure as the thermocouple unit 300 of the second material. Taking the thermocouple unit 200 of the first material as an example, it has an overall elongated structure with a first end and a second end, which are the two ends of the elongated structure. Since the thermocouple units 200 of the first material are arranged in a ring and spaced apart, the first ends of N thermocouple units 200 of the first material form an inner circle, and the second ends of N thermocouple units 200 of the first material form an outer circle.

[0039] Then, the first end of each thermocouple unit 200 of the first material is connected to the first end of a thermocouple unit 300 of the second material via a metal post 400, and the second end of each thermocouple unit 200 of the first material is connected to the second end of another thermocouple unit 300 of the second material via a metal post 400, so that the thermocouple units 200 of the first material on the first substrate 22 and the thermocouple units 300 of the second material on the second substrate 23 are connected in series. The first ends of N thermocouple units 200 of the first material and the first ends of N thermocouple units 300 of the second material form an inner thermoelectric junction. The second ends of N thermocouple units 200 of the first material and the second ends of N thermocouple units 300 of the second material form an outer thermoelectric junction. Adjacent thermocouple units 200 of the first material and thermocouple units 300 of the second material constitute a pair of thermocouples (in a V-shape); N pairs of thermocouples form a bottom thermopile 21.

[0040] This can be understood as the bottom thermopile 21 being formed by 2N thermocouples arranged alternately in series, with the overall arrangement being a ring.

[0041] Because the bottom thermopile 21 adopts an inner and outer circular distribution structure, the inner thermoelectric junctions are more concentrated and denser, thus enhancing the intensity of the detected heat flow signal and effectively measuring the temperature difference in the inner and outer directions. Simultaneously, the bottom thermopile 21 employs a staggered vertical distribution, with thermocouples of the same material located only on the same insulating plate, and thermocouples of different materials connected vertically by metal pillars 400. This staggered distribution of the bottom thermopile 21 enables effective measurement of temperature differences in the vertical direction. For example, for any thermocouple 200 of the first material, the thermocouple structure can measure the temperature difference between the first end of the first material thermocouple 200 and the second end of the second material thermocouple 300 connected to the second end of the first material thermocouple 200. This method, by sensing vertical heat flow, further expands the measurement area, making the thermoelectric signal more prominent and the response more sensitive. In other words, the bottom thermopile 21 itself can also vertically sense temperature and perform effective measurement.

[0042] In the second implementation, please refer to Figures 5-6 Optionally, the bottom thermoelectric layer 20 may include a bottom thermoelectric substrate 24.

[0043] N thermocouple units 200 of the first material are disposed through the bottom thermoelectric substrate 24. The first ends of the N thermocouple units 200 of the first material are located on the first surface of the bottom thermoelectric substrate 24, and the second ends of the N thermocouple units 200 of the first material are located on the second surface of the bottom thermoelectric substrate 24; N is a positive integer.

[0044] N thermocouple units 300 of the second material are disposed through the bottom thermoelectric substrate 24; the first end of the N thermocouple units 300 of the second material is located on the first surface of the bottom thermoelectric substrate 24, and the second end of the N thermocouple units 300 of the second material is located on the second surface of the bottom thermoelectric substrate 24.

[0045] Among them, N thermocouple units 200 of the first material and N thermocouple units 300 of the second material are arranged alternately, connected in series and forming multiple concentric circles with different radii by reducing the range radially.

[0046] like Figure 6 and Figure 7 As shown, six concentric circles of different diameters are formed from the outside to the inside.

[0047] For the thermocouple units in the middle of the series connection: the first end of each thermocouple unit 200 of the first material is connected to the first end of an adjacent thermocouple unit 300 of the second material, and the second end of each thermocouple unit 200 of the first material is connected to the second end of another adjacent thermocouple unit 300 of the second material.

[0048] It can be understood that, for any thermocouple unit 200 of the first material, the thermocouple unit 300 of the second material connected to its first end is different from the thermocouple unit 300 of the second material connected to its second end, so that thermocouple units of different materials are arranged in an alternating manner and connected in series.

[0049] It should be noted that the adjacent thermocouple units 200 of the first material and the thermocouple units 300 of the second material constitute a pair of thermocouples, thereby making the three-dimensional thermal analysis sensor 100 include N pairs of thermocouples, and the N pairs of thermocouples form the bottom thermopile 21.

[0050] In the specific measurement application of the three-dimensional thermal analysis sensor 100, the first surface of its bottom thermoelectric substrate 24 is positioned closer to the crucible. The first ends of two connected thermocouple units on the first surface of the bottom thermoelectric substrate 24 form an upper surface thermoelectric junction; that is, the first surface of the bottom thermoelectric substrate 24 includes N upper surface thermoelectric junctions. The second ends of two connected thermocouple units on the second surface of the bottom thermoelectric substrate 24 form a lower surface thermoelectric junction; that is, the second surface of the bottom thermoelectric substrate 24 includes N lower surface thermoelectric junctions. It can be understood that the two thermoelectric junctions of N pairs of thermocouples are respectively distributed on the upper and lower surfaces of the bottom thermoelectric substrate 24, thus enabling measurement when a temperature difference exists between the two surfaces, resulting in a thermoelectric potential.

[0051] That is, the bottom thermopile 21 provides a method for sensing and detecting the temperature difference between the upper and lower surfaces. Measurement is achieved by detecting the overall temperature difference between the two surfaces. This method, by detecting the temperature difference between the upper and lower surfaces, better aligns with the heat transfer direction of the sample reaction within the crucible, improving measurement accuracy. Simultaneously, the arrangement of the upper and lower thermocouples significantly increases the density of the thermocouples compared to traditional methods using thermocouples on the same plane. This allows the upper surface to more completely capture the heat released by the sample reaction within the crucible, thereby improving the thermoelectric conversion coefficient of the heat flow measurement. Furthermore, this embodiment provides a through-type thermocouple structure, which reduces the thermal measurement time constant. The bottom thermopile 21 can capture transient temperature changes more quickly, detecting smaller temperature differences per unit time, thus improving thermal resolution and detection sensitivity.

[0052] Optionally, in one embodiment, the circumferential directions between two adjacent concentric circles are opposite; one end of the outermost concentric circle is used to connect to the first pin 101; one end of the innermost concentric circle extends radially to the outermost concentric circle and is used to connect to the second pin 102, so that the first pin 101 and the second pin 102 are adjacent.

[0053] The directions of rotation include clockwise and counterclockwise, such as... Figure 7 As shown, for example, assuming the first pin 101 is the starting point of the connection, the outermost concentric circle rotates counterclockwise, and then turns radially at the end point to enter the second concentric circle. The second concentric circle rotates clockwise, and so on, until the connection forms the innermost concentric circle.

[0054] It should be noted that in this embodiment, the circumferential directions between two adjacent concentric circles are opposite; one end of the outermost concentric circle is used to connect to the first pin 101; one end of the innermost concentric circle extends radially to the outermost concentric circle and is used to connect to the second pin 102, making the first pin 101 and the second pin 102 adjacent. This method optimizes space utilization and integration convenience, enabling high-density integration. It also ensures that the first and second pins are adjacent, significantly shortening the physical distance between pins, reducing line loss during signal transmission, facilitating subsequent circuit connections, and reducing the complexity of system-level integration.

[0055] Optionally, at least two thermocouple units are included between one end of the innermost concentric circle and the second pin 102.

[0056] By setting at least two thermocouple units between one end of the innermost concentric circle and the second pin 102, the entire measurement area can be covered more comprehensively, thereby sensing the temperature changes of the entire measurement area more comprehensively, avoiding measurement errors caused by local blind spots, and improving the spatial uniformity of thermal response.

[0057] In one embodiment, the number of thermocouple units between one end of the innermost concentric circle and the second pin 102 is the same as the number of concentric circles.

[0058] By matching the number of thermocouple units between one end of the innermost concentric circle and the second pin 102 to the number of concentric circles, the path from the innermost concentric circle to the second pin 102 forms a strict symmetrical relationship with the layered structure of each concentric circle. The symmetrical structure avoids local blind spots caused by uneven distribution of thermocouple units, ensuring that the pin connection path can uniformly capture the heat signal transmitted by each layer. The symmetrical heat signal transmission path allows the temperature difference response of each layer to reach the pin synchronously, further improving the spatial uniformity of the thermal response.

[0059] Optionally, the bottom thermoelectric substrate 24 is a hollow structure or a partially hollow structure.

[0060] It should be noted that the hollow or partially hollow structure can reduce the heat capacity of the bottom thermoelectric substrate 24, thereby reducing the heat conduction path inside the bottom thermoelectric substrate 24 and improving the ability to capture transient temperature differences. Specifically, when the sample inside the crucible undergoes transient thermal changes (such as rapid heating or phase change), the heat does not need to overcome the thermal inertia of the bottom thermoelectric substrate 24 and can be directly and quickly transferred to the thermocouple unit that runs through it, thereby further shortening the thermal measurement time constant and allowing the sensor to respond more sensitively to the instantaneous temperature difference changes of the sample.

[0061] Optionally, the thickness of the bottom thermoelectric substrate 24 is M millimeters; M is a positive number; the range of M is 0.3~1.2.

[0062] It should be noted that setting the thickness of the bottom thermoelectric substrate 24 to 0.3 mm to 1.2 mm can make the temperature difference between the upper surface (close to the heat source) and the lower surface (away from the heat source) of the bottom thermoelectric substrate 24 significant, thereby improving the sensitivity of differential measurement. In other words, it can achieve a significant temperature difference between the upper and lower surfaces, thus enhancing the signal output.

[0063] Please see Figures 8-9 Optionally, the first thermoelectric layer 40 includes a third substrate 42 and a fourth substrate 43. The third substrate 42 includes N thermocouple units 200 of a first material; the N thermocouple units 200 of the first material are arranged in a ring and spaced apart; each thermocouple unit 200 of the first material includes a first end and a second end; N is a positive integer. The fourth substrate 43 includes N thermocouple units 300 of a second material; the N thermocouple units 300 of the second material are arranged in a ring and spaced apart; each thermocouple unit 300 of the second material includes a first end and a second end; wherein, the first end of each thermocouple unit 200 of the first material is connected to the first end of a thermocouple unit 300 of the second material through a metal post 400, and the second end of each thermocouple unit 200 of the first material is connected to the second end of another thermocouple unit 300 of the second material through a metal post 400, so that the thermocouple units 200 of the first material on the third substrate 42 and the thermocouple units 300 of the second material on the fourth substrate 43 are connected in series; N pairs of thermocouples form a first thermopile 41.

[0064] It should be noted that the first thermopile 41 composed of the third substrate 42 and the fourth substrate 43 has a similar structure to the bottom thermopile 21 composed of the first substrate 22 and the second substrate 23, the difference being their overall size and distribution. The bottom thermopile 21 composed of the first substrate 22 and the second substrate 23 has a larger overall structure and is used for measurement at the bottom of the crucible. The first thermopile 41 composed of the third substrate 42 and the fourth substrate 43 is smaller overall, distributed around the through-hole, and used for measurement on the sidewall of the crucible. Therefore, the structural similarities between the first thermopile 41 composed of the third substrate 42 and the fourth substrate 43 and the bottom thermopile 21 composed of the first substrate 22 and the second substrate 23 can be referred to interchangeably, and will not be elaborated further here.

[0065] In one embodiment, the three-dimensional thermal analysis sensor 100 provided in this application adopts... Figure 8 The first thermopile 41 shown and as shown Figure 5 The bottom thermopile 21 is shown.

[0066] That is, in this embodiment, the first thermopile 41 and the bottom thermopile 21 are configured with different structures. The heat flow at the bottom of the crucible is mainly vertically downward, while the heat flow on the sidewall is mainly radial diffusion and depth conduction. The differential structure of the bottom thermopile 21 can directly detect the temperature difference between the upper and lower surfaces caused by the vertical heat flow, accurately capturing subtle changes in the vertical heat flow and avoiding signal loss caused by the horizontal diffusion of heat flow. The independent structure of the first thermopile 41 on the sidewall can form a ring detection zone around the sidewall of the crucible, adapting to the diffusion law of the radial heat flow on the sidewall and reducing heat loss due to diffusion. Through structural differentiation, the two are matched with the heat transfer characteristics of the bottom and the sidewall respectively, maximizing the heat flow capture efficiency.

[0067] In another embodiment, the three-dimensional thermal analysis sensor 100 provided in this application uses... Figure 8 The first thermopile 41 shown and as shown Figure 3 The bottom thermopile 21 is shown.

[0068] That is, in this embodiment of the application, the first thermopile 41 and the bottom thermopile 21 are configured with similar structures. This approach can achieve a unified processing flow, ensure consistent thermoelectric performance, and the annular arrangement of the same structure allows for a more matched heat flow capture range.

[0069] Based on this, the positional relationship between the first thermopile 41 and the bottom thermopile 21 can satisfy the following: the thermocouples in the first thermopile 41 are inserted into the thermocouples in the bottom thermopile 21.

[0070] That is, the thermocouples in the first thermopile 41 do not overlap with the thermocouples in the bottom thermopile 21, but are spaced apart.

[0071] The thermocouple units of the bottom thermopile 21 are arranged in a ring-shaped interval, and the interval area is easy to become the missed area of ​​bottom heat flow; while the thermocouple units of the first thermopile 41 are inserted in these intervals, which can cover the area not reached by the bottom thermopile in the vertical direction, forming a three-dimensional detection network, avoiding the three-dimensional thermal field reconstruction deviation caused by the failure to capture local heat flow.

[0072] Meanwhile, the bottom thermopile 21 and the first thermopile 41 are located on both sides of the middle substrate 30, respectively. The slot arrangement makes the thermopile structure on the upper and lower sides of the middle substrate 30 more symmetrical, avoiding heat loss due to gaps.

[0073] Please see Figure 10 Optionally, the first thermoelectric layer 40 may also include Q sub-substrates 44.

[0074] Q is a positive integer greater than 1, such as Figure 9In this context, the value of Q is 2. Q sub-substrates 44 are disposed between the third substrate 42 and the fourth substrate 43, and each metal pillar passes through the Q sub-substrates 44.

[0075] By increasing the distance between the third substrate 42 and the fourth substrate 43, the depth of thermal measurement can be increased. In this way, the measurement of temperature difference in the vertical direction can be further improved, and a larger temperature difference change can be sensed.

[0076] Please see Figure 11 Optionally, the three-dimensional thermal analysis sensor 100 also includes a second thermoelectric layer 60.

[0077] The second thermoelectric layer 60 is disposed between the first thermoelectric layer 40 and the top substrate 50.

[0078] The second thermoelectric layer 60 includes two through holes and two second thermoelectric stacks 61, with each second thermoelectric stack 61 distributed around one of the through holes of the second thermoelectric layer 60; the two through holes of the second thermoelectric layer 60 correspond to the positions of the two through holes of the first thermoelectric layer 40.

[0079] It should be noted that the structure of the second thermoelectric layer 60 can be referred to the structural description of the first thermoelectric layer 40, and will not be repeated here.

[0080] In this embodiment, by adding an additional second thermoelectric layer 60 in the depth direction, effective thermal measurements can be performed at different depth locations along the crucible sidewall, further improving the accuracy of three-dimensional thermal measurements.

[0081] Please see Figure 12 Optionally, the second thermoelectric layer 60 includes a fifth substrate 62 and a sixth substrate 63 stacked sequentially.

[0082] The fifth substrate 62 includes N thermocouple units of a first material; the N thermocouple units of the first material are arranged in a ring and spaced apart; each thermocouple unit of the first material includes a first end and a second end; N is a positive integer; the sixth substrate includes N thermocouple units of a second material; the N thermocouple units of the second material are arranged in a ring and spaced apart; each thermocouple unit of the second material includes a first end and a second end; wherein, the first end of each thermocouple unit of the first material is connected to the first end of a thermocouple unit of the second material through a metal post, and the second end of each thermocouple unit of the first material is connected to the second end of another thermocouple unit of the second material through a metal post, so that the thermocouple units of the first material on the fifth substrate and the thermocouple units of the second material on the sixth substrate are connected in series; N pairs of thermocouples form a second thermopile 61.

[0083] It should be noted that the second thermopile 61, composed of the fifth substrate 62 and the sixth substrate 63, has the same structure as the first thermopile 41, composed of the third substrate 42 and the fourth substrate 43. Therefore, the same parts can be referred to each other, and will not be described in detail here.

[0084] Please see Figure 13 Optionally, the three-dimensional thermal analysis sensor 100 also includes a temperature sensing layer 70. The temperature sensing layer 70 is stacked between the bottom substrate 10 and the bottom thermoelectric layer 20. The temperature sensing layer 70 is used for temperature measurement.

[0085] Please see Figure 14 Optionally, the temperature sensing layer 70 includes two temperature sensing metal regions 71, and the metal in the temperature sensing metal regions is platinum. Of course, other metals may be used in other embodiments, and this is not limited here.

[0086] It should be noted that the thermocouple monomer 200 of the first material and the thermocouple monomer 300 of the second material in this embodiment are two thermocouple monomers made of different materials. In one embodiment, the first material is gold-platinum-palladium, and the second material is gold. Adjacent thermocouple monomers 200 of the first material and thermocouple monomers 300 of the second material can be connected by gold.

[0087] In addition, in this embodiment, the bottom substrate 10, the first substrate 22, the second substrate 23, the middle substrate 30, the third substrate 42, the fourth substrate 43, the sub-substrate 44, the second thermoelectric layer 60, the fifth substrate 62, the sixth substrate 63, and the temperature sensing layer 70 can all be single-layer insulating substrates. The insulating substrate can be a ceramic plate, specifically a co-fired high-temperature resistant ceramic sheet. Of course, this is not a limitation; other high-temperature resistant insulating materials can also be used. Furthermore, the bottom substrate 10, the first substrate 22, the second substrate 23, the middle substrate 30, the third substrate 42, the fourth substrate 43, the sub-substrate 44, the second thermoelectric layer 60, the fifth substrate 62, the sixth substrate 63, and the temperature sensing layer 70 can all be circular in shape.

[0088] Please see Figures 15-24 As an example of a complete three-dimensional thermal analysis sensor 100, it includes 10 layers of insulating substrate.

[0089] A three-dimensional sensor is realized using a multilayer insulating substrate stacking technology. From bottom to top, the insulating layers are as follows: the first layer is the insulating bottom layer (corresponding to the bottom substrate 10), the second layer is a platinum layer (corresponding to the temperature sensing layer 70), the third and fourth layers are calorimetric sensor layers (the third layer corresponds to the second substrate 23, and the fourth layer corresponds to the first substrate 22), the fifth layer is an insulating separator layer (corresponding to the middle substrate 30), the sixth to ninth layers are calorimetric sensor layers (the sixth layer corresponds to the fourth substrate 43, the seventh layer corresponds to the third substrate 42, the eighth layer corresponds to the sixth substrate 63, and the ninth layer corresponds to the fifth substrate 62), and the tenth layer is the top insulating layer (corresponding to the top substrate 50).

[0090] The insulating substrate is circular in shape, with two symmetrically distributed regions on its surface: the sample region and the reference region.

[0091] The second layer consists of a platinum layer coated on an insulating substrate, symmetrically distributed in the sample and reference regions.

[0092] The third layer consists of a gold-platinum-palladium metal paste coated onto an insulating substrate, symmetrically distributed in the sample and reference regions. Metal rings are distributed on the surface of the insulating substrate.

[0093] The fourth layer consists of a gold paste deposited on an insulating substrate, symmetrically distributed in the sample and reference regions. The metal rings are distributed on the surface of the insulating substrate. Holes are made at the endpoints of the inner ring of the metal layer on the insulating substrate, and gold paste is poured in to connect with the corresponding third layer of gold, platinum, and palladium, forming an inner ring thermoelectric junction. Holes are also made at the endpoints of the outer ring of the metal layer on the insulating substrate, and gold paste is poured in to connect with the corresponding third layer of gold, platinum, and palladium, forming an outer ring thermoelectric junction.

[0094] The fifth layer is an insulating substrate that protects the surface metal of the fourth layer.

[0095] The sixth layer is a metal paste gold coated on an insulating substrate, symmetrically distributed in the sample area and the reference area.

[0096] The seventh layer consists of a gold-platinum-palladium metal paste coated onto an insulating substrate, symmetrically distributed in the sample and reference regions. The metal rings are distributed on the surface of the insulating substrate. Holes are made at the endpoints of the inner ring of the metal layer on the insulating substrate, and gold metal paste is poured in, connecting to the corresponding gold layer of the sixth layer to form an inner ring thermoelectric junction. Holes are also made at the endpoints of the outer ring of the metal layer on the insulating substrate, and gold metal paste is poured in, connecting to the corresponding gold layer of the sixth layer to form an outer ring thermoelectric junction.

[0097] The eighth layer consists of a gold-platinum-palladium metal paste coated on an insulating substrate, symmetrically distributed in the sample and reference regions.

[0098] The ninth layer consists of a gold paste deposited on an insulating substrate, symmetrically distributed in the sample and reference regions. The metal rings are distributed on the surface of the insulating substrate. Holes are made at the endpoints of the inner ring of the metal layer on the insulating substrate, and gold paste is poured in to connect with the corresponding gold-platinum-palladium layer (the eighth layer), forming an inner ring thermoelectric junction. Holes are also made at the endpoints of the outer ring of the metal layer on the insulating substrate, and gold paste is poured in to connect with the corresponding gold-platinum-palladium layer (the ninth layer), forming an outer ring thermoelectric junction.

[0099] The 10th layer is an insulating substrate that protects the surface metal of the 9th layer.

[0100] The third and fourth layers are connected by filling metal through holes to form the bottom thermopile, the sixth and seventh layers are connected by filling metal through holes to form the middle thermopile, and the eighth and ninth layers are connected by filling metal through holes to form the upper thermopile.

[0101] The bottom and middle thermopile are connected in series through openings in the insulating substrate, filled with gold paste. The middle and top thermopile are also connected in series through openings in the insulating substrate, filled with gold paste.

[0102] The heat at the bottom of the sample crucible is measured by the bottom thermopile, while the heat on the side walls is measured by the middle and top thermopiles, forming a three-dimensional heat measurement. This three-dimensional thermocouple sensor method improves the efficiency of heat measurement.

[0103] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A three-dimensional thermal analysis sensor, characterized in that, It includes a bottom substrate, a bottom thermoelectric layer, a middle substrate, a first thermoelectric layer and a top substrate stacked in sequence; The bottom thermoelectric layer includes two bottom thermopiles. The first thermoelectric layer includes two through holes and two first thermopiles, with each first thermopile distributed around one of the through holes in the first thermoelectric layer. The top substrate includes two through holes. The two through holes in the first thermoelectric layer correspond to the positions of the two through holes in the top substrate. The two bottom thermopiles in the bottom thermoelectric layer also correspond to the positions of the two through holes in the first thermoelectric layer. The outermost edge of the bottom thermopile is aligned with the outermost edge of the corresponding first thermopile. During measurement, both the test crucible and the empty crucible are placed on the middle substrate and are located in the through holes of the first thermoelectric layer and the top substrate.

2. The three-dimensional thermal analysis sensor according to claim 1, characterized in that, The bottom thermopile is positioned such that when the crucible is placed on the middle substrate, the bottom thermopile is located directly below the crucible.

3. The three-dimensional thermal analysis sensor according to claim 2, characterized in that, The bottom thermoelectric layer includes: a bottom thermoelectric substrate; N thermocouple units of a first material are disposed through the bottom thermoelectric substrate; the first end of each of the N thermocouple units of the first material is located on the first surface of the bottom thermoelectric substrate, and the second end of each of the N thermocouple units of the first material is located on the second surface of the bottom thermoelectric substrate; N is a positive integer. N thermocouple units of a second material are disposed through the bottom thermoelectric substrate; the first end of each of the N thermocouple units of the second material is located on the first surface of the bottom thermoelectric substrate, and the second end of each of the N thermocouple units of the second material is located on the second surface of the bottom thermoelectric substrate. Among them, the N thermocouple units of the first material and the N thermocouple units of the second material are arranged alternately, connected in series and forming multiple concentric circles with different radii by radially narrowing the range; For the thermocouple units in the middle of the series connection: the first end of each thermocouple unit of the first material is connected to the first end of an adjacent thermocouple unit of the second material, and the second end of each thermocouple unit of the first material is connected to the second end of an adjacent thermocouple unit of the second material.

4. The three-dimensional thermal analysis sensor according to claim 3, characterized in that, The circumferential directions between two adjacent concentric circles are opposite; one end of the outermost concentric circle is used to connect to the first pin; one end of the innermost concentric circle extends radially to the outermost concentric circle and is used to connect to the second pin, so that the first pin and the second pin are adjacent.

5. The three-dimensional thermal analysis sensor according to claim 3, characterized in that, The first thermoelectric layer includes a third substrate and a fourth substrate; The third substrate includes N thermocouple units of a first material; the N thermocouple units of the first material are arranged in a ring and spaced apart; each thermocouple unit of the first material includes a first end and a second end; N is a positive integer; The fourth substrate includes N thermocouple units of a second material; the N thermocouple units of the second material are arranged in a ring and spaced apart; each thermocouple unit of the second material includes a first end and a second end; In this configuration, the first end of each thermocouple unit of the first material is connected to the first end of a thermocouple unit of the second material via a metal post, and the second end of each thermocouple unit of the first material is connected to the second end of another thermocouple unit of the second material via a metal post, so that the thermocouple units of the first material on the third substrate and the thermocouple units of the second material on the fourth substrate are connected in series in sequence; N pairs of thermocouples form the first thermopile.

6. The three-dimensional thermal analysis sensor according to claim 1, characterized in that, The bottom thermoelectric layer comprises a first substrate and a second substrate stacked sequentially. The first substrate includes N thermocouple units of a first material; the N thermocouple units of the first material are arranged in a ring and spaced apart; each thermocouple unit of the first material includes a first end and a second end; N is a positive integer; The second substrate includes N thermocouple units made of a second material; the N thermocouple units made of the second material are arranged in a ring and spaced apart; each thermocouple unit made of the second material includes a first end and a second end; In this configuration, the first end of each thermocouple unit of the first material is connected to the first end of a thermocouple unit of the second material via a metal post, and the second end of each thermocouple unit of the first material is connected to the second end of another thermocouple unit of the second material via a metal post, so that the thermocouple units of the first material on the first substrate and the thermocouple units of the second material on the second substrate are connected in series; N pairs of thermocouples form the bottom thermopile.

7. The three-dimensional thermal analysis sensor according to claim 6, characterized in that, The first thermoelectric layer includes a third substrate and a fourth substrate; The third substrate includes N thermocouple units of a first material; the N thermocouple units of the first material are arranged in a ring and spaced apart; each thermocouple unit of the first material includes a first end and a second end; N is a positive integer; The fourth substrate includes N thermocouple units of a second material; the N thermocouple units of the second material are arranged in a ring and spaced apart; each thermocouple unit of the second material includes a first end and a second end; In this configuration, the first end of each thermocouple unit of the first material is connected to the first end of a thermocouple unit of the second material via a metal post, and the second end of each thermocouple unit of the first material is connected to the second end of another thermocouple unit of the second material via a metal post, so that the thermocouple units of the first material on the third substrate and the thermocouple units of the second material on the fourth substrate are connected in series in sequence; N pairs of thermocouples form the first thermopile.

8. The three-dimensional thermal analysis sensor according to claim 7, characterized in that, The positional relationship between the first thermopile and the bottom thermopile satisfies: The thermocouples in the first thermopile are inserted into the thermocouples in the bottom thermopile.

9. The three-dimensional thermal analysis sensor according to claim 1, characterized in that, The three-dimensional thermal analysis sensor also includes a second thermoelectric layer; The second thermoelectric layer is disposed between the first thermoelectric layer and the top substrate; the second thermoelectric layer includes two through holes and two second thermoelectric stacks, and each second thermoelectric stack is distributed around one of the through holes of the second thermoelectric layer; the two through holes of the second thermoelectric layer correspond to the positions of the two through holes of the first thermoelectric layer.

10. The three-dimensional thermal analysis sensor according to claim 1, characterized in that, The three-dimensional thermal analysis sensor also includes a temperature sensing layer; The temperature sensing layer is stacked between the bottom substrate and the bottom thermoelectric layer.

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