A vacuum testing device for detecting the function of a semiconductor wafer heating plate
Patent Information
- Application Number
- CN202522188850.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-16
- Publication Date
- 2026-09-25
- Estimated Expiration
- 2035-10-16
AI Technical Summary
[0003]现有技术中，测试设备往往专用性较强，仅能够对特定尺寸和规格的晶圆进行测试，缺乏灵活性，无法适应不同半导体制造工艺中所需的各种晶圆规格，这种局限性导致了测试设备的使用范围受限，进而影响了半导体制造工艺的普遍适用性和生产效率
[0016]本实用新型的有益效果为：本实用新型通过真空腔体、放置机构、测温机构、控温机构与真空机构的组合，提供一种更灵活和高效的测试方式。采用了密封真空腔体结构，确保在低压或真空条件下工作的稳定性，其中真空腔体的外壳开设有测温孔、冷却孔与真空孔，这些孔不仅使装置具备多用途接口，还保障了整机密封性；放置机构中的承接板为加热盘提供稳定的平台，结合测温机构设置的压板与滑动测温组件，可对晶圆加热盘进行精确的温度分布测量；测温组件在压板通槽内的滑动设计，赋予其位置调节能力，允许对不同区域进行多点温度监测，从而提升测试的全面性与精准度；控温机构通过穿过冷却孔连接加热盘内加热丝，使得装置能够对加热盘施加独立的温度控制，真实模拟加工环境，实现对加热盘热处理能力的有效验证；真空机构能够在真空腔体内部进行气体抽放，以达成理想的低压或真空工作环境。本实用新型实现了在密封性、适配能力与测试准确性上的全方位进化。
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Figure CN224802687U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a vacuum testing device for detecting the function of a semiconductor wafer heating plate. Background Technology
[0002] Semiconductor wafer heating pads play a crucial role in modern semiconductor manufacturing processes, applied in various steps such as photolithography, chemical vapor deposition (CVD), and physical vapor deposition (PVD). These heating pads are responsible for precise temperature control of the wafer, thereby ensuring the performance and quality of semiconductor devices. To verify the functionality and performance of wafer heating pads, an effective testing tool is essential—this is the vacuum testing device for wafer heating pad functionality. This testing device is designed to simulate the working conditions of the heating pads in real-world processing environments, particularly under low pressure or vacuum conditions, to verify their thermal processing capabilities and performance stability.
[0003] In the existing technology, testing equipment is often highly specialized and can only test wafers of specific sizes and specifications. It lacks flexibility and cannot adapt to the various wafer specifications required in different semiconductor manufacturing processes. This limitation leads to a limited scope of application for testing equipment, which in turn affects the general applicability and production efficiency of semiconductor manufacturing processes.
[0004] To overcome these problems, there is an urgent need for a test device that can adapt to the testing needs of wafers of various specifications through structural improvements and optimized design. Utility Model Content
[0005] In view of at least one of the above technical problems, the present invention provides a vacuum testing device for detecting the function of a semiconductor wafer heating plate, and adopts structural improvements to adapt to the testing needs of wafers of various specifications.
[0006] This utility model provides a vacuum testing device for detecting the function of a semiconductor wafer heating plate, comprising: A vacuum chamber includes an outer shell and a test door. An opening is provided on one end face of the outer shell, and the test door is rotatably connected to the opening. Temperature measuring holes, cooling holes, and vacuum holes are also provided on the outer shell. The vacuum chamber is sealed. A placement mechanism, disposed inside the housing, includes a receiving plate; The temperature measuring mechanism includes a pressure plate disposed inside the housing, a temperature measuring component disposed on the pressure plate, and a temperature measuring instrument disposed outside the vacuum chamber and connected to the temperature measuring component. The temperature measuring instrument and the temperature measuring component are further provided with a connecting wire, which passes through the temperature measuring hole and is sealed. A temperature control mechanism passes through the cooling hole and is connected to the heating wire inside the heating plate; A vacuum mechanism, connected to the vacuum port, is used to extract or release gas from the vacuum chamber. The pressure plate and the receiving plate are arranged opposite to each other. The pressure plate has multiple through slots. The temperature measuring component is slidably arranged in the through slots and abuts against the heating plate on the receiving plate.
[0007] In some embodiments of this utility model, the placement mechanism further includes a bracket, one end of which is connected to the outer shell and the other end of which is connected to the receiving plate.
[0008] In some embodiments of this utility model, the receiving plate is provided with a pick-up and put-out opening.
[0009] In some embodiments of this utility model, the receiving plate has a supporting foot on the side facing the pressure plate, and the supporting foot is movably disposed on the receiving plate.
[0010] In some embodiments of this utility model, the support foot is made of ceramic.
[0011] In some embodiments of this utility model, the temperature measuring component includes a connecting rod passing through the through groove, limiting members fixedly installed at both ends of the connecting rod, a spring disposed between the limiting member and the pressure plate on the side near the receiving plate, and a temperature measuring element connected to the end of the connecting rod near the receiving plate. The connecting rod is relatively movable in the extension direction.
[0012] In some embodiments of this utility model, the temperature measuring mechanism further includes a mounting frame, which includes a mounting rod with one end connected to the outer shell and the other end connected to the pressure plate.
[0013] In some embodiments of this utility model, the mounting rods are equidistant from the center of the pressure plate, and the distance between two adjacent mounting rods is equidistant.
[0014] In some embodiments of this utility model, a plurality of through slots are evenly distributed extending from the center of the pressure plate outwards, and the through slots are disposed between two adjacent mounting rods.
[0015] In some embodiments of this utility model, the test door also has a window, and the window is sealed to the test door.
[0016] The beneficial effects of this utility model are as follows: This utility model provides a more flexible and efficient testing method through the combination of a vacuum chamber, a placement mechanism, a temperature measuring mechanism, a temperature control mechanism, and a vacuum mechanism. A sealed vacuum chamber structure is adopted to ensure stability under low pressure or vacuum conditions. The outer shell of the vacuum chamber has temperature measuring holes, cooling holes, and vacuum holes. These holes not only provide the device with a multi-purpose interface but also ensure the overall sealing performance. The support plate in the placement mechanism provides a stable platform for the heating plate. Combined with the pressure plate and sliding temperature measuring component in the temperature measuring mechanism, precise temperature distribution measurement of the wafer heating plate can be performed. The sliding design of the temperature measuring component within the pressure plate slot gives it position adjustment capability, allowing for multi-point temperature monitoring of different areas, thereby improving the comprehensiveness and accuracy of the test. The temperature control mechanism connects to the heating wire inside the heating plate through the cooling holes, enabling the device to apply independent temperature control to the heating plate, realistically simulating the processing environment and effectively verifying the heat treatment capability of the heating plate. The vacuum mechanism can extract and release gas inside the vacuum chamber to achieve an ideal low-pressure or vacuum working environment. This invention represents a comprehensive evolution in terms of sealing performance, adaptability, and testing accuracy. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the structure of the vacuum testing device for detecting the function of the semiconductor wafer heating plate in this embodiment of the present invention; Figure 2 This is a schematic diagram of the internal structure of the vacuum testing device for detecting the function of the semiconductor wafer heating plate in this embodiment of the present invention; Figure 3 This is a schematic diagram of the temperature measuring mechanism and the placement mechanism in the vacuum testing device for detecting the function of the semiconductor wafer heating plate in this embodiment of the present invention; Figure 4 This is a front view of the temperature measuring mechanism and the placement mechanism in the vacuum testing device for detecting the function of the semiconductor wafer heating plate in this embodiment of the present invention; Figure 5 This is a schematic diagram of the temperature measuring mechanism in the vacuum testing device for detecting the function of the semiconductor wafer heating plate in this embodiment of the present invention.
[0019] Reference numerals: 1. Vacuum chamber; 11. Outer shell; 11a. Opening; 12. Test door; 12a. Window; 13. Temperature measuring hole; 14. Cooling hole; 15. Vacuum hole; 2. Placement mechanism; 21. Receiving plate; 21a. Pick-up and drop-off port; 22. Bracket; 23. Support foot; 3. Temperature measuring mechanism; 31. Pressure plate; 31a. Through groove; 32. Temperature measuring component; 32a. Connecting rod; 32b. Limiting component; 32c. Temperature measuring component; 32d. Spring; 33. Mounting bracket; 33a. Mounting rod. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0023] like Figures 1 to 5 The vacuum testing apparatus shown for testing the function of a semiconductor wafer heating plate includes: The vacuum chamber 1 includes a housing 11 and a test door 12. One end face of the housing 11 has an opening 11a, and the test door 12 is rotatably connected to the opening 11a. The housing 11 also has a temperature measuring hole 13, a cooling hole 14, and a vacuum hole 15. The vacuum chamber 1 is sealed. It should be noted that the sealing between the test door 12 and the housing 11 can be achieved by installing a sealing material between them.
[0024] The placement mechanism 2 is located inside the outer casing 11 and includes a receiving plate 21. It should be noted that the receiving plate 21 can be fixedly connected inside the outer casing 11 and receive the receiving plate by setting an adjustable part on the receiving plate, or it can be connected inside the outer casing 11 with adjustable height to accommodate heating plates of different heights.
[0025] The temperature measuring mechanism 3 includes a pressure plate 31 disposed inside the outer casing 11, a temperature measuring component 32 disposed on the pressure plate 31, and a thermometer disposed outside the vacuum chamber 1 and connected to the temperature measuring component 32. A connecting wire is also provided between the thermometer and the temperature measuring component 32, passing through the temperature measuring hole 13 and being sealed. It should be noted that the temperature measuring component 32 can take many forms, such as a fiber optic temperature sensor, a thermocouple, or other temperature-measuring components. It should also be noted that the position of the through-slot 31a can be varied. The position of the through-slot 31a can be planned according to the actual heating plate to be tested, or it can be distributed in a circular pattern, or other feasible distribution forms.
[0026] The temperature control mechanism passes through the cooling hole 14 and is connected to the heating wire inside the heating plate. When the heating plate needs to be heated, the temperature control mechanism heats it. When the heating plate needs to be cooled, a cooling medium is introduced through the air passage inside the plate body to achieve the cooling effect.
[0027] The vacuum mechanism, connected to the vacuum port 15, evacuates or releases gas from inside the vacuum chamber 1. When low-pressure or vacuum environment testing of the heating plate is required, the vacuum mechanism extracts air from inside the vacuum chamber 1 to regulate the gas pressure.
[0028] The pressure plate 31 and the receiving plate 21 are arranged opposite to each other. The pressure plate 31 has multiple through slots 31a, and the temperature measuring component 32 can be slidably arranged in the through slots 31a. The temperature measuring component 32 abuts against the heating plate on the receiving plate 21. The temperature measuring component 32 can be slidably arranged on the pressure plate 31 to accommodate heating plates of different diameters.
[0029] When testing the function of the semiconductor wafer heating plate using the vacuum testing device of this invention, the heating plate to be tested is first carefully placed on the receiving plate 21 inside the vacuum chamber 1, ensuring that the heating plate is firmly fixed in the adaptation structure of the receiving plate 21. The receiving plate 21 can be adapted to heating plates of different specifications by adjusting the positioning structure, for example, providing a stable foundation for subsequent testing. Subsequently, the pressure plate 31 in the temperature measuring mechanism 3 is adjusted to a suitable position so that the temperature measuring component 32 on it accurately contacts the surface of the heating plate. The flexibility of the temperature measuring component 32 in the sliding through groove 31a allows it to be finely adjusted according to the surface characteristics of the heating plate to achieve accurate multi-point temperature measurement and monitoring. The connecting wire passes through the temperature measuring through hole and is connected to the temperature measuring instrument outside the vacuum chamber 1 through the sealing structure to achieve real-time signal transmission. After the hardware is installed and connected, the heating plate is tested under different working conditions in the following situations. The temperature control mechanism establishes an electrical connection with the heating wire inside the heating plate, and the temperature control equipment begins to execute a preset temperature control program on the heating plate, simulating various heat treatment conditions that may be encountered during semiconductor processing. The vacuum mechanism is activated, and the vacuum pump connected to vacuum port 15 begins to evacuate or de-evacuate the gas in vacuum chamber 1, gradually bringing the entire test environment to the required low pressure or vacuum state, ensuring that the heating plate operates under conditions consistent with the actual process. Finally, the thermometer continuously collects and records the temperature changes of the heating plate at different times and locations through temperature sensing component 32, ensuring accurate reflection of its thermal performance and response speed. All data is displayed and recorded for subsequent analysis. After the test is completed, the vacuum environment is slowly restored to atmospheric pressure, the heating plate is safely removed, and the equipment is prepared for the next test cycle, ensuring a smooth process.
[0030] This invention provides a more flexible and efficient testing method through the combination of a vacuum chamber 1, a placement mechanism 2, a temperature measuring mechanism 3, a temperature control mechanism, and a vacuum mechanism. The device employs a sealed vacuum chamber 1 structure to ensure stability under low-pressure or vacuum conditions. The outer shell 11 of the vacuum chamber 1 has temperature measuring holes 13, cooling holes 14, and vacuum holes 15. These holes not only provide the device with a multi-purpose interface but also ensure the overall sealing performance. The receiving plate 21 in the placement mechanism 2 provides a stable platform for the heating plate. Combined with the pressure plate 31 and sliding temperature measuring component 32 in the temperature measuring mechanism 3, precise temperature distribution measurement of the wafer heating plate can be performed. The sliding design of the temperature measuring component 32 within the through groove 31a of the pressure plate 31 gives it position adjustment capability, allowing for multi-point temperature monitoring of different areas, thereby improving the comprehensiveness and accuracy of the test. The temperature control mechanism connects to the heating wire inside the heating plate through the cooling hole 14, enabling the device to apply independent temperature control to the heating plate, realistically simulating the processing environment and effectively verifying the heat treatment capability of the heating plate. The vacuum mechanism can extract and release gas inside the vacuum chamber 1 to achieve an ideal low-pressure or vacuum working environment. This invention represents a comprehensive evolution in sealing performance, adaptability, and testing accuracy.
[0031] In the testing of semiconductor wafer heating plates, the stability and adaptability of the device structure are key factors. Existing equipment often struggles to adapt to heating plates of different sizes and specifications due to the specificity of its structural design. This not only affects the general applicability of the test but also limits the equipment's efficiency. For example... Figures 2 to 4 As shown, the placement mechanism 2 also includes a support 22, one end of which is connected to the outer shell 11, and the other end is connected to the receiving plate 21. This load-bearing arrangement can evenly distribute the weight and heat of the heating plate to the vacuum chamber 1 structure. Through this arrangement, the receiving plate 21 can maintain stability under the action of heating plates of various sizes and weights, efficiently supporting the testing tasks. The support 22 structure transfers external forces and heat energy to the vacuum chamber 1, thereby minimizing the impact of single-point stress on the receiving plate 21. Compared with traditional placement structures, the enhanced stability and load-bearing capacity of this device through the support 22 can withstand larger loads and thermal effects, possessing greater adaptability and flexibility.
[0032] like Figure 3As shown, the receiving plate 21 has a pick-and-place port 21a. The presence of the pick-and-place port 21a simplifies the placement, adjustment, and removal of the heating plate, allowing convenient operation of the heating plate from multiple angles and positions. This reduces the complexity and difficulty of manual operation and installation positioning. Especially when facing the need for rapid changeover of heating plates of different sizes and specifications, it can significantly reduce operation time and improve overall work efficiency. The pick-and-place port 21a facilitates the application of automated operation in the equipment, optimizes the workflow of robotic arms or other automatic loading and unloading systems, and makes the equipment easier to integrate into modern production lines.
[0033] To enable the receiving plate to have greater adaptability and precise operation capabilities. For example... Figure 3 As shown, the receiving plate 21 also has support feet 23 on the side facing the pressure plate 31. The support feet 23 are movably mounted on the receiving plate 21. The support feet 23 provide additional stability to the heating plate, not only enhancing the support effect of the receiving plate 21 on the plate surface, but also allowing for fine height and position adjustments at different test stages. The mobility of the support feet 23 means that the support force and flatness can be customized according to the specific size and shape of the heating plate, ensuring that the heating plate remains stable under complex pressure conditions or vacuum environments. This helps reduce the interference of external vibrations or equipment errors on test data, and improves the accuracy and repeatability of measurements.
[0034] To ensure greater stability and accuracy of test results, in some embodiments of this invention, the support foot 23 is made of ceramic. Ceramic materials are known for their excellent heat resistance and low thermal conductivity, which allows the support foot 23 to effectively isolate heat in high-temperature environments, reducing heat transfer from the receiving plate 21 to other parts of the vacuum chamber 1, thereby minimizing external interference with the heating plate's thermal field. The chemical stability and corrosion resistance of ceramics ensure that it maintains structural integrity and does not undergo physical or chemical changes when exposed to different chemical reagents in a vacuum environment or during semiconductor processing.
[0035] Existing temperature measurement mechanisms lack flexibility and accuracy, making them susceptible to installation errors and environmental changes, leading to unstable or inaccurate data. In some embodiments of this invention, reference is made to... Figures 3 to 5As shown, the temperature measuring assembly 32 includes a connecting rod 32a passing through a through slot 31a, limiting members 32b fixedly installed at both ends of the connecting rod 32a, a spring 32d disposed between the limiting member 32b and the pressure plate 31 near the receiving plate 21, and a temperature measuring element 32c connected to the end of the connecting rod 32a near the receiving plate 21. The connecting rod 32a is relatively movable in its extension direction. The movable arrangement of the connecting rod 32a allows the temperature measuring assembly 32 to have flexible adjustment capabilities during actual operation. The position of the temperature measuring element 32c can be adjusted according to the specific requirements of the heating plate surface, thereby achieving accurate temperature data acquisition. The limiting members 32b fixed at both ends of the connecting rod 32a ensure the stability and position control of the rod during movement, maintaining consistency and repeatability during adjustment. The spring 32d provides necessary support and cushioning, automatically adjusting pressure during temperature measurement to ensure full contact between the temperature measuring element 32c and the heating plate surface, thereby reducing measurement deviations caused by poor contact. This flexible adjustment mechanism not only improves the stability of the measurement, but also allows the device to maintain consistent measurement accuracy when facing measurement requirements with different curvatures or positions.
[0036] To allow the temperature sensing component 32 a certain vertical floating range. For example... Figures 3 to 5 As shown, the temperature measuring mechanism 3 also has a mounting bracket 33, which includes a mounting rod 33a connected at one end to the outer casing 11 and at the other end to the pressure plate 31. This not only provides some space for the temperature measuring component 32 to move, but also provides support for the pressure plate 31, resulting in higher accuracy for temperature acquisition. It should be noted that the connection between the mounting rod 33a and the outer casing 11 can be vertical or at an angle. It should also be noted that a mounting plate can be provided between the mounting rod 33a and the outer casing 11 to connect them, or other components can be provided to connect the two.
[0037] In some embodiments of this utility model, the mounting rods 33a are equidistant from the center of the pressure plate 31, and the distance between two adjacent mounting rods 33a is equal. The uniformly distributed circumferential design ensures that the mounting rods 33a generate a balanced stress distribution when supporting the pressure plate 31, enabling the temperature measuring mechanism 3 to maintain a stable horizontal plane and position. Regardless of the working state or environmental conditions of the equipment, it can reduce errors caused by its own structural imbalance. The uniformly distributed mounting rods 33a, with their symmetry, enable the entire temperature measuring structure to withstand greater process pressure and external disturbances, improving the stability of the temperature measuring component 32 during dynamic or long-term use.
[0038] The detection of semiconductor wafer heating plates requires multi-point monitoring and high-precision measurement of temperature changes, which necessitates a reasonable arrangement and structural distribution of the temperature measuring mechanism 3. In some embodiments of this invention, multiple through slots 31a are evenly distributed extending outwards from the center of the pressure plate 31, with the through slots 31a positioned between two adjacent mounting rods 33a. This evenly distributed design from the center outwards allows the through slots 31a and the temperature measuring component 32 to cover key areas of the heating plate surface, achieving global temperature monitoring. It also ensures uniform spacing between temperature measuring points, thereby capturing a more accurate and comprehensive temperature distribution. Placing the through slots 31a between the mounting rods 33a further optimizes the structural layout, making the force distribution within the pressure plate 31 more balanced. This avoids localized pressure concentration caused by the simultaneous presence of the temperature measuring component 32 and the mounting rods 33a, thus ensuring the stability of equipment operation and the reliability of test results.
[0039] In the testing process of semiconductor wafer heating plates, real-time observation of the internal testing status is crucial for controlling the testing progress and adjusting testing conditions in a timely manner. For example... Figure 1 As shown, the test door 12 also has a window 12a, which is sealed to the test door 12. By observing the working status of the wafer heating plate and the operation of the temperature measuring component 32 inside the equipment through the transparent window 12a, the operator can quickly determine whether the heating plate is functioning normally and whether the temperature measuring mechanism 3 is in the expected working state. This can effectively reduce test interruptions or repeated operations caused by unknown factors. The sealed connection of the window 12a ensures that the equipment maintains good airtightness during operation and does not affect the internal vacuum state.
[0040] Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A vacuum testing device for detecting the function of a semiconductor wafer heating plate, characterized in that, include: A vacuum chamber includes an outer shell and a test door. An opening is provided on one end face of the outer shell, and the test door is rotatably connected to the opening. Temperature measuring holes, cooling holes, and vacuum holes are also provided on the outer shell. The vacuum chamber is sealed. A placement mechanism, disposed inside the housing, includes a receiving plate; The temperature measuring mechanism includes a pressure plate disposed inside the housing, a temperature measuring component disposed on the pressure plate, and a temperature measuring instrument disposed outside the vacuum chamber and connected to the temperature measuring component. The temperature measuring instrument and the temperature measuring component are further provided with a connecting wire, which passes through the temperature measuring hole and is sealed. A temperature control mechanism passes through the cooling hole and is connected to the heating wire inside the heating plate; A vacuum mechanism, connected to the vacuum port, is used to extract or release gas from the vacuum chamber. The pressure plate and the receiving plate are arranged opposite to each other. The pressure plate has multiple through slots. The temperature measuring component is slidably arranged in the through slots and abuts against the heating plate on the receiving plate.
2. The vacuum testing device for detecting the function of a semiconductor wafer heating plate according to claim 1, characterized in that, The placement mechanism also includes a bracket, one end of which is connected to the outer shell and the other end of which is connected to the receiving plate.
3. The vacuum testing device for detecting the function of a semiconductor wafer heating plate according to claim 2, characterized in that, The receiving plate has an opening for taking out and putting in.
4. The vacuum testing device for detecting the function of a semiconductor wafer heating plate according to claim 2, characterized in that, The receiving plate also has a support foot on the side facing the pressure plate, and the support foot can be movably mounted on the receiving plate.
5. The vacuum testing device for detecting the function of a semiconductor wafer heating plate according to claim 4, characterized in that, The support feet are made of ceramic.
6. The vacuum testing device for detecting the function of a semiconductor wafer heating plate according to claim 1, characterized in that, The temperature measuring component includes a connecting rod passing through the through groove, limiting members fixedly installed at both ends of the connecting rod, a spring disposed between the limiting member and the pressure plate on the side near the receiving plate, and a temperature measuring element connected to the end of the connecting rod near the receiving plate. The connecting rod is relatively movable in the extension direction.
7. The vacuum testing device for detecting the function of a semiconductor wafer heating plate according to claim 1, characterized in that, The temperature measuring mechanism also has a mounting frame, which includes a mounting rod with one end connected to the outer casing and the other end connected to the pressure plate.
8. The vacuum testing device for detecting the function of a semiconductor wafer heating plate according to claim 7, characterized in that, The mounting rods are equidistant from the center of the pressure plate, and the distance between two adjacent mounting rods is equal.
9. The vacuum testing device for detecting the function of a semiconductor wafer heating plate according to claim 8, characterized in that, The multiple through slots are evenly distributed extending from the center of the pressure plate outwards, and the through slots are disposed between two adjacent mounting rods.
10. The vacuum testing device for detecting the function of a semiconductor wafer heating plate according to claim 1, characterized in that, The test door also has a window, which is sealed to the test door.