A bonding force testing device

Abstract

The utility model relates to the field of bonding force test technology, concretely relates to a bonding force testing device, including base, be provided with support frame and be located in the push -and -pull force machine of support frame one side on the base, be provided with the fixed mould of fixed test sample on the support frame lead frame, the test sample middle part is provided with the injection molding glue way of sticking with test sample, the push -and -pull force machine includes drive part and the push rod of drive part connection, be provided with detection spare on the push rod, the push rod lower extreme is connected with the ejection spare, the push -and -pull force machine of the utility model runs in the push mode, through the ejection spare of vertical downward push to test sample on injection molding glue way exert push, make it from test sample on the separation, record the maximum push value through detection spare in the process, it is the bonding force between two, as the quantitative index of evaluation to injection molding glue way strength.

Description

Technical Field

[0001] This utility model relates to the field of adhesive force testing technology, and in particular to an adhesive force testing device. Background Technology

[0002] In semiconductor packaging processes, after epoxy molding compound is injection molded, the injection runners on the leadframe need to be removed. However, this process often results in "leadframe sticking," leading to runner residue or leadframe deformation. This excessive adhesion between the injection runner and the leadframe affects subsequent processes. Analysis shows that the degree of "leadframe sticking" is influenced by multiple factors, including the adhesion strength between the epoxy molding compound and the leadframe, the material's flexural strength, and the runner removal temperature. However, in current material development and optimization processes, simply measuring the conventional adhesion strength and flexural strength between the epoxy molding compound and copper is insufficient to accurately quantify its "leadframe sticking" tendency under actual operating conditions. Utility Model Content

[0003] In view of this, the purpose of this utility model is to propose an adhesive force testing device to solve the problem of difficulty in accurately quantifying the adhesive force testing effect.

[0004] Based on the above objectives, this utility model provides an adhesion testing device, including a base, a support frame and a push-pull force machine located on one side of the support frame, a receiving space for receiving materials below the support frame, a fixing mold for fixing the lead frame on the test sample on the support frame, the fixing mold including a lower mold on the support frame, an upper mold above the lower mold and cooperating with it, a placement space for placing the test sample between the upper mold and the lower mold, a telescopic cylinder connected to the upper mold on one side of the lower mold, the telescopic cylinder retracting can drive the upper mold to move downward, so that the upper mold presses down to fix the test sample placed on the lower mold, the test sample has an injection groove in the middle of the test sample to adhere to the test sample, the push-pull force machine includes a driving component and a push rod connected to the driving component, a detection component is provided on the push rod, and an ejector is connected to the lower end of the push rod;

[0005] The driving component can drive the push rod to move downwards in the vertical direction, so that the ejector contacts the surface of the injection molded channel on the test sample and applies pressure to the injection molded channel to detach it from the test sample; the detection component can detect the magnitude of the surface pressure applied to the injection molded channel on the test sample by the push-pull force machine, and detect the adhesion between the lead frame and the injection molded channel in the test sample based on the detachment of the injection molded channel from the test sample.

[0006] Optionally, the ejector includes a push head connected to the lower end of the push rod, the lower end of the push head is connected to an ejector pin, the upper mold has a needle hole for ejecting the ejector pin, the lower mold has an outlet adapted to the injection molding runner, the outlet is located below the needle hole, and the outlet communicates with the receiving space.

[0007] Optionally, the lower mold is provided with a positioning pin, and the test sample is provided with a positioning hole that cooperates with the positioning pin.

[0008] Optionally, heating elements are provided inside both the upper and lower molds.

[0009] Optionally, the upper mold has an upper placement groove on its upper end face, and an upper cover is provided at the opening of the upper placement groove. The lower mold has a lower placement groove on its lower end face, and a lower cover is provided at the opening of the lower placement groove. The heating element is placed in both the upper placement groove and the lower placement groove.

[0010] Optionally, both the upper and lower covers are provided with a heat insulation layer.

[0011] Optionally, the sidewalls of both the upper and lower placement slots are provided with the insulation layer.

[0012] Optionally, the detection element is a force gauge.

[0013] Optionally, a conveyor belt is provided on the base, the support frame is located in the middle of the conveyor belt, the conveyor belt is arranged in a transverse direction, and multiple receiving boxes for receiving materials are arranged at equal intervals on the conveyor belt.

[0014] The beneficial effects of this utility model are as follows: This utility model provides an adhesion testing device. The test object is a test sample of the adhesion between the epoxy molding compound injection mold and the lead frame. The push-pull tester operates in push mode. The ejector pushes the injection mold on the test sample vertically downward to make it detach from the test sample. During the process, the maximum push value is recorded by the detection device, which is the adhesion between the two, and serves as a quantitative indicator for evaluating the force of removing the injection mold.

[0015] This device simulates the actual epoxy molding process, quantitatively evaluates the strength of epoxy molding compound removal from the injection mold, provides an important reference for epoxy molding compound product development, and offers a key performance evaluation method for the development and optimization of epoxy molding compound formulations, which helps improve the continuous productivity and yield of semiconductor packaging. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 for Figure 1 Enlarged structural diagram at point A in the middle.

[0019] In the diagram: 1. Push-pull tester; 2. Base; 3. Support frame; 4. Receiving space; 5. Force gauge; 6. Push rod; 7. Test sample; 71. Lead wire frame; 72. Injection runner; 8. Ejector; 81. Push head; 82. Ejector pin; 9. Fixed mold; 91. Upper mold; 92. Needle hole; 93. Lower mold; 94. Positioning pin; 95. Discharge port; 96. Telescopic cylinder; 97. Heating element; 98. Upper placement slot; 99. Top cover; 10. Conveyor belt; 11. Receiving box. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0021] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this utility model should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "first," "second," and similar terms used in this utility model do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0022] like Figures 1 to 2As shown, an adhesion testing device includes a base 2, a support frame 3 and a push-pull force testing machine 1 located on one side of the support frame 3, a receiving space 4 for receiving materials located on the base 2 below the support frame 3, a fixing mold 9 for fixing the lead frame 71 on the test sample 7 on the support frame 3, the fixing mold 9 including a lower mold 93 located on the support frame 3, an upper mold 91 that cooperates with the lower mold 93 above the lower mold 93, and a spacer between the upper mold 91 and the lower mold 93. The test sample 7 is placed in a space. A telescopic cylinder 96 connected to the upper mold 91 is provided on one side of the lower mold 93. The telescopic cylinder 96 can retract to drive the upper mold 91 to move downward, so that the upper mold 91 presses down to fix the test sample 7 placed on the lower mold 93. An injection channel 72 for bonding with the test sample 7 is provided in the middle of the test sample 7. The push-pull force machine 1 includes a driving component and a push rod 6 connected to the driving component. A detection component is provided on the push rod 6. An ejector 8 is connected to the lower end of the push rod 6.

[0023] The driving component can drive the push rod 6 to move downwards in the vertical direction, so that the ejector 8 contacts the surface of the injection molding channel 72 on the test sample 7 and applies pressure to the injection molding channel 72, causing the injection molding channel 72 to detach from the test sample 7, thus separating the injection molding channel 72 from the lead frame 71; the detection component can detect the magnitude of the surface pressure applied by the push-pull force machine 1 to the injection molding channel 72 on the test sample 7, and detect the adhesion force between the lead frame 71 and the injection molding channel 72 in the test sample 7 based on the detachment of the injection molding channel 72 from the test sample 7.

[0024] The test object is a test sample 7, which is the test specimen 7 of the epoxy molding compound injection channel 72 and the lead frame 71. The push-pull machine 1 operates in push mode and applies a push force to the injection channel 72 on the test specimen 7 by pushing the ejector 8 vertically downward, so that it detaches from the test specimen 7 and peels the injection channel 72 from the test specimen 7. The injection channel 72 separates from the lead frame 71. During the process, the maximum push force value is recorded by the detection device, which is the adhesion between the two. This serves as a quantitative indicator for evaluating the force of removing the injection channel 72, i.e., the peel strength. The operation is simple and the results are reliable.

[0025] This device simulates the actual epoxy molding process, quantitatively evaluates the 72-degree force of epoxy molding compound removal from injection molds, provides an important reference for epoxy molding compound product development, and offers a key performance evaluation method for the development and optimization of epoxy molding compound formulations, which helps improve the continuous productivity and yield of semiconductor packaging.

[0026] The driving component of the push-pull force machine 1 can be a drive telescopic cylinder. The telescopic end of the drive telescopic cylinder is connected to the push rod 6. The driving method of the drive telescopic cylinder can be hydraulic, electric or pneumatic. The detection component can be set on the push rod 6 or between the push rod 6 and the telescopic end of the drive telescopic cylinder.

[0027] The ejector 8 includes a pusher head 81 connected to the lower end of the push rod 6. The lower end of the pusher head 81 is connected to an ejector pin 82. The upper mold 91 has a needle hole 92 for ejecting the ejector pin 82. The lower mold 93 has a discharge port 95 adapted to the injection molding channel 72. The discharge port 95 is located below the needle hole 92 and communicates with the receiving space 4. When the ejector 8 moves downward to apply pressure to the injection molding channel 72 on the test sample 7, the ejector pin 82 on the ejector 8 contacts the surface of the injection molding channel 72 through the needle hole 92 and applies pressure to the injection molding channel 72, causing the injection molding channel 72 to detach from the test sample 7 and enter the receiving space 4 through the discharge port 95. The ejector pin 82 is provided with a pusher head 81. After the pusher head 81 contacts the upper mold 91, it restricts the pusher head 81 and the ejector pin 82 from continuing to move downward, preventing the ejector pin 82 from pressing down excessively.

[0028] The lower mold 93 is provided with a positioning pin 94, and the test sample 7 is provided with a positioning hole that cooperates with the positioning pin 94. The lower end face of the upper mold 91 is provided with a mating groove that cooperates with the positioning pin 94, which facilitates the positioning of the test sample 7. The mating groove is provided to prevent the upper mold 91 from pressing down and bending the positioning pin 94, thus preventing it from affecting the positioning of the test sample 7.

[0029] Both the upper mold 91 and the lower mold 93 are equipped with heating elements 97, which can simulate the temperature conditions of the test sample 7 during the actual packaging process and more realistically evaluate the bonding behavior. The heating elements 97 are PTC heating elements 97.

[0030] The upper mold 91 has an upper placement groove 98 on its upper end face, and an upper cover 99 is provided at the opening of the upper placement groove 98. The lower mold 93 has a lower placement groove on its lower end face, and a lower cover is provided at the opening of the lower placement groove. The heating element 97 is placed in both the upper placement groove 98 and the lower placement groove. The upper placement groove 98 and the lower placement groove are provided to facilitate the accommodation of the heating element 97.

[0031] Both the upper cover 99 and the lower cover are provided with heat insulation layers, so that more of the heat emitted by the heating element 97 remains between the upper cover 99 and the lower cover, reducing the efficiency of heat dissipation.

[0032] Both the upper placement slot 98 and the lower placement slot have heat insulation layers on their side walls. This ensures that the heating elements 97 in the upper placement slot 98 and the lower placement slot can only radiate heat from the bottom of the upper placement slot 98 and the bottom of the lower placement slot. The heating elements 97 can simulate the temperature conditions of the test sample 7 during the actual packaging process, thus more realistically evaluating the bonding behavior.

[0033] The detection component is a force gauge 5, which controls the pressure applied by the ejector 8 to the lead frame 71 of the test sample 7. When the ejector 8 moves down to squeeze the injection molded channel 72 of the test sample 7, the force gauge 5 can display the pressure applied to the injection molded channel 72 in real time. By monitoring the pressure of the force gauge 5 and adjusting the applied force, the separation between the test sample 7 and the injection molded channel 72 under different pressures can be detected, thereby detecting the adhesion between the lead frame 71 of the test sample 7 and the injection molded channel 72.

[0034] The base 2 is provided with a conveyor belt 10, and the support frame 3 is located in the middle of the conveyor belt 10. The conveyor belt 10 is arranged in a transverse direction. Multiple material receiving boxes 11 are arranged at equal intervals on the conveyor belt 10 for receiving materials. The material receiving boxes 11 facilitate the collection of materials during the testing process.

[0035] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the present invention is limited to these examples. The present invention is not limited to the above-described embodiments, that is, it does not mean that the present invention must rely on the above methods and structures to be implemented. Under the concept of the present invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in the details for the sake of brevity.

[0036] The embodiments of this utility model are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An adhesive force testing device, comprising a base, characterized in that, The base is provided with a support frame and a push-pull machine located on one side of the support frame. A receiving space for receiving materials is provided below the support frame. A fixing mold for fixing the lead frame on the test sample is provided on the support frame. The fixing mold includes a lower mold located on the support frame and an upper mold that cooperates with it above the lower mold. A placement space for placing the test sample is provided between the upper mold and the lower mold. A telescopic cylinder connected to the upper mold is provided on one side of the lower mold. The telescopic cylinder can drive the upper mold to move downward when it retracts, so that the upper mold presses down to fix the test sample placed on the lower mold. An injection molded groove for adhering to the test sample is provided in the middle of the test sample. The push-pull machine includes a driving component and a push rod connected to the driving component. A detection component is provided on the push rod, and an ejector is connected to the lower end of the push rod. The driving component can drive the push rod to move downwards in the vertical direction, so that the ejector contacts the surface of the injection molded channel on the test sample and applies pressure to the injection molded channel to detach it from the test sample; the detection component can detect the magnitude of the surface pressure applied to the injection molded channel on the test sample by the push-pull force machine, and detect the adhesion between the lead frame and the injection molded channel in the test sample based on the detachment of the injection molded channel from the test sample.

2. The adhesion testing device according to claim 1, characterized in that, The ejector includes a pusher head connected to the lower end of the push rod, and an ejector pin connected to the lower end of the pusher head. The upper mold has a needle hole for ejecting the ejector pin, and the lower mold has a discharge port adapted to the injection molding runner. The discharge port is located below the needle hole and communicates with the receiving space.

3. The adhesion testing device according to claim 1, characterized in that, The lower mold is provided with a positioning pin, and the test sample is provided with a positioning hole that cooperates with the positioning pin.

4. The adhesion testing device according to claim 1, characterized in that, Heating elements are provided inside both the upper and lower molds.

5. The adhesion testing device according to claim 4, characterized in that, The upper mold has an upper placement groove on its upper end face, and an upper cover is provided at the opening of the upper placement groove. The lower mold has a lower placement groove on its lower end face, and a lower cover is provided at the opening of the lower placement groove. The heating element is placed in both the upper placement groove and the lower placement groove.

6. The adhesion testing device according to claim 5, characterized in that, Both the upper and lower covers are provided with heat insulation layers.

7. The adhesion testing device according to claim 6, characterized in that, The side walls of both the upper and lower placement slots are provided with the insulation layer.

8. The adhesion testing device according to claim 1, characterized in that, The testing component is a force gauge.

9. The adhesion testing device according to claim 1, characterized in that, A conveyor belt is provided on the base, and the support frame is located in the middle of the conveyor belt. The conveyor belt is arranged in a transverse direction, and multiple receiving boxes for receiving materials are arranged at equal intervals on the conveyor belt.

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