A device for sic wafer surface defect detection

Abstract

The utility model relates to the device technical field for sic wafer surface defect detection discloses a device for sic wafer surface defect detection, including work table, the both sides fixed mounting of work table upper end have support frame, the upper end fixed mounting of support frame has detector, the recess that the upper end of work table was opened has, the both sides swing mounting of support frame have knob, the one side fixed connection of knob has connecting rod, when using this device, can realize the convenient overturning of wafer in the detection process through the cooperation knob and connecting rod that set up, need not manual overturning wafer of staff, the cooperation of movable slot, movable block and two -way threaded rod and second adjusting knob, make clamping block can adjust position and clamping degree flexibly, ensure the stability of wafer in the detection process, the design of arc clamping block and rubber soft pad not only increased the comfort degree of clamping, also protected wafer from damage, can bring better use prospect.

Description

Technical Field

[0001] This utility model relates to the technical field of devices for detecting surface defects on SiC wafers, specifically a device for detecting surface defects on SiC wafers. Background Technology

[0002] During the manufacturing process of SiC wafers, defects such as cracks, scratches, and peeling may occur on the wafer surface. There are two reasons for the formation of these defects: one is that they are originally formed during the wafer growth process, and the other is that they are caused after the wafer has gone through various processing steps. In order for the wafer to achieve the expected performance, it is necessary to ensure that the wafer surface is basically free of defects.

[0003] However, it still has some drawbacks. For example, the current SiC wafer surface defect detection devices have a relatively simple structure. Most of them simply place the wafer flat under the optical detector and then complete the irradiation detection through the optical detector. Moreover, the reverse side of the wafer also needs to be inspected for defects. The operator simply flips the wafer over and then performs the inspection, which reduces the detection efficiency of the device.

[0004] To address the aforementioned issues, this application proposes a device for detecting surface defects on SiC wafers. Utility Model Content

[0005] The purpose of this invention is to provide a device for detecting surface defects on SiC wafers, thereby solving the problem of the relatively simple structure in the prior art mentioned in the background section.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a device for detecting surface defects of SiC wafers, comprising a worktable, support frames fixedly installed on both sides of the upper end of the worktable, a detector fixedly installed on the upper end of the support frames, and a groove formed on the upper end of the worktable.

[0007] Preferably, knobs are movably installed on both sides of the support frame, a connecting rod is fixedly connected to one side of each knob, and a support testing platform is fixedly installed on one side of each connecting rod.

[0008] Preferably, a first adjustment knob is fixedly installed at the front end of the support frame, an adjustment rod is fixedly installed at the rear end of the first adjustment knob, a top plate is fixedly installed at the rear end of the adjustment rod, and an anti-slip pad is fixedly installed at the rear end of the top plate.

[0009] Preferably, a movable groove is provided on one side of the support testing platform, a movable block is movably installed in the inner cavity of the movable groove, a bidirectional threaded rod is threadedly connected to the inner cavity of the movable block, a second adjusting knob is fixedly connected to one side of the bidirectional threaded rod, a clamping block is fixedly installed at the rear end of the movable block, a rubber pad is fixedly installed on the inner side of the clamping block, a connecting block is fixedly installed at the rear end of the outer wall of the clamping block, and a connecting bolt is detachably connected to the inner cavity of the connecting block.

[0010] Preferably, the detector is located at the upper end of the supporting detection platform.

[0011] Preferably, the connecting rods are fixed on both sides of the supporting testing platform, the top plate and the connecting rods are in two sets, and the anti-slip pad is located on one side of the outer wall of the connecting rod.

[0012] Preferably, the clamping block is arc-shaped, there are two sets of clamping blocks, and the clamping blocks are movably located in the inner cavity of the support testing stage. There are four sets of rubber pads, and the wafer is placed between two sets of rubber pads.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This invention, through the design of a support testing platform, along with a knob and connecting rod, enables convenient flipping of the wafer during the testing process, eliminating the need for manual wafer flipping by operators and thus improving testing efficiency. The first adjustment knob, adjustment rod, top plate, and anti-slip pad provide additional anti-slip support during wafer testing, preventing the wafer from slipping due to detector irradiation or improper operation, further enhancing the stability and safety of the testing process.

[0015] This invention utilizes a movable groove, movable block, and a two-way threaded rod on the support testing platform, along with a second adjustment knob, to allow the clamping block to flexibly adjust its position and clamping force, ensuring the stability of the wafer during testing. The arc-shaped clamping block and rubber pad design not only increase clamping comfort but also protect the wafer from damage. The clamping block is detachably connected via connecting blocks and bolts, facilitating replacement or adjustment according to the wafer size and simplifying device maintenance. The support testing platform design ensures the wafer remains horizontal during testing, reducing testing errors caused by uneven placement and improving testing quality. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a device for detecting surface defects on SiC wafers according to the present invention.

[0017] Figure 2 This is a schematic diagram of the support testing stage structure of a device for detecting surface defects on SiC wafers according to this utility model.

[0018] Figure 3 This is a schematic diagram of the top plate structure of a device for detecting surface defects in SiC wafers according to the present invention.

[0019] Figure 4 This is a schematic diagram of the clamping block structure of a device for detecting surface defects on SiC wafers according to this utility model;

[0020] Figure 5 This is a schematic diagram of the clamping and fixing structure of a device for detecting surface defects on SiC wafers according to this utility model.

[0021] In the diagram: 1. Workbench; 2. Support frame; 3. Detector; 4. Groove; 5. Knob; 6. Connecting rod; 7. Support for the detection platform; 8. First adjustment knob; 9. Adjusting rod; 10. Top plate; 11. Anti-slip pad; 12. Movable groove; 13. Movable block; 14. Two-way threaded rod; 15. Second adjustment knob; 16. Clamping block; 17. Rubber pad; 18. Connecting block; 19. Connecting bolt. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Please see Figures 1-3 This utility model provides a technical solution: a device for detecting surface defects on SiC wafers, including a worktable 1, support frames 2 fixedly installed on both sides of the upper end of the worktable 1, a detector 3 fixedly installed on the upper end of the support frame 2, the detector 3 being located on the upper end of the support detection platform 7, a groove 4 being formed on the upper end of the worktable 1, a first adjustment knob 8 fixedly installed on the front end of the support frame 2, an adjustment rod 9 fixedly installed on the rear end of the first adjustment knob 8, a top plate 10 fixedly installed on the rear end of the adjustment rod 9, and an anti-slip pad 11 fixedly installed on the rear end of the top plate 10. Through the arrangement of the first adjustment knob 8, the adjustment rod 9, the top plate 10, and the anti-slip pad 11, the wafer detection process can be optimized. Additional anti-slip supports are provided during the process to prevent the wafer from slipping due to irradiation by the detector 3 or improper operation, further enhancing the stability and safety of the inspection. There are two sets of top plate 10 and connecting rod 6. Anti-slip pad 11 is located on one side of the outer wall of the connecting rod 6. Rotary knobs 5 are movably installed on both sides of the support frame 2. A connecting rod 6 is fixedly connected to one side of the rotary knob 5. A support inspection platform 7 is fixedly installed on one side of the connecting rod 6. The connecting rod 6 is fixedly located on both sides of the support inspection platform 7. Through the support inspection platform 7, in conjunction with the rotary knob 5 and the connecting rod 6, the wafer can be conveniently flipped during the inspection process without the need for manual flipping by the staff, thereby improving the inspection efficiency.

[0024] In this embodiment, as Figures 4-5 As shown, a movable groove 12 is provided on one side of the support testing table 7. A movable block 13 is movably installed in the inner cavity of the movable groove 12. A bidirectional threaded rod 14 is threadedly connected to the inner cavity of the movable block 13. A second adjusting knob 15 is fixedly connected to one side of the bidirectional threaded rod 14. Through the cooperation of the movable groove 12, movable block 13, bidirectional threaded rod 14, and second adjusting knob 15 on the support testing table 7, the clamping block 16 can be flexibly adjusted in position and clamping force to ensure the stability of the wafer during the testing process. The clamping block 16 is fixedly installed at the rear end of the movable block 13. The clamping block 16 is designed in an arc shape. The design of the arc-shaped clamping block 16 and the rubber pad 17 not only increases the comfort of clamping but also protects the wafer from damage. The clamping blocks 16 consist of two sets, and the clamping blocks 16 are movably located within the inner cavity of the support testing stage 7. Rubber pads 17 are fixedly installed on the inner side of the clamping blocks 16, and there are four sets of rubber pads 17. The wafer is placed between two sets of rubber pads 17. A connecting block 18 is fixedly installed at the rear end of the outer wall of the clamping blocks 16. A connecting bolt 19 is detachably connected to the inner cavity of the connecting block 18. The clamping blocks 16 are detachably connected through the connecting blocks 18 and the connecting bolts 19, which facilitates replacement or adjustment according to the size of the wafer. It also facilitates the maintenance and upkeep of the device. The design of the support testing stage 7 ensures that the wafer remains horizontal during the testing process, reducing testing errors caused by uneven placement and improving testing quality.

[0025] Working principle:

[0026] The support testing platform 7, along with the knob 5 and connecting rod 6, allows for convenient wafer flipping during the testing process, eliminating the need for manual wafer flipping and thus improving testing efficiency. The first adjustment knob 8, adjustment rod 9, top plate 10, and anti-slip pad 11 provide additional anti-slip support during wafer testing, preventing the wafer from slipping due to irradiation by the detector 3 or improper operation, further enhancing testing stability and safety. The support testing platform 7 also features a movable slot 12, movable block 13, and bidirectional threaded rod 14, which, along with the second adjustment knob 15... The combination of the clamping block 16 and the rubber pad 17 allows for flexible adjustment of the position and clamping force, ensuring the stability of the wafer during the inspection process. The design of the arc-shaped clamping block 16 and the rubber pad 17 not only increases the comfort of clamping but also protects the wafer from damage. The clamping block 16 is detachably connected by the connecting block 18 and the connecting bolt 19, which facilitates replacement or adjustment according to the size of the wafer and also facilitates the maintenance and upkeep of the device. The design of the support inspection stage 7 ensures that the wafer remains horizontal during the inspection process, reducing inspection errors caused by uneven placement and improving the inspection quality.

[0027] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

Claims

1. An apparatus for detecting surface defects on SiC wafers, comprising a worktable (1), characterized in that: Support frames (2) are fixedly installed on both sides of the upper end of the workbench (1). A detector (3) is fixedly installed on the upper end of the support frame (2). A groove (4) is opened on the upper end of the workbench (1). A knob (5) is movably installed on both sides of the support frame (2). A connecting rod (6) is fixedly connected to one side of the knob (5). A support detection platform (7) is fixedly installed on one side of the connecting rod (6). A first adjustment knob (8) is fixedly installed at the front end of the support frame (2). An adjustment rod (9) is fixedly installed at the rear end of the first adjustment knob (8). A top plate (10) is fixedly installed at the rear end of the adjustment rod (9). A non-slip pad (11) is fixedly installed; a movable groove (12) is provided on one side of the support testing platform (7), a movable block (13) is movably installed in the inner cavity of the movable groove (12), a double-threaded rod (14) is threadedly connected to the inner cavity of the movable block (13), a second adjusting knob (15) is fixedly connected to one side of the double-threaded rod (14), a clamping block (16) is fixedly installed at the rear end of the movable block (13), a rubber soft pad (17) is fixedly installed on the inner side of the clamping block (16), a connecting block (18) is fixedly installed at the rear end of the outer wall of the clamping block (16), and a connecting bolt (19) is detachably connected to the inner cavity of the connecting block (18).

2. The device for detecting surface defects on a SiC wafer according to claim 1, characterized in that: The detector (3) is located at the upper end of the support detection platform (7).

3. The device for detecting surface defects on a SiC wafer according to claim 2, characterized in that: The connecting rods (6) are fixed on both sides of the support testing platform (7). There are two sets of top plates (10) and connecting rods (6). The anti-slip pad (11) is located on one side of the outer wall of the connecting rod (6).

4. The device for detecting surface defects on a SiC wafer according to claim 3, characterized in that: The clamping block (16) is set to be arc-shaped, and there are two sets of clamping blocks (16). The clamping block (16) is located in the inner cavity of the support testing stage (7). There are four sets of rubber pads (17), and the wafer is placed between the two sets of rubber pads (17).

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