Circuit board inspection apparatus and circuit board inspection system

Abstract

The application discloses a kind of circuit board detection equipment and circuit board detection system, it is related to circuit board quality detection technical field, the equipment includes: detection dark box;Motion platform, image acquisition device and multiple light source modules are set in detection dark box, motion platform carries the circuit board to be measured on, motion platform drives the transmission of circuit board to be measured;All light source modules are set in detection dark box, each light source module irradiates circuit board to be measured under corresponding illumination mode;Image acquisition device includes the image acquisition module of each light source module corresponding, image acquisition device is set as by each image acquisition device in different illumination mode acquisition multi-modal image of circuit board to be measured;With the defect detection module electrically connected to image acquisition device is set as according to multi-modal image sent by image acquisition device carries out defect detection, the defect detection efficiency of flexible circuit board is effectively improved while ensuring the defect detection precision.

Description

Technical Field

[0001] This application relates to the field of circuit board quality inspection technology, and in particular to a circuit board inspection device and a circuit board inspection system. Background Technology

[0002] With the continuous development of circuit board quality inspection technology, users have placed higher demands on the accuracy and efficiency of FPC (Flexible Printed Circuit) defect detection. However, existing FPC inspection equipment generally uses a single-angle front light source module for image acquisition. Since different defects in FPCs (such as minor scratches, dents, and residual copper) exhibit different characteristics under different lighting conditions, a single light source cannot simultaneously optimize the contrast of all defects, resulting in many defect features being inconspicuous or masked, thus increasing the false negative rate. Furthermore, the single imaging mode is sensitive to interference from dust and reflections, easily leading to false positives (i.e., over-detection rate) exceeding 70%, heavily relying on manual re-inspection. Therefore, improving the defect detection efficiency of flexible circuit boards while ensuring accuracy is a pressing technical problem that needs to be solved.

[0003] The above content is only used to help understand the technical solution of this application and does not represent an admission that the above content is prior art. Utility Model Content

[0004] The main purpose of this invention is to provide a circuit board inspection device and a circuit board inspection system, which aims to ensure the accuracy of defect detection while effectively improving the defect detection efficiency of flexible circuit boards.

[0005] To achieve the above objectives, this application provides a circuit board testing device, the circuit board testing device comprising: Detecting the dark box; A motion platform is disposed inside the detection dark box, and the circuit board to be tested is carried on the motion platform; Multiple light source modules are provided, all of which are located inside the detection dark box. Each light source module illuminates the circuit board under test in its corresponding illumination mode. An image acquisition device, comprising an image acquisition module corresponding to each of the light source modules, wherein the image acquisition device is configured to acquire multimodal images of the circuit board under test under different lighting modes; A defect detection module is electrically connected to the image acquisition device, and the defect detection module is configured to perform defect detection based on the multimodal image sent by the image acquisition device.

[0006] In one embodiment, the detection dark box includes a first detection area, and one of the multiple sets of light source modules is a low-angle light source, which is located at the upper side of the first detection area. When the motion platform moves the circuit board under test to the first detection area, the low-angle light source shines on the circuit board under test from the upper side position at a preset incident angle. The preset incident angle is the angle between the incident light from the low-angle light source and the first detection area. The image acquisition module corresponding to the low-angle light source is a first image acquisition device. The first image acquisition device is located directly above the first detection area and perpendicular to the first detection area. The first image acquisition device is configured to acquire the dark field illumination image formed by the surface scattered light of the circuit board under test when illuminated by the low-angle light source.

[0007] In one embodiment, the detection dark box includes a second detection area, and another set of the multiple sets of light source modules is a coaxial light source module, which is disposed on the side of the second detection area close to the first detection area; The image acquisition module corresponding to the coaxial light source module is a second image acquisition device. The second image acquisition device is located directly above the second detection area and perpendicular to the second detection area. The second image acquisition device is configured to acquire the bright field reflected light image of the circuit board under test when illuminated by the coaxial light source module.

[0008] In one embodiment, the coaxial light source module includes a coaxial light source and a beam splitter prism; The coaxial light source is disposed on the side of the second detection area close to the first detection area. The beam splitter is disposed between the second image acquisition device and the second detection area. The reflecting surface of the beam splitter faces the light emitting side of the coaxial light source, and the transmitting surface of the beam splitter faces the second detection area.

[0009] In one embodiment, the multimodal image includes the dark field illumination image and the bright field reflected light image, and the defect detection module includes a control unit, a three-dimensional detection unit, a two-dimensional detection unit, and a detection output unit; The first analog signal terminal of the control unit is electrically connected to the first image acquisition device, the first digital signal terminal of the control unit is electrically connected to the input terminal of the three-dimensional detection unit, and the output terminal of the three-dimensional detection unit is electrically connected to the first input terminal of the detection output unit. The second analog signal terminal of the control unit is electrically connected to the second image acquisition device, the second digital signal terminal of the control unit is electrically connected to the input terminal of the two-dimensional detection unit, and the output terminal of the two-dimensional detection unit is electrically connected to the second input terminal of the detection output unit.

[0010] In one embodiment, both the three-dimensional detection unit and the two-dimensional detection unit are identical AND gate logic devices; When the AND gate logic device is the three-dimensional detection unit, the first terminal of the AND gate logic device is electrically connected to the first digital signal terminal, the second terminal of the AND gate logic device is electrically connected to the preset first reference signal terminal, and the output terminal of the AND gate logic device constitutes the output terminal of the three-dimensional detection unit and is electrically connected to the first input terminal. When the AND gate logic device is the two-dimensional detection unit, the first terminal of the AND gate logic device is electrically connected to the second digital signal terminal, the second terminal of the AND gate logic device is electrically connected to the first reference signal terminal, and the output terminal of the AND gate logic device constitutes the output terminal of the two-dimensional detection unit and is electrically connected to the second input terminal.

[0011] In one embodiment, the detection output unit is an OR gate logic device, the first input terminal of the OR gate logic device is electrically connected to the output terminal of the three-dimensional detection unit, and the second input terminal of the OR gate logic device is electrically connected to the output terminal of the two-dimensional detection unit.

[0012] In addition, to achieve the above objectives, a circuit board inspection system is also provided, the circuit board inspection system comprising: The aforementioned circuit board testing equipment; An automated loading and unloading module is used to transfer the circuit board to be tested to the motion platform in the circuit board testing equipment, and to transfer the circuit board after defect detection to the target storage area.

[0013] In one embodiment, the automated loading and unloading module includes: Line-side compartment, used to store circuit boards to be tested; A transmission mechanism is disposed between the line-side compartment and the motion platform for transmitting the circuit board under test from the line-side compartment to the motion platform.

[0014] In one embodiment, the automated loading and unloading module includes: A sorting mechanism is electrically connected to the defect detection module in the circuit board inspection equipment. The sorting mechanism is disposed between the motion platform and the target storage area, which includes a good product storage area and a defective product storage area. The sorting mechanism is configured to place the circuit board after defect detection in the good product storage area when the detection result sent by the defect detection module is qualified; and to place the circuit board after defect detection in the defective product storage area when the detection result sent by the defect detection module is unqualified.

[0015] The circuit board inspection equipment described in this application features a motion platform that drives the circuit board under test within a sealed inspection dark chamber. This dark chamber also houses an image acquisition device and multiple light source modules. Since the image acquisition device integrates image acquisition modules corresponding to each light source module, when each light source module illuminates the circuit board under test in its corresponding illumination mode, the image acquisition device acquires multimodal images of the circuit board under test under different illumination modes. This significantly enhances the characteristic representation of different defect types (such as minor scratches, dents, and residual copper) of the circuit board under test under different light fields, making defects that would otherwise be masked by a single light source more prominent. This greatly reduces the false negative rate and significantly improves the defect detection accuracy of the circuit board under test. Subsequently, a defect detection module electrically connected to the image acquisition device automatically performs defect detection on the multimodal images sent by the image acquisition device, avoiding the inefficiency caused by manual defect detection and significantly improving the defect detection efficiency of the circuit board under test. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the circuit board testing equipment involved in this application; Figure 2 This is a schematic diagram of low-angle light source imaging involved in the embodiments of this application; Figure 3 This is a schematic diagram of the coaxial light source module involved in the embodiments of this application; Figure 4 This is a schematic diagram of the defect detection module involved in the embodiments of this application; Figure 5 This is a schematic diagram of a circuit board testing system involved in the embodiments of this application.

[0017] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0018] Explanation of icon numbers: PCB1, Circuit Board Under Test; 10, Detection Dark Box; 20, Motion Platform; 30, Light Source Module; 40, Image Acquisition Device; 41, Image Acquisition Module; 50, Defect Detection Module; 41-1, First Image Acquisition Unit; 41-2, Second Image Acquisition Unit; 31, Low-Angle Light Source; 32, Coaxial Light Source; 33, Beam Splitter; 51, Control Unit; 52, Three-Dimensional Detection Unit; 53, Two-Dimensional Detection Unit; 54, Detection Output Unit; 61, Line-Side Warehouse; 62, Transmission Mechanism; 63, Sorting Mechanism; 64, Good Product Storage Area; 65, Defective Product Storage Area; S1, First Reference Signal Terminal. Detailed Implementation

[0019] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0020] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0021] With the continuous development of circuit board quality inspection technology, users have placed higher demands on the accuracy and efficiency of FPC (Flexible Printed Circuit) defect detection. However, existing FPC inspection equipment generally uses a single-angle front light source module for image acquisition. Since different defects in FPCs (such as minor scratches, dents, and residual copper) exhibit different characteristics under different lighting conditions, a single light source cannot simultaneously optimize the contrast of all defects, resulting in many defect features being inconspicuous or masked, thus increasing the false negative rate. Furthermore, the single imaging mode is sensitive to interference from dust and reflections, easily leading to false positives (i.e., over-detection rate) exceeding 70%, heavily relying on manual re-inspection. Therefore, improving the defect detection efficiency of flexible circuit boards while ensuring accuracy is a pressing technical problem that needs to be solved.

[0022] Therefore, based on the shortcomings of the above-mentioned flexible circuit board defect detection, the circuit board inspection equipment of this application is proposed. The circuit board inspection equipment of this application sets up a motion platform that drives the circuit board under test in a sealed inspection dark box. The inspection dark box is equipped with an image acquisition device and multiple light source modules. Since the image acquisition device integrates the image acquisition modules corresponding to each light source module, when each light source module illuminates the circuit board under test in the corresponding illumination mode, the image acquisition device acquires multimodal images of the circuit board under test under different illumination modes through the image acquisition modules. This significantly enhances the characteristic performance of different defect types of the circuit board under test (such as minor scratches, dents, and residual copper) under different light fields, making defects that were originally masked by a single light source on the circuit board under test stand out, thereby greatly reducing the false negative rate and significantly improving the defect detection accuracy of the circuit board under test. Subsequently, through the defect detection module electrically connected to the image acquisition device, the multimodal images sent by the image acquisition device are automatically inspected for defects, avoiding the low efficiency caused by manual defect inspection and significantly improving the defect detection efficiency of the circuit board under test.

[0023] Based on this, embodiments of this application provide a circuit board testing device, referring to... Figure 1 , Figure 1 This is a schematic diagram of the circuit board testing equipment involved in this application.

[0024] Reference Figure 1 This application provides a circuit board testing device, which includes: Detection of dark box 10.

[0025] In this embodiment, refer to Figure 1 The testing dark box 10 has a sealed structure and a light-shielding layer on its inner wall, which effectively isolates external ambient light interference and dust interference, providing a low-interference and high-stability optical imaging environment for the circuit board PCB1 under test, thereby significantly reducing the risk of false detection and missed detection caused by external environmental interference.

[0026] It should be noted that the light-blocking layer can be a black coating.

[0027] The motion platform 20 is disposed inside the detection dark box 10. The motion platform 20 carries the circuit board PCB1 under test and drives the circuit board PCB1 under test to be transmitted.

[0028] In this embodiment, the motion platform 20 is disposed inside the detection dark box 10. The motion platform 20 includes a three-axis servo motor and a platform carrier belt. The three-axis servo motor is connected to the platform carrier belt through mechanical transmission, and drives the platform carrier belt to move the circuit board PCB1 under test according to the specified path. Figure 1The image shows a stable movement in the direction indicated by the bold black arrow, providing a reliable positioning basis for subsequent multimodal image acquisition.

[0029] It should be noted that the circuit board under test, PCB1, is a flexible circuit board.

[0030] Multiple light source modules 30 are provided, all of which are located inside the detection dark box 10. Each light source module 30 illuminates the circuit board PCB1 under test in a corresponding illumination mode. An image acquisition device 40 is provided, which includes an image acquisition module 41 corresponding to each of the light source modules 30. The image acquisition device 40 is configured to acquire multimodal images of the circuit board PCB1 under test through each image acquisition device 40 in different illumination modes.

[0031] In this embodiment, different light source modules 30 correspond to different lighting modes, and the image acquisition device 40 includes an image acquisition module 41 corresponding to each light source module 30. When each light source module 30 illuminates the circuit board PCB1 under test in the corresponding lighting mode, the image acquisition device 40 acquires multimodal images of the circuit board PCB1 under test under different lighting modes through each image acquisition module 41. This fundamentally solves the problem of missed or misjudged defects caused by insufficient imaging features of a single light source, and provides a rich image data base for subsequent defect detection of the circuit under test.

[0032] A defect detection module 50 is electrically connected to the image acquisition device 40, and the defect detection module 50 is configured to perform defect detection based on the multimodal image sent by the image acquisition device 40.

[0033] In this embodiment, the defect detection module 50, which is electrically connected to the image acquisition device 40, automatically performs defect detection on the multimodal images sent by the image acquisition device 40, avoiding the low efficiency caused by manual defect detection and significantly improving the defect detection efficiency of the circuit board PCB1 under test.

[0034] Furthermore, based on the first embodiment of this application described above, a second embodiment of the circuit board testing equipment of this application is proposed, with reference to... Figure 2 , Figure 2 This is a schematic diagram of the imaging of a low-angle light source 31 involved in the embodiment of this application. In some feasible embodiments, the detection dark box 10 includes a first detection area, and one of the multiple sets of light source modules 30 is a low-angle light source 31, which is located on the side and above the first detection area.

[0035] In this embodiment, when the number of low-angle light sources 31 is only one, such as Figure 2The low-angle light source 31, indicated by the solid circle, is positioned above and to the side of the first detection area; furthermore, the number of low-angle light sources 31 can be expanded to two, one of which is... Figure 2 The solid circle indicates the low-angle light source 31 (i.e., the first light source), while the other is... Figure 2 The low-angle light source 31 (i.e., the second light source) shown by the dashed circle is arranged symmetrically with the first light source and is located on the upper side of both sides of the first detection area, which ensures the uniformity of illumination coverage of the circuit board PCB1 under test in the first detection area.

[0036] When the motion platform 20 moves the circuit board PCB1 under test to the first detection area, the low-angle light source 31 is incident on the circuit board PCB1 under test from the upper side position at a preset incident angle. The preset incident angle is the angle between the incident light of the low-angle light source 31 and the first detection area. The image acquisition module 41 corresponding to the low-angle light source 31 is a first image acquisition element 41-1. The first image acquisition element 41-1 is located directly above the first detection area and perpendicular to the first detection area. The first image acquisition element 41-1 is configured to acquire the dark field illumination image formed by the surface scattered light of the circuit board PCB1 under test when the low-angle light source 31 is irradiated.

[0037] In this embodiment, the first image acquisition device 41-1 (i.e., the image acquisition module 41 corresponding to the low-angle light source 31) is placed directly above the first detection area. The field of view of the first image acquisition device 41-1 can completely cover the entire surface area of ​​the circuit board PCB1 under test on the first detection area. The preset incident angle can be in the range of 15° to 30°, or it can be customized according to the application requirements. This application does not impose any restrictions here.

[0038] When the motion platform 20 moves the circuit board PCB1 under test to be aligned with... Figure 2When the first detection area overlaps, the circuit board detection device will immediately trigger the low-angle light source 31 to emit high-brightness light at a preset incident angle, accurately illuminating the entire upper surface of the circuit board PCB1 under test, which is already positioned in the first detection area. Simultaneously, the first image acquisition unit 41-1 will acquire a dark-field illumination image of the circuit board PCB1 under test illuminated by the low-angle light source 31. For example, when the circuit board PCB1 under test is illuminated by the low-angle light source 31 at a preset incident angle, the flat surface of the circuit board PCB1 under test will undergo specular reflection, that is, the incident light will be concentrated and reflected out at a reflection angle equal to the incident angle. This prevents the light reflected by the circuit board PCB1 under test from entering the first image acquisition unit 41-1 located directly above the first detection area, forming a dark-field background. At the same time, microscopic three-dimensional morphological defects existing on the surface of the circuit board PCB1 under test (such as scratches, raised residual copper, depressions, etc.) will damage the surface geometry at their location. When the low-angle light source 31 illuminates these defect areas, their irregular microscopic surface structure will produce a strong scattering effect on the incident light. That is, the incident light will scatter in all directions, including the direction of the light path received by the first image acquisition device 41-1. This allows the first image acquisition device 41-1 to efficiently and completely capture the scattered light signal generated by the microscopic three-dimensional morphological defects, thereby forming a dark-field illumination image with a dark background and bright three-dimensional morphological defect features.

[0039] Furthermore, in some other feasible embodiments, reference is made to... Figure 3 , Figure 3 This is a schematic diagram of the coaxial light source 32 module 30 involved in the embodiment of this application. The detection dark box 10 includes a second detection area. Another set of light source modules 30 in the plurality of sets of light source modules 30 is a coaxial light source 32 module 30. The coaxial light source 32 module 30 is disposed on the side of the second detection area close to the first detection area. The image acquisition module 41 corresponding to the coaxial light source 32 module 30 is a second image acquisition element 41-2. The second image acquisition element 41-2 is disposed directly above the second detection area and perpendicular to the second detection area. The second image acquisition element 41-2 is configured to acquire the bright field reflected light image of the circuit board PCB1 under test when illuminated by the coaxial light source 32 module 30.

[0040] Furthermore, in some feasible embodiments, reference is made to Figure 3 The coaxial light source 32 module 30 includes a coaxial light source 32 and a beam splitter 33; the coaxial light source 32 is disposed on the side of the second detection area close to the first detection area, and the beam splitter 33 is disposed between the second image acquisition device 41-2 and the second detection area. The reflective surface of the beam splitter 33 faces the light-emitting side of the coaxial light source 32, and the transmissive surface of the beam splitter 33 faces the second detection area.

[0041] In this embodiment, when the motion platform 20 moves the circuit board PCB1 under test away from the first detection area, the low-angle light source and the first image acquisition device 41-1 are simultaneously turned off. Next, refer to... Figure 3 When the motion platform 20 moves the circuit board PCB1 under test to be completely aligned with the second detection area, the parallel beam emitted by the coaxial light source 32 is horizontally directed towards the reflective surface of the beam splitter 33. After being deflected by the beam splitter 33 at 90 degrees, it forms a vertically downward beam that evenly illuminates the entire surface of the circuit board PCB1 under test. At this time, the smooth surface area of ​​the circuit board PCB1 under test follows the law of specular reflection, reflecting the vertically incident light back to the beam splitter 33 along the original path. After passing through the transmission surface of the beam splitter 33, it is completely received by the second image acquisition unit 41-2, which is set directly above the second detection area, forming a uniform and bright background area. However, two-dimensional defect areas with stains, oxide spots, ink, characters, holes, or uneven surface materials will produce diffuse reflection due to the destruction of specular reflection characteristics, resulting in a significant attenuation of the intensity of the vertically returned light. This will appear as a dark area with obvious characteristics in the image, thus enabling the second image acquisition unit 41-2 to accurately acquire a high-quality bright field reflected light image that completely characterizes the two-dimensional apparent defects of the surface.

[0042] Furthermore, in some other feasible embodiments, reference is made to... Figure 4 , Figure 4 This is a schematic diagram of the defect detection module 50 involved in the embodiment of this application. The multimodal image includes the dark field illumination image and the bright field reflected light image. The defect detection module 50 includes a control unit 51, a three-dimensional detection unit 52, a two-dimensional detection unit 53, and a detection output unit 54. The first analog signal terminal of the control unit 51 is electrically connected to the first image acquisition device 41-1, the first digital signal terminal of the control unit 51 is electrically connected to the input terminal of the three-dimensional detection unit 52, and the output terminal of the three-dimensional detection unit 52 is electrically connected to the first input terminal of the detection output unit 54. The second analog signal terminal of the control unit 51 is electrically connected to the second image acquisition device 41-2, the second digital signal terminal of the control unit 51 is electrically connected to the input terminal of the two-dimensional detection unit 53, and the output terminal of the two-dimensional detection unit 53 is electrically connected to the second input terminal of the detection output unit 54.

[0043] In this embodiment, the control unit 51 can be a controller carrying a digital-to-analog conversion module. Specifically, the control unit 51 receives the dark field illumination image and the bright field reflected light image through the first analog signal terminal and the second analog signal terminal. When the control unit 51 identifies a three-dimensional morphological defect feature in the dark field illumination image, the control unit 51 outputs a high level "1" through the first digital signal terminal. If there is no three-dimensional morphological defect feature in the dark field illumination image, the control unit 51 outputs a low level "0" through the first digital signal terminal. Similarly, when the control unit 51 identifies a two-dimensional appearance defect feature in the bright field reflected light image, the control unit 51 outputs a high level "1" through the first digital signal terminal. If there is no two-dimensional appearance defect feature in the bright field reflected light image, the control unit 51 outputs a low level "0" through the second digital signal terminal.

[0044] Furthermore, in some feasible embodiments, reference is made to Figure 4 The three-dimensional detection unit 52 and the two-dimensional detection unit 53 are both the same AND gate logic device; when the AND gate logic device is the three-dimensional detection unit 52, the first end of the AND gate logic device is electrically connected to the first digital signal terminal, the second end of the AND gate logic device is electrically connected to the preset first reference signal terminal S1, and the output end of the AND gate logic device constitutes the output end of the three-dimensional detection unit 52 and is electrically connected to the first input end.

[0045] In this embodiment, the reference signal output by the preset first reference signal terminal S1 is a signal indicating that the circuit board PCB1 under test has surface defects, and this reference signal can be represented by a high level. When the AND gate logic device is configured as a three-dimensional detection unit 52, the output terminal of the AND gate logic device outputs a high level if and only if both inputs are high level, so as to confirm that the circuit board PCB1 under test has three-dimensional morphological defect features.

[0046] When the AND gate logic device is the two-dimensional detection unit 53, the first terminal of the AND gate logic device is electrically connected to the second digital signal terminal, the second terminal of the AND gate logic device is electrically connected to the first reference signal terminal S1, and the output terminal of the AND gate logic device constitutes the output terminal of the two-dimensional detection unit 53 and is electrically connected to the second input terminal.

[0047] In this embodiment, when the AND gate logic device is configured as a two-dimensional detection unit 53, the output terminal of the AND gate logic device outputs a high level if and only if both inputs at both ends are high level, so as to confirm that the circuit board PCB1 under test has two-dimensional morphological defect features.

[0048] In summary, the circuit board testing equipment described in this application includes a motion platform 20 that drives the circuit board PCB1 under test within a sealed testing dark box 10. An image acquisition device 40 and multiple light source modules 30 are also installed within the testing dark box 10. Since the image acquisition device 40 integrates image acquisition modules 41 corresponding to each light source module 30, when each light source module 30 illuminates the circuit board PCB1 under test in its corresponding illumination mode, the image acquisition device 40 acquires multimodal images of the circuit board PCB1 under test under different illumination modes through the image acquisition modules 41. This significantly improves the accuracy of the imaging. The feature representation of different defect types (such as minor scratches, dents, and residual copper) of the PCB1 under test is enhanced under different light fields, so that defects that were originally masked by a single light source on the PCB1 under test can be highlighted, thereby greatly reducing the false negative rate and significantly improving the defect detection accuracy of the PCB1 under test. Subsequently, the defect detection module 50, which is electrically connected to the image acquisition device 40, automatically performs defect detection on the multimodal images sent by the image acquisition device 40, avoiding the low efficiency caused by manual defect detection and significantly improving the defect detection efficiency of the PCB1 under test.

[0049] Furthermore, in some other feasible embodiments, reference is made to... Figure 4 The detection output unit 54 is an OR gate logic device. The first input terminal of the OR gate logic device is electrically connected to the output terminal of the three-dimensional detection unit 52, and the second input terminal of the OR gate logic device is electrically connected to the output terminal of the two-dimensional detection unit 53.

[0050] In this embodiment, when the output of the three-dimensional detection unit 52 is high, the OR gate logic immediately outputs a high level regardless of the output state of the two-dimensional detection unit 53; when the output of the two-dimensional detection unit 53 is high, the OR gate logic also outputs a high level regardless of the output state of the three-dimensional detection unit 52; the OR gate logic outputs a low level only when both the three-dimensional detection unit 52 and the two-dimensional detection unit 53 output a low level.

[0051] It should be noted that a low-level output from the OR gate indicates that the detection result sent by the defect detection module 50 is qualified; a high-level output from the OR gate indicates that the detection result sent by the defect detection module 50 is unqualified.

[0052] Furthermore, based on the first and second embodiments of this application described above, a second embodiment of the circuit board testing equipment of this application is proposed with reference to... Figure 5 , Figure 5 This is a schematic diagram of a circuit board inspection system according to an embodiment of this application. In some feasible embodiments, the circuit board inspection system includes: The circuit board inspection equipment as described in any of the above; an automated loading and unloading module, wherein the automated loading and unloading module is used to transfer the circuit board PCB1 to be tested to the motion platform 20 in the circuit board inspection equipment, and to transfer the circuit board after defect detection to the target storage area.

[0053] Furthermore, in some feasible embodiments, reference is made to Figure 5 The automated loading and unloading module includes: a line-side bin 61 for storing circuit boards to be tested; and a transmission mechanism 62, disposed between the line-side bin 61 and the motion platform 20, for transferring the circuit board PCB1 to be tested from the line-side bin 61 to the motion platform 20.

[0054] Furthermore, in some other feasible embodiments, reference is made to... Figure 5 The automated loading and unloading module includes a sorting mechanism 63, which is electrically connected to the defect detection module 50 in the circuit board testing equipment. The sorting mechanism 63 is located between the motion platform 20 and the target storage area, which includes a good product storage area 64 and a defective product storage area 65. The sorting mechanism 63 is configured to place the circuit board after defect detection in the good product storage area 64 when the detection result sent by the defect detection module 50 is qualified, and to place the circuit board after defect detection in the defective product storage area 65 when the detection result sent by the defect detection module 50 is unqualified.

[0055] In this embodiment, the automated loading and unloading module is deeply integrated with the circuit board testing equipment to construct a complete intelligent closed-loop circuit board testing system. This circuit board testing system realizes full-process automation from flexible circuit board loading, multi-station testing, intelligent judgment to automatic sorting, minimizing manual intervention, ensuring the consistency of testing standards and the traceability of results, and significantly improving the overall operating efficiency and intelligence level of the production line.

[0056] The above are only some embodiments of this application and do not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A circuit board testing device, characterized in that, The circuit board testing equipment includes: Detecting the dark box; A motion platform is provided inside the detection dark box. The motion platform carries the circuit board under test and drives the circuit board under test to be transmitted. Multiple light source modules are provided, all of which are located inside the detection dark box. Each light source module illuminates the circuit board under test in its corresponding illumination mode. An image acquisition device, comprising an image acquisition module corresponding to each of the light source modules, wherein the image acquisition device is configured to acquire multimodal images of the circuit board under test under different lighting modes; A defect detection module is electrically connected to the image acquisition device, and the defect detection module is configured to perform defect detection based on the multimodal image sent by the image acquisition device.

2. The circuit board testing equipment as described in claim 1, characterized in that, The detection dark box includes a first detection area, and one of the multiple sets of light source modules is a low-angle light source, which is located above and to the side of the first detection area. When the motion platform moves the circuit board under test to the first detection area, the low-angle light source is incident on the circuit board under test at a preset incident angle, which is the angle between the incident light from the low-angle light source and the first detection area. The image acquisition module corresponding to the low-angle light source is a first image acquisition device. The first image acquisition device is located directly above the first detection area and perpendicular to the first detection area. The first image acquisition device is configured to acquire the dark field illumination image formed by the surface scattered light of the circuit board under test when illuminated by the low-angle light source.

3. The circuit board testing equipment as described in claim 2, characterized in that, The detection dark box includes a second detection area, and another set of the multiple sets of light source modules is a coaxial light source module, which is disposed on the side of the second detection area close to the first detection area. The image acquisition module corresponding to the coaxial light source module is a second image acquisition device. The second image acquisition device is located directly above the second detection area and perpendicular to the second detection area. The second image acquisition device is configured to acquire the bright field reflected light image of the circuit board under test when illuminated by the coaxial light source module.

4. The circuit board testing equipment as described in claim 3, characterized in that, The coaxial light source module includes a coaxial light source and a beam splitter; The coaxial light source is disposed on the side of the second detection area close to the first detection area. The beam splitter is disposed between the second image acquisition device and the second detection area. The reflecting surface of the beam splitter faces the light emitting side of the coaxial light source, and the transmitting surface of the beam splitter faces the second detection area.

5. The circuit board testing equipment as described in claim 4, characterized in that, The multimodal image includes the dark field illumination image and the bright field reflected light image, and the defect detection module includes a control unit, a three-dimensional detection unit, a two-dimensional detection unit, and a detection output unit; The first analog signal terminal of the control unit is electrically connected to the first image acquisition device, the first digital signal terminal of the control unit is electrically connected to the input terminal of the three-dimensional detection unit, and the output terminal of the three-dimensional detection unit is electrically connected to the first input terminal of the detection output unit. The second analog signal terminal of the control unit is electrically connected to the second image acquisition device, the second digital signal terminal of the control unit is electrically connected to the input terminal of the two-dimensional detection unit, and the output terminal of the two-dimensional detection unit is electrically connected to the second input terminal of the detection output unit.

6. The circuit board testing equipment as described in claim 5, characterized in that, Both the three-dimensional detection unit and the two-dimensional detection unit are the same AND gate logic components; When the AND gate logic device is the three-dimensional detection unit, the first terminal of the AND gate logic device is electrically connected to the first digital signal terminal, the second terminal of the AND gate logic device is electrically connected to the preset first reference signal terminal, and the output terminal of the AND gate logic device constitutes the output terminal of the three-dimensional detection unit and is electrically connected to the first input terminal. When the AND gate logic device is the two-dimensional detection unit, the first terminal of the AND gate logic device is electrically connected to the second digital signal terminal, the second terminal of the AND gate logic device is electrically connected to the first reference signal terminal, and the output terminal of the AND gate logic device constitutes the output terminal of the two-dimensional detection unit and is electrically connected to the second input terminal.

7. The circuit board testing equipment as described in claim 5, characterized in that, The detection output unit is an OR gate logic device. The first input terminal of the OR gate logic device is electrically connected to the output terminal of the three-dimensional detection unit, and the second input terminal of the OR gate logic device is electrically connected to the output terminal of the two-dimensional detection unit.

8. A circuit board testing system, characterized in that, The circuit board testing system includes: The circuit board testing equipment as described in any one of claims 1 to 7; An automated loading and unloading module is used to transfer the circuit board to be tested to the motion platform in the circuit board testing equipment, and to transfer the circuit board after defect detection to the target storage area.

9. The circuit board testing system as described in claim 8, characterized in that, The automated loading and unloading module includes: Line-side compartment, used to store circuit boards to be tested; A transmission mechanism is disposed between the line-side compartment and the motion platform for transmitting the circuit board under test from the line-side compartment to the motion platform.

10. The circuit board testing system as described in claim 8, characterized in that, The automated loading and unloading module includes: The sorting mechanism is electrically connected to the defect detection module in the circuit board testing equipment. The sorting mechanism is located between the motion platform and the target storage area, which includes a good product storage area and a defective product storage area. The sorting mechanism is configured to place the circuit board after defect detection in the good product storage area when the detection result sent by the defect detection module is qualified; and to place the circuit board after defect detection in the defective product storage area when the detection result sent by the defect detection module is unqualified.

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