Semiconductor test voltage precision regulation device

CN224803082UActive Publication Date: 2026-09-25WUXI FUTURE SEMICON CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202522169842.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-14
Publication Date
2026-09-25
Estimated Expiration
2035-10-14

AI Technical Summary

Technical Problem

[0004]为了弥补以上不足,本实用新型提供了一种半导体测试电压精准调控装置,旨在改善了现有技术中通过手动旋钮调节铁芯位置时,最小调节步长仅能达到0.5mm,无法精准控制变压器耦合系数,导致电压调节误差超过±2%,而且操作人员无法直观获取铁芯位置、实际输出电压等关键信息,只能通过外接仪表间接测量,不仅操作不便,且无法及时发现调节偏差,从而降低了电压调控的精准度的问题

Benefits of technology

本实用新型中转动杆与铁芯、圆盘的滑动配合,为铁芯移动提供稳定的导向基准,避免铁芯在移动过程中出现偏移、晃动,保证铁芯与绕组相对位置调节的精度,三组连接板将圆盘与铁芯稳定连接,可均匀传递圆盘的移动作用力,确保铁芯在移动过程中受力平衡,实现平稳移动,通过传感器与显示器的电性连接,能实时采集铁芯位置、绕组电流等关键参数并同步显示,操作人员可根据显示数据精准判断调节效果,及时修正调节动作,提升了电压调控的可控性与精准度。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224803082U_ABST
    Figure CN224803082U_ABST
Patent Text Reader

Abstract

The utility model relates to the field of semiconductor test discloses a kind of semiconductor test voltage accurate regulation and control device, including main control unit, precision signal generation module, power amplifier module, feedback detection module and load adaptation module, the load adaptation module includes isolation transformer, the utility model rotatable rod and the sliding fit of iron core, disc, provide stable guiding reference for iron core movement, avoid the deviation, shaking of iron core in moving process, guarantee the precision of relative position adjustment of iron core and winding, three groups of connecting plate will disc and iron core stable connection, can evenly transfer the moving force of disc, ensure that iron core is balanced in moving process, realize smooth movement, by the electrical connection of sensor and display, can real-time acquisition iron core position, winding current and other key parameters and synchronous display, operating personnel can accurately judge adjustment effect according to display data, timely correction adjustment action, improve the controllability and accuracy of voltage regulation.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing, and in particular to a device for precise control of semiconductor testing voltage. Background Technology

[0002] Semiconductor testing refers to the process of detecting, verifying, and screening the electrical characteristics, functional performance, reliability, and other indicators of semiconductor devices throughout their entire lifecycle, including research and development, manufacturing, and packaging, using specialized testing equipment and technologies. Its core objectives are to identify unqualified products, monitor the stability of production processes, and ensure the safety and reliability of end applications. It is a key link connecting manufacturing and application in the semiconductor industry.

[0003] Most load adapter modules are directly connected to the power grid and the load under test. When the external power grid fluctuates or transient current signals fed back from the load side are easily coupled to the test voltage output terminal through the circuit, the test voltage will drift and fluctuate. When adjusting the iron core position by manually turning the knob, the minimum adjustment step can only reach 0.5mm, which cannot accurately control the transformer coupling coefficient, resulting in a voltage regulation error of more than ±2%. Moreover, the operator cannot intuitively obtain key information such as the iron core position and the actual output voltage. They can only measure indirectly through external instruments, which is not only inconvenient to operate, but also cannot detect the adjustment deviation in time, thus reducing the accuracy of voltage regulation. To solve the above problems, a semiconductor test voltage precision regulation device is proposed. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a semiconductor test voltage precision control device, which aims to improve the existing technology where the minimum adjustment step size can only reach 0.5mm when adjusting the iron core position by manually turning the knob. This makes it impossible to accurately control the transformer coupling coefficient, resulting in a voltage regulation error of more than ±2%. Moreover, operators cannot intuitively obtain key information such as the iron core position and the actual output voltage, and can only indirectly measure it through external instruments. This is not only inconvenient to operate, but also makes it impossible to detect adjustment deviations in time, thereby reducing the accuracy of voltage regulation.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A semiconductor test voltage precision control device includes a main control unit, a precision signal generation module, a power amplification module, a feedback detection module, and a load adaptation module. The load adaptation module includes an isolation transformer, which has an iron core and windings. The isolation transformer has a moving component inside for driving the iron core to move. A door panel is provided on the front side of the isolation transformer, and a display is fixedly installed on the front side of the door panel. An installation frame is fixedly installed inside the isolation transformer. The windings are fixedly installed on the rear side of the inner wall of the isolation transformer, and the windings are located on the surface of the iron core. As a further description of the above technical solution: The moving component includes a rotating rod, the top and bottom of which are slidably mounted to the top and bottom of the inner wall of the mounting frame. The rotating rod is slidably mounted to the iron core. A disc is slidably mounted on the surface of the rotating rod. Three sets of connecting plates are fixedly mounted on the bottom of the disc. The bottom of the connecting plates is fixedly mounted to the top of the iron core. A sensor is fixedly mounted on the bottom of the disc. The output end of the sensor is electrically connected to the input end of the display. As a further description of the above technical solution: A mounting sleeve is slidably mounted on the surface of the rotating rod, and a fixed rod is rotatably mounted inside the mounting sleeve. Gears are fixedly mounted on both sides of the surface of the fixed rod, and toothed plates are fixedly mounted on both sides of the back of the rotating rod. The toothed plates and gears mesh. As a further description of the above technical solution: Fixing blocks are fixedly installed on both sides of the mounting sleeve, and a fixing plate is fixedly installed on the bottom of the disc. The bottom of the fixing plate and the top of the fixing blocks are fixedly installed. As a further description of the above technical solution: A worm gear is fixedly installed on the surface of the fixed rod, and a worm is rotatably installed on the inner wall of the mounting sleeve. The back of the worm extends through to the back of the mounting sleeve and is movably installed with the mounting sleeve. The worm meshes with the worm gear. A motor is fixedly installed on the back of the worm. A placement plate is fixedly installed at the bottom of the motor. The front side of the placement plate is fixedly installed with the back of the mounting sleeve. As a further description of the above technical solution: Two sets of circular blocks are fixedly installed on the surface of the iron core. The circular blocks and the rotating rod are slidably installed, and the outer side of the circular blocks is in contact with the inner wall of the mounting frame. As a further description of the above technical solution: A reinforcing block is fixedly installed on the outside of the fixing block, and the top of the reinforcing block and the bottom of the fixing plate are fixedly installed.

[0006] This utility model has the following beneficial effects: In this invention, the sliding cooperation between the rotating rod, the iron core, and the disc provides a stable guiding reference for the movement of the iron core, preventing the iron core from shifting or wobbling during movement and ensuring the accuracy of the relative position adjustment between the iron core and the winding. Three sets of connecting plates stably connect the disc and the iron core, evenly transmitting the moving force of the disc and ensuring that the iron core is balanced during movement, achieving smooth movement. Through the electrical connection between the sensor and the display, key parameters such as the iron core position and winding current can be collected in real time and displayed synchronously. Operators can accurately judge the adjustment effect based on the displayed data and correct the adjustment action in a timely manner, improving the controllability and accuracy of voltage regulation.

[0007] In this invention, when the fixing rod is rotated, the fixing rod can drive the gear to rotate. The rotation of the gear drives the mounting sleeve to move up and down through the toothed plate. The up and down movement of the mounting sleeve drives the disc, rotating rod and iron core to move to the top or bottom, thereby precisely adjusting the electromagnetic parameters of the winding, so that the load adapter module can more accurately match the voltage requirements of different semiconductor loads. Attached Figure Description

[0008] Figure 1 This is a front view of the isolation transformer of this utility model; Figure 2 This is a schematic diagram of the internal structure of the isolation transformer of this utility model; Figure 3 This is an exploded view of the iron core and windings of this utility model; Figure 4 This utility model Figure 3 Enlarged structural diagram at point A in the middle; Figure 5 This utility model Figure 3 Enlarged structural diagram at point B in the middle.

[0009] Legend: 1. Isolation transformer; 2. Iron core; 3. Winding; 4. Moving component; 41. Rotating rod; 42. Disc; 43. Connecting plate; 44. Sensor; 45. Mounting sleeve; 46. Fixing rod; 47. Gear; 48. Gear plate; 49. Fixing block; 410. Fixing plate; 411. Worm gear; 412. Worm; 413. Motor; 414. Placement plate; 5. Door panel; 6. Display; 7. Mounting frame; 8. Round block; 9. Reinforcing block. Detailed Implementation

[0010] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0011] Reference Figure 1-5This utility model provides an embodiment of a semiconductor test voltage precision control device, including a main control unit, a precision signal generation module, a power amplification module, a feedback detection module, and a load adaptation module. The load adaptation module includes an isolation transformer 1, which has an iron core 2 and a winding 3 inside. A moving component 4 for driving the iron core 2 is provided inside the isolation transformer 1. A door panel 5 is provided on the front side of the isolation transformer 1, and a display 6 is fixedly installed on the front side of the door panel 5. A mounting frame 7 is fixedly installed inside the isolation transformer 1. The winding 3 is fixedly installed on the rear side of the inner wall of the isolation transformer 1, and the winding 3 is located on the surface of the iron core 2. The isolation transformer 1 in the module effectively isolates external electrical interference, preventing interference signals from affecting the stability of the test voltage and providing a clean voltage environment for semiconductor testing. The moving component 4 can drive the iron core 2 to move. By changing the relative position of the iron core 2 and the winding 3, the electromagnetic parameters of the isolation transformer 1, such as the turns ratio and inductance, can be flexibly adjusted to adapt to the voltage requirements of semiconductor loads of different specifications. Subsequently, the key parameters such as voltage and the position of the iron core 2 can be intuitively displayed on the display 6 on the door panel 5. At the same time, combined with the adjustment of electromagnetic parameters by the movement of the iron core 2, the precise control of the semiconductor test voltage can be achieved, improving the accuracy and reliability of the test results.

[0012] Reference Figure 1-5The moving component 4 includes a rotating rod 41, the top and bottom of which are slidably mounted to the top and bottom of the inner wall of the mounting frame 7. The rotating rod 41 and the iron core 2 are slidably mounted. A disc 42 is slidably mounted on the surface of the rotating rod 41. Three sets of connecting plates 43 are fixedly mounted on the bottom of the disc 42. The bottom of the connecting plates 43 is fixedly mounted to the top of the iron core 2. A sensor 44 is fixedly mounted on the bottom of the disc 42. The output end of the sensor 44 is electrically connected to the input end of the display 6. The sliding cooperation between the rotating rod 41, the iron core 2, and the disc 42 provides a stable guiding reference for the movement of the iron core 2, preventing the iron core 2 from shifting or shaking during movement, and ensuring the accuracy of the relative position adjustment between the iron core 2 and the winding 3. The three sets of connecting plates 43 connect the disc 42 and the iron core 2. A stable connection ensures the uniform transmission of the moving force of the disc 42, guaranteeing the balance of forces on the core 2 during movement and achieving smooth motion. Through the electrical connection between the sensor 44 and the display 6, key parameters such as the position of the core 2 and the current of the winding 3 can be collected in real time and displayed synchronously. Operators can accurately judge the adjustment effect based on the displayed data and promptly correct the adjustment action, improving the controllability and accuracy of voltage regulation. A mounting sleeve 45 is slidably installed on the surface of the rotating rod 41, and a fixed rod 46 is rotatably installed inside the mounting sleeve 45. Gears 47 are fixedly installed on both sides of the surface of the fixed rod 46, and toothed plates 48 are fixedly installed on both sides of the back of the rotating rod 41. The toothed plates 48 and gears 47 mesh. When the fixed rod 46 is rotated, it drives the gears 47. The rotation of gear 47 drives the mounting sleeve 45 to move up and down via gear plate 48. This movement of the mounting sleeve 45 causes the disc 42, rotating rod 41, and iron core 2 to move upwards or downwards, thereby precisely adjusting the electromagnetic parameters of the winding 3. This allows the load adapter module to more accurately match the voltage requirements of different semiconductor loads. Fixing blocks 49 are fixedly installed on both sides of the mounting sleeve 45, and a fixing plate 410 is fixedly installed on the bottom of the disc 42. The bottom of the fixing plate 410 and the top of the fixing blocks 49 are fixedly installed. The fixed connection between the fixing blocks 49 and the fixing plate 410 rigidly connects the mounting sleeve 45 and the disc 42 as a single unit, ensuring that the movement of the mounting sleeve 45 is completely synchronously transmitted to the disc 42, preventing displacement between the mounting sleeve 45 and the disc 42. To prevent lag or deviation in adjustment and further ensure the accuracy of electromagnetic parameter adjustment of winding 3, a worm gear 411 is fixedly installed on the surface of the fixed rod 46, and a worm 412 is rotatably installed on the inner wall of the mounting sleeve 45. The back of the worm 412 extends through to the back of the mounting sleeve 45 and is movably installed with the mounting sleeve 45. The worm 412 meshes with the worm gear 411. A motor 413 is fixedly installed on the back of the worm 412, and a placement plate 414 is fixedly installed at the bottom of the motor 413. The front side of the placement plate 414 is fixedly installed on the back of the mounting sleeve 45. The worm gear 411 and worm 412 transmission has a self-locking characteristic. After the motor 413 stops driving, the worm gear 411 and worm 412 can maintain their current position, preventing the iron core 2 from shifting due to external force and ensuring the stability of the adjusted electromagnetic parameters.

[0013] Reference Figure 1-5 Two sets of circular blocks 8 are fixedly installed on the surface of the iron core 2. The circular blocks 8 and the rotating rod 41 are slidably installed. The outer side of the circular blocks 8 contacts the inner wall of the mounting frame 7. The sliding cooperation between the circular blocks 8 and the rotating rod 41 provides a limit for the iron core 2. The outer side of the circular blocks 8 contacts the inner wall of the mounting frame 7, which can replace the iron core 2 directly rubbing against the mounting frame 7, greatly reducing the wear degree of the iron core 2 and the mounting frame 7, and extending the service life of the iron core 2 and the mounting frame 7. A reinforcing block 9 is fixedly installed on the outer side of the fixing block 49. The top of the reinforcing block 9 is fixedly installed on the bottom of the fixing plate 410. The reinforcing block 9 connects the fixing block 49 and the fixing plate 410, which can effectively enhance the structural strength of the connection part, distribute the force of the connection part, and avoid the connection part from breaking or deforming when used for a long time or under great force.

[0014] Working principle: The system is initialized through the operation interface, and historical test data is cleared. According to the voltage requirements of the semiconductor under test, the initial test voltage signal parameters are preset in the precision signal generation module, and the voltage detection threshold is set in the feedback detection module to ensure that the subsequent detection can accurately identify the voltage deviation. Then, the initial parameters displayed on the display 6 are observed to confirm that the current position of the iron core 2 is in the default initial position, the winding 3 has no abnormal current signal, and the isolation transformer 1 has entered the electrical isolation state normally, eliminating the influence of external electrical interference on the test. Then, the motor 413 can be started. The output end of the motor 413 drives the worm 412 to rotate. The rotation of the worm 412 drives the worm wheel 411 to rotate. The rotation of the worm wheel 411 drives the fixed rod 46 to rotate. The rotation of the fixed rod 46 drives the gears 47 on both sides to rotate. The rotation of the gears 47 drives the mounting sleeve 45 to slide up and down along the rotating rod 41 through the tooth plate 48. The up and down movement of the mounting sleeve 45 drives the fixed block 49, the fixed plate 410 and the disc 42 to move synchronously. The movement of the disc 42 drives the iron core 2 to slide on the rotating rod 41. The operator observes the position change of the iron core 2 in real time through the display 6. When the relative position of the iron core 2 and the winding 3 reaches the electromagnetic parameters such as the ratio and inductance required to adapt to the load, the motor 413 is stopped. At this time, the self-locking characteristics of the worm gear 411 and the worm 412 can fix the position of the iron core 2 to prevent external force from causing displacement and ensure the stability of electromagnetic parameters. The main control unit controls the precision signal generation module to generate a preset test voltage signal. This signal is transmitted to the power amplification module, which amplifies the voltage signal to an amplitude that meets the test standard according to the load requirements. The amplified voltage signal is then transmitted to the winding 3 of the isolation transformer 1. Through the electromagnetic conversion of the isolation transformer 1, a test voltage adapted to the load is output to the semiconductor load. The feedback detection module collects the actual voltage signal, load current signal, and core 2 position signal transmitted by the sensor 44 of the moving component 4 in real time. All data are transmitted synchronously to the main control unit and the display 6. If there is a deviation between the actual output voltage and the preset value, the main control unit automatically calculates the deviation value and triggers the moving component 4 to fine-tune the position of the core 2 again. The voltage deviation is corrected by adjusting the electromagnetic parameters of the isolation transformer 1 until the output voltage accurately matches the preset value.

[0015] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor test voltage precision control device, comprising a main control unit, a precision signal generation module, a power amplification module, a feedback detection module, and a load adaptation module, characterized in that: The load adaptation module includes an isolation transformer (1), which has an iron core (2) and a winding (3) inside. The isolation transformer (1) has a moving component (4) for driving the iron core (2) to move inside. The isolation transformer (1) has a door panel (5) on the front side, and a display (6) is fixedly installed on the front side of the door panel (5). The isolation transformer (1) has a mounting frame (7) fixedly installed inside. The winding (3) is fixedly installed on the rear side of the inner wall of the isolation transformer (1) and is located on the surface of the iron core (2).

2. The semiconductor test voltage precision control device according to claim 1, characterized in that: The moving component (4) includes a rotating rod (41), the top and bottom of which are slidably mounted to the top and bottom of the inner wall of the mounting frame (7). The rotating rod (41) and the iron core (2) are slidably mounted. A disc (42) is slidably mounted on the surface of the rotating rod (41). Three sets of connecting plates (43) are fixedly mounted on the bottom of the disc (42). The bottom of the connecting plates (43) and the top of the iron core (2) are fixedly mounted. A sensor (44) is fixedly mounted on the bottom of the disc (42). The output end of the sensor (44) is electrically connected to the input end of the display (6).

3. The semiconductor test voltage precision control device according to claim 2, characterized in that: A mounting sleeve (45) is slidably mounted on the surface of the rotating rod (41), and a fixing rod (46) is rotatably mounted inside the mounting sleeve (45). Gears (47) are fixedly mounted on both sides of the surface of the fixing rod (46), and toothed plates (48) are fixedly mounted on both sides of the back of the rotating rod (41). The toothed plates (48) and the gears (47) mesh.

4. The semiconductor test voltage precision control device according to claim 3, characterized in that: Fixing blocks (49) are fixedly installed on both sides of the mounting sleeve (45), and a fixing plate (410) is fixedly installed on the bottom of the disc (42). The bottom of the fixing plate (410) and the top of the fixing block (49) are fixedly installed.

5. The semiconductor test voltage precision control device according to claim 3, characterized in that: A worm gear (411) is fixedly installed on the surface of the fixed rod (46), and a worm (412) is rotatably installed on the inner wall of the mounting sleeve (45). The back of the worm (412) extends through to the back of the mounting sleeve (45) and is movably installed with the mounting sleeve (45). The worm (412) meshes with the worm gear (411). A motor (413) is fixedly installed on the back of the worm (412). A placement plate (414) is fixedly installed at the bottom of the motor (413). The front side of the placement plate (414) is fixedly installed with the back of the mounting sleeve (45).

6. The semiconductor test voltage precision control device according to claim 2, characterized in that: Two sets of circular blocks (8) are fixedly installed on the surface of the iron core (2). The circular blocks (8) and the rotating rod (41) are slidably installed. The outer side of the circular blocks (8) is in contact with the inner wall of the mounting frame (7).

7. The semiconductor test voltage precision control device according to claim 4, characterized in that: A reinforcing block (9) is fixedly installed on the outside of the fixing block (49), and the top of the reinforcing block (9) and the bottom of the fixing plate (410) are fixedly installed.