A combination chip test fixture

Abstract

The utility model discloses a kind of combination chip test fixture, comprising: fixture base plate;Placement groove, be opened in fixture base plate surface, and placement groove is used to fix the chip to be measured;Multiple positioning holes one in array distribution, positioning hole one is opened on fixture base plate and is distributed in the both sides of placement groove;Alignment module, the both ends of alignment module are connected with positioning hole one, to make the counter-inserting mouth of alignment tool and placement groove match;Test module, test module includes claw and the radio frequency detection module between claw, radio frequency detection module inserts counter-inserting mouth and is electrically connected with the chip to be measured.The utility model is matched with the positioning hole one of array distribution by alignment module with the help of positioning shaft, realize position adjustment in conjunction with locking screw, the counter-inserting hole of alignment tool and chip value ball point correspond, can offset micrometer level position deviation of spliced welding chip, can sequentially test the component chip of spliced welding chip in turn, improve the applicability of test fixture, and greatly improve positioning accuracy.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and specifically to a combined chip testing fixture. Background Technology

[0002] For bonded chips composed of multiple individual chips, testing is required after manufacturing or processing. Because bonded chips are composed of multiple chips, and each chip is relatively small, precise control of the gaps between individual chips is difficult during actual production. This results in low positioning accuracy and alignment deviations during bonding, leading to micrometer-level positional offsets in individual chips. Such offsets cause misalignment between the test probes and chip pins, affecting signal transmission stability.

[0003] However, the test modules of the test fixtures in related technologies adopt a fixed structure, characterized by standardization and alignment. But their degree of adjustment is limited, and they cannot adapt to the slight positional differences caused by chip offset. This not only increases the calibration time before testing, but may also lead to distorted test results due to poor contact, significantly increasing the difficulty of testing the assembled chips. Utility Model Content

[0004] The purpose of this utility model is to provide a combined chip testing fixture in order to solve the above problems.

[0005] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0006] A combined chip test fixture includes: a fixture base plate;

[0007] A placement slot is formed on the surface of the fixture base plate, and the placement slot is used to fix the chip to be tested.

[0008] Multiple positioning holes are arranged in an array, the positioning holes being formed on the base plate of the fixture and distributed on both sides of the placement slot;

[0009] Alignment module, the two ends of which are connected to the positioning hole to match the insertion port of the alignment fixture with the placement slot;

[0010] The test module includes a latch and an RF detection module located between the latches. The RF detection module is inserted into the connector and electrically connected to the chip under test.

[0011] In one embodiment, positioning blocks are detachably connected to all four corners of the placement slot, and the positioning blocks are used to fix the chip under test.

[0012] In one embodiment, both ends of the alignment module are provided with downward-facing positioning shafts, and locking screws are inserted inside the positioning shafts. The positioning shafts are adapted to the first positioning hole, and the bottom of the first positioning hole is threaded.

[0013] In one embodiment, the alignment module includes an alignment bracket and an alignment fixture, wherein the alignment fixture is disposed in the insertion port, the center of the alignment fixture is an opening corresponding to the chip under test, and alignment holes are provided at the four corners of the alignment piece, the alignment holes corresponding to the spheres on the surface of the chip.

[0014] In one embodiment, positioning holes are provided at both ends of the alignment fixture.

[0015] In one embodiment, the test module includes a housing, with latches on both sides of the housing, a downward-facing radio frequency detection module inside the housing, a knob on the top of the housing for driving the radio frequency detection module to move up and down, and protective brackets on both sides of the housing.

[0016] In one embodiment, a positioning pin is provided below the radio frequency detection module, and the positioning pin is adapted to the positioning hole.

[0017] In one embodiment, the bottom of the housing is provided with a plurality of elastic contact points, and the alignment bracket is provided with elastic holes corresponding to the elastic contact points.

[0018] In one embodiment, one end of the radio frequency detection module is provided with a plug-in plate, and the plug-in plate is arrayed with multiple grounding probes and multiple radio frequency probes.

[0019] In one embodiment, the test fixture is applied to a chip assembly, the chip assembly being composed of multiple chip sets assembled together.

[0020] The beneficial effects of this utility model are as follows:

[0021] This invention uses an alignment module that engages with a positioning shaft and an array of positioning holes, combined with locking screws, to achieve position adjustment. The alignment holes of the alignment fixture correspond to the chip's spheres, which can offset the micron-level positional offset of the assembled chips. At the same time, the components of the assembled chips can be tested sequentially, improving the applicability of the test fixture and significantly improving the positioning accuracy.

[0022] To more clearly illustrate the structural features and functions of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0023] Figure 1This is a schematic diagram of the base plate of the fixture of this utility model;

[0024] Figure 2 This is a schematic diagram of the fixture base plate of this utility model after the chip to be tested is placed;

[0025] Figure 3 This is a schematic diagram of the inverted clamp base plate of this utility model;

[0026] Figure 4 This is a cross-sectional view of the alignment module of this utility model;

[0027] Figure 5 This is a perspective view of the alignment module of this utility model.

[0028] Figure 6 This is a perspective view of the alignment module and the fixture base plate of this utility model.

[0029] Figure 7 This is a top view of the alignment module and the fixture base plate of this utility model.

[0030] Figure 8 This is a three-dimensional view of the testing module of this utility model.

[0031] Figure 9 This is an inverted perspective view of the test module of this utility model.

[0032] Figure 10 This is a perspective view of the combined chip test fixture of this utility model.

[0033] Figure 11 This is a cross-sectional view of the combined chip test fixture of this utility model.

[0034] Reference numerals: 110, fixture base plate; 120, placement slot; 121, positioning block; 130, positioning hole one; 140, support leg; 200, alignment module; 210, alignment bracket; 211, positioning shaft; 212, locking screw; 213, elastic hole; 220, alignment fixture; 221, alignment hole; 222, positioning hole two; 230, insertion port; 300, test module; 310, housing; 311, knob; 312, protective bracket; 313, elastic contact point; 320, latch; 330, RF detection module; 331, positioning pin; 332, insertion plate; 400, chip under test. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0036] like Figures 1-11As shown, in one embodiment, a combined chip test fixture includes:

[0037] The fixture base plate 110 is a square plate.

[0038] The placement slot 120 is formed on the surface of the fixture base plate 110. The placement slot 120 is used to fix the chip under test 400. During the chip testing process, the chip under test 400 is fixed in the placement slot 120 for testing purposes.

[0039] Multiple positioning holes 130 are arranged in an array. The positioning holes 130 are opened on the fixture base plate 110 and distributed on both sides of the placement groove 120. Among them, the positioning holes 130 are initial positioning holes, which are used to match the positioning shafts 211 at both ends of the alignment module 200.

[0040] Alignment module 200, both ends of alignment module 200 are connected to positioning hole 130 so that the insertion port 230 of alignment fixture 220 matches the placement slot 120;

[0041] Specifically, since the chip under test 400 is a welded chip composed of multiple chips, each chip in the welded chip needs to be tested sequentially during testing. During the testing process, the two ends of the alignment module 200 are sequentially inserted into two of the positioning holes 130 array, so that the alignment module 200 can locate the position of each chip, and can achieve precise alignment of each chip for subsequent testing.

[0042] The test module 300 includes latches 320 and an RF detection module 330 located between the latches 320. The RF detection module 330 is inserted into the alignment port 230 and electrically connected to the chip under test 400. After the alignment module 200 is aligned with one of the chips under test 400, the test module 300 is inserted into the alignment module 200, making the RF detection module 330 electrically connected to the chip under test 400, thus enabling accurate testing of the chip under test 400.

[0043] like Figures 1-2 As shown, in one embodiment, positioning blocks 121 are detachably connected to the four corners of the placement slot 120. The positioning blocks 121 are used to fix the chip under test 400. The positioning blocks 121 are customized according to the chip's tolerances; different chips may have different tolerances. During actual testing, a suitable positioning block 121 can be replaced to achieve precise positioning. The positioning block 121 has two threaded holes on its surface, allowing for detachable connection to the placement slot 120 via screws. A recessed area is formed at one edge of the positioning block 121, which is used to fix the four corners of the chip under test 400.

[0044] like Figure 3 As shown, in one embodiment, support legs 140 are provided on both sides of the fixture base plate 110 to support the fixture base plate 110. In another embodiment, the length of the support leg 140 on one side of the fixture base plate 110 is greater than the length of the support leg 140 on the other side. Since there are support legs 140 on both sides of the fixture base plate 110, the fixture base plate 110 can be flipped over for use in window-opening debugging. It should be noted that the chip placement slot 120 is a partially through-hole mechanism, thus enabling the flipping and window-opening debugging function.

[0045] like Figures 4-8 As shown, in one embodiment, the alignment module 200 includes an alignment bracket 210 and an alignment fixture 220. The alignment fixture 220 is disposed within the socket, and its center has an opening corresponding to the chip under test 400. Alignment holes 221 are provided at each of the four corners of the alignment piece, corresponding to the spherical dots on the chip surface. Both ends of the alignment module 200 are provided with downward-facing positioning shafts 211. Locking screws 212 pass through the positioning shafts 211, which are adapted to positioning holes 130. The bottom of the positioning holes 130 is threaded. When locking is required, the locking screws 212 are rotated, moving downwards along the alignment bracket 210 and matching the threads inside the positioning holes 130. In some embodiments, there is a gap between the positioning shafts 211 and the positioning holes 130, the size of which is specifically determined according to the chip's offset. Meanwhile, since there is a gap between the positioning shaft 211 and the positioning hole 130, the position of the alignment module 200 can be adjusted so that the alignment hole 221 is aligned with the four ball placement points of the chip under test 400, and then the locking screw 212 can be rotated. The ball placement points are the ball placement points at the outer edge of the chip under test 400, so as not to affect the chip under test 400.

[0046] In one embodiment, the alignment fixture 220 is an alignment piece with an opening in the middle, which is detachably connected to the alignment bracket 210 by screws.

[0047] In one embodiment, positioning holes 222 are provided at both ends of the alignment fixture 220. These positioning holes 222 connect with positioning pins 331 in the test module 300, achieving precise alignment between the alignment module 200 and the test module 300. The specific structure of the test module 300 will be described below:

[0048] like Figures 8-9As shown, the test module 300 includes a housing 310, with latches 320 on both sides of the housing 310, and an RF detection module 330 facing downwards inside the housing 310. A knob 311 is provided on the top of the housing 310, which is used to drive the RF detection module 330 to rise and fall. Protective brackets 312 are provided on both sides of the housing 310.

[0049] The latch 320 is connected to the latches on both sides of the alignment module 200. After inserting the test module 300 into the socket of the alignment module 200, pressing the latch 320 achieves a fixed connection between the test module 300 and the alignment module 200. Then, rotating the knob 311 causes the RF detection module 330 to move up and down. When not being tested, the RF detection module 330 is always at the highest point of the housing 310, meaning the probe of the RF detection module 330 will not exceed the protective bracket 312. During testing, rotating the knob lowers the RF detection module 330, and the RF detection module 330 becomes electrically connected to the chip under test 400. It should be noted that the technical solution of using the knob 311 to move the RF detection module 330 up and down is a relatively mature existing technology and is not an innovation of this application, so it will not be described in detail here.

[0050] In one embodiment, a plurality of protective brackets 312 are provided on the outside of the housing 310. The protective brackets 312 are bent so that the radio frequency detection module 330 inside the housing 310 is suspended when not in use, so as to protect its probes and allow the test module 300 to be placed horizontally on the table without touching the probes.

[0051] In one embodiment, the bottom of the housing 310 is provided with a plurality of elastic contact points 313, and the alignment bracket 210 is provided with elastic holes 213 corresponding to the elastic contact points 313. Through the cooperation and alignment of the elastic contact points 313 and the elastic holes 213, the positional accuracy of the test module 300 when inserted into the alignment module 200 can be guaranteed.

[0052] In one embodiment, one end of the RF detection module 330 is provided with a connector plate 332, on which multiple ground probes and multiple RF probes are arrayed. These probes can contact the ball-mounting points of the chip under test 400, thereby enabling testing of the chip under test 400. It should be noted that multiple interfaces are provided on one side of the RF detection module 330, which connect to the RF probes and ground probes, and can be connected to external testing equipment.

[0053] In one embodiment, the combined chip test fixture is a fixture used to test the assembled chips, which are composed of multiple chips, specifically, the number of chips is not less than two. In one embodiment, each assembled chip consists of 16 chips.

[0054] like Figures 10-11 As shown, the steps for testing assembled chips using a chip test fixture include:

[0055] The chip is placed between the positioning block 121 and the fixture base plate 110, i.e., in the placement slot 120;

[0056] Assemble the alignment module 200 with the fixture base plate 110;

[0057] During assembly, determine the initial positioning hole 130, which is the location of the individual chip to be tested, and match the positioning shaft 211 with the initial positioning hole.

[0058] Positioning is achieved by using four alignment holes 221 on the alignment fixture 220 to align with the four ball placement points of a single chip on the chip assembly. When the four alignment holes 221 are aligned with the four ball placement points, the locking screw 212 is tightened. The locking screw 212 moves down along the alignment bracket 210, thereby locking.

[0059] During testing, the mating plate 332 of the test module 300 is initially positioned with the mating port 230 of the alignment module 200 to achieve mating.

[0060] The latch 320 locks the test module 300 and the alignment module 200 together;

[0061] Rotating knob 311 causes the RF test module 300 of test module 300 to move downward, so that positioning pin 331 contacts positioning hole and elastic contact point 313 contacts elastic hole 213, and then test can be performed.

[0062] After the test is completed, press and hold the latches 320 on both sides to separate the test module 300 from the alignment module 200.

[0063] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A combined chip test fixture, characterized in that, include: Fixture base plate; A placement slot is formed on the surface of the fixture base plate, and the placement slot is used to fix the chip to be tested. Multiple positioning holes are arranged in an array, the positioning holes being formed on the base plate of the fixture and distributed on both sides of the placement slot; The alignment module has two ends connected to the positioning hole so that the insertion port of the alignment module matches the placement slot. The test module includes a latch and an RF detection module located between the latches. The RF detection module is inserted into the connector and electrically connected to the chip under test.

2. The combined chip test fixture according to claim 1, characterized in that, The four corners of the placement slot are detachably connected to positioning blocks, which are used to fix the chip under test.

3. The combined chip test fixture according to claim 1, characterized in that, Both ends of the alignment module are provided with downward-facing positioning shafts, and locking screws are inserted inside the positioning shafts. The positioning shafts are adapted to the first positioning hole, and the bottom of the first positioning hole is threaded.

4. The combined chip test fixture according to claim 1, characterized in that, The alignment module includes an alignment bracket and an alignment fixture, wherein the alignment fixture is disposed in the insertion port, the center of the alignment fixture is an opening corresponding to the chip under test, and alignment holes are provided at the four corners of the alignment fixture, the alignment holes corresponding to the spheres on the surface of the chip.

5. The combined chip test fixture according to claim 4, characterized in that, The alignment fixture has two positioning holes at both ends.

6. The combined chip test fixture according to claim 5, characterized in that, The test module includes a housing with latches on both sides. The radio frequency detection module facing downwards is located inside the housing. A knob is located on the top of the housing for driving the radio frequency detection module to move up and down. Protective brackets are provided on both sides of the housing.

7. The combined chip test fixture according to claim 6, characterized in that, A positioning pin is provided below the radio frequency detection module, and the positioning pin is adapted to the positioning hole.

8. The combined chip test fixture according to claim 6, characterized in that, The bottom of the housing is provided with multiple elastic contact points, and the alignment bracket is provided with elastic holes corresponding to the elastic contact points.

9. The combined chip test fixture according to claim 1, characterized in that, The radio frequency detection module is provided with a plug-in board at one end, and multiple grounding probes and multiple radio frequency probes are arrayed on the plug-in board.

10. The combined chip test fixture according to claim 1, characterized in that, The test fixture is used for bonding chips, which are composed of multiple sets of chip bonding.

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