Aging test board and semiconductor test apparatus

Abstract

The application discloses an aging test board and a semiconductor test device, which comprise an outer frame, a main board and a reinforcing frame. The outer frame comprises a first rod body, a second rod body, a third rod body and a fourth rod body, and the first rod body, the second rod body, the third rod body and the fourth rod body enclose a mounting area. The main board is arranged on the outer frame, and the main board is provided with a socket and a connector. The reinforcing frame is arranged on the side of the main board away from the socket, the reinforcing frame is arranged in the mounting area, and the reinforcing frame abuts against the outer frame. The reinforcing frame comprises a first reinforcing frame and a second reinforcing frame. The first reinforcing frame and the second reinforcing frame are arranged in abutment in the mounting area, and the first reinforcing frame and the second reinforcing frame each comprise a first reinforcing piece and a second reinforcing piece. The first reinforcing piece and the second reinforcing piece are arranged in an integrated mode, and the first reinforcing piece and the second reinforcing piece are arranged in a cross mode. Through the structural arrangement of the reinforcing frame, the deflection deformation of the aging test board caused by the acting force can be effectively reduced, and the influence of the deflection deformation on the test effect is reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to an aging test board and semiconductor testing equipment. Background Technology

[0002] In semiconductor testing, aging test boards are commonly used. These boards are subjected to high and low temperature cycling during use. Aging test boards are prone to bending and deformation, which can damage the internal structure or components and affect the stability of signal transmission, thus impacting test results. Utility Model Content

[0003] This application aims to provide an aging test board and semiconductor testing equipment, which are designed to reduce the impact of flexural deformation on the test results of the aging test board.

[0004] In a first aspect, this application proposes an aging test board, including an outer frame, a main board, and a reinforcing frame. Specifically, the outer frame includes a first rod, a second rod, a third rod, and a fourth rod, which together form an installation area. The main board is disposed on the outer frame and has multiple sockets and connectors. The multiple sockets are used to install electronic devices to be tested for aging. The reinforcing frame is disposed on the side of the main board away from the sockets. The reinforcing frame is located in the installation area and abuts against the outer frame. The reinforcing frame includes a first reinforcing frame and a second reinforcing frame. The first reinforcing frame and the second reinforcing frame are abutting against each other in the installation area. Both the first reinforcing frame and the second reinforcing frame include a plurality of first reinforcing members and a plurality of second reinforcing members. The first reinforcing members and the second reinforcing members are integrally disposed, and the plurality of first reinforcing members and the plurality of second reinforcing members are intersecting.

[0005] In the above scheme, the mounting area formed by the first, second, third, and fourth rods of the outer frame provides a stable mounting environment for the motherboard and the reinforcing frame. The motherboard provides working signals for aging tests, such as clock signals and reset signals. The reinforcing frame is abutted against the outer frame, and the first and second reinforcing frames abut against each other within the mounting area, which enhances the structural strength and load-bearing capacity of the reinforcing frame. The first and second reinforcing members of the reinforcing frame are intersected and integrally set, further improving the structural strength of the reinforcing frame. By designing the structure of the reinforcing frame and placing it on the side of the motherboard away from the socket, the reinforcing frame can absorb the forces received by the motherboard, effectively reducing the bending deformation of the aging test board caused by forces during testing, and reducing the impact of bending deformation on the test results.

[0006] In some embodiments, the aging test board further includes a cover plate located on the side of the outer frame away from the motherboard. The cover plate has several heat dissipation holes that penetrate the cover plate along the thickness direction of the motherboard. Adding a cover plate enhances the stability of the reinforcing frame and provides physical protection for the aging test board. By providing several heat dissipation holes in the cover plate, when the motherboard generates heat during testing, the heat can flow through the gap between the first and second reinforcing members to the cover plate and then escape through the heat dissipation holes, thereby improving the motherboard's heat dissipation efficiency.

[0007] In some embodiments, the cover plate includes a first protruding plate and a second protruding plate disposed opposite each other along a first direction, a first mounting plate and a second mounting plate disposed opposite each other along a second direction, and a third mounting plate and a fourth mounting plate disposed opposite each other along the second direction. The first mounting plate, the second mounting plate, the third mounting plate, and the fourth mounting plate are provided with mounting holes. The first direction and the second direction are perpendicular to each other. The first and second protruding plates on the cover plate improve the stability of the cover plate in the first direction. The first mounting plate, the second mounting plate, the third mounting plate, and the fourth mounting plate, with mounting holes on the mounting plates, allow the cover plate to be mounted on the outer frame using fasteners, dispersing the fastening force and making the connection between the cover plate and the outer frame more secure.

[0008] In some embodiments, the motherboard is connected to the first, second, third, and fourth rods, and the cover plate is connected to the first and third rods. Connecting the motherboard to all four rods of the outer frame effectively improves the connection stability between the motherboard and the outer frame. Connecting the cover plate to the first and third rods enhances the stability of the cover plate and reduces the fastening force borne by the outer frame.

[0009] In some embodiments, the first and third rods have grooves on the side away from the main board, and screw holes are provided in the grooves. The first and third mounting plates of the cover plate are disposed in the grooves of the first rods, and the second and fourth mounting plates are disposed in the grooves of the third rods. The mounting holes correspond to the screw holes. By creating grooves in the first and third rods and installing the mounting plates of the cover plate in the grooves, the overall integrity of the cover plate and the outer frame is enhanced, the structural strength of the outer frame and the cover plate is improved, and the resistance to flexural deformation of the aging test plate is further enhanced.

[0010] In some embodiments, the second and fourth rods have fitting openings at both ends, and the first and third rods have fitting protrusions at both ends. The fitting openings and fitting protrusions are installed by screws. The fitting openings on the second and fourth rods, and the fitting protrusions on the first and third rods, form a fitting structure, making the connection between the various rods of the outer frame more robust and stable.

[0011] In some embodiments, the first reinforcing member has a plurality of first protrusions on the side facing the motherboard, the plurality of first protrusions being spaced apart, and at least a portion of the first protrusions abutting against the motherboard. The second reinforcing member has a plurality of second protrusions on the side facing the motherboard, the plurality of second protrusions being spaced apart, and at least a portion of the second protrusions abutting against the motherboard. The plurality of first protrusions and the plurality of second protrusions abutting against the motherboard, with multiple contact points, can absorb the force received by the motherboard over a wider area, and can disperse the local force to the entire reinforcing frame, improving the uniformity of force distribution, thereby better absorbing the force.

[0012] In some embodiments, a first clearance opening is formed between two adjacent first protrusions. The first clearance opening is used to avoid components on the side of the motherboard away from the socket. The formation of a plurality of first clearance openings between a plurality of first protrusions can provide space for components on the motherboard, which is beneficial to improving the compactness of the aging test board and also to the heat dissipation of the motherboard.

[0013] In some embodiments, a first connecting plate is provided on the side of the first reinforcing frame facing the second reinforcing frame, and a second connecting plate is provided on the side of the second reinforcing frame facing the first connecting plate, with the first connecting plate abutting against the second connecting plate. Adding the first and second connecting plates helps to improve the structural strength at the connection between the first and second reinforcing frames and enhances the stability of the reinforcing frames.

[0014] Secondly, this application also proposes a semiconductor testing device, including an aging test board according to any embodiment of the first aspect.

[0015] Additional aspects and advantages of the embodiments of this application will be described, shown, or illustrated in part by way of implementation of the embodiments of this application in the following description. Attached Figure Description

[0016] One or more embodiments are illustrated by way of example with reference to the accompanying drawings, which are not intended to limit the embodiments, and elements having the same reference numerals in the drawings are designated as similar elements.

[0017] Figure 1 This is a schematic diagram of the structure of an aging test plate according to some embodiments of this application; Figure 2 This is an exploded view of an aging test board according to some embodiments of this application; Figure 3 This is a schematic diagram of the structure of the reinforcing frame in some embodiments of this application; Figure 4 This is a schematic diagram of the structure of the cover plate in some embodiments of this application; Figure 5 This is an exploded view of a portion of the structure of an aging test board according to some embodiments of this application; Figure 6This is a schematic diagram of the outer frame of some embodiments of this application.

[0018] Explanation of reference numerals in the attached drawings: 1. Outer frame; 11. First rod; 12. Second rod; 13. Third rod; 14. Fourth rod; 15. Groove; 16. Screw hole; 17. Fitting protrusion; 18. Fitting opening; 2. Motherboard; 21. Socket; 22. Connector; 3. Reinforcing frame; 31. First reinforcing member; 311. First protrusion; 312. First clearance opening; 32. Second reinforcing member; 321. Second protrusion; 33. First reinforcing frame; 331. First connecting plate; 34. Second reinforcing frame; 341. Second connecting plate; 4. Cover plate; 41. Heat dissipation holes; 42. First protruding plate; 43. Second protruding plate; 44. First mounting plate; 45. Second mounting plate; 46. Third mounting plate; 47. Fourth mounting plate; 48. Mounting holes; 101. Installation area; X, the first direction; Y, the second direction. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0020] In this application, the reference to "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments.

[0021] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0022] The technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0023] In one aspect, this application proposes an aging test board, including an outer frame 1, a main board 2, and a reinforcing frame 3.

[0024] The outer frame 1 described above provides an attachment environment and physical protection for other components of the aging test panel. To maintain the accuracy and stability of the aging test panel during testing, the outer frame 1 can be configured in a closed loop. Furthermore, since the testing environment is typically high-temperature, the outer frame 1 can be made of high-temperature resistant materials such as epoxy fiberglass cloth.

[0025] For the aforementioned motherboard 2, as the main component in the aging test, it is directly connected to the device under test (such as chips, capacitors, etc.) and the test system. To maintain good test accuracy, motherboard 2 can adopt a grounding design that separates analog ground signals and digital ground signals, which can reduce signal interference caused by poor grounding. Furthermore, since the test environment is usually a high-temperature environment, motherboard 2 can use a substrate with a high glass transition temperature and heat distortion temperature, such as composite materials including fiberglass cloth and epoxy resin.

[0026] For the aforementioned reinforcing frame 3, to ensure good stability and testing accuracy of the aging test plate, and to better improve its resistance to deformation, the reinforcing frame 3 can be made of a material with high strength and hardness. Furthermore, since the testing environment is typically high-temperature, the material of the reinforcing frame 3 needs good thermal stability. In this application, the material of the reinforcing frame 3 can be a polyhexamethylene adipamide composite material containing 10% glass fiber. The polyhexamethylene adipamide composite material containing 10% glass fiber has good thermal stability, with a heat distortion temperature exceeding 220℃. Furthermore, it has good mechanical strength and good resistance to external deformation, thus effectively meeting the above requirements.

[0027] Specifically, please refer to Figures 1 to 3 The outer frame 1 includes a first rod 11, a second rod 12, a third rod 13, and a fourth rod 14, which together form an installation area 101. A main board 2 is disposed on the outer frame 1. The main board 2 has multiple sockets 21 and connectors 22. The multiple sockets 21 are used to install electronic devices to be tested for aging. A reinforcing frame 3 is disposed on the side of the main board 2 away from the sockets 21. The reinforcing frame 3 is located in the installation area 101 and abuts against the outer frame 1. The reinforcing frame 3 includes a first reinforcing frame 33 and a second reinforcing frame 34. The first reinforcing frame 33 and the second reinforcing frame 34 are abutted against each other in the installation area 101. Both the first reinforcing frame 33 and the second reinforcing frame 34 include several first reinforcing members 31 and several second reinforcing members 32. The first reinforcing members 31 and the second reinforcing members 32 are integrally disposed, and the several first reinforcing members 31 and the several second reinforcing members 32 are arranged intersectingly.

[0028] In the above scheme, the mounting area 101 formed by the first rod 11, the second rod 12, the third rod 13, and the fourth rod 14 of the outer frame 1 provides a stable mounting environment for the main board 2 and the reinforcing frame 3. The main board 2 provides working signals for aging tests, such as clock signals and reset signals. The reinforcing frame 3 is abutted against the outer frame 1, and the first reinforcing frame 33 and the second reinforcing frame 34 are abutted against each other within the mounting area 101, which can enhance the structural strength of the reinforcing frame 3 and improve its load-bearing capacity. The first reinforcing member 31 and the second reinforcing member 32 of the reinforcing frame 3 are intersected and integrally set, further enhancing the structural strength of the reinforcing frame 3. By setting the structure of the reinforcing frame 3 and placing the reinforcing frame 3 on the side of the main board 2 away from the socket 21, the reinforcing frame 3 can absorb the force received by the main board 2, which can effectively reduce the bending deformation of the aging test board caused by the force during the test operation and reduce the impact of bending deformation on the test results.

[0029] In some embodiments, please refer to Figure 2 and Figure 4 The aging test board also includes a cover plate 4, which is located on the side of the outer frame 1 away from the motherboard 2. The cover plate 4 has several heat dissipation holes 41 that extend through it along the thickness direction of the motherboard 2. Adding the cover plate 4 enhances the stability of the reinforcing frame 3 and provides physical protection for the aging test board. By providing several heat dissipation holes 41 to the cover plate 4, when the motherboard 2 generates heat during testing, the heat can flow through the gap between the first reinforcing member 31 and the second reinforcing member 32 to the cover plate 4 and then escape through the heat dissipation holes 41, thereby improving the heat dissipation efficiency of the motherboard 2.

[0030] In some embodiments, please refer to Figure 4 The cover plate 4 includes a first protruding plate 42 and a second protruding plate 43 arranged opposite each other along a first direction X, a first mounting plate 44 and a second mounting plate 45 arranged opposite each other along a second direction Y, and a third mounting plate 46 and a fourth mounting plate 47 arranged opposite each other along a second direction Y. Mounting holes 48 are provided on the first mounting plate 44, the second mounting plate 45, the third mounting plate 46, and the fourth mounting plate 47. The first direction X and the second direction Y are perpendicular to each other. The first protruding plate 42 and the second protruding plate 43 on the cover plate 4 improve the stability of the cover plate 4 in the first direction X. The mounting holes 48 on the first mounting plate 44, the second mounting plate 45, the third mounting plate 46, and the fourth mounting plate 47 allow the cover plate 4 to be mounted on the outer frame 1 using fasteners, which disperses the fastening force and makes the connection between the cover plate 4 and the outer frame 1 more secure.

[0031] In some embodiments, the motherboard 2 is connected to the first rod 11, the second rod 12, the third rod 13, and the fourth rod 14, and the cover plate 4 is connected to the first rod 11 and the third rod 13. Connecting the motherboard 2 to all four rods of the outer frame 1 effectively improves the connection stability between the motherboard 2 and the outer frame 1. Connecting the cover plate 4 to the first rod 11 and the third rod 13 enhances the stability of the cover plate 4 and reduces the fastening force borne by the outer frame 1.

[0032] In some embodiments, please refer to Figure 5 The first rod 11 and the third rod 13 have grooves 15 on the side away from the main board 2, and screw holes 16 are provided in the grooves 15. The first mounting plate 44 and the third mounting plate 46 of the cover plate 4 are set in the groove 15 of the first rod 11, and the second mounting plate 45 and the fourth mounting plate 47 are set in the groove 15 of the third rod 13. The mounting holes 48 are correspondingly set with the screw holes 16. By opening grooves 15 in the first rod 11 and the third rod 13 and installing the mounting plates of the cover plate 4 in the grooves 15, the integrity of the cover plate 4 and the outer frame 1 is enhanced, the structural strength of the outer frame 1 and the cover plate 4 is improved, and the ability of the aging test plate to resist flexural deformation is further enhanced.

[0033] In some embodiments, please refer to Figure 6 The second rod 12 and the fourth rod 14 have fitting openings 18 at both ends, and the first rod 11 and the third rod 13 have fitting protrusions 17 at both ends. The fitting openings 18 and the fitting protrusions 17 are installed by screws. The fitting openings 18 on the second rod 12 and the fourth rod 14, and the fitting protrusions 17 on the first rod 11 and the third rod 13, form a fitting structure, making the connection between the various rods of the outer frame 1 more secure and the stability stronger.

[0034] In some embodiments, please refer to Figure 3 The first reinforcing member 31 has a plurality of first protrusions 311 on the side facing the motherboard 2, with the protrusions 311 spaced apart, and at least a portion of the first protrusions 311 abutting against the motherboard 2. The second reinforcing member 32 has a plurality of second protrusions 321 on the side facing the motherboard 2, with the second protrusions 321 spaced apart, and at least a portion of the second protrusions 321 abutting against the motherboard 2. The multiple contact points of the first protrusions 311 and the second protrusions 321 abutting against the motherboard 2 can absorb the force received by the motherboard 2 over a wider area, and can distribute the local force to the entire reinforcing frame 3, improving the uniformity of force distribution, thereby better absorbing the force.

[0035] In some embodiments, please refer to Figure 3A first clearance opening 312 is formed between two adjacent first protrusions 311. The first clearance opening 312 is used to avoid components on the side of the motherboard 2 away from the socket 21. The formation of several first clearance openings 312 between several first protrusions 311 can provide space for components on the motherboard 2, which is beneficial to improving the compactness of the aging test board and also to heat dissipation of the motherboard 2.

[0036] In some embodiments, please refer to Figure 3 A first connecting plate 331 is provided on the side of the first reinforcing frame 33 facing the second reinforcing frame 34, and a second connecting plate 341 is provided on the side of the second reinforcing frame 34 facing the first connecting plate 331. The first connecting plate 331 and the second connecting plate 341 abut against each other. The addition of the first connecting plate 331 and the second connecting plate 341 helps to improve the structural strength at the connection between the first reinforcing frame 33 and the second reinforcing frame 34, and enhances the stability of the reinforcing frame 3.

[0037] Secondly, this application also proposes a semiconductor testing device, including an aging test board according to any embodiment of the first aspect.

[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this application as described above, which are not provided in detail for the sake of brevity; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An aging test plate, characterized in that, include: The outer frame includes a first rod, a second rod, a third rod, and a fourth rod, which together form an installation area. A motherboard is disposed on the outer frame. The motherboard is provided with multiple sockets and connectors. The multiple sockets are used to install electronic devices to be tested for aging. A reinforcing frame is disposed on the side of the motherboard away from the socket. The reinforcing frame is located in the mounting area and abuts against the outer frame. The reinforcing frame includes a first reinforcing frame and a second reinforcing frame. The first reinforcing frame and the second reinforcing frame are abutted against each other in the mounting area. Both the first reinforcing frame and the second reinforcing frame include a plurality of first reinforcing members and a plurality of second reinforcing members. The first reinforcing members and the second reinforcing members are integrally disposed, and the plurality of first reinforcing members and the plurality of second reinforcing members are arranged intersectingly.

2. The aging test plate according to claim 1, characterized in that, The aging test board also includes a cover plate, which is located on the side of the outer frame away from the motherboard. The cover plate has several heat dissipation holes that penetrate the cover plate along the thickness direction of the motherboard.

3. The aging test plate according to claim 2, characterized in that, The cover plate includes a first protruding plate and a second protruding plate arranged opposite each other along a first direction, a first mounting plate and a second mounting plate arranged opposite each other along a second direction, and a third mounting plate and a fourth mounting plate arranged opposite each other along the second direction; the first mounting plate, the second mounting plate, the third mounting plate and the fourth mounting plate are provided with mounting holes; the first direction and the second direction are perpendicular to each other.

4. The aging test plate according to claim 2, characterized in that, The main board is connected to the first rod, the second rod, the third rod, and the fourth rod, and the cover plate is connected to the first rod and the third rod.

5. The aging test plate according to claim 3, characterized in that, The first rod and the third rod have grooves on the side away from the main board, and screw holes are provided in the grooves. The first mounting plate and the third mounting plate of the cover plate are disposed in the groove of the first rod, and the second mounting plate and the fourth mounting plate are disposed in the groove of the third rod. The mounting holes are provided corresponding to the screw holes.

6. The aging test plate according to claim 1, characterized in that, The second rod and the fourth rod have fitting openings at both ends, and the first rod and the third rod have fitting protrusions at both ends. The fitting openings and the fitting protrusions are installed by screws.

7. The aging test plate according to claim 1, characterized in that, The first reinforcing member has a plurality of first protrusions on the side facing the motherboard, the plurality of first protrusions being spaced apart, and at least a portion of the first protrusions abutting against the motherboard; The second reinforcing member has a plurality of second protrusions on the side facing the motherboard, the plurality of second protrusions being spaced apart, and at least a portion of the second protrusions abutting against the motherboard.

8. The aging test plate according to claim 7, characterized in that, A first clearance opening is formed between two adjacent first protrusions. The first clearance opening is used to avoid components on the side of the motherboard away from the socket.

9. The aging test plate according to claim 8, characterized in that, The first reinforcing frame has a first connecting plate on the side facing the second reinforcing frame, and the second reinforcing frame has a second connecting plate on the side facing the first connecting plate, with the first connecting plate abutting against the second connecting plate.

10. A semiconductor testing device, characterized in that, Including the aging test plate as claimed in any one of claims 1 to 9.

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