A winged pin component test fixture

Abstract

The present application relates to the technical field of electronic component testing, and particularly relates to a wing-shaped pin component testing clamp, which comprises a testing base and a testing pressure head, and a plurality of sinking structures matched with the to-be-tested chip are arranged on the testing base, a double-spring-leaf pair structure matched with the number of pins of the to-be-tested chip is arranged on each sinking structure, one end of the double-spring-leaf pair structure penetrates through the testing base to lead out an eccentric pointer, and a wiring hole for welding a testing cable is reserved on each eccentric pointer; each testing pressure head is matched with each sinking structure, and a spring structure is arranged for each pin of the to-be-tested chip, when the pin of the to-be-tested chip is placed on the double-spring-leaf pair structure, the spring structure is placed above the to-be-tested pin, and a vertical downward force is applied to the spring structure to fix the pin of the to-be-tested chip. The present application can effectively solve the problem of component pin damage in the testing process and meet the needs of large-scale production.

Description

Technical Field

[0001] This invention relates to the field of electronic component testing technology, and in particular to a test fixture for wing-shaped pin components. Background Technology

[0002] With the continuous development of electronic component packaging technology, various new packaging structures are emerging, and product packaging sizes are becoming increasingly diversified. Among them, signal transmission using metal leads has the advantages of low cost, good transmission effect, and high connection strength, making it a widely used process in the industry. To ensure that components with pins of different sizes can be directly mounted on printed circuit boards, the leads are bent and shaped in the post-packaging process to ensure that the components can be soldered onto the board during use.

[0003] In actual production, manufacturing, and use, testing the electrical performance of packaged wing-shaped lead components often presents certain challenges. On the one hand, the miniaturized package size inevitably results in finer and denser leads, and excessive test stress can easily cause irreversible damage to these leads, especially at the junction of the leads and the package. On the other hand, deviations are inevitable during the lead bending process, and conventional test fixtures often have alignment issues, leading to distorted test signals and affecting the test accuracy and efficiency of the product.

[0004] Furthermore, during the testing of some new pilot-production products with multiple varieties, the manufacturing and development cost of the test fixtures even exceeds the price of the test host, and their processing and manufacturing cycle also seriously affects the product development progress, putting great pressure on the company's delivery. Summary of the Invention

[0005] To effectively address the issue of component pin damage during testing and meet the needs of large-scale production, this invention proposes a wing-shaped pin component test fixture, comprising a test base and a test head. The test base has multiple recessed structures that match the chip under test. Each recessed structure has a double-spring pair structure that matches the number of pins on the chip under test. One end of the double-spring pair structure passes through the test base and leads out an eccentric pointer. Each eccentric pointer has a wiring hole for soldering test cables. Each test head matches each recessed structure and has a spring structure for each pin of the chip under test. When the pin of the chip under test is placed on the double-spring pair structure, the spring structure is positioned above the pin under test, applying a vertically downward force to the spring structure to fix the pin of the chip under test.

[0006] Compared with the prior art, the wing-shaped lead component test fixture of the present invention has the following advantages: 1. This invention enables batch testing of wing-shaped pin components; 2. During the testing process, the base and the test head body are closed and limited, and the height of its internal cavity is greater than the height of the component body, so as to avoid damage to the component due to force. 3. The interface design of the spring-loaded pin and the snap-fit ​​spring sheet can accommodate pin forming deviations, ensure good contact, avoid pin damage due to force, and also take into account the shaping function. Attached Figure Description

[0007] Figure 1 This is a schematic diagram illustrating an embodiment of the wing-shaped lead component test fixture of the present invention; Figure 2 This is a schematic diagram of the test base and test head structure of a test fixture for wing-shaped lead components according to the present invention; Figure 3 This is a schematic diagram of the mounting structure corresponding to the double spring pair structure in the wing-shaped pin component test fixture of the present invention; Figure 4 This is a schematic diagram of the sunken structure on the test base of a test fixture for wing-shaped lead components according to the present invention; Figure 5 This is a schematic diagram of the test head structure of a test fixture for wing-shaped lead components according to the present invention; Among them, 1. Test base; 11. Double spring pair structure; 111. First spring; 112. Second spring; 12. Recessed groove; 13. Through hole; 2. Chip to be tested; 21. Pin; 3. Test pressure head. Detailed Implementation

[0008] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0009] This invention proposes a test fixture for wing-shaped pin components, including a test base 1 and a test head 3. The test base is provided with multiple recessed structures that match the chip under test 2. Each recessed structure is provided with a double spring pair structure that matches the number of pins of the chip under test. One end of the double spring pair structure passes through the test base and leads out an eccentric pointer. Each eccentric pointer has a wiring hole for soldering test cables. Each test head matches each recessed structure and is provided with a spring structure for each pin of the chip under test. When the pin of the chip under test is placed on the double spring pair structure, the spring structure is placed above the pin under test, and a vertically downward force is applied to the spring structure to fix the pin of the chip under test.

[0010] like Figure 1This embodiment proposes a specific implementation scheme for a test fixture for wing-shaped pin components. In this embodiment, the test base is provided with 3×3 sinking structures, each of which holds a chip to be tested, and each chip to be tested corresponds to a test pressure head.

[0011] like Figure 2 When the chip under test is placed in the recessed structure, the structure 11 is fixed to each pin 21 of the chip under test 2 by double spring clips. The number of double spring clips in each recessed structure matches the number of chips under test. This embodiment takes a chip under test with 10 pins on both sides as an example. When the test head and the test base are in a closed state, the cavity formed between the test head and the test base matches the chip under test, avoiding damage to the chip under test due to force. Figure 2 The chip under test has 5 wing-shaped pins on each side of the 10-pin dual-sided test head. Each pin is placed on a double spring pair structure, and each spring structure on the test head is aligned with each double spring pair structure.

[0012] As an optional implementation, the test base is provided with a mounting structure corresponding to the double spring pair structure. This structure is installed at the bottom of the recessed structure. When the chip to be tested is placed on the double spring pair structure, the chip to be tested contacts the double spring pair structure. Further, the mounting structure corresponding to the double spring pair structure includes a recessed groove 22 and two through holes 23. The two through holes are located on both sides of the recessed groove. The double spring pair structure is installed in the recessed groove, and the excess parts on both sides of the double spring pair structure are placed in the through holes. The double spring pair structure is fixed by fixing its position between the recessed groove and the two through holes. Further, the double spring pair structure includes a first spring 111 and a second spring 112. The first spring and the second spring form an acute-angled cone. This cone is used to place the pins of the chip to be tested. The excess part of the other end of the first spring is hidden by inserting it into one of the through holes of the mounting structure. The other end of the second spring passes through the other and is led out of the test base as an eccentric pin.

[0013] Preferably, the test base is made of graphite, carbon fiber, or a rigid antistatic material, or a rigid metal material coated with an antistatic layer. The rigid metal material can be stainless steel, hard aluminum alloy, or other similar metals. In other words, the test base should be made of stainless steel or hard aluminum alloy coated with an antistatic layer, ensuring it is sturdy, durable, and resistant to deformation, and capable of meeting the requirements of high-frequency testing. When made of metal, a Teflon or antistatic paint coating should be applied to its surface for electrostatic protection and to prevent hard contact between metals from damaging the component's appearance.

[0014] The test base should be designed with a recessed structure to limit the alignment of the leads and test springs. The test springs employ a double-spring snap-fit ​​structure. This ensures effective contact while preventing hard contact between the wing-shaped leads and the test interface, thus avoiding unnecessary damage to the test leads. Furthermore, the snap-fit ​​structure is inverted conical, improving compatibility with lead misalignment after molding, ensuring testing effectiveness while also providing some shaping function for misaligned leads. The snap-fit ​​springs are mechanically snapped onto the test base, with one end extending beyond the base and having a wiring hole for soldering test cables to ensure test signal transmission. The number of test springs corresponds to the number of pins under test.

[0015] like Figure 5 The main body of the test head is a U-shaped structure, with the U-shape matching the chip size. Two protruding spring-loaded pins are located, each corresponding to a pin of the chip under test. A pressure connector is positioned at the center of the U-shaped structure. During testing, test pressure is applied via a vertical displacement pressure structure, ensuring that the spring structures at both ends of the test head act on the wing-shaped component pins, allowing for full contact between the pins and the double-spring structure. This full contact ensures accurate signal acquisition. This double-safety design of the spring structure and the double-spring structure minimizes unnecessary damage to the test pins.

[0016] In addition, during normal testing, when the test head is pressed down, its main body and the test base should form a hard contact to limit the movement and prevent the test head from continuing to move down and applying unnecessary pressure to the component body, thus protecting the component body from test stress. Therefore, the depth of the U-shaped structure needs to be matched according to the height of the chip. That is, the protrusions on both sides of the U-shaped structure are used for limiting, ensuring that only the spring pins on the protrusions enter the sunken structure on the test base, which plays a role in limiting and positioning.

[0017] In the description of this invention, it should be understood that the terms "coaxial," "bottom," "one end," "top," "middle," "other end," "upper," "side," "top," "inner," "outer," "front," "center," "both ends," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0018] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "setting," "connection," "fixing," "rotation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0019] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A test fixture for wing-shaped lead components, characterized in that, The device includes a test base and a test head. The test base has multiple recessed structures that match the chip under test. Each recessed structure has a double-spring pair structure that matches the number of pins of the chip under test. One end of the double-spring pair structure passes through the test base and leads out an eccentric pointer. Each eccentric pointer has a wiring hole for soldering test cables. Each test head matches each recessed structure and has a spring structure for each pin of the chip under test. When the pin of the chip under test is placed on the double-spring pair structure, the spring structure is placed above the pin under test, and a vertical downward force is applied to the spring structure to fix the pin of the chip under test.

2. The airfoil lead component test fixture according to claim 1, characterized in that, The test base is equipped with a mounting structure corresponding to the double spring pair structure. This structure is installed at the bottom of the recessed structure. When the chip to be tested is placed on the double spring pair structure, the chip to be tested comes into contact with the double spring pair structure.

3. The airfoil lead component test fixture according to claim 2, characterized in that, The mounting structure corresponding to the double spring pair structure includes a recessed groove and two through holes. The two through holes are located on both sides of the recessed groove. The double spring pair structure is installed in the recessed groove, and the excess parts on both sides of the double spring pair structure are placed in the through holes. The double spring pair structure is fixed in position between the recessed groove and the two through holes.

4. The airfoil lead component test fixture according to claim 3, characterized in that, The dual-spring pair structure includes a first spring and a second spring, which form an acute-angled cone shape between the first spring and the second spring. This cone shape is used to place the pins of the chip to be tested. The excess part of the other end of the first spring is hidden by inserting it into one of the through holes of the mounting structure. The other end of the second spring passes through another and is led out as an eccentric pin through the test base.

5. A test fixture for wing-shaped lead components according to claim 1, characterized in that, The test base is made of rigid antistatic material or rigid metal material coated with an antistatic layer.

6. A test fixture for wing-shaped lead components according to claim 5, characterized in that, The test base is made of graphite and carbon fiber.

7. A test fixture for wing-shaped lead components according to claim 5, characterized in that, The test base is made of stainless steel or hard aluminum alloy coated with an antistatic layer.

8. A test fixture for wing-shaped lead components according to claim 1, characterized in that, When the test head and the test base are in a closed state, the cavity formed between the test head and the test base matches the chip under test, thus avoiding damage to the chip under test due to force.

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