A cold plate module simulation load heat performance testing device

Abstract

The utility model discloses a cold plate module simulation load heat generation performance testing arrangement, including the box that is filled with cooling liquid, the heat conduction simulation unit of being located in the box, liquid supply pipeline and back liquid pipeline and controller, adopt heating module heat generation and pass through the heat conduction plate transmission to the heat spreading plate, and then even import the brazing embedded copper pipe or through -hole copper bar and realize heat conduction, and copper pipe high -efficient heat conduction to liquid medium, restrain the bubble that generates, form unidirectional stable liquid flow, and through the stepless regulation of voltage of each heating module of pressure regulator, simulate different power server heat generation working condition, realize accurate simulation and intelligent flexible control. The utility model provides a kind of more real stable controllable data center liquid cooling equipment test simulation load system and method.

Description

Technical Field

[0001] This utility model belongs to the field of data center liquid cooling equipment testing technology, specifically relating to a simulated load system and performance testing method for testing the performance of liquid cooling equipment, which is particularly suitable for performance testing during the manufacturing and processing of data center liquid cooling products. Background Technology

[0002] With modern society's increasing reliance on data centers and the rapid growth in data processing volume, reducing data center power usage efficiency (PUE) has become a key objective. This directly drives the urgent market demand for high-efficiency liquid cooling products. To ensure the quality of liquid cooling products, performance testing using load systems capable of simulating the heat dissipation characteristics of servers is crucial during their manufacturing process.

[0003] Currently, the commonly used analog load systems in the industry have the following structural characteristics and problems: Existing analog load systems typically use a heating module as the heat source. This heating module is directly immersed and fixedly installed in a container filled with liquid medium. The entire system is connected to the supply and return circuits of the coolant distribution unit via a supply pipe and a return pipe. Temperature sensors and other monitoring components are usually installed on the supply and return pipes. Existing analog load systems are prone to distortion of heat exchange methods and gas-liquid mixing problems, which in turn lead to distorted monitoring data and system instability. Specifically: (1) Since the heat exchange module is in direct contact with the liquid medium, its heat transfer mechanism (mainly forced convection) cannot truly reproduce the heat transfer mode of key heat-generating components such as server chips through indirect conduction with the cold plate via thermally conductive materials (such as thermal pads and solder) in actual operation, thus causing the heat exchange mode to be distorted.

[0004] (2) During the process of heat transfer from the heating module to the liquid medium, the large temperature difference at the interface between the two can easily cause the liquid in direct contact with the surface of the heating module to boil violently or vaporize locally, generating a large amount of gas. This gas mixes into the liquid, causing a gas-liquid mixture to form inside the entire pipeline system, thus creating a gas-liquid mixing problem.

[0005] (3) The presence of gas-liquid mixture makes it impossible for temperature sensor to accurately and stably measure the actual temperature value of pure liquid phase. This leads to distortion of supply / return liquid temperature monitoring and causes significant fluctuations in flow rate and pressure within the system, affecting the stability and repeatability of test conditions. Summary of the Invention

[0006] To address the problems existing in the prior art, this utility model provides a device for testing the heating performance of a cold plate module under simulated load, and provides a more realistic, stable and controllable simulated load system and method for testing data center liquid cooling equipment.

[0007] To solve the above-mentioned technical problems, this utility model adopts the following technical solution: a device for testing the simulated load heating performance of a cold plate module, comprising a tank filled with coolant, a heat conduction simulation unit, a coolant supply pipeline and a coolant return pipeline disposed within the tank, and a controller. The heat conduction simulation unit includes a heat spreader and several heating modules disposed on the heat spreader. The upper and lower surfaces of the heat spreader are respectively provided with several grooves, and heat transfer copper tubes are embedded in the grooves. The outer surface of the copper tubes is a planar structure flush with the upper and lower surfaces of the heat spreader. The several heating modules are tightly attached to the upper and lower surfaces of the heat spreader by thermal grease on the contact surface. Each heating module consists of two heat-conducting plates and a heating module disposed between the heat-conducting plates. A temperature sensor is embedded in the heating module. The liquid supply pipeline includes a liquid supply manifold and a liquid supply port, and the liquid return pipeline includes a liquid return manifold and a liquid return port. The heat transfer copper tubes in the heat spreader are connected in series and parallel to form several loops. The two ends of each loop are connected to the liquid supply manifold and the liquid return manifold, respectively. The tail ends of the liquid supply manifold and the liquid return manifold are connected to the liquid supply port and the liquid return port, respectively. The liquid supply port and the liquid return port are used to connect to the cooling distributor. The heating module is electrically connected to the controller and is controlled by the controller signal to start and stop the heating.

[0008] Preferably, the outer surface of the heat transfer copper tube is provided with raised textures and is embedded in the groove of the heat spreader plate by vacuum brazing, and the top of the heat transfer copper tube is flattened so that it is flush with the surface of the heat spreader plate.

[0009] Preferably, both the supply port and the return port are equipped with a temperature sensor, a pressure sensor, and a flow sensor.

[0010] Preferably, the connection line between the heating module and the controller is equipped with a current sensor, a voltage sensor, and a voltage regulator, which can adjust the power of different heating modules.

[0011] Preferably, the contact area between the heat spreader and the heating module is provided with several through holes, which are filled with a medium with high thermal conductivity.

[0012] Preferably, the controller is also connected to an alarm.

[0013] Beneficial effects: Compared with the prior art, the present invention has the following advantages: The present invention optimizes the heat conduction structure and restores the real heat transfer path, and improves the conductivity at the interface with the copper tube through the heat spreader; efficient and uniform heat transfer suppresses the generation of bubbles, thereby ensuring the authenticity of the test and the stability of the system, realizing precise stepless adjustment and flexible simulation of the simulated test heating power, and ensuring comprehensive data monitoring and visualization. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Wherein: Figure 1 This is a schematic diagram of the structure of the simulated load heating performance testing device for the cold plate module described in this utility model.

[0015] Figure 2 This is a top view of the simulated load heating performance testing device for the cold plate module described in this utility model.

[0016] Figure 3 This is a schematic diagram of the structure of the heating module described in this utility model.

[0017] In the diagram, 1 is the housing, 2 is the heat spreader, 3 is the heat transfer copper pipe, 4 is the liquid supply port, 5 is the liquid return port, 6 is the heating module, 7 is the temperature sensor, 8 is the pressure sensor, 9 is the flow sensor, 10 is the heating module, 11 is the pressure regulator, 12 is the current sensor, 13 is the voltage sensor, 14 is the alarm, 15 is the controller, 16 is the heat conduction plate, 17 is the liquid supply manifold, 18 is the liquid return manifold, and 19 is the heat conduction copper rod. Detailed Implementation

[0018] The present invention will be further illustrated below with reference to the accompanying drawings and specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. After reading the present invention, any modifications of the present invention in various equivalent forms by those skilled in the art fall within the scope defined by the appended claims.

[0019] like Figure 1 As shown, the cold plate module simulated load heating performance testing device of this utility model mainly includes: a box filled with coolant, a heat conduction simulation unit, a supply pipe and a return pipe installed in the box, a temperature / pressure / flow sensor, a pressure regulator, a current / voltage transmitter, a buzzer, and a central processing unit display and control unit as the controller, wherein: The heat conduction simulation unit includes a heat spreader plate and several heat-generating modules disposed on the heat spreader plate. Several grooves are provided on the upper and lower surfaces of the heat spreader plate. Heat transfer copper tubes are embedded in the grooves. The outer surface of the heat transfer copper tubes is provided with raised textures and is embedded in the grooves of the heat spreader plate by vacuum brazing. The top of the heat transfer copper tubes is flattened so that it is flush with the surface of the heat spreader plate.

[0020] The heating module is tightly attached to the upper and lower surfaces of the heat spreader using thermal grease on the contact surfaces. The heating module consists of two heat-conducting plates and a heating module located between the heat-conducting plates, with a temperature sensor embedded within the heating module.

[0021] The liquid supply pipeline includes a liquid supply manifold and a liquid supply port, and the liquid return pipeline includes a liquid return manifold and a liquid return port. The heat transfer copper tubes within the heat spreader are connected in series and parallel to form several loops. The two ends of each loop are connected to the liquid supply manifold and the liquid return manifold, respectively. The tail ends of the liquid supply manifold and the liquid return manifold are connected to the liquid supply port and the liquid return port, respectively. The liquid supply port and the liquid return port are used to connect to the cooling distributor. For flexible control, temperature sensors, pressure sensors, and flow sensors are installed at both the liquid supply port and the liquid return port.

[0022] The heating module is electrically connected to the controller and is controlled by the controller signal to start and stop heating. The connection line between the heating module and the controller is equipped with a current sensor, a voltage sensor, and a voltage regulator, which can adjust the power of different heating modules.

[0023] As a preferred embodiment, the contact area between the heat spreader and the heating module is further provided with several through holes, which are filled with a medium with high thermal conductivity.

[0024] The above-mentioned simulated load heating performance testing device for cold plate module of this utility model is used to test the simulated load of cold plate distributor, and specifically includes the following steps: S1, Preparation and parameter setting: Confirm the working status of the device and the medium filling status of the liquid cooling pipeline by using pressure sensors and flow sensors at the liquid supply port and return port; and determine the output voltage and current parameters of the heating module according to the simulated load power. S2, after the heating module is controlled by the controller to work according to the preset parameters for 3 minutes, the temperature T1 of the heating module is measured; S3, while keeping the heating module working according to the preset parameters for 5 minutes, start the coolant distributor. After the coolant enters the supply pipe through the supply pipe, it is sent to the heat transfer copper pipe of the heat spreader to absorb the heat of the heating module. Then, it flows back to the coolant distributor through the return pipe. Measure the coolant temperature T2 at the supply pipe and the coolant temperature T3 at the return pipe. S4. When T3 < T2 + 12℃, the heat dissipation effect of the coolant distributor is excellent. When T3 > T2 + 12℃, the heating module is turned off, and the coolant distributor continues to be running for 2 minutes. If T3 < T2 + 5℃, the heat dissipation effect of the coolant distributor is qualified. When T3 > T2 + 12℃, the heating module is turned off, and the coolant distributor continues to be running for 2 minutes. If T3 > T2 + 5℃, the heat dissipation effect of the coolant distributor is unqualified.

[0025] Furthermore, the controller uses a voltage regulator to achieve stepless adjustment of the heating module, simulating the heating conditions of servers with different power levels.

[0026] Therefore, this utility model solves the following technical problems that still exist in the prior art through the following technical solutions: Optimize the heat conduction structure to reproduce the actual heat transfer path: A pre-set gap is established between the housing of the heating module and the heat spreader plate with embedded copper pipes, and thermally conductive silicone grease is filled into this gap. This structural design simulates the thermal interface material layer between server chips and the cold plate, significantly increasing heat conduction efficiency and ensuring consistency between the heat conduction method and the actual operating state of data center servers. This allows for a realistic simulation of the heat conduction methods of key heat-generating components (such as CPU and GPU chips) in data center servers.

[0027] Improve the thermal conductivity of the interface between the heat spreader and the copper tube: The copper tubes are embedded and fixed inside the heat spreader using a vacuum brazing process. This process eliminates the microscopic gaps between the heat spreader and the copper tubes, forming a metallurgical bond and maximizing the heat conduction capacity at their interface. Furthermore, the use of through-hole embedded tubes (high thermal conductivity copper rods) and other technologies further enhances heat conduction efficiency.

[0028] Efficient and uniform heat transfer, suppressing bubble formation: Heat is transferred from the heating module to the heat spreader via a thermally conductive silicone grease layer, and then from the heat spreader to the liquid medium flowing through the copper tubes in a uniform and efficient manner. This indirect, controlled conductive heat exchange method effectively avoids drastic temperature differences and localized overheating caused by direct contact between the heating element surface and the liquid, thus fundamentally suppressing bubble formation. It also avoids distortion of temperature sensor measurements in the supply / return lines (which fail to reflect the true temperature of the pure liquid phase) and solves the technical problem of unstable and non-repeatable test conditions caused by significant fluctuations in system flow and pressure.

[0029] Ensuring the authenticity of monitoring and the stability of the system: Because technical solution c) effectively eliminates the generation of bubbles, it ensures stable single-phase liquid flow in the pipeline, thereby significantly improving the authenticity and accuracy of the supply / return liquid temperature monitoring data; it also ensures the high stability of system flow and pressure, providing reliable and repeatable operating conditions for testing.

[0030] Achieve precise stepless adjustment and flexible simulation of heating power: The system is equipped with an adjustable transformer (or equivalent power regulator) that allows for continuous, stepless adjustment of the supply voltage to the heat-generating modules connected to different zones. By independently adjusting the voltage of each zone, it can simultaneously simulate the heat generation conditions of servers with various power specifications, covering a wider range of testing needs.

[0031] Achieve closed-loop precise control of heating power: The system is equipped with current and voltage transmitters to collect the operating current and voltage of the heating modules in each area in real time. The central processing unit (CPU) receives this data and calculates the actual heating power of each area in real time. The CPU compares the calculated actual power value with the preset target power value. If there is a deviation, the CPU outputs an adjustment signal to the PID (proportional-integral-derivative) controller, which finely adjusts the power supply voltage of the corresponding area (through the adjustable transformer or power regulation device in the control e) to accurately stabilize the heating power of each area at the preset value.

[0032] Achieve comprehensive data monitoring and visualization: The system collects the following data in real time and transmits it to the central processing unit (CPU): Supply temperature, return temperature; System pressure, liquid flow rate; The operating current, operating voltage, and real-time calculated heating power of the heating modules in each area; Real-time temperature at key points in each region.

[0033] The CPU processes, analyzes, and stores the received data, and displays key information intuitively and clearly on the monitor, making it easy for operators to monitor the system status and testing process.

[0034] Achieve early warning and security protection for abnormal states: The central processing unit (CPU) performs real-time analysis and judgment on various data (temperature, pressure, flow rate, current, voltage, power, etc.) collected in technical solution g). When any parameter is detected to exceed the preset safety threshold range or abnormal fluctuations occur (indicating that the system may malfunction or be in an unsafe state), the CPU immediately triggers a buzzer to sound an alarm, reminding staff to check and handle the abnormal situation in a timely manner, ensuring system safety and restoring it to normal working status as soon as possible.

Claims

1. A device for testing the simulated load heating performance of a cold plate module, characterized in that: This includes a tank filled with coolant, a heat conduction simulation unit housed within the tank, coolant supply and return piping, and a controller. The heat conduction simulation unit includes a heat spreader and several heating modules disposed on the heat spreader. The upper and lower surfaces of the heat spreader are respectively provided with several grooves, and heat transfer copper tubes are embedded in the grooves. The outer surface of the copper tubes is a planar structure flush with the upper and lower surfaces of the heat spreader. The several heating modules are tightly attached to the upper and lower surfaces of the heat spreader by thermal grease on the contact surface. Each heating module consists of two heat-conducting plates and a heating module disposed between the heat-conducting plates. A temperature sensor is embedded in the heating module. The liquid supply pipeline includes a liquid supply manifold and a liquid supply port; the liquid return pipeline includes a liquid return manifold and a liquid return port; the heat transfer copper tubes in the heat spreader are connected in series and parallel to form several loops; the two ends of each loop are connected to the liquid supply manifold and the liquid return manifold, respectively; the tail ends of the liquid supply manifold and the liquid return manifold are connected to the liquid supply port and the liquid return port, respectively; the liquid supply port and the liquid return port are used to connect to the coolant flow distributor; the heating module is electrically connected to the controller and is controlled by the controller signal to start and stop the heating.

2. The cold plate module simulated load heating performance testing device according to claim 1, characterized in that: The outer surface of the heat transfer copper tube is provided with raised textures and is embedded in the groove of the heat spreader plate by vacuum brazing. The top of the heat transfer copper tube is flattened so that it is flush with the surface of the heat spreader plate.

3. The cold plate module simulated load heating performance testing device according to claim 1, characterized in that: Both the supply and return ports are equipped with temperature sensors, pressure sensors, and flow sensors.

4. The cold plate module simulated load heating performance testing device according to claim 1, characterized in that: The connection line between the heating module and the controller is equipped with a current sensor, a voltage sensor, and a voltage regulator, which can adjust the power of different heating modules.

5. The cold plate module simulated load heating performance testing device according to claim 1, characterized in that: The contact area between the heat spreader and the heating module is also provided with several through holes, which are filled with a medium with high thermal conductivity.

6. The cold plate module simulated load heating performance testing device according to claim 1, characterized in that: The controller is also connected to an alarm.

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