A high-low temperature test device

Abstract

The utility model discloses a high low temperature testing arrangement, including water tank, the radiating top cover of connection in water tank top, the semiconductor refrigeration sheet of arrangement in the radiating top cover top and the heat preservation board of arrangement on semiconductor refrigeration sheet, the hot face of semiconductor refrigeration sheet is in accord with the top of radiating top cover, still be arranged on the cold face of semiconductor refrigeration sheet bearing seat, and the first through -hole is seted up in the corresponding place of bearing seat on heat preservation board, and the upper portion of bearing seat passes through first through -hole arrangement, the top of heat preservation board still is equipped with the limiting clamp for the product under test pressure tight location, and the one end of bearing seat in the top of heat preservation board still is connected with the limiting card seat for installing optical fiber, one end of water tank still is arranged for the power supply component of the product under test power on. The utility model discloses adopt the mode of TEC temperature control and water cooling combination to carry out the temperature test of TOSA's rise and fall, can reduce the power consumption, save the cost, improve the test efficiency, and the practicality is strong.

Description

Technical Field

[0001] This utility model relates to the field of active optical device technology, and in particular to a high and low temperature testing device. Background Technology

[0002] like Figure 1 As shown, currently, high and low temperature chambers are typically used to adjust the operating environment temperature of TOSA (Optical Component Array) devices to different temperatures, such as -5℃, 25℃, and 75℃, in order to test the DC and AC signal performance of the devices under different temperature conditions. However, during product testing, the heating and cooling of the high and low temperature chambers is very slow and takes a long time, and the power consumption of the high and low temperature chambers is very high (approximately 5kW), resulting in high testing costs. Therefore, improvements are needed. Utility Model Content

[0003] The purpose of this invention is to provide a high and low temperature testing device. This device uses a combination of TEC temperature control and water cooling to perform TOSA temperature rise and fall tests, which can reduce power consumption, save costs, improve testing efficiency, and is highly practical.

[0004] To achieve the above objectives, the following technical solution is adopted: A high and low temperature testing device includes a water tank, a heat dissipation cover connected to the top of the water tank, a thermoelectric cooler arranged on the top of the heat dissipation cover, and a heat insulation plate arranged on the thermoelectric cooler. The hot surface of the thermoelectric cooler is in contact with the top of the heat dissipation cover. A support seat is also arranged on the cold surface of the thermoelectric cooler. A first through hole is opened on the heat insulation plate corresponding to the support seat, and the upper part of the support seat is arranged through the first through hole. A support groove for supporting the product under test is opened on the top of the support seat. A limiting clamp for pressing and limiting the product under test is also installed on the top of the heat insulation plate. A limiting bracket for installing optical fiber is also connected to one end of the top of the heat insulation plate at the support seat. A power supply component for powering the product under test is also arranged at one end of the water tank.

[0005] Furthermore, a mounting plate is arranged on the top of the heat dissipation cover, and an insulation plate is arranged on the mounting plate; a first mounting hole is opened on the mounting plate, and a semiconductor cooling chip is installed in the first mounting hole; a wire through hole is also opened at the end of the mounting plate away from the power supply component.

[0006] Furthermore, the bottom of the heat dissipation top cover is provided with several heat dissipation fins, which are arranged inside the water tank.

[0007] Furthermore, the limiting clamp includes a limiting cover, a limiting block, and a first fixing block and a second fixing block connected to the top of the insulation board; the upper part of the bearing seat is located between the first fixing block and the second fixing block; the lower part of the limiting cover is rotatably connected to the top end of the first fixing block, and the top of the limiting cover is also provided with a first slot; the limiting block has a T-shaped structure, and the vertical end of the T-shaped limiting block is rotatably connected to the top end of the second fixing block, and the horizontal end of the T-shaped limiting block is arranged above the second fixing block.

[0008] Furthermore, a buffer pad is also installed on the side of the limiting cover near the limiting block.

[0009] Furthermore, a first extension block extends upward from each side of the top end of the first fixing block, and a first connecting shaft is connected between the two first extension blocks; a rotating connecting block extends downward from the bottom of the limiting pressure cover, and the rotating connecting block is movably sleeved on the first connecting shaft; a limiting slot is opened at the top end of the second fixing block, extending through to one end of the second fixing block, and a second connecting shaft is connected between the inner walls of the two sides of the limiting slot; the T-shaped vertical end of the limiting stop is movably sleeved on the second connecting shaft.

[0010] Furthermore, the power supply component includes a first bracket arranged at one end of the water tank, a first slide rail assembly arranged vertically on one side of the first bracket, and a lifting slider slidably arranged on the first slide rail assembly; a fixing plate is installed on one side of the lifting slider, and a probe mounting block is connected to the bottom of the fixing plate; one end of the probe mounting block extends above one end of the bearing groove, and a plurality of power supply probes are also installed at one end of the probe mounting block in the vertical direction.

[0011] Furthermore, an adjustment plate is connected to the top of the first bracket, and an adjustment screw is installed on the adjustment plate; the adjustment screw is connected to the top of the lifting slider.

[0012] Furthermore, a limit block is also connected to one side of the first bracket below the lifting slider.

[0013] Furthermore, the top of the limiting card seat is also provided with a first mounting groove for accommodating optical fibers.

[0014] By adopting the above solution, the beneficial effects of this utility model are: This invention employs a combination of TEC temperature control and water cooling for TOSA temperature rise and fall testing, which can reduce power consumption, save costs, improve testing efficiency, and is highly practical. Attached Figure Description

[0015] Figure 1 A schematic diagram of the existing technology for high and low temperature testing of TOSA; Figure 2 This is a schematic diagram of the structure of this utility model; Figure 3 This is an exploded view of the present invention after omitting the power supply component; The following are explanations of the labels in the attached diagram: 1. Water tank; 2. Heat dissipation top cover; 3. Semiconductor cooling chip; 4. Insulation board; 5. Bearing seat; 6. Limiting clamp; 7. Limiting card seat; 8. Power supply assembly; 9. Mounting plate; 21. Heat sink; 61. Limiting pressure cover; 62. Limiting stop; 63. First fixing block; 64. Second fixing block; 65. First card slot; 66. Buffer pad; 71. Optical fiber; 81. First bracket; 82. Lifting slider; 83. Fixing plate; 84. Probe mounting block; 85. Power supply probe; 86. Adjusting plate; 87. Adjusting screw; 88. Limiting block. Detailed Implementation

[0016] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] Reference Figures 2 to 3 As shown, this utility model provides a high and low temperature testing device. In one embodiment, it includes a water tank 1, a heat dissipation cover 2 connected to the top of the water tank 1, a semiconductor cooling chip 3 arranged on the top of the heat dissipation cover 2, and a heat insulation plate 4 arranged on the semiconductor cooling chip 3. The hot surface of the semiconductor cooling chip 3 is in contact with the top of the heat dissipation cover 2. A support seat 5 is also arranged on the cold surface of the semiconductor cooling chip 3. A first through hole is opened on the heat insulation plate 4 corresponding to the support seat 5, and the upper part of the support seat 5 is arranged through the first through hole. A support groove for supporting the product to be tested is opened on the top of the support seat 5. A limiting clamp 6 for pressing and limiting the product to be tested is also installed on the top of the heat insulation plate 4. A limiting bracket 7 for installing an optical fiber 71 is also connected to one end of the top of the heat insulation plate 4 located on the support seat 5. A power supply component 8 for energizing the product to be tested is also arranged at one end of the water tank 1.

[0018] In this implementation, the product to be tested is a TOSA (Optical Component Assembly). The TOSA needs to be powered on, and it can convert electro-optical output. The light is transmitted to the test equipment via optical fiber 71 for testing DC and AC signals (the internal laser of the TOSA emits light, which is coupled through a lens and converged into the optical fiber 71 adapter; the adapter and optical fiber 71 are connected, and the optical signal is transmitted to the test equipment). The TEC (Thermal Design Equipment), or semiconductor cooling chip 3, is used for high and low temperature environment switching. The limiting clamp 6 is used to hold the TOSA to limit and fix it, ensuring its stability during testing. The power supply component 8 is used to power the TOSA's pads via the array probes. The water tank 1 stores cold water to dissipate heat from the hot side of the TEC. The insulation board 4, made of insulation materials (such as fiberglass, polyetheretherketone, etc.), is used to prevent unnecessary hot and cold interactions on the cold side of the TEC.

[0019] In this embodiment, a mounting plate 9 is also arranged on the top of the heat dissipation cover 2, and an insulation plate 4 is arranged on the mounting plate 9. A first mounting hole is provided on the mounting plate 9, and the semiconductor refrigeration chip 3 is installed in the first mounting hole. A through-hole leading to the first mounting hole is also provided at the end of the mounting plate 9 away from the power supply component 8. The mounting plate 9 is made of a soft material (such as Teflon), which can limit the TEC while avoiding damage to the TEC. At the same time, the TEC cable can pass through the through-hole to connect to external control equipment.

[0020] In addition, the bottom of the heat dissipation top cover 2 is provided with a plurality of heat dissipation fins 21, and the heat dissipation fins 21 are arranged inside the water tank 1. The heat dissipation fins 21 at the bottom of the heat dissipation top cover 2 are immersed in the cold water in the water tank 1, and the heat of the TEC hot surface is dissipated in a timely manner through heat conduction.

[0021] In one embodiment, the limiting clamp 6 includes a limiting cover 61, a limiting block 62, and a first fixing block 63 and a second fixing block 64 connected to the top of the insulation board 4; the upper part of the bearing seat 5 is located between the first fixing block 63 and the second fixing block 64; the lower part of the limiting cover 61 is rotatably connected to the top end of the first fixing block 63, and the top of the limiting cover 61 is also provided with a first slot 65; the limiting block 62 has a T-shaped structure, and the T-shaped vertical end of the limiting block 62 is rotatably connected to the top end of the second fixing block 64, and the T-shaped... The horizontal end is arranged above the second fixing block 64; at the same time, a first extension block extends upward from each side of the top end of the first fixing block 63, and a first connecting shaft is connected between the two first extension blocks; a rotating connecting block extends downward from the bottom of the limiting pressure cover 61, and the rotating connecting block is movably sleeved on the first connecting shaft; a limiting groove is opened at the top end of the second fixing block 64, which extends to one end of the second fixing block 64, and a second connecting shaft is connected between the inner walls of the two sides of the limiting groove; the T-shaped vertical end of the limiting stop block 62 is movably sleeved on the second connecting shaft.

[0022] After placing the TOSA into the bearing groove, the limiting cover 61 can be rotated clockwise to press the TOSA firmly. Simultaneously, the limiting block 62 can be rotated so that its T-shaped vertical end passes through the limiting slot, and its T-shaped horizontal end presses against the limiting cover 61 to lock it in place. After testing, the limiting block 62 and the limiting cover 61 can be rotated in the opposite direction to remove the TOSA. Furthermore, a buffer pad 66 is installed on the side of the limiting cover 61 near the limiting block 62. When the limiting cover 61 presses and limits the TOSA, the buffer pad 66 cushions the downward pressure, preventing the limiting cover 61 from damaging the TOSA.

[0023] In one embodiment, the power supply component 8 includes a first bracket 81 disposed at one end of the water tank 1, a first slide rail assembly disposed vertically on one side of the first bracket 81, and a lifting slider 82 slidably disposed on the first slide rail assembly; a fixing plate 83 is installed on one side of the lifting slider 82, and a probe mounting block 84 is connected to the bottom of the fixing plate 83; one end of the probe mounting block 84 extends above one end of the bearing groove, and a plurality of power supply probes 85 are also installed vertically on one end of the probe mounting block 84. The power supply device can be connected to the power supply probes 85 via cables. After the TOSA is placed, the lifting slider 82 is slid downwards to make the power supply probes 85 contact the TOSA pads, thereby realizing power supply.

[0024] Preferably, the top of the first bracket 81 is also connected to an adjusting plate 86, and an adjusting screw 87 is also installed on the adjusting plate 86; the adjusting screw 87 is connected to the top of the lifting slider 82. The adjusting screw 87 can drive the lifting slider 82 to rise and fall, so that the power supply probe 85 contacts or moves away from the TOSA pad. At the same time, a limiting block 88 is also connected to one side of the first bracket 81 below the lifting slider 82. The limiting block 88 can limit the descent stroke of the lifting slider 82. In addition, the top of the limiting holder 7 is also provided with a first mounting groove for accommodating the optical fiber 71. The optical fiber 71 can be directly inserted into the first mounting groove, making installation and disassembly convenient.

[0025] The working process of this utility model is as follows: 1) Clean the limit fixture 6, the TOSA photoelectric port, and other tooling; 2) Place the TOSA in the support groove; 3) The lifting slider 82 descends so that the power supply probe 85 contacts the TOSA pad; 4) Insert fiber optic cable 71 into the TOSA fiber optic cable 71 adapter; 5) Adjust the TEC temperature to reach the three predetermined temperature points: -5℃, 25℃, and 75℃; 6) Conduct relevant DC and AC signal tests.

[0026] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high and low temperature testing device, characterized in that, The device includes a water tank, a heat dissipation cover connected to the top of the water tank, a thermoelectric cooler arranged on the top of the heat dissipation cover, and an insulation plate arranged on the thermoelectric cooler. The hot side of the thermoelectric cooler is in contact with the top of the heat dissipation cover. A support seat is also arranged on the cold side of the thermoelectric cooler. A first through hole is opened on the insulation plate corresponding to the support seat, and the upper part of the support seat is arranged through the first through hole. A support groove for supporting the product under test is opened on the top of the support seat. A limiting clamp for pressing and limiting the product under test is also installed on the top of the insulation plate. A limiting bracket for installing optical fiber is also connected to one end of the top of the insulation plate at the support seat. A power supply component for powering the product under test is also arranged at one end of the water tank.

2. The high and low temperature testing device according to claim 1, characterized in that, The top of the heat dissipation cover is also provided with a mounting plate, and an insulation plate is arranged on the mounting plate; a first mounting hole is opened on the mounting plate, and a semiconductor cooling chip is installed in the first mounting hole; a wire through hole is also opened at the end of the mounting plate away from the power supply component.

3. The high and low temperature testing device according to claim 2, characterized in that, The bottom of the heat dissipation top cover is provided with several heat dissipation fins, which are arranged inside the water tank.

4. The high and low temperature testing device according to claim 1, characterized in that, The limiting clamp includes a limiting cover, a limiting block, and a first fixing block and a second fixing block connected to the top of the insulation board; the upper part of the bearing seat is located between the first fixing block and the second fixing block; the lower part of the limiting cover is rotatably connected to the top end of the first fixing block, and the top of the limiting cover is also provided with a first slot; the limiting block has a T-shaped structure, and the vertical end of the T-shaped limiting block is rotatably connected to the top end of the second fixing block, and the horizontal end of the T-shaped limiting block is arranged above the second fixing block.

5. The high and low temperature testing device according to claim 4, characterized in that, A buffer pad is also installed on the side of the limiting cover near the limiting block.

6. The high and low temperature testing device according to claim 4, characterized in that, The first fixing block has a first extension block extending upward from each of its two sides at the top end, and a first connecting shaft is connected between the two first extension blocks; the bottom of the limiting pressure cover has a rotating connecting block extending downward, and the rotating connecting block is movably sleeved on the first connecting shaft; the top end of the second fixing block has a limiting groove extending through to one end of the second fixing block, and a second connecting shaft is connected between the inner walls of the two sides of the limiting groove; the T-shaped vertical end of the limiting stop block is movably sleeved on the second connecting shaft.

7. The high and low temperature testing device according to claim 1, characterized in that, The power supply component includes a first bracket arranged at one end of the water tank, a first slide rail assembly arranged vertically on one side of the first bracket, and a lifting slider slidably arranged on the first slide rail assembly; a fixing plate is installed on one side of the lifting slider, and a probe mounting block is connected to the bottom of the fixing plate; one end of the probe mounting block extends above one end of the bearing groove, and a plurality of power supply probes are also installed at one end of the probe mounting block in the vertical direction.

8. The high and low temperature testing device according to claim 7, characterized in that, An adjustment plate is also connected to the top of the first bracket, and an adjustment screw is installed on the adjustment plate; the adjustment screw is connected to the top of the lifting slider.

9. The high and low temperature testing device according to claim 8, characterized in that, A limit block is also connected to one side of the first bracket, below the lifting slider.

10. The high and low temperature testing device according to claim 1, characterized in that, The top of the limiting card holder is also provided with a first mounting slot for accommodating optical fibers.

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