Wafer burn-in apparatus

Abstract

The application relates to a wafer aging test device, which comprises a wafer clamp, a test plate, a support structure, a test structure and a connecting structure; the support structure is configured to support the wafer clamp, the connecting structure is configured to electrically connect the wafer clamp and the test structure; the test structure comprises an adapter and an adapter plate, the adapter comprises at least one horizontal section and at least one vertical section, the adapter plate is electrically connected with the vertical section, and the horizontal section is provided with an electric connection position at the end; the test plate is electrically connected with the adapter through the electric connection position and can be separately detached between each test plate, so that any test plate can be independently operated without relying on the dismounting sequence of other levels, and the technical problem of mutual influence of test plate stacking in the existing test device is solved.

Description

Technical Field

[0001] This application relates to the field of wafer testing technology, and more specifically, to a wafer aging test apparatus. Background Technology

[0002] Wafer Level Burn In (WLBI) technology is a critical testing step in the semiconductor manufacturing process, primarily used for reliability screening of chips at the wafer stage. This technology operates the chip under accelerated stress conditions such as high temperature and high voltage, causing chips with potential defects to expose faults in a short period of time, thereby ensuring the reliability of delivered products.

[0003] However, existing wafer aging test devices have many shortcomings: First, the test boards are installed using a vertical stacking structure, which means that the test boards must be installed and removed in a fixed order, making it impossible to achieve independent maintenance at any level; second, the connection structure uses a probe-type design, which not only limits the layout flexibility of the test boards, but also increases the risk of poor contact.

[0004] The aforementioned problems severely impact testing efficiency, equipment maintenance, and the accuracy of test results. Therefore, existing technologies urgently need improvement to address these issues. Summary of the Invention

[0005] The purpose of this application is to provide a wafer aging test device that enables independent installation and maintenance of the test board, thereby improving testing efficiency and equipment maintenance convenience.

[0006] This application provides a wafer aging test apparatus, comprising: Wafer fixtures, test boards, support structures, test structures, and connection structures; The support structure is configured to support the wafer fixture, and the connection structure is configured to electrically connect the wafer fixture and the test structure; The test structure includes an adapter and an adapter plate. The adapter includes at least one horizontal section and at least one vertical section. The adapter plate is electrically connected to the vertical section. The end of the horizontal section is provided with an electrical connection position. The test plate is electrically connected to the adapter through the electrical connection position, and each test plate can be detached individually.

[0007] It is important to note that the test board mentioned in this article refers to a board-shaped structure that integrates specific test circuits. Its core functions are: to receive test signals from the test system and transmit them to the wafer under test through the connection module and fixture module; to receive electrical performance data fed back from the wafer during the test and to analyze it itself or transmit it to an external system for analysis, ultimately determining whether the wafer has potential defects; due to functional and stability requirements, the test board needs to be stably connected during the test, and it needs to be installed and removed before and after the test, and the test board needs to be replaced accordingly for different tests.

[0008] Meanwhile, in some embodiments, it is exemplarily shown that in existing designs, test boards are connected via probes and stacked vertically. This necessitates sequential disassembly and maintenance of the test boards, either from top to bottom or bottom to top. In this application, the test boards are connected and fixed to vertical or horizontal interfaces via interfaces provided on adapters / connectors. These interfaces provide support, allowing for the disassembly and maintenance of any layer of test boards through plug-and-play interfaces. Alternatively, the movement direction of the test boards can be restricted by setting limit brackets / slides, connecting the test boards to unsupported electrical connection positions or supported interfaces. This also achieves the technical effect of disassembling or maintaining any layer of test boards. The main difference lies in designing adapters or connectors to make the stacking direction and movement direction of the test boards perpendicular to each other, thus solving the problem of interference between test boards.

[0009] A modular connection architecture enables independent maintenance and flexible layout of the test boards. The wafer fixture and test structure form a separable electrical connection through the connection structure. The support structure provides physical support for the wafer fixture, keeping the fixture and connection structure separate when not in testing mode to avoid accidental contact. The adapter in the test structure uses a combination of horizontal and vertical segments. Electrical connection points are set at the ends of the horizontal segments to form distributed connection nodes. The test boards directly interface with these electrical connection points via plug-in connections, achieving independent installation paths for each test board. This replaces the original technique of connecting individual test boards using probes, avoiding the inconvenience caused by the limitations of probe structures during test board installation and removal, which necessitates top-down or bottom-up installation or removal, preventing arbitrary installation or removal of any particular layer. It also avoids the inconvenience of probe connections and the vulnerability of probes. The adapter board, electrically connected to the vertical segment, forms a signal relay layer, integrating and transmitting signals from multiple test boards on the horizontal segment. The three-dimensional layout of horizontal and vertical segments ensures the horizontal scalability of the test board while enabling spatial layered wiring through the vertical extension. Each test board achieves physical isolation through independent electrical connection points, allowing any test board to be disassembled and replaced independently without relying on adjacent boards, fundamentally eliminating the mandatory constraints on maintenance sequence imposed by traditional stacking structures.

[0010] In one embodiment, each test board is plugged into the adapter in a vertical or horizontal direction via the test interface of the electrical connection point.

[0011] Modular maintenance is achieved by limiting the installation direction and connection method of the test boards. By setting the test interfaces for vertical or horizontal plug-in installation, each test board can be independently assembled and disassembled, freeing it from the rigid constraints of traditional vertical stacking structures on the installation sequence. Vertical plug-in can adapt to the need for compact vertical layouts, while horizontal plug-in facilitates the horizontal expansion of the number of test boards. This selective setting of two directions maintains structural compactness while providing flexibility in test board layout. The plug-in connection method achieves physical contact and signal transmission directly through electrical connection points. Compared to traditional probe connections, this avoids the risk of poor contact and allows each test board to form an independent functional module, supporting individual plug-in and removal maintenance without affecting other test boards. Furthermore, the structure is simplified by abandoning limiting structures and using test structures with certain support capabilities to support the test boards, making the overall test structure more flexible and requiring less space.

[0012] In one embodiment, a test group corresponding to the adapter board is also included, the test group including at least one test board, and the test boards in the test group are all connected to the same side of the adapter board.

[0013] By grouping test boards into sets and corresponding them one-to-one with adapter boards, modularity and independence of the test board layout are achieved. Specifically, each adapter board corresponds to a test group, ensuring that all test boards within a group are connected to the same side of the adapter board, avoiding layout chaos caused by multi-directional connections. The design of each test group containing at least one test board allows for flexible adjustment of the number of test boards according to testing needs, while maintaining structural uniformity within the group. By limiting all test boards within the same test group to connection on the same side of the adapter board, the installation path is further simplified, the risk of poor contact caused by multi-directional insertion is reduced, and the physical space feasibility for independent disassembly and maintenance of the test boards is provided.

[0014] In one embodiment, at least one of the vertical segments is connected to the same horizontal segment or at least one of the horizontal segments is connected to the same vertical segment to form an integral connector; or each of the vertical segments is individually connected to a horizontal segment to form multiple independent connectors.

[0015] In the above technical solution, the connector is used to connect the test board and the adapter board. Two optional connector architecture designs enable flexible configuration of the test device's connection structure. The first method integrates the vertical and horizontal segments into a single connector, reducing the number of components and enhancing connection stability through physical integration, making it suitable for fixed scenarios requiring high-density test interfaces. The second method uses an independent connector design, with each vertical segment combined separately with its corresponding horizontal segment to form a modular structure, allowing for the free addition, removal, or replacement of specific connection units according to test requirements. This coexistence of these two architectures overcomes the limitations of traditional single connection structures. It can meet compact testing requirements through an integrated structure while enabling partitioned maintenance of the test board through an independent structure, solving the problems of test board installation sequence restrictions and maintenance difficulties caused by fixed connector layouts in existing technologies. The horizontal segment serves as the basic connection carrier, and the vertical segment as the interface extension branch; the choice of their combination provides structural adaptability for different testing scenarios.

[0016] In one embodiment, the support structure further includes a limiting frame, which is provided with a groove for each of the test plates to be slidably installed in a vertical or horizontal direction.

[0017] This technical solution addresses the maintenance difficulties caused by the fixed installation method of existing test boards by introducing a limiting frame and its sliding groove structure. The sliding groove design of the limiting frame allows each test board to slide vertically or horizontally, enabling independent movement and positioning of the test boards without relying on a fixed sequence or stacking structure. The vertical or horizontal selection of the sliding groove provides flexibility in test board layout, adapting to the spatial requirements of different testing scenarios while avoiding the layout limitations imposed by probe-type connections. Through the sliding installation method, test boards can be disassembled and maintained individually, reducing the risk of failure due to poor contact or structural interference. It also solves the problem of easy breakage at the interface connection between the adapter and the test board.

[0018] In one embodiment, the support structure includes a support base and a support platform; At least one adapter plate is provided on the support base, and the adapter plate is electrically connected to the connection structure; the support platform is configured to support the wafer jig and keep the wafer jig separated from the connection structure.

[0019] This technical solution divides the support structure into two parts: a support base and a support platform. The adapter plate on the support base is electrically connected to the connecting structure, ensuring the stability of signal transmission. The support platform independently supports the wafer fixture and keeps it separated from the connecting structure, avoiding unnecessary electrical contact before testing and thus reducing the risk of accidental contact. Maintaining the separation allows the wafer fixture to move or be replaced freely during non-testing phases without disconnecting complex electrical connections. When testing is required, a lifting mechanism brings the wafer fixture into contact with the connecting structure, achieving dynamic switching between connection and separation. This structural design solves the maintenance difficulties caused by the fixed connection between the wafer fixture and the test interface in traditional devices, while also providing physical space for subsequent operations such as heating and positioning.

[0020] In one embodiment, the support platform is provided with a rolling element for rolling support of the wafer jig.

[0021] By incorporating rolling elements on the support platform, the sliding friction or fixed contact between the wafer jig and the support platform is transformed into rolling support, enabling the wafer jig to move smoothly along the support platform surface. The introduction of rolling elements reduces resistance during wafer jig movement, facilitating installation and removal while ensuring precise alignment with the connecting structure. Rolling support avoids localized stress concentration or frictional damage that can occur with traditional fixed supports, protecting the structural integrity of the wafer jig and improving the operational flexibility of the testing equipment. This design also indirectly solves the problem of poor contact in the connecting structure caused by uneven wafer jig movement.

[0022] In one embodiment, a heating component is also included, which is vertically and vertically disposed below the wafer jig for heating the wafer jig.

[0023] By incorporating a height-adjustable heating component, the heating mechanism can dynamically adjust its contact state with the wafer fixture according to testing requirements. Positioning the heating component below the wafer fixture, the lifting motion switches between contact heating and separation cooling, ensuring efficient heat transfer during heating while avoiding interference from fixed heating devices on the wafer fixture's displacement. This "height-adjustable" feature, through mechanical movement, enables precise positional control of the heating component and wafer fixture, ensuring uniform heating contact during testing and freeing up space for electrical contact operations of the connection structure when not heated. This structural design effectively solves the problems of uneven contact pressure and thermal stress concentration caused by traditional fixed heating devices, while also achieving synchronized timing between temperature control and electrical connection operations.

[0024] In one embodiment, the heating assembly includes an aging heating mechanism disposed below the wafer jig; A lifting component is used to drive the aging heating mechanism and / or the wafer fixture to move up and down, so that the aging heating mechanism contacts the lower surface of the wafer fixture and brings the wafer fixture close to the connecting structure.

[0025] In one embodiment, the connecting structure is disposed on the lower side of the wafer jig, the support base is provided with a spring column connected to the support platform, and the lifting member is connected to the connecting structure by pressing down the wafer jig.

[0026] This technical solution achieves dual control of heating operation and electrical connection status through the coordinated design of structural layout and motion control. Specifically, the aging heating mechanism, positioned below the wafer fixture, directly conducts heat to the fixture, avoiding the uneven temperature distribution problem caused by traditional lateral heating. The linkage control of the aging heating mechanism and the wafer fixture via a lifting mechanism ensures sufficient contact between the heating mechanism and the wafer fixture to improve heat conduction efficiency. Simultaneously, the lifting motion adjusts the relative position of the wafer fixture and the connection structure, establishing a stable electrical connection while completing heating. Notably, the selection of different drive methods retains the flexibility of driving the heating mechanism or the wafer fixture individually, while also allowing for coordinated lifting of both. This configurable design can adapt to the contact pressure requirements of different testing scenarios.

[0027] In one embodiment, the connection structure is disposed on the upper side of the wafer clamp, and the lifting member is connected to the connection structure by the upper wafer clamp.

[0028] This technical solution changes the traditional probe-style layout by placing the connection structure on the upper / lower side of the wafer chuck, allowing the wafer chuck to directly contact the connection structure above / below during lifting. The lifting mechanism uses an upward / downward drive to force the wafer chuck to move up / down through vertical mechanical force, thereby eliminating connection gaps and establishing a stable electrical conduction path. This design avoids the misalignment risks that may occur with horizontal insertion, and simultaneously completes the heating mechanism contact and electrical connection functions through a single lifting action, simplifying the operation process.

[0029] This application provides a wafer aging test device in which multiple test boards are connected by sliding plug-in connection, which can realize the individual installation and removal of any test board. The adapter has horizontal and vertical sections, which, together with the test interface, can realize the plug-in of test boards in the horizontal or vertical direction. The layout of test boards can be customized according to the site conditions, which has high applicability and small footprint.

[0030] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, the preferred embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of a wafer aging test apparatus provided in one embodiment of this application.

[0032] In the diagram: 1. Wafer fixture; 2. Test board; 3. Support structure; 4. Test structure; 5. Connection structure; 6. Adapter; 7. Adapter board; 8. Limiting frame; 9. Support base; 10. Support platform; 11. Rolling element; 12. Heating assembly. Detailed Implementation

[0033] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0034] In existing technologies, wafer aging test equipment typically uses a vertically stacked arrangement of test boards 2, which means that circuit switch boards can only be installed or removed in a fixed sequence. This structure prevents maintenance personnel from flexibly replacing intermediate layer test boards 2; they must remove upper-layer components layer by layer to access the target board, increasing operational complexity. For example, in a certain existing technology, probes connect multiple vertically stacked test boards 2. When it is necessary to replace a non-top-layer test board 2, all upper layers must be removed, resulting in low maintenance efficiency and a risk of component damage.

[0035] To address the aforementioned issues, the inventors discovered that existing vertical stacking structures limit the independent operating space of the test board 2, leading to maintenance difficulties. Analysis of the test board 2's connection method revealed that while probe-type vertical connections save space, they cannot achieve free horizontal expansion. Based on this, a limiting frame 8 with a sliding groove is proposed to guide the sliding of the test board 2, and an adapter 6 with horizontal and vertical sections is designed. This maintains the continuity of the signal transmission path while providing the test board 2 with independent horizontal operating space, enabling independent installation / removal of the test board 2 in either the horizontal or vertical direction.

[0036] Therefore, this application proposes a wafer aging test apparatus, including a wafer fixture 1, a test board 2, a support structure 3, a test structure 4, and a connection structure 5. The support structure 3 supports the wafer fixture 1, and the connection structure 5 electrically connects the wafer fixture 1 and the test structure 4. The test structure 4 includes an adapter 6 and an adapter board 7. The adapter 6 has a horizontal section and a vertical section. The adapter board 7 is electrically connected to the vertical section, and an electrical connection position is provided at the end of the horizontal section. The test board 2 is connected to the adapter 6 through the electrical connection position and can be detached independently.

[0037] The wafer fixture 1 refers to a clamping device used to fix the wafer under test. Specifically, it may include an upper fixture and a lower fixture, which are fixed in a detachable manner via mechanical snap-fit ​​structures or screws. The lower surface of the lower fixture may have conductive contacts for establishing an electrical connection. The test board 2 refers to a modular unit integrating test circuitry. Specifically, it can be implemented using a PCB board with integrated switches and test modules; the test board may only contain switches. The support structure 3 refers to the frame that supports the wafer fixture 1, adapter board 7, and other components. The adapter 6 refers to a connector with three-dimensional wiring capabilities. Specifically, it can be formed by stacking multiple layers of printed circuit boards to create an L-shaped structure, with an interface at the end of the horizontal section serving as an electrical connection point. Independent detachability means that each test board 2 can be installed and removed independently without affecting the installation status of other test boards 2 or the connection status of other components.

[0038] Specifically, the wafer fixture 1 is kept separate from the connecting structure 5 by the support structure 3, and the two are connected by a lifting mechanism during testing. Each horizontal segment of the adapter 6 has an independent electrical connection point at its end. The electrical connection point can be implemented by means of a male-female interface, and the test board 2 is inserted into the electrical connection point in the horizontal or vertical direction through the slot interface. The adapter board 7 forms a three-dimensional signal transmission network with the vertical segment of the adapter 6 and the horizontal segments of multiple adapters 6. When it is necessary to replace the test board 2, the operator can directly pull out the target test board 2 from the side without moving the adjacent test boards 2.

[0039] Compared to existing technologies, in traditional solutions, test boards 2 are vertically stacked to form a series connection. This solution establishes a parallel connection node through the horizontal section of the adapter 6, giving each test board 2 an independent access path. Existing technologies use probe connections, leading to unstable contact resistance. This solution uses a gold finger connector 7 to achieve surface contact, improving signal transmission reliability. Traditional structures require complete disassembly of the entire test board 2 group; this solution allows for individual replacement of any test board 2.

[0040] Through the above technical solutions, this application enables independent maintenance of the test board 2, eliminating installation sequence restrictions. The distributed electrical connection design enhances the layout flexibility of the test board 2. The surface contact connection method effectively reduces the incidence of poor contact and improves the stability of test signal transmission.

[0041] This application further proposes that each test board 2 be plugged into the adapter 6 in a vertical or horizontal direction via the test interface of the electrical connection position.

[0042] The test interface refers to the contact points used to achieve physical connection and electrical signal transmission. Specifically, it can be implemented using flexible contact pieces or slot-type terminals, with signal conduction achieved through direct matching of the contact points. Vertical insertion installation refers to the test board 2 being inserted into the adapter 6 in a direction perpendicular to the horizontal plane, suitable for layouts with limited lateral space. Horizontal insertion installation refers to the test board 2 being inserted into the adapter 6 in a direction parallel to the horizontal plane, facilitating vertical expansion of the number of test boards 2. The adapter 6 is the intermediate component that carries the test board 2 and provides an electrical connection path. Specifically, it can be implemented using a combination of multilayer printed circuit boards and metal contacts, forming a multi-directional connection channel through the combination of horizontal and vertical segments.

[0043] Specifically, test board 2 forms a physical lock and electrical connection with the adapter 6 through the test interface and the electrical connection point. When vertical insertion is selected, test board 2 is inserted vertically into the test interface at the end of the horizontal section of adapter 6 (the opening of the test interface faces vertically), and is fixed by the snap-fit ​​mechanism within the interface; when horizontal insertion is selected, test board 2 slides horizontally into the test interface of the horizontal section of adapter 6 (the opening of the test interface faces horizontally), and is fixed by the snap-fit ​​mechanism within the interface. Both insertion methods make test board 2 an independent functional module. Removing any test board 2 will not disrupt the connection status of other test boards 2, and the insertion direction can be flexibly adjusted according to the equipment space layout requirements.

[0044] Compared to existing technologies, traditional test boards 2 employ a vertical stacking structure, requiring disassembly layer by layer according to the installation sequence. This solution, however, uses a plug-in installation method to form each test board 2 as an independent unit, allowing for disassembly and assembly in any order. Furthermore, existing technologies using probe-type connections rely on precise alignment settings or highly error-free manual operation, while this solution uses direct matching of plug-in contact surfaces, avoiding signal attenuation issues caused by poor contact between the probe and the test board.

[0045] Through the above technical solution, this application solves the problem of having to follow a fixed sequence when maintaining the test board 2, realizing the independent disassembly and replacement of a single test board 2, while improving the reliability of electrical contact through plug-in connection. The layout of the test board 2 can be expanded vertically or horizontally according to actual needs, improving equipment maintenance efficiency while ensuring structural compactness.

[0046] This application further proposes a test group corresponding to the adapter board 7 one-to-one. The test group includes at least one test board 2, and all test boards 2 in the test group are connected to the same side of the adapter board 7.

[0047] In this context, a test group refers to a functional unit formed by multiple test boards 2 connected on the same side of the adapter board 7. This can be implemented using a pluggable modular structure, with each test group independently corresponding to one adapter board 7, forming physical isolation. One-to-one correspondence of the adapter boards 7 means that each test group establishes an electrical connection with only a single adapter board 7. This can be achieved through independent wiring or a separate interface design, ensuring that the groups do not interfere with each other. Same-side connection means that all test boards 2 are fixed to the same mounting surface of the adapter board 7. This can be achieved using parallel slots or uniformly oriented plug-in interfaces, forming a unidirectional expansion layout structure.

[0048] Specifically, test board 2 is divided into multiple independent test groups, each with an electrical connection channel established through a dedicated adapter board 7. When maintaining a specific test group, only the corresponding adapter board 7 needs to be operated, without removing adjacent test groups. Test boards 2 use a uniform insertion direction on the same side of the adapter board 7, ensuring a linear installation path and avoiding wiring crossovers caused by multi-directional insertions. The number of test boards 2 within a test group can be dynamically adjusted according to testing needs; capacity expansion can be achieved by adding or removing slots while maintaining the principle of same-side connection.

[0049] Compared to existing technologies, traditional vertical stacking structures require test boards 2 to be installed in a fixed order. This solution, however, utilizes a modular test group design, allowing any test group to be independently disassembled and maintained. Existing technologies employ probe-type connections, resulting in layout limitations. This solution, through a unidirectional plug-in method on the same side, enables the test board 2 layout to form a predictable linear expansion pattern, significantly reducing the risk of accidental touches.

[0050] Through the above technical solution, this application achieves the ability to maintain test boards 2 independently in groups, allowing maintenance personnel to operate on faulty test groups individually without requiring a complete system shutdown. The same-side connection method constrains the layout of test boards 2 to a single expansion direction, eliminating the wiring chaos caused by multi-directional plugging. The modular design means that adjusting the number of test boards 2 does not require replanning the overall layout; capacity changes can be completed simply by adding or removing test boards 2 from the same-side slots.

[0051] This application further proposes a connector 7 in which at least one vertical segment is connected to the same horizontal segment or at least one horizontal segment is connected to the same vertical segment to form an integral connector; or each vertical segment is individually connected to a horizontal segment to form multiple independent connectors 7.

[0052] The vertical segment refers to the longitudinally extending structure that electrically connects to the adapter board 7. It can be implemented using a connector strip or pin header, and its function is to establish a vertical signal transmission channel between the test board 2 and the adapter board 7. The horizontal segment refers to the laterally extending structure that electrically connects to the test board 2. It can be implemented using a rigid substrate with conductive lines, and its function is to provide a plug-in mounting interface for the test board 2. The integrated connector 7 refers to the physical integration of the vertical and horizontal segments into a single component, which can be achieved using injection molding. The independent connector 7 refers to the separate, separable unit formed by combining the vertical and horizontal segments, which can be implemented using a modular interface, and its function is to allow independent maintenance for specific test areas.

[0053] Compared with existing technologies, the existing connector 7 adopts a fixed stacking structure, which requires the test board 2 to be installed in sequence. This solution achieves horizontal expansion through an integrated connector 7, avoiding the sequence restriction caused by vertical stacking. At the same time, modular partitioning is achieved through independent connector 7, overcoming the maintenance difficulties caused by the fixed contact points of the traditional probe-type connection structure 5.

[0054] This application further proposes that the support structure 3 also includes a limiting frame 8, which is provided with a sliding groove for each test plate 2 to be slidably installed in the vertical or horizontal direction.

[0055] The limiting frame 8 refers to the frame structure used to fix the movement trajectory of the test plate 2. Specifically, it can be made of metal or polymer material with a sliding groove. Its function is to provide a stable mounting base for the test plate 2 and restrict its movement direction. The sliding groove refers to a linear groove or track structure set in the limiting frame 8 and matching the edge shape of the test plate 2. Its function is to guide the test plate 2 to move along a preset direction through sliding contact and keep the electrical connection position aligned.

[0056] Specifically, the test board 2 is constrained to the limiting frame 8 by embedding a sliding groove at its edge, with the groove extending in the same direction as the test board 2's installation direction. When installing the test board 2, the operator pushes it along the groove until it aligns with the adapter 6 interface; disassembly involves pulling and sliding it in the opposite direction to detach it. Since each test board 2 corresponds to an independent groove, the movement of a single test board 2 will not interfere with the position of adjacent test boards 2, thus enabling independent maintenance without a fixed sequence. The vertical or horizontal orientation of the groove can be adapted to the layout requirements of the test boards 2; for example, vertical stacking can be used when space is limited, or horizontal spacing can be used when rapid heat dissipation is required.

[0057] Compared with existing technologies, traditional test boards 2 are installed by vertical stacking, which requires sequential disassembly layer by layer. Furthermore, the probe-type connection structure 5 is prone to positioning deviations due to uneven contact pressure. This solution, through the cooperation of the slide groove and the limiting frame 8, enables the test board 2 to automatically correct positional deviations during sliding, eliminating the problem of unstable probe contact pressure, and avoiding low maintenance efficiency caused by restrictions on the disassembly sequence.

[0058] Through the above technical solution, this application realizes the free installation and disassembly of the test board 2 in the vertical or horizontal direction, solves the defect of the test board 2 in the prior art that must be maintained in a fixed order, reduces the risk of poor contact caused by structural interference, and at the same time ensures the precise alignment of electrical connection positions through the sliding guide structure, improving the flexibility of the layout of the test board 2 and the convenience of maintenance operations.

[0059] This application further proposes a support structure 3 including a support base 9 and a support platform 10; at least one adapter plate 7 is provided on the support base 9, and the adapter plate 7 is electrically connected to the connection structure 5; the support platform 10 is configured to support the wafer clamp 1 and keep the wafer clamp 1 and the connection structure 5 in a separated state.

[0060] The support base 9 refers to the rigid substrate used to fix the adapter plate 7, which can be implemented using a metal frame or composite material. The support platform 10 refers to a load-bearing platform independent of the support base 9, which can be implemented using a ceramic base or a metal tabletop with a heat-insulating coating. Its surface is provided with positioning grooves or guide structures to restrict the position of the wafer jig 1 during non-testing stages. The separated state refers to the interval state in which there is no physical contact between the wafer jig 1 and the connecting structure 5. This can be achieved through the height adjustment of the support platform 10 or the telescoping design of the connecting structure 5, so that the wafer jig 1 is completely disconnected from the electrical connection during non-testing stages.

[0061] Specifically, the support base 9 detachably mounts the adapter plate 7, and the adapter plate 7 and the connecting structure 5 are electrically connected via a plug-in connection. The support platform 10 independently supports the wafer fixture 1, maintaining a preset distance from the connecting structure 5 during non-testing phases to avoid electrical interference or physical wear caused by accidental contact of probes or contacts. When aging tests are required, an external drive mechanism pushes the wafer fixture 1 to move vertically, making it contact the connecting structure 5 to form an electrical path; after the test, the wafer fixture 1 resets and disengages from the connecting structure 5. This design allows the wafer fixture 1 to switch connection states simply by adjusting its position without disconnecting complex electrical connections during loading, unloading, or maintenance.

[0062] Through the above technical solution, this application realizes the dynamic separation and reliable connection between the wafer fixture 1 and the connection structure 5. During the test, only the position of the wafer fixture 1 needs to be adjusted to complete the establishment and disconnection of the electrical path, avoiding the maintenance difficulties caused by the traditional fixed connection method. At the same time, it reduces the risk of signal interference caused by unnecessary contact, and significantly improves the efficiency of test operation and the convenience of equipment maintenance.

[0063] This application further proposes that the support platform 10 is provided with a rolling element 11 for rolling support of the wafer fixture 1.

[0064] The rolling element 11 refers to a mechanical component disposed on the surface of the support platform 10 in the contact area with the wafer jig 1. It can be implemented using rollers, balls, or bearings, replacing sliding friction with rolling contact to reduce resistance during the movement of the wafer jig 1. The support platform 10 refers to a rigid platform that supports the wafer jig 1. It can be made of metal or ceramic material, with grooves or guide rails on its surface to accommodate the rolling element 11, ensuring that the rolling element 11 moves within a predetermined trajectory.

[0065] Specifically, the wafer jig 1 is placed on the rolling elements 11 on the surface of the support platform 10. The rolling elements 11 achieve translation of the wafer jig 1 by rotating. The rolling elements 11 reduce frictional resistance through rolling contact, enabling the wafer jig 1 to quickly reach the target position. The distribution density and arrangement direction of the rolling elements 11 can be adjusted according to the weight and movement direction requirements of the wafer jig 1. For example, multiple rows of staggered rolling balls can be used to ensure uniform support and unrestricted movement direction.

[0066] Compared with existing technologies, traditional support stages 10 use fixed planes or sliding guides, requiring wafer jigs 1 to overcome significant frictional forces during movement, which can easily lead to positioning deviations or surface wear. However, by introducing rolling elements 11, the contact between wafer jigs 1 and support stages 10 is changed from sliding friction to rolling friction, significantly reducing movement resistance.

[0067] This application further proposes a heating assembly 12, which is vertically and vertically disposed below the wafer jig 1 for heating the wafer jig 1.

[0068] The heating component 12 refers to a device that applies temperature control to the wafer jig 1 through heat conduction. Specifically, it can be implemented using a hot wire, resistance heating element, infrared radiation module, or hot air circulation mechanism, with its heat source distribution matching the shape of the lower surface of the wafer jig 1. The height-adjustable setting refers to adjusting the relative height between the heating component 12 and the wafer jig 1 via a mechanical drive mechanism. This can be achieved using a hydraulic cylinder, electric push rod, or lead screw slide. The drive mechanism controls the lifting stroke through a displacement sensor or pressure feedback signal.

[0069] Specifically, the heating component 12 is initially separated from the wafer fixture 1. When heating is required for testing, the drive mechanism pushes the heating component 12 up to contact the lower surface of the wafer fixture 1 or pushes the wafer fixture 1 down so that its lower surface contacts the upper surface of the heating component 12, achieving uniform heating through heat conduction. When the test is completed or the electrical connection needs to be disconnected, the drive mechanism drives the heating component 12 or the wafer fixture 1 to reset. During the lifting and lowering process, the contact pressure between the heating component 12 and the wafer fixture 1 is dynamically adjusted through an elastic buffer structure or pressure sensor to ensure uniform contact surface adhesion.

[0070] Through the above technical solutions, this application achieves controllable contact pressure between the heating component 12 and the wafer fixture 1, solving the problem of unstable contact caused by thermal expansion; at the same time, through the coordinated control of lifting timing and electrical connection operation, it ensures that the heating stage and the electrical signal transmission stage do not interfere with each other, improving the controllability and reliability of the testing process.

[0071] This application further proposes that the heating assembly 12 includes an aging heating mechanism disposed below the wafer jig 1, and a lifting member for driving the aging heating mechanism or the wafer jig 1 to rise and fall, so that the aging heating mechanism contacts the lower surface of the wafer jig 1 through the lifting action, and the wafer jig 1 is brought close to the connecting structure 5.

[0072] The aging heating mechanism refers to a device that heats the wafer jig 1 through heat conduction. Specifically, it can be implemented using a heating wire, resistance heating element, infrared radiation plate, or thermocouple module. Positioned below the wafer jig 1, it directly transfers heat to the bearing surface of the wafer jig 1. The lifting component is a driving component capable of vertical displacement. Specifically, it can be implemented using a cylinder, electric push rod, or hydraulic cylinder. By controlling the movement path of the lifting component, the contact pressure between the aging heating mechanism and the wafer jig 1, as well as the relative position of the wafer jig 1 and the connecting structure 5, can be adjusted synchronously.

[0073] Through the above technical solution, this application solves the problem of low temperature conduction efficiency caused by unstable contact pressure during the heating process of wafer fixture 1, while ensuring that the electrical connection state remains stable during the heating process and avoiding contact offset caused by thermal expansion.

[0074] This application further proposes that the connection structure is located on the lower side of the wafer jig, and a spring column connected to the support platform is provided on the support base. The lifting component connects to the connection structure by pressing down the wafer jig.

[0075] This application further proposes that the connection structure 5 is disposed on the upper side of the wafer clamp 1, and the lifting component is connected to the connection structure 5 by lifting the wafer clamp 1.

[0076] The connection of the lifting component through the upper wafer clamp 1 refers to the use of a drive mechanism to apply an upward thrust to the wafer clamp 1. Specifically, a lifting device driven by a hydraulic cylinder or a motor can be used to achieve this, and the clamp displacement and electrical connection are completed synchronously through the force in a single direction.

[0077] Specifically, when the lifting mechanism is activated, the wafer jig 1 is lifted vertically upwards, and its top conductive contact forms surface contact with the upper connecting structure 5. Since the connecting structure 5 is fixed to the upper side of the jig, the displacement direction of the jig during lifting is consistent with the direction of the contact surface, avoiding misalignment or tilting that may occur with horizontal insertion. The contact surfaces fit tightly under vertical pressure, eliminating the gap problems caused by insufficient elastic deformation or mechanical wear in traditional probe-type connections, thereby establishing a stable electrical conductivity state.

[0078] Compared to existing technologies, traditional probe-type connections rely on horizontal insertion and removal actions, which are prone to poor contact due to positioning deviations, and the probes are susceptible to elastic failure after long-term use. This solution, through the cooperation of vertical lifting and the upper-mounted connection structure 5, transforms the electrical connection action into a unidirectional mechanical transmission, reducing the degrees of freedom at the contact interface and lowering the risk of misalignment. Simultaneously, the fixed layout of the connection structure 5 avoids dynamic frictional losses between moving parts, extending its service life.

[0079] Through the above technical solution, this application solves the problem of electrical contact stability of the upper connection structure 5 of the wafer fixture 1. A gapless physical contact is directly established through a vertical lifting action, eliminating the risk of poor contact caused by misalignment or elastic failure in traditional probe-type connections. Furthermore, the single drive action of the lifting component simultaneously completes the contact operation between the electrical connection and the heating mechanism, simplifying the testing process and improving operational efficiency.

[0080] refer to Figure 1 This embodiment provides a wafer aging test device, including a support structure 3, a wafer fixture 1, a heating assembly 12, an adapter plate 7, an adapter 6, and a test group; the test group, adapter 6, adapter plate 7, and connecting structure 5 (lower finger probe group) correspond one-to-one, and each is provided in two groups, with each test group having three test plates 2; the details are as follows: A wafer fixture 1 generally includes an upper fixture and a lower fixture. The upper fixture is rectangular, and the lower fixture is cylindrical. The top of the lower fixture has a cavity for placing the wafer under test. The upper fixture includes a PCB board and probes. The PCB board is electrically connected to the probes, which are used to connect to the wafer under test placed in the lower fixture. The probe assembly can connect to contacts on the upper or lower surface of the PCB board. Figure 1 In the middle, the PCB board has contacts on its lower surface.

[0081] The support structure 3 includes two support seats 9 arranged at intervals on the left and right, with a heating component 12 arranged between the support seats. A wafer clamp 1 is arranged above the heating component. The upper surface of the support seat 9 is used to place the adapter board 7. The top of the adapter board 7 near the wafer clamp 1 is electrically connected to the contacts on the lower surface of the PCB board through a probe group. The other side of the adapter board 7 is electrically connected to the test group through an adapter 6. The adapter board 7 can be fixed to the support seat 9 by screws or other means. It can also be fixed by setting a fixing plate on the upper surface of the adapter board 7 for pressing. The fixing plate is located on the side away from the wafer clamp 1. The fixing plate is then connected to the support seat 9 by screws or other detachable means.

[0082] Assuming the wafer jig 1 enters along the front-to-back direction, the support base 9 is equipped with a support platform 10 along the front-to-back direction to support the wafer jig 1 in a separated state from the probe group. The support base 9 has spring pillars on both its front and back sides connected to the lower surface of the support platform 10. The support platform 10 can then be lowered by the compressible action of the spring pillars. The support platform 10 can be L-shaped, and its surface is equipped with rolling elements 11 for rolling support of the wafer jig, such as ball bearings laid along the front-to-back direction.

[0083] The heating assembly 12 may include an aging heating mechanism and a lifting member disposed below the wafer jig 1. The lifting member is used to press down the wafer jig 1 so that the aging heating mechanism contacts the lower surface of the wafer jig 1 and brings the wafer jig 1 closer to the probe group.

[0084] The aging heating mechanism is provided with a first inlet / outlet gas interface, and the wafer jig 1 is provided with a second inlet / outlet gas interface. When the aging heating mechanism comes into contact with the wafer jig 1, the first inlet / outlet gas interface and the second inlet / outlet gas interface are connected to evacuate or fill the wafer jig 1. After evacuating the wafer jig 1, an inert gas, such as nitrogen, can be filled into the wafer jig 1.

[0085] The adapter 6 is located on the lower side of the adapter plate 7. It is composed of multiple horizontal and vertical segments of connectors, that is, three test boards 2 correspond to three connectors. Of course, the adapter 6 can be set to a style of three vertical segments and one horizontal segment. The core is to transfer the connection position between the adapter plate 7 and the test board 2 to facilitate the installation and removal of the test board 2. The vertical segment can be equipped with a power strip for electrical connection.

[0086] For the connection with test board 2, a male-female interface can be used, that is, a male interface is set on one side of test board 2 and a female interface is set on adapter 6, and a stable connection is formed by plugging in.

[0087] To ensure more accurate connection and stability of the test board 2 after connection, a limiting frame 8 with a sliding groove is configured for supporting and limiting the connection of the test board 2. The limiting frame 8 can be set on one side or above the support structure 3, depending on the setting direction of the test board 2; for example... Figure 1 In the middle, since the test plate 2 is set to be horizontal and laid in the vertical direction, the chute is opened in the horizontal direction, and the limiting frame 8 is set on one side of the support structure 3.

[0088] Through the above technical solution, this application solves the limitation that the maintenance of test board 2 needs to be carried out in sequence, so that any test board 2 can be plugged in and unplugged individually, avoiding the interlayer dependency caused by the probe stacking structure, thereby reducing maintenance complexity and improving operation efficiency.

[0089] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A wafer aging test apparatus, characterized in that, include: Wafer fixtures, test boards, support structures, test structures, and connection structures; The support structure is configured to support the wafer fixture, and the connection structure is configured to electrically connect the wafer fixture and the test structure; The test structure includes an adapter and an adapter plate. The adapter includes at least one horizontal section and at least one vertical section. The adapter plate is electrically connected to the vertical section. The end of the horizontal section is provided with an electrical connection position. The test plate is electrically connected to the adapter through the electrical connection position, and each test plate can be detached individually.

2. The testing device according to claim 1, characterized in that, Each test board is plugged into the adapter in a vertical or horizontal direction via the test interface of the electrical connection point.

3. The testing device according to claim 2, characterized in that, It also includes test groups that correspond one-to-one with the adapter board. Each test group includes at least one test board, and all test boards in the test group are connected to the same side of the adapter board.

4. The testing device according to claim 1, characterized in that, A connector in which at least one of the vertical segments is connected to the same horizontal segment or at least one of the horizontal segments is connected to the same vertical segment to form an integral connector; Alternatively, each of the vertical segments can be individually connected to a horizontal segment to form multiple independent connectors.

5. The testing apparatus according to any one of claims 1 to 4, characterized in that, The support structure also includes a limiting frame, which is provided with a sliding groove for each test plate to be slidably installed in the vertical or horizontal direction.

6. The testing apparatus according to claim 1, characterized in that, The support structure includes a support base and a support platform; At least one adapter plate is provided on the support base, and the adapter plate is electrically connected to the connecting structure; The support platform is configured to support the wafer clamp and keep the wafer clamp separated from the connection structure.

7. The testing apparatus according to claim 6, characterized in that, The support platform is provided with a rolling element for rolling support of the wafer fixture.

8. The testing apparatus according to claim 6, characterized in that, It also includes a heating component, which can be raised and lowered below the wafer chuck for heating the wafer chuck.

9. A testing device according to claim 8, characterized in that, The heating assembly includes an aging heating mechanism disposed below the wafer fixture; A lifting component is used to drive the aging heating mechanism and / or the wafer fixture to move up and down, so that the aging heating mechanism contacts the lower surface of the wafer fixture and brings the wafer fixture close to the connecting structure.

10. A testing apparatus according to claim 9, characterized in that, The connecting structure is located on the lower side of the wafer clamp, and the support base is provided with a spring column connected to the support platform. The lifting component connects to the connecting structure by pressing down the wafer clamp.

11. A testing apparatus according to claim 9, characterized in that, The connection structure is located on the upper side of the wafer clamp, and the lifting component is connected to the connection structure by the upper wafer clamp.

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