Wafer burn-in test assembly and test apparatus

Abstract

The utility model discloses a kind of wafer aging test components and testing device, mainly related to wafer testing equipment technical field.The wafer aging test component of the utility model, comprising: adapter plate group, at least one probe group and several test boards;Wafer aging test device, based on above-mentioned wafer aging test component, further comprising: wafer fixture and heating component.The utility model sets up several test boards into plug-in mode and cooperates sliding connection, the installation and maintenance replacement of any test board can be realized;By equipping multiple test boards, the size and cost of single test board can be reduced, by a probe group corresponding multiple test boards, equipment complexity can be reduced and parallel test flexibility is improved;Meanwhile, test component whole is located in the uppermost of the testing device, when needing to overhaul test component, other components do not need to be disassembled, and test board vertically stacked is arranged into horizontal arrangement and is plugged in adapter plate, test board is conveniently disassembled and maintained.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing equipment technology, and in particular to a wafer aging test component and a wafer aging test device. Background Technology

[0002] Wafer Level Burn In (WLBI) is a technique used in semiconductor manufacturing to test the aging of chips while they are still in a wafer state. At this stage, the chip has not yet been cut and packaged, but exists in the form of a wafer.

[0003] By subjecting chips to accelerated stress conditions such as high temperature and high voltage for a period of time, chips that are prone to early failure are identified. This is because potential faults may exist in the chip manufacturing process due to material defects, process deviations, or other factors. Aging tests can expose these potentially faulty chips in a short period of time, thereby ensuring higher reliability of the delivered chips.

[0004] In existing technologies, aging test fixtures are generally coupled to an adapter board via probes, and then coupled to a test board or test instrument via the adapter board for wafer testing. Most existing aging test equipment has the problems of large footprint and inconvenient installation / maintenance. There is an urgent need for a model with a reasonable layout and convenient maintenance, which can also be adapted to the needs of fully automatic testing. Utility Model Content

[0005] The purpose of this utility model is to provide a wafer aging test component and test device, which can easily disassemble and maintain the test board, while having a reasonable layout and small footprint.

[0006] The objective of this utility model is achieved through the following technical solution: A wafer aging test assembly includes: The adapter board assembly is provided with a plurality of electrical connection positions; At least one probe group having multiple probes for contacting the PCB board of the wafer jig, the at least one probe group being connected to the same adapter board group; Several test boards are provided, each of which is independently mounted on each electrical connection point, and at least one test board is electrically connected to the same probe group through the adapter board group.

[0007] Furthermore, the adapter plate assembly includes at least one adapter plate and at least one connector, wherein the at least one connector is electrically connected to the same probe group through at least one adapter plate, and the connector forms an electrical connection point.

[0008] Furthermore, the plurality of test boards are plugged into the adapter board assembly via test interfaces of electrical connection points.

[0009] Furthermore, the test assembly also includes a limiting frame, which is provided with a sliding groove for each test plate to be slidably installed.

[0010] Furthermore, the test assembly also includes a first mounting component, the adapter plate assembly is disposed on the first mounting component, the lower surface of the first mounting component is provided with a first limiting part, and the top of the wafer jig is provided with a second limiting part for adapting to the first limiting part, for limiting the wafer jig.

[0011] This application also relates to a wafer aging test apparatus, which, based on the above-mentioned wafer aging test components, further includes: A wafer fixture is height-adjustable, and at least one probe group is electrically connected to the PCB board of the wafer fixture when the wafer fixture is close to the adapter board group, so that the test board can perform power-on testing on the wafer. The heating element is height-adjustable and positioned below the wafer chuck for heating the wafer chuck.

[0012] Furthermore, the heating assembly includes: An aging heating mechanism is located below the wafer fixture; The lifting component is used to drive the aging heating mechanism or wafer fixture to rise and fall, so that the aging heating mechanism contacts the lower surface of the wafer fixture and brings the wafer fixture closer to the probe group.

[0013] Furthermore, the heating assembly includes a second mounting component, and the aging heating mechanism is disposed on the second mounting component. The aging heating mechanism and the wafer fixture are driven to rise and fall by a lifting component.

[0014] Furthermore, the aging heating mechanism is provided with a first inlet / outlet gas interface, and the wafer fixture is provided with a second inlet / outlet gas interface. When the aging heating mechanism contacts the wafer fixture, the first inlet / outlet gas interface and the second inlet / outlet gas interface are connected to evacuate or fill the wafer fixture.

[0015] Furthermore, it also includes: a support base, wherein the adapter plate assembly is disposed on the support base, and the support base is provided with a rolling element for rolling support of the wafer fixture.

[0016] Furthermore, it also includes: a base, on which the support is disposed; and / or; The support base includes two support platforms arranged at relative intervals, each support platform having an inner step facing the other support platform, the adapter plate assembly being disposed on the top of the two support platforms, and the rolling element being disposed on the step surface of the inner step.

[0017] Compared with the prior art, the beneficial effects of this utility model include at least the following: This utility model provides a wafer aging test assembly and test device. The test assembly sets several test boards in a plug-in manner and with sliding connection, which can realize the installation, maintenance and replacement of any test board. By equipping multiple test boards, the size and cost of a single test board can be reduced. By using one probe group to correspond to multiple test boards, the complexity of the equipment can be reduced and the flexibility of parallel testing can be improved. At the same time, the test assembly is set above the wafer fixture, that is, the entire test assembly is located at the top of the test device. When the test assembly needs to be repaired, there is no need to disassemble other components. The vertically stacked test boards are arranged horizontally and plugged into the adapter board, and any test board can be plugged in and removed for repair, which facilitates the disassembly and maintenance of the test boards. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a wafer aging test device according to Embodiment 2 of this utility model; Figure 2 This is a schematic diagram of the structure of a wafer aging test device according to Embodiment 3 of this utility model; Figure 3 This is a schematic diagram of the structure of a wafer aging test device according to Embodiment 4 of this utility model.

[0019] In the figure: 1. Support base; 201. Adapter board assembly; 202. Probe assembly; 203. Test board; 204. Test interface; 205. First mounting component; 3. Wafer fixture; 401. Fixing plate; 402. Limiting frame; 501. Second mounting component; 502. Aging heating mechanism; 503. Lifting component; 601. First limiting part; 602. Second limiting part; 8. Rolling component; 9. Base; 1001. Pushing component. Detailed Implementation

[0020] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.

[0021] The terms used to describe position and direction in this utility model are illustrated with the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this utility model. Example 1:

[0022] This embodiment provides a wafer aging test assembly, including an adapter board assembly 201, which is disposed on a support base 1 and has a plurality of electrical connection positions. At least one probe group 202 has a plurality of probes that contact the PCB board of the wafer jig, and at least one probe group 202 is connected to the same adapter board group 201. Several test boards 203 are installed independently on each electrical connection position, and at least one test board 203 is electrically connected to the same probe group 202 through the adapter board group 201.

[0023] It is worth noting that the number of probe groups 202 is less than the number of test boards 203, for example... Figure 1 As shown, there are two probe groups 202 and eight test boards 203. Every four test boards 203 correspond to one probe group 202. Multiple probe groups 202 are connected to several test boards 203 through the same adapter board group 201. This avoids the need to separately arrange adapter boards and test boards 203 on the left and right sides of the wafer fixture 3, resulting in a more optimized structural layout and a significant reduction in equipment footprint. Furthermore, all test boards 203 are installed individually, allowing for separate installation and removal, which facilitates installation and replacement.

[0024] In a preferred embodiment, the adapter plate assembly 201 includes at least one adapter plate and at least one connector, wherein the at least one connector is electrically connected to the same probe assembly 202 via the at least one adapter plate, and the connector forms an electrical connection point.

[0025] Specifically, the wafer fixture 3 generally includes an upper fixture and a lower fixture. The lower fixture has a cavity for placing the wafer under test. The upper fixture includes a PCB board and probes. The PCB board is electrically connected to the probes. The probes are used to connect with the wafer under test placed in the lower fixture. The probe group 202 can be connected to the contacts on the upper or lower surface of the PCB board. The adapter board group 201 can have one, two, or more adapter boards. Adapter board assembly 201 has only one adapter board: like Figure 1 As shown, contacts are set on the upper surface of the PCB board, and probe group 202 is located above wafer fixture 3. Two probe groups 202 are connected to the same adapter board above, and multiple connectors are set on the top of the adapter board. Alternatively, contacts can be set on the lower surface of the PCB board, and two probe groups 202 are located below the contacts on both sides of the PCB. The bottom ends of the two probe groups 202 are connected to the upper surface of the adapter board, and multiple connectors are set on the lower surface of the adapter board to connect to the test board 203.

[0026] In one example, the electrical connector uses a plug-in method (such as a male-female interface), and several test boards 203 are ultimately plugged into the adapter board group 201 through the test interface 204 of the electrical connection position. The connector can also be configured in other forms, such as connecting to the horizontally placed test board 203 via probes, or using an L-shaped connector to adjust the vertical installation to a horizontal installation, or an angled installation at any angle to the horizontal. When the probe group 202 is positioned above the wafer fixture 3, the connection between the probe group 202 and the wafer fixture 3 is achieved by driving the wafer fixture 3 to rise.

[0027] Adapter board assembly 201 is equipped with two adapter boards, defined as upper adapter board and lower adapter board: like Figure 2 As shown, contacts are set on the upper surface of the PCB board, and probe group 202 is located above the fixture. Two probe groups 202 are respectively connected to two lower adapter boards above (the two lower adapter boards can also be set as one unit). The two lower adapter boards are then electrically connected to the same upper adapter board. Multiple connectors are set on the upper adapter board; in addition, as Figure 3 Alternatively, contacts can be set on the lower surface of the PCB board, with two probe groups 202 located below the contacts on both sides of the PCB board. The bottom ends of the two probe groups 202 are connected to the upper surfaces of the two lower adapter boards, respectively. Multiple connectors are set on the lower surface of the upper adapter board to connect with the lower adapter board. Of course, the aforementioned upper adapter board for mounting connectors can be set on the lower side of the lower adapter board, which can be set according to requirements and will not be elaborated on here.

[0028] In one example, the electrical connector uses a plug-in method (such as a male-female interface), and several test boards 203 are ultimately plugged into the adapter board group 201 through the test interface 204 of the electrical connection position. The connector can also be configured in other forms, such as connecting to the horizontally placed test board 203 via probes, or using an L-shaped connector to adjust the vertical installation to a horizontal installation, or an angled installation at any angle to the horizontal. When the probe group 202 is positioned below the wafer fixture 3, the connection between the probe group 202 and the wafer fixture 3 is achieved by driving the wafer fixture 3 to descend.

[0029] In a preferred embodiment, the test assembly further includes a limiting component, which includes a fixing plate 401 and a limiting frame 402. The fixing plate 401 is disposed on the upper surface of the adapter plate assembly 201. The fixing plate 401 is provided with clearance grooves for the test interface 204 to pass through. There can be multiple clearance grooves, each corresponding to a test interface 204. The fixing plate 401 can reinforce the test interface 204 and improve its stability. The limiting frame 402 is disposed on the fixing plate 401. The limiting frame 402 can be vertically installed on the fixing plate 401 with bolts for easy disassembly. The limiting frame 402 is provided with a sliding groove for the test plate 203 to pass through vertically. The sliding groove matches the shape of the test plate 203 and is used to limit and support the test plate 203. Figure 1 As shown, the slide is opened vertically, and the test plate 203 is inserted into the test interface 204 along the slide downward. This can guide the test plate 203 during installation, improve the accuracy of the test plate 203 during installation, and improve the stability of the test plate 203 after installation.

[0030] In a preferred embodiment, the test assembly further includes a first mounting member 205, which is disposed on the support base 1. The adapter plate assembly 201 is disposed on the first mounting member 205. A first limiting part 601 is provided on the lower surface of the first mounting member 205. A second limiting part 602 is provided on the top of the wafer jig 3 for adapting to the first limiting part 601 and for limiting the wafer jig 3.

[0031] Specifically, the first mounting component 205 is mounted on the support base 1, and the adapter plate assembly 201 is mounted on the first mounting component 205 so that it can be detachably mounted on the support base 1 via the first mounting component 205. The first mounting component 205 and the support base 1 are fixed together by a connector. Specifically, the connector can be fixed by bolts, mechanical buckles, etc., for easy disassembly. Example 2:

[0032] refer to Figure 1 This embodiment provides a wafer aging test device. The adapter board assembly 201 is provided with only one adapter board, including: a support base 1, a test component and a wafer fixture 3.

[0033] The test assembly includes an adapter board assembly 201, at least one probe assembly 202, and several test boards 203. The adapter board assembly 201 is mounted on the support base 1, and a certain accommodating space is formed below the adapter board assembly 201. Several test interfaces 204 are provided on the upper surface of the adapter board assembly 201. Each test board 203 is mounted on the upper surface of the adapter board assembly 201 and connected to one test interface 204. The probe assembly 202 is mounted on the lower surface of the adapter board assembly 201. The test boards 203 are electrically connected to the probe assembly 202 through the adapter board assembly 201. Several test boards 203 are vertically inserted and mounted on the adapter board assembly 201 through the test interfaces 204.

[0034] The wafer fixture 3 is vertically and vertically positioned below the adapter board assembly 201 for placing the wafer to be tested. The wafer fixture 3 is provided with a PCB board for electrical connection with the pads of the wafer to be tested. The probe assembly 202 is used to electrically connect the PCB board of the wafer fixture 3 when the wafer fixture 3 is close to the adapter board assembly 201, so that the test board 203 can perform power-on testing on the wafer.

[0035] The wafer aging test device provided in this embodiment sets the test components above the wafer fixture 3, that is, the entire test components are located at the top of the test device. When repairing the test components, there is no need to disassemble other components. Furthermore, the vertically stacked test boards 203 are arranged horizontally and inserted into the adapter board group 201, allowing any test board 203 to be plugged in and unplugged for repair, which facilitates the disassembly and maintenance of the test boards 203.

[0036] In a preferred embodiment, a first mounting component 205 is also included. The first mounting component 205 is disposed on the support base 1, and the adapter plate assembly 201 is mounted on the first mounting component 205 so that it can be detachably disposed on the support base 1 via the first mounting component 205. The first mounting component 205 and the support base 1 are fixed together by a connector. Specifically, the connector can be fixed by bolts, mechanical buckles, or other means to facilitate disassembly.

[0037] In a preferred embodiment, the wafer aging test apparatus provided in this embodiment further includes a limiting component, which includes a fixing plate 401 and a limiting frame 402.

[0038] A fixing plate 401 is disposed on the upper surface of the adapter plate assembly 201. The fixing plate 401 has clearance grooves for the test interface 204 to pass through. Multiple clearance grooves can be provided, each corresponding to a test interface 204. The fixing plate 401 reinforces the test interface 204, improving its stability. A limiting bracket 402 is disposed on the fixing plate 401. The limiting bracket 402 can be vertically installed on the fixing plate 401 with bolts for easy disassembly. The limiting bracket 402 has a sliding groove for the test plate 203 to pass through vertically. The sliding groove matches the shape of the test plate 203, limiting and supporting the test plate 203. It guides the test plate 203 during installation, improving the accuracy of installation and enhancing its stability after installation.

[0039] In a preferred embodiment, the wafer aging test apparatus provided in this embodiment further includes a heating component. The heating component heats the bottom of the lower clamp in the wafer fixture 3, and then heats the wafer inside the wafer fixture 3 through heat conduction, thereby testing its aging performance. The heating component includes: a second mounting component 501, an aging heating mechanism 502, and a lifting component 503. The lifting component 503 can be a hydraulic cylinder, an electric telescopic rod, or other component with telescopic function.

[0040] The second mounting member 501 is disposed below the wafer jig 3. The aging heating mechanism 502 is disposed on the second mounting member 501. The lifting member 503 is used to drive the second mounting member 501 to rise and fall, so that the aging heating mechanism 502 contacts the wafer jig 3 and brings the wafer jig 3 closer to the adapter plate assembly 201. Two lifting members 503 can be provided. The second mounting member 501 has horizontal sections on the left and right sides, and a lifting member 503 is disposed below each horizontal section. The aging heating mechanism 502 is disposed in the recess between the two horizontal sections. Driven by the lifting member 503, the second mounting member 501 first moves upward so that the horizontal section abuts against the lower surface of the wafer jig 3, and then moves upward together with the wafer jig 3, so that several contacts on the upper surface of the wafer jig 3 are electrically connected to several probes of the probe assembly 202. In other embodiments, if space permits, there may be only one lifting member 503, which is disposed below the second mounting member 501 to drive the second mounting member 501 to rise and fall.

[0041] In a preferred embodiment, the aging heating mechanism 502 is provided with a first inlet / outlet gas interface, and the wafer jig 3 is provided with a second inlet / outlet gas interface. When the aging heating mechanism 502 contacts the wafer jig 3, the first inlet / outlet gas interface and the second inlet / outlet gas interface are connected to evacuate or fill the wafer jig 3. After evacuating the wafer jig 3, an inert gas, such as nitrogen, can be filled into the wafer jig 3.

[0042] In a preferred embodiment, a first limiting part 601 is provided on the lower surface of the first mounting member 205, and a second limiting part 602 is provided on the top of the wafer jig 3 to adapt to the first limiting part 601 and limit the rising height of the wafer jig 3. Specifically, the first limiting part 601 can be a post, and the second limiting part 602 can be a groove, or the first limiting part 601 can be a groove, and the second limiting part 602 can be a post. When the first limiting part 601 and the second limiting part 602 are engaged, it indicates that the probe group 202 is aligned with several contact points on the upper surface of the wafer jig 3. The first limiting part 601 and the second limiting part 602 cooperate with each other to prevent the wafer jig 3 from being over-connected to the probe group 202 in the test assembly, thus protecting the probe group 202 from breakage or damage to the PCB board.

[0043] In a preferred embodiment, the wafer jig 3 is mounted on the support base 1, and the support base 1 is provided with a rolling element 8 for rolling support of the wafer jig 3. When the wafer jig 3 is loaded or unloaded, the rolling element 8 provides rolling support to the wafer jig 3 by pulling out or pushing it onto the support base 1, which facilitates loading or unloading the wafer jig 3. When the rolling element 8 supports the wafer jig 3, the bottom of the wafer jig 3 is higher than the top of the aging heating mechanism 502.

[0044] The support base 1 includes two support platforms spaced apart from each other. Each support platform has an inner step facing the other support platform. The support platforms are generally L-shaped. The adapter plate assembly 201 is disposed on top of the two support platforms. The rolling element 8 is disposed on the step surface of the inner step. The wafer clamp 3 is located between the inner steps of the two support platforms and can limit the movement of the wafer clamp 3. The above structure facilitates the arrangement of the adapter plate assembly 201, the wafer clamp 3, and the heating assembly, and has a high space utilization rate.

[0045] In a preferred embodiment, the wafer aging test apparatus provided in this embodiment further includes: a base 9, and a support base 1 disposed on the base 9. The base 9 is used to provide a support platform for the testing work. Example 3:

[0046] refer to Figure 2 This embodiment provides a wafer aging test apparatus that is basically the same as the wafer aging test apparatus in Embodiment 2, except that: The adapter board assembly 201 includes two adapter boards, and the two adapter boards are electrically connected to each other through probes / plugs or other means.

[0047] The first limiting part 601 is provided on the lower surface of the first mounting member 205.

[0048] Apart from the structure described above, all other structures in the wafer aging test apparatus of this embodiment are the same as those in Embodiment 2, and therefore will not be described again.

[0049] The wafer aging test device provided in this embodiment is applicable to different workspaces compared to Embodiment 2. Example 4:

[0050] refer to Figure 3 This embodiment provides a wafer aging test apparatus that is basically the same as the wafer aging test apparatus in Embodiment 2, except that: The adapter board assembly 201 includes two adapter boards, and the two adapter boards are electrically connected to each other through probes / plugs or the like. One of the adapter boards is set on the inner step of the support stage and is located below the wafer fixture 3.

[0051] The probe group 202 is mounted on the adapter plate located below the wafer fixture 3.

[0052] The aging heating mechanism 502 is set on the base 9. This embodiment does not have the second mounting component 501 of embodiment 2. At least two elastic columns are set on the support base 1 along the entry direction of the wafer jig 3. An L-shaped support platform is installed on the at least two elastic columns. The rolling element 8 is installed on the L-shaped support platform. The L-shaped support platform supports both sides of the wafer jig 3. When the rolling element 8 supports the wafer jig 3, the bottom of the wafer jig 3 is higher than the highest point of the probe group 202 and the first limiting part 601.

[0053] The first mounting component 205 is a hollow structure with a lower opening and a cavity. The wafer jig 3 is located at the lower opening of the first mounting component 205 and can limit the wafer jig 3. A pusher 1001 is provided in the cavity of the first mounting component 205. The pusher 1001 is installed on the upper surface of the inner wall of the cavity. By pressing down the pusher 1001, the wafer jig 3 can be coupled downward to the probe group 202.

[0054] The pusher 1001 is positioned above the wafer fixture 3. The pusher 1001 can be a component with telescopic function, such as a hydraulic cylinder or an electric telescopic rod.

[0055] The pusher 1001 is used to push the wafer jig 3 downward so that the contacts of the PCB board on the wafer jig 3 are coupled with the probe group 202. At the same time, it makes the bottom of the wafer jig 3 contact the aging heating mechanism 502. Specifically, it makes the bottom of the lower jig of the wafer jig 3 contact the aging heating mechanism 502, thereby heating the wafer inside the wafer jig 3.

[0056] Apart from the structure described above, all other structures in the wafer aging test apparatus of this embodiment are the same as those in Embodiment 2, and therefore will not be described again.

[0057] The wafer aging test device provided in this embodiment couples the PCB board of the wafer fixture 3 with the probe group 202 by pressing down, which is applicable to the wafer fixture 3 when the PCB board is located on the lower surface of the upper fixture.

[0058] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention without departing from the principles and spirit of the present invention, and all such changes should fall within the protection scope of the claims of the present invention.

Claims

1. A wafer aging test assembly, characterized in that, include: The adapter board assembly (201) is provided with a plurality of electrical connection positions; At least one probe group (202) has a plurality of probes for contacting the PCB board of the wafer jig (3), the at least one probe group (202) being connected to the same adapter board group (201). Several test boards (203) are independently mounted on each electrical connection point, and at least one test board (203) is electrically connected to the same probe group (202) through the adapter board group (201).

2. The wafer aging test assembly as described in claim 1, characterized in that, The adapter plate assembly (201) includes at least one adapter plate and at least one connector, the at least one connector being electrically connected to the same probe assembly (202) via at least one adapter plate, the connector forming an electrical connection point.

3. The wafer aging test assembly as described in claim 1, characterized in that, The plurality of test boards (203) are plugged into the adapter board group (201) via test interfaces (204) of electrical connection positions.

4. The wafer aging test assembly as described in claim 1, characterized in that, The test assembly also includes a limiting frame (402) having a sliding groove for each test plate (203) to be slidably installed.

5. The wafer aging test assembly as described in claim 1, characterized in that, The test assembly also includes a first mounting component (205), the adapter plate assembly (201) is disposed on the first mounting component (205), the lower surface of the first mounting component (205) is provided with a first limiting part (601), and the top of the wafer jig (3) is provided with a second limiting part (602) for matching the first limiting part (601) and for limiting the wafer jig (3).

6. A wafer aging test apparatus, characterized in that, The wafer aging test assembly according to any one of claims 1-5 further includes: The wafer fixture (3) is height-adjustable, and at least one probe group (202) is electrically connected to the PCB board of the wafer fixture (3) when the wafer fixture (3) is close to the adapter board group (201) so that the test board (203) can perform power-on testing on the wafer. The heating component is adjustable and positioned below the wafer jig (3) to heat the wafer jig (3).

7. The wafer aging test apparatus as described in claim 6, characterized in that, The heating component includes: An aging heating mechanism (502) is disposed below the wafer fixture (3); The lifting component (503) is used to drive the aging heating mechanism (502) or the wafer jig (3) to rise and fall, so that the aging heating mechanism (502) contacts the lower surface of the wafer jig (3) and brings the wafer jig (3) closer to the probe group (202).

8. The wafer aging test apparatus as described in claim 7, characterized in that, The heating assembly includes a second mounting component (501), and an aging heating mechanism (502) is disposed on the second mounting component (501). The aging heating mechanism (502) and the wafer fixture (3) are driven to rise and fall by a lifting component (503).

9. The wafer aging test apparatus as described in claim 7, characterized in that, The aging heating mechanism (502) is provided with a first inlet / outlet gas interface, and the wafer fixture (3) is provided with a second inlet / outlet gas interface. When the aging heating mechanism (502) contacts the wafer fixture (3), the first inlet / outlet gas interface and the second inlet / outlet gas interface are connected to evacuate or fill the wafer fixture (3).

10. A wafer aging test apparatus as described in claim 6, characterized in that, Also includes: Support base (1), the adapter plate assembly (201) is disposed on the support base (1), and the support base (1) is provided with a rolling element (8) for rolling support of the wafer fixture (3).

11. The wafer aging test apparatus as described in claim 10, characterized in that, Also includes: The base (9) and the support (1) are disposed on the base (9); and / or; The support base (1) includes two support platforms arranged at relative intervals, each of the support platforms having an inner step facing the other support platform, the adapter plate assembly (201) is disposed on the top of the two support platforms, and the rolling element (8) is disposed on the step surface of the inner step.

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