A test device for PCB pogo pins

Abstract

The application relates to the technical field of PCB testing, and provides a test device for a PCB paster spring needle, which comprises a PCB substrate, a paster spring needle assembly and a wire collecting assembly. The PCB substrate is provided with detection positions corresponding to test point positions of a measured PCB. Each PCB substrate is provided with a solder pad at the detection position, and the center of the solder pad is provided with a mounting groove. The paster spring needle assembly is provided with a plurality of paster spring needle assemblies. One end of each paster spring needle assembly is mounted into the mounting groove, and the other end is used for abutting against a test point of the measured PCB. The point position design of the PCB substrate is reused for the measured PCB, the design cycle and cost are reduced, the end of the paster spring needle is used for abutting against the test point of the measured PCB for testing, the service life of the test device is prolonged, the wire collecting assembly realizes signal concentration and lead-out, the terminal can be quickly positioned in the channel when a fault occurs, the contact array of the paster spring needle assembly is synchronously SMT attached with the PCB, and the compatibility problem of the wiring terminal and the production efficiency are improved.

Description

Technical Field

[0001] This application relates to the field of PCB testing technology, and in particular to a testing device for PCB surface mount spring pins. Background Technology

[0002] In multi-channel AD / DA signal acquisition technology and PCB / PCBA testing, it is sometimes necessary to perform tests on multiple channels simultaneously on a single circuit board to check for faults and acquire signals. In this acquisition and testing process, a special technology is required that can both meet the requirement of simultaneous multi-channel testing and keep each channel independent to avoid mutual interference.

[0003] In existing technologies, chip probe testing technology is used to inspect PCB boards. Spring pins are used to test the circuit board. Typically, the spring pins are inserted into a plastic socket or clamped between two layers of acrylic sheets using a mechanical structure. This method requires extremely high processing standards for the clamping components, is prone to wear on the spring pins, and has limitations, increasing the difficulty of the experiment. Summary of the Invention

[0004] Therefore, it is necessary to provide a testing device for PCB surface mount spring pins to address the above-mentioned technical problems, thereby solving the problems that traditional testing requires extremely high processing requirements for the clamping components, is prone to wear on the spring pins, and has limitations that increase the difficulty of the experiment.

[0005] This application provides a testing device for PCB surface mount spring pins, including:

[0006] The PCB substrate has detection positions corresponding to the test points of the PCB board under test. Each PCB substrate has a pad at the detection position, and a mounting groove is formed in the center of the pad.

[0007] A surface mount spring pin assembly is provided in multiple ways. One end of each surface mount spring pin assembly is installed in the mounting groove, and the other end is used to abut against the test point of the PCB under test.

[0008] A wire bundling assembly includes a terminal block and a wire bundle connected to the terminal block. The terminal block is soldered onto a PCB substrate and is connected to a surface mount spring pin assembly.

[0009] In one embodiment, the PCB substrate has internal circuitry etched inside, and the terminal block is connected to the patch spring pin assembly via the internal circuitry of the copper foil.

[0010] In one embodiment, a positioning component is also included, the positioning component including a positioning hole and a positioning pin, the positioning hole being formed on the PCB substrate, the positioning pin cooperating with the positioning hole, the positioning pin being used to lock the positions of the PCB substrate and the PCB board under test.

[0011] In one embodiment, the wire harness is a shielded wire harness, with its core wire being tin-plated copper wire and its shielding layer being tin-plated copper mesh.

[0012] In one embodiment, the patch spring needle assembly includes a needle shaft, a compression spring mounted in the needle shaft, and a needle tube inserted into the needle shaft.

[0013] In one embodiment, the bottom of the needle shaft is connected to the mounting groove, and the end of the needle tube abuts against the test point of the PCB being tested.

[0014] In one embodiment, the surface of the pad is plated with a nickel-gold layer; the diameter of the mounting groove is larger than the outer diameter of the needle.

[0015] In one embodiment, the terminal block is a pluggable structure that is plugged into the PCB substrate and then soldered.

[0016] In one embodiment, the patch spring pin assembly is fixed to the mounting groove by solder, and the solder covers the outer periphery and bottom of the pin tube welding end.

[0017] In one embodiment, the PCB substrate is made of epoxy resin substrate, and the internal circuitry is made of copper foil.

[0018] The aforementioned PCB surface mount spring pin testing device reuses the test PCB's point design on the PCB substrate, reducing design cycle and cost. Testing is performed by contacting the end of the surface mount spring pin with the test point on the PCB, reducing friction, improving wear resistance, and extending the lifespan of the testing device. A wire bundle assembly enables centralized signal output, allowing for quick channel location via terminals in case of faults. The surface mount spring pin assembly contact array is synchronously SMT-mounted with the PCB board, eliminating the need for custom CNC chip test sockets and wire harness terminal crimping / soldering processes, improving terminal compatibility. Production is completed together with other components, increasing production line efficiency. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure in one embodiment;

[0020] Figure 2 This is a schematic diagram of the overall structure from another perspective in one embodiment;

[0021] Figure 3This is a schematic diagram of the pads and mounting grooves on a PCB substrate in one embodiment.

[0022] Figure 4 This is a schematic diagram of the patch spring pin assembly in one embodiment;

[0023] Reference numerals: 11, PCB substrate; 111, pad; 112, mounting groove; 12, surface mount spring pin assembly; 121, pin shaft; 122, pin tube; 13, wire harness assembly; 131, terminal block; 132, wire harness. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0025] Example 1, please refer to Figures 1-4 This application provides a testing device for PCB surface mount spring pins, including a PCB substrate 11, surface mount spring pin assemblies 12, and wire gathering assembly 13. The PCB substrate 11 has detection positions corresponding to the test points of the PCB board under test. Each PCB substrate 11 has a pad 111 at the detection position, and a mounting groove 112 is formed in the center of the pad 111. Multiple surface mount spring pin assemblies 12 are provided. One end of each surface mount spring pin assembly 12 is installed in the mounting groove, and the other end is used to abut against the test point of the PCB under test. The wire gathering assembly 13 includes a terminal block 131 and a wire bundle 132 connected to the terminal block 131. The terminal block 131 is soldered on the PCB substrate 11 and is conductive to the surface mount spring pin assembly 12.

[0026] Through the above structural design, the PCB substrate 11 reuses the point design of the PCB under test, reducing the design cycle and cost. The test spring pins are tested by contacting the test points of the PCB under test with the ends of the surface mount spring pins, which reduces the friction of the test spring pins, improves wear resistance, and extends the service life of the test device. The wire bundle assembly 13 realizes the centralized signal output. In case of failure, the channel can be quickly located through the terminal. The contact array of the surface mount spring pin assembly 12 is synchronously SMT mounted with the PCB board, eliminating the need for custom CNC chip test sockets and wire harness terminal crimping / soldering processes, improving the compatibility of the wiring terminal 131, and completing the production together with other components, thereby improving the production line efficiency.

[0027] In this embodiment, the PCB substrate 11 has internal circuits etched inside. The terminal block 131 is connected to the patch spring pin assembly 12 through the internal circuits of the copper foil. By setting internal circuits to replace traditional external connection circuits, an integrated signal path is formed, which shortens the signal transmission path, reduces intermediate contact points in signal transmission, and reduces the risk of loosening of external wire connections.

[0028] The wire harness 132 is a shielded wire harness with a core wire made of tinned copper wire and a shielding layer made of tinned copper mesh. The tinned copper mesh shielding layer can isolate external electromagnetic interference and prevent interference signals from entering the test path. The tinned copper wire core wire improves the conductivity and corrosion resistance of the core wire, reduces the transmission loss of signals in the wire, and the tinning layer improves the corrosion resistance of the wire and increases its service life.

[0029] In this embodiment, the patch spring pin assembly 12 includes a pin shaft 121, a compression spring installed in the pin shaft 121, and a pin tube 122 inserted into the pin shaft 121. The bottom of the pin shaft 121 is connected to the mounting groove 112, and the end of the pin tube 122 abuts against the test point of the PCB under test, realizing the extension and retraction function of the pin tube 122. This allows the end of the pin tube 122 to adapt to the slight flatness deviation of the test point of the PCB under test, ensuring reliable contact and stable transmission of test signals, and avoiding overvoltage damage to the PCB pads 111 under test.

[0030] In addition, the surface of the pad 111 is plated with a nickel-gold layer; the diameter of the mounting groove is larger than the outer diameter of the needle tube 122, the patch spring pin assembly 12 is fixed to the mounting groove 112 by solder, and the solder covers the outer periphery and bottom of the soldering end of the needle tube 122. The nickel-gold plating improves the wear resistance and conductivity of the pad 111, while preventing the pad 111 from oxidizing and extending its service life. A solder filling gap is reserved at the groove to ensure that the solder can completely cover the outer wall of the needle tube 122, improve the welding strength between the needle tube 122 and the pad 111, reduce the rate of poor soldering, and fill the gap between the needle tube 122 and the groove to improve signal transmission performance.

[0031] The terminal block 131 has a pluggable structure and is soldered after being plugged into the PCB substrate 11. During assembly, the terminal is initially fixed to the substrate by the pluggable structure to prevent terminal misalignment during soldering and improve soldering accuracy. The PCB substrate 11 is made of epoxy resin substrate, which has the characteristics of high temperature resistance and impact resistance. The copper foil material of the internal circuitry results in low signal transmission loss.

[0032] Example 2 differs from the first example; please refer to [link to example]. Figure 1 A testing device for PCB surface mount spring pins also includes a positioning component. The positioning component includes a positioning hole and a positioning pin. The positioning hole is formed on the PCB substrate 11, and the positioning pin cooperates with the positioning hole. The positioning pin is used to lock the positions of the PCB substrate 11 and the PCB board under test, providing a rigid positioning reference for the PCB substrate 11 and the PCB board under test, avoiding relative displacement caused by pressing and vibration during the test, ensuring that the contact position between the surface mount spring pin assembly 12 and the test point of the PCB under test remains unchanged during the test, maintaining the stability of the signal path, avoiding wear of the spring pin end caused by position displacement, and further improving the service life of the spring pin.

[0033] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0034] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A testing device for PCB surface mount spring pins, characterized in that, include: PCB substrate (11), the PCB substrate (11) is provided with detection positions corresponding to the test points of the PCB board under test, each PCB substrate (11) is provided with pads (111) at the detection positions, and the pads (111) are provided with mounting grooves (112) in the center. A patch spring pin assembly (12) is provided in multiple ways. One end of each patch spring pin assembly (12) is installed in the mounting groove (112), and the other end is used to abut against the test point of the PCB under test. The wire gathering assembly (13) includes a terminal block (131) and a wire bundle (132) connected to the terminal block (131). The terminal block (131) is soldered onto the PCB substrate (11) and is connected to the patch spring pin assembly (12).

2. The testing device for PCB surface mount spring pins according to claim 1, characterized in that, The PCB substrate (11) has internal circuits etched inside, and the terminal block (131) is connected to the patch spring pin assembly (12) through the internal circuits of the copper foil.

3. The testing device for PCB surface mount spring pins according to claim 1, characterized in that, It also includes a positioning component, which includes a positioning hole and a positioning pin. The positioning hole is formed on the PCB substrate (11), and the positioning pin cooperates with the positioning hole. The positioning pin is used to lock the position of the PCB substrate (11) and the PCB board under test.

4. The testing device for PCB surface mount spring pins according to claim 1, characterized in that, The wire harness (132) is a shielded wire harness, with its core wire being tin-plated copper wire and its shielding layer being tin-plated copper mesh.

5. The testing device for PCB surface mount spring pins according to claim 1, characterized in that, The patch spring needle assembly (12) includes a needle shaft (121), a compression spring installed in the needle shaft (121), and a needle tube (122) inserted into the needle shaft (121).

6. The testing device for PCB surface mount spring pins according to claim 5, characterized in that, The bottom of the needle shaft (121) is connected to the mounting groove (112), and the end of the needle tube (122) abuts against the test point of the PCB being tested.

7. The testing device for PCB surface mount spring pins according to claim 6, characterized in that, The surface of the pad (111) is plated with a nickel-gold layer; the diameter of the mounting groove (112) is larger than the outer diameter of the needle (122).

8. The testing device for PCB surface mount spring pins according to claim 1, characterized in that, The terminal block (131) is a plug-in type and is soldered after being plugged into the PCB substrate (11).

9. The testing device for PCB surface mount spring pins according to claim 6, characterized in that, The patch spring pin assembly (12) is fixed to the mounting groove (112) by solder, and the solder covers the outer periphery and bottom of the welding end of the needle tube (122).

10. A testing device for PCB surface mount spring pins according to claim 2, characterized in that, The PCB substrate (11) is made of epoxy resin substrate, and the internal circuit is made of copper foil.

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