Embedded memory chip high temperature aging test box

Abstract

The utility model relates to a storage chip test technical field especially relates to a kind of embedded storage chip high temperature ageing test box, including box, box door, handle, air inlet pipe, filter screen, air pump, fixed frame, slide bar and other components;Box front rotatablely connected with box door, box door front fixedly connected with handle, box inside fixedly connected with air inlet pipe, air inlet pipe inside fixedly connected with filter screen, air inlet pipe is fixedly connected and is communicated with air pump, box inside both sides are symmetrically fixedly connected with fixed frame, the same side two fixed frame one side are slidably connected with slide bar.The utility model is through air outlet and the corresponding cooperation of placing plate, so that the heated air can be evenly blown to each layer chip, the multiple through holes of installation frame bottom promote the up and down convection of air in box, form complete heat cycle path, the heat generated by electric heating tube is evenly conducted to entire box space by heat conduction disc, cooperate with air flow circulation system driven by air pump, effectively eliminate local hot spot phenomenon.

Description

Technical Field

[0001] This utility model relates to the field of memory chip testing technology, and in particular to a high-temperature aging test chamber for embedded memory chips. Background Technology

[0002] Memory chips are semiconductor integrated circuits used to store and retrieve digital information, and are one of the core components of modern electronic devices. They are mainly divided into two categories: volatile memory and non-volatile memory. Volatile memory, such as DRAM (Dynamic Random Access Memory), has fast read and write speeds, but data is lost when power is off; it is commonly used in computer memory. Non-volatile memory, such as NAND Flash and NOR Flash, retains data even when power is off and is widely used in USB flash drives, solid-state drives, mobile phones, and embedded devices to store system and user data.

[0003] In semiconductor manufacturing, high-temperature aging testing is a critical step in screening early-failure chips and ensuring product reliability. Currently, traditional designs often employ a single-location heating source and simple airflow structure, leading to uneven hot air distribution. This results in localized overheating (hot spots) or areas of low temperature within the chamber, especially when multiple layers of chips are stacked, causing significant temperature differences between layers and affecting the accuracy and consistency of the test. Furthermore, the internal airflow path design is often inadequate, lacking effective forced circulation and vertical convection mechanisms. This hinders the rapid and even distribution of heat to all corners, resulting in slow heating and lag in temperature response. In addition, insufficient or improperly positioned temperature monitoring points lead to incomplete feedback information and prevent the temperature control system from accurately adjusting the heating power, making it difficult to maintain long-term temperature stability throughout the test space. This further reduces the reliability and efficiency of aging tests.

[0004] Therefore, it is necessary to design a high-temperature aging test chamber for embedded memory chips to solve the above-mentioned technical problems. Utility Model Content

[0005] To overcome the shortcomings of traditional designs, such as uneven thermal field and large temperature difference between layers due to a single heating source and simple air duct; unreasonable convection path and slow heating; insufficient temperature measurement points and imprecise temperature control, which affect the accuracy, consistency and efficiency of testing, this utility model provides a high-temperature aging test chamber for embedded memory chips.

[0006] The technical solution is as follows: A high-temperature aging test chamber for embedded memory chips includes a chamber body, a door, a handle, an air inlet pipe, a filter, an air pump, a fixing frame, a sliding rod, a mounting frame, placement plates, a pressure relief valve, and a temperature control component. The front of the chamber body is rotatably connected to the door, and a handle is fixedly connected to the front of the door. An air inlet pipe is fixedly connected inside the chamber body, and a filter is fixedly connected inside the air inlet pipe. An air pump is fixedly connected and connected to the air inlet pipe. Fixing frames are symmetrically fixedly connected to both sides inside the chamber body. Sliding rods are slidably connected to one side of each of the two fixing frames on the same side. A mounting frame is fixedly connected between the four sliding rods. Multiple placement plates are vertically distributed and fixedly connected inside the mounting frame. Multiple placement slots are formed in a rectangular array within the multiple placement plates. Air vent pipes are provided on both sides of the top of the chamber body. A pressure relief valve is fixedly connected and connected to the top of each of the two air vent pipes. A temperature control component is provided inside the chamber body.

[0007] Optionally, the bottom rectangular array of the mounting frame has multiple through holes.

[0008] Optionally, the temperature control component includes a heat-conducting plate, an electric heating tube, a temperature sensor, a temperature controller, and an air guide frame. The heat-conducting plate is embedded and fixedly connected inside the chamber, and the electric heating tube is fixedly connected inside the heat-conducting plate. Multiple temperature sensors are fixedly connected in a linear array inside the chamber. A temperature controller is fixedly connected to the front of the chamber door. All multiple temperature sensors are electrically connected to the temperature controller. An air guide frame is fixedly connected inside the chamber. The air guide frame is located at the rear of the mounting frame. Multiple air outlets are opened in a linear array on the front side of the air guide frame. All multiple air outlets are located behind the corresponding placement plates.

[0009] Optionally, multiple temperature sensors are located on the right side of their respective placement plates.

[0010] Optionally, it also includes push frames, limit rods, clamping frames, springs, and abutment plates. Multiple push frames are fixedly connected in a linear array inside the housing. The front of each push frame has a wedge-shaped structure. Multiple sets of limit rods are arranged in a linear array inside the mounting frame. Each set of limit rods has four limit rods. Clamping frames are slidably connected between each set of four limit rods. Multiple clamping frames abut against the corresponding placement plates. Springs connect each clamping frame to each set of four limit rods. Abutment plates are fixedly connected to the top left and right sides of each clamping frame. Each abutment plate has a wedge-shaped structure and abuts against the corresponding push frame.

[0011] Optionally, it also includes locking posts and locking plates. The right side of the door has locking slots on both sides, and the right side of the body has locking posts that are rotatably connected. The front of each locking post is fixedly connected to a locking plate, and each locking post is engaged in the corresponding locking slot.

[0012] Optionally, it also includes a sealing ring, which is fixedly connected to the rear of the door and abuts against the inside of the box.

[0013] The beneficial effects of this utility model are as follows: 1. This utility model uses the air outlet and the placement plate to match each other, so that the heated air can be blown evenly to each layer of chips. The multiple through holes at the bottom of the mounting frame promote the vertical convection of air in the box and form a complete heat circulation path. The heat conduction plate evenly conducts the heat generated by the electric heating tube to the entire box space. With the air pump driven airflow circulation system, the phenomenon of local hot spots is effectively eliminated. Three temperature sensors monitor the temperature of each layer respectively. The power of the electric heating tube is adjusted in real time by the temperature controller to ensure that the temperature field remains stable.

[0014] 2. When the mounting frame is pushed backward, the wedge-shaped structure of the abutment plate and the pusher interacts, causing the clamping frame to move downward along the limiting rod and apply uniform pressure to the chip on the placement plate. At this time, the spring is in a compressed state, continuously providing a stable clamping force. During the test, this mechanical structure can ensure that the chip in each placement slot remains accurately positioned, avoiding poor contact caused by vibration or airflow. After the test is completed, when the mounting frame moves forward, the abutment plate separates from the pusher, the spring resets and drives the clamping frame to move upward, automatically releasing the clamping state. This design realizes the rapid clamping and release of the chip, which not only ensures the reliability of the test, but also improves the operating efficiency.

[0015] 3. This utility model forms a mechanical lock through the cooperation of the locking post and the locking groove, and the tight contact between the sealing ring and the chamber body ensures the complete sealing of the chamber body, prevents heat leakage, and avoids the risk of the chamber door being accidentally opened under high temperature conditions. When the pressure inside the chamber rises abnormally, the pressure relief valve opens automatically and releases the pressure safely through the vent pipe, ensuring the safety and reliability of the testing process. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0017] Figure 2 This is a three-dimensional structural diagram of the components of this utility model, including the air intake pipe, filter, and air pump.

[0018] Figure 3 This is a three-dimensional structural diagram of the components of this utility model, including the box body, mounting frame, and placement plate.

[0019] Figure 4 This is a three-dimensional structural diagram of the components of this utility model, including the housing, temperature sensor, and temperature controller.

[0020] Figure 5 This is a three-dimensional structural diagram of the fixing frame and sliding rod of this utility model.

[0021] Figure 6 This is a three-dimensional structural diagram of the air intake pipe, filter screen and air pump of this utility model.

[0022] Figure 7This is a three-dimensional structural diagram of the sliding rod, mounting frame, and placement plate of this utility model.

[0023] Figure 8 This is a three-dimensional structural diagram of the pusher, clamping frame, and abutment plate components of this utility model.

[0024] Figure 9 This is a three-dimensional structural diagram of the placement plate of this utility model.

[0025] Figure 10 This is a three-dimensional structural diagram of the mounting frame and abutment plate of this utility model.

[0026] Figure 11 for Figure 10 A magnified structural diagram of point A in the middle.

[0027] Figure 12 This is a three-dimensional structural diagram of the placement plate, clamping frame, and abutment plate of this utility model.

[0028] Figure 13 This is a three-dimensional structural diagram of the box body, box door, handle, and other components of this utility model.

[0029] Figure 14 This is a three-dimensional structural diagram of the box body, card posts, and card plates of this utility model.

[0030] Figure 15 This is a three-dimensional structural diagram of the box body, box door, and sealing ring of this utility model.

[0031] Explanation of reference numerals in the attached drawings: 1: Box body, 2: Box door, 3: Handle, 4: Air inlet pipe, 5: Filter screen, 6: Air pump, 7: Fixing frame, 8: Slide rod, 9: Mounting frame, 10: Placement plate, 11: Pressure relief valve, 12: Heat transfer plate, 13: Electric heating element, 14: Temperature sensor, 15: Temperature controller, 16: Air guide frame, 17: Push frame, 18: Limiting rod, 19: Clamping frame, 20: Spring, 21: Abutment plate, 22: Locking post, 23: Locking plate, 24: Sealing ring. Detailed Implementation

[0032] Example: A high-temperature aging test chamber for embedded memory chips, such as... Figures 1-15As shown, the enclosure includes a housing 1, a door 2, a handle 3, an air inlet pipe 4, a filter 5, an air pump 6, a fixing frame 7, a sliding rod 8, a mounting frame 9, a placement plate 10, a pressure relief valve 11, a heat-conducting plate 12, an electric heating element 13, a temperature sensor 14, a temperature controller 15, and an air guide frame 16. The door 2 is rotatably connected to the front left side of the housing 1, and a handle 3 is welded to the front right side of the door 2. An air inlet pipe 4 is welded to the lower inside of the housing 1. A filter 5 is installed at the front end of the air inlet pipe 4 via screws. An air pump 6 is fixedly connected and connected to the middle of the air inlet pipe 4. Fixing frames 7 are symmetrically welded to the upper and lower sides of the inside of the housing 1. Sliding rods 8 are slidably connected to the two fixing frames 7 on the same side of the upper and lower sections. Mounting frames 9 are welded between the inner sides of the four sliding rods 8. Multiple through holes are formed in a rectangular array on the bottom side of the mounting frame 9. Vertically distributed welding elements are welded inside the mounting frame 9. Three placement plates 10 are provided, each with a rectangular array of placement slots. Vent pipes are located on the top left and right sides of the housing 1, with two vent pipes fixedly connected to and connected to pressure relief valves 11. A heat-conducting plate 12 is embedded and welded to the bottom inside the housing 1, with an electric heating element 13 installed inside the heat-conducting plate 12 via screws. Three temperature sensors 14 are installed in a linear array on the right side of the housing 1 via screws, each located to the right of its corresponding placement plate 10. A temperature controller 15 is installed in the middle front of the housing door 2 via screws, with each of the three temperature sensors 14 electrically connected to the temperature controller 15. A venting frame 16 is installed in the rear inside the housing 1 via screws, located behind the mounting frame 9. Three air outlets are arranged in a linear array on the front side of the venting frame 16, each located behind its corresponding placement plate 10.

[0033] like Figure 7 , Figure 8 , Figure 10 , Figure 11 and Figure 12 As shown, it also includes pushers 17, limit rods 18, clamping frames 19, springs 20, and abutment plates 21. Three pushers 17 are welded in a linear array on the rear side of the inner side of the housing 1. The front end of the three pushers 17 is a wedge-shaped structure. Three sets of limit rods 18 are arranged in a linear array inside the mounting frame 9. Each set of limit rods 18 has four limit rods. Each set of four limit rods 18 is slidably connected to a clamping frame 19. Each of the three clamping frames 19 abuts against the corresponding placement plate 10. Each of the three clamping frames 19 is connected to the corresponding set of four limit rods 18 with a spring 20. Abutment plates 21 are welded on the left and right sides of the top of each of the three clamping frames 19. Each abutment plate 21 is a wedge-shaped structure and abuts against the corresponding pusher 17.

[0034] like Figure 13 , Figure 14 and Figure 15As shown, it also includes a locking post 22, a locking plate 23, and a sealing ring 24. The upper and lower right sides of the door 2 are provided with locking grooves. The upper and lower right sides of the body 1 are rotatably connected with locking posts 22. The front end of each locking post 22 is welded with a locking plate 23. Each locking post 22 is inserted into the corresponding locking groove. The rear side of the door 2 is fixedly connected with a sealing ring 24, which abuts against the front side of the interior of the body 1.

[0035] When this device is needed, first rotate the clamping plate 23 counterclockwise by 90 degrees, then pull the handle 3 clockwise to open the box door 2. At this time, the clamping post 22 disengages from the clamping groove. Then, the slide rod 8 slides forward along the fixed frame 7 to pull out the mounting frame 9. At the same time, the pusher 17 gradually disengages from the abutment plate 21. The spring 20 is initially in a compressed state, so the clamping frame 19 gradually moves upward along the guide rod and disengages from the placement plate 10 under the action of the spring 20. When the mounting frame 9 is completely pulled out of the box 1, the clamping frame 19 is completely disengaged from the placement plate 10. The embedded storage chip can then be placed sequentially into the placement slots of the three placement plates 10 to ensure the core... With the chip leads facing upwards and in full contact with the placement slot, after the chip loading is completed, push the mounting frame 9 backwards. The slide bar 8 will then move backwards along the fixed frame 7. At the same time, the abutment plate 21 will again abut against the pusher 17, squeezing the clamping frame 19 to move downwards along the guide rod to clamp the memory chip. At this time, the spring 20 will be compressed and deformed again. Then, the door 2 will be closed by rotating the handle 3 counterclockwise. At the same time, the locking pin 22 will be inserted into the locking slot. Rotating the locking plate 23 clockwise by ninety degrees will lock the door 2 so that it cannot be opened. At this time, the sealing ring 24 will be tightly abutted against the box body 1 to form an effective seal, ensuring that the door 2 remains tightly closed during the test.

[0036] After the door 2 is completely closed, the heating element 13 is activated by the temperature controller 15. The heat generated by the heating element 13 is evenly conducted to the interior space of the chamber 1 through the heat conduction plate 12. At the same time, the air pump 6 starts to work. External air enters the air inlet pipe 4 after being filtered by the filter screen 5, and then enters the interior of the chamber 1 under the drive of the air pump 6. The air entering the chamber 1 is guided by the air guide frame 16 and blown evenly to the rear side of the three placement plates 10 through the three air outlets on the front side of the air guide frame 16, forming a stable airflow circulation. Multiple through holes help to promote the vertical convection of air inside the chamber 1, ensuring that the heat is evenly distributed to the chips in each placement slot.

[0037] During the high-temperature aging test, three temperature sensors 14 continuously monitor the temperature data of each layer inside the chamber 1 and transmit the monitoring data to the temperature controller 15 on the chamber door 2 in real time. When the temperature reaches the set value, the temperature controller 15 will automatically adjust the power output of the heating element 13 to keep the temperature inside the chamber within the set range. If the pressure inside the chamber exceeds the safety threshold, the pressure relief valve 11 will automatically open and discharge excess gas through the vent pipe to ensure that the test process is safe and reliable.

[0038] After the test is completed, first turn off the heating element 13 and the air pump 6. After the temperature inside the chamber drops to a safe range, repeat the above operation process to move the entire mounting frame 9 out of the chamber 1. During this process, under the reset action of the spring 20, the abutment plate 21 and the pusher 17 gradually separate, and the clamping frame 19 moves upward along the limit rod 18, automatically releasing the pressure fixation on the placement plate 10. Finally, the tested chip is taken out from the placement slot of the placement plate 10, thus completing the entire test process.

Claims

1. A high-temperature aging test chamber for embedded memory chips, characterized in that, The enclosure includes a housing (1), a door (2), a handle (3), an air inlet pipe (4), a filter (5), an air pump (6), a fixing frame (7), a sliding rod (8), a mounting frame (9), a placement plate (10), a pressure relief valve (11), and a temperature control assembly. The front of the housing (1) is rotatably connected to the door (2), and the front of the door (2) is fixedly connected to the handle (3). An air inlet pipe (4) is fixedly connected inside the housing (1), and a filter (5) is fixedly connected inside the air inlet pipe (4). An air pump (6) is fixedly connected and connected to the air inlet pipe (4). The body (1) has fixed frames (7) symmetrically fixed on both sides inside. The two fixed frames (7) on the same side are slidably connected to a slide rod (8) on one side. The four slide rods (8) are fixedly connected to an installation frame (9) inside. The installation frame (9) is vertically distributed and fixedly connected to multiple placement plates (10). Multiple placement slots are opened in a rectangular array inside the multiple placement plates (10). The top of the box (1) is provided with vent pipes on both sides. The top sides of the two vent pipes are fixedly connected and connected to a pressure relief valve (11). The box (1) is provided with a temperature control component inside.

2. The high-temperature aging test chamber for embedded memory chips according to claim 1, characterized in that, The bottom rectangular array of the mounting frame (9) has multiple through holes.

3. The high-temperature aging test chamber for embedded memory chips according to claim 2, characterized in that, The temperature control component includes a heat-conducting plate (12), an electric heating tube (13), a temperature sensor (14), a temperature controller (15), and an air guide frame (16). The heat-conducting plate (12) is embedded and fixedly connected inside the housing (1). The electric heating tube (13) is fixedly connected inside the heat-conducting plate (12). Multiple temperature sensors (14) are fixedly connected in a linear array inside the housing (1). The temperature controller (15) is fixedly connected to the front of the door (2). Multiple temperature sensors (14) are electrically connected to the temperature controller (15). An air guide frame (16) is fixedly connected inside the housing (1). The air guide frame (16) is located at the rear of the mounting frame (9). Multiple air outlets are opened in a linear array on the front side of the air guide frame (16). Multiple air outlets are located at the rear of the corresponding placement plate (10).

4. The high-temperature aging test chamber for embedded memory chips according to claim 3, characterized in that, Multiple temperature sensors (14) are located to the right of the corresponding placement plate (10).

5. The high-temperature aging test chamber for embedded memory chips according to claim 4, characterized in that, It also includes pushers (17), limit rods (18), clamping frames (19), springs (20) and abutment plates (21). Multiple pushers (17) are fixedly connected in a linear array inside the housing (1). The front of each pusher (17) is a wedge-shaped structure. Multiple sets of limit rods (18) are arranged in a linear array inside the mounting frame (9). Each set of limit rods (18) has four rods. Each set of four limit rods (18) is slidably connected to a clamping frame (19). Multiple clamping frames (19) are abutted against the corresponding placement plate (10). Multiple clamping frames (19) are connected to each set of four limit rods (18) with a spring (20). Abutment plates (21) are fixedly connected to the top left and right sides of multiple clamping frames (19). Each abutment plate (21) is a wedge-shaped structure. Each abutment plate (21) is abutted against the corresponding pusher (17).

6. The high-temperature aging test chamber for embedded memory chips according to claim 5, characterized in that, It also includes a locking post (22) and a locking plate (23). The right side of the door (2) is provided with locking slots. The right side of the box body (1) is rotatably connected with a locking post (22). The front of the two locking posts (22) is fixedly connected with a locking plate (23). The two locking posts (22) are locked into the corresponding locking slots.

7. The high-temperature aging test chamber for embedded memory chips according to claim 6, characterized in that, It also includes a sealing ring (24), and the sealing ring (24) is fixedly connected to the rear of the door (2), and the sealing ring (24) abuts against the inside of the box body (1).

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