Ai server motherboard test equipment

Abstract

The utility model relates to AI server mainboard test equipment belongs to test equipment technical field, and the application includes test frame and test component, and test component includes carrier plate unit and component insertion unit, and component insertion unit includes test board, a plurality of component docking module and test module, component docking module includes mounting seat and component, carrier plate unit includes carrier plate and driving part, and carrier plate is driven to the direction of test board movable installation in test frame through driving part, and the AI server mainboard of measurement is installed in carrier plate, mounting seat corresponds with the component clamping groove of AI server mainboard of measurement, and the component is installed in the direction component clamping groove side of mounting groove, test module includes test probe and control unit, and test probe is installed in test board, and a plurality of component docking module, driving part and test probe are electric connection with control unit respectively. The AI server mainboard test equipment of the application can replace manual test, reduce component installation and dismounting cycle, improve test efficiency and reduce personnel workload.

Description

Technical Field

[0001] This utility model relates to an AI server motherboard testing device, belonging to the technical field of testing equipment. Background Technology

[0002] As a core component of a computer system, the server motherboard plays a crucial role in connecting and coordinating key components such as the CPU, memory, storage devices, and expansion cards. Server motherboard testing has an irreplaceable role in computer manufacturing, quality control, and repair services. With the rapid development of computer technology, server motherboards are becoming increasingly integrated and their circuit designs more complex, making server motherboard fault diagnosis and performance evaluation more specialized and systematic. Server motherboard functional testing is a comprehensive verification process of the server motherboard's hardware, software, and system functions, aiming to ensure its stability, compatibility, and performance meet the demands of high-load operation.

[0003] Current AI server motherboard testing involves manually connecting and installing components such as the CPU, memory modules, and network cards onto the motherboard under test. Test probes are then used to perform power-on functional tests to assess the motherboard's quality. This manual component installation is inefficient due to its long installation and removal cycle and high workload. Furthermore, the limited space and numerous components on the server motherboard can lead to improper placement, affecting test accuracy. Particularly when configuring a CPU cooling fan, ineffective fan contact can result in insufficient cooling, potentially causing overheating and unstable test results. Therefore, a new AI server motherboard testing device is needed to address the problems of low efficiency, high workload, low accuracy, and poor stability associated with the current manual component installation method. Utility Model Content

[0004] The purpose of this invention is to provide an AI server motherboard testing device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an AI server motherboard testing device, comprising a test rack and a test assembly, the test assembly comprising a carrier board unit and a component mating unit, the component mating unit comprising a test board, several component docking modules, and a test module; the component docking module comprising a mounting base and a component; the carrier board unit comprising a carrier board and a driving component, the carrier board being movably mounted on the test rack towards the test board direction by the driving component, the AI ​​server motherboard under test being mounted on the carrier board; the mounting base corresponding to the component slot of the AI ​​server motherboard under test, and the component being mounted on the mounting slot facing the component slot side; the test module comprising a test probe and a control unit, the test probe being mounted on the test board, and the several component docking modules, the driving component, and the test probe being electrically connected to the control unit respectively.

[0006] Specifically, the component docking modules include a CPU testing module, a memory module insertion / removal module, and a network card testing module; the CPU testing module has a CPU installed on it, and the CPU corresponds to the CPU slot of the AI ​​server motherboard under test; the memory module insertion / removal module has a memory module installed on it, and the memory module corresponds to the memory slot of the AI ​​server motherboard under test; the network card testing module has a network card installed on it, and the network card corresponds to the network card slot of the AI ​​server motherboard under test.

[0007] Specifically, the CPU test module includes a first mounting bracket, a first motor, a first mounting base, a heat sink unit, and a floating plate; the first mounting bracket is fixedly mounted on the test board, and the first mounting base is slidably mounted on its bracket towards the carrier board; the first motor is fixedly mounted on the first mounting bracket, and its power end is connected to the first mounting base; the heat sink unit is mounted on the first mounting base, the floating plate is fixedly mounted on the heat sink unit, and the CPU is mounted on the floating plate.

[0008] Specifically, the radiator unit includes a mounting plate, a radiator, a fan radiator, and a water pump; the mounting plate is equipped with a first guide post, and a first guide hole is opened on the first mounting base at a position corresponding to the first guide post; the first mounting base is equipped with bolt holes, and a connecting bolt is slidably installed in the bolt holes; the mounting plate is equipped with threaded holes at positions corresponding to the connecting bolts; the mounting plate is threadedly connected to the threaded holes through the connecting bolts, and is slidably connected to the first mounting base, and the first guide post is slidably installed in the first guide hole; The radiator is fixedly mounted on the mounting plate, and the fan radiator and water pump are fixedly mounted on the test rack. The radiator, fan radiator, and water pump are connected in series via connecting water pipes. A floating plate is fixedly mounted on the side of the radiator facing the carrier plate, and several elastic guide posts are installed on the side of the floating plate facing the carrier plate. The elastic guide posts of this application are preferably compression-type elastic guide posts, which are fixedly mounted on the floating plate, and the compression guide posts are slidably mounted inside by springs.

[0009] Specifically, the memory module insertion / removal module includes a second mounting bracket, a pressing cylinder, a second mounting base, a memory module rotating plate, and a pre-pressure floating plate. The second mounting bracket is fixedly mounted on the test board, and its frame has several second guide holes. Second guide posts are fixedly mounted on the second mounting base at positions corresponding to the second guide holes, and the second guide posts are slidably mounted in the second guide holes. The pressing cylinder is fixedly mounted on the second mounting bracket, and its power end is connected to the second mounting base. Several memory module rotating plates are mounted on the mounting base facing the carrier board for installing memory modules. A pre-pressure floating plate is mounted on the mounting base facing the carrier board. A positioning groove is formed on the pre-pressure floating plate at a position corresponding to the memory module slot. The end of the memory module rotating plate away from the memory module extends into the positioning groove to form a mating end. A limit plate is fixedly mounted on the mounting base facing the carrier board. A compression spring connects the pre-pressure floating plate and the second mounting base.

[0010] Specifically, the network card test module includes a third mounting bracket, a third mounting base, a network card adapter plate, and a floating preload plate. The third mounting bracket is fixedly mounted on the test board, and its frame has several mounting slots corresponding to the network card slots. The third mounting bases are installed in the mounting slots one by one. The network card adapter plate is mounted on the third mounting base for installing network cards. The frame of the third mounting bracket facing the carrier board has several elastic pins, and a connecting end is slidably mounted on one end of the elastic pin facing the carrier board. The floating preload plate is slidably connected to the third mounting bracket through the connecting end. Anti-static voltage rods are installed on the plate facing the carrier board, and network card slots are opened on the floating preload plate at positions corresponding to the network card slots.

[0011] Specifically, the mounting slot of the third mounting bracket is provided with screw mounting holes on the frame, and the third mounting base is provided with connecting threaded holes at the corresponding positions of the screw mounting holes. The third mounting base is connected to the third mounting bracket by threading through the screw mounting holes and connecting threaded holes of the third mounting bracket with equal-height screws, and a compression spring is fitted on the equal-height screws between the third mounting bracket and the third mounting base.

[0012] Specifically, the test frame includes an upper frame and a lower frame. The upper frame is a hollow cabinet-type box structure, and the lower frame is a hollow cabinet-type box structure with an open top. The bottom box of the upper frame is hinged to the top opening side of the lower frame. The hollow box of the upper frame forms the first storage cavity, and the top box of the upper frame is detachably fitted with a top cover. The hollow box of the lower frame forms the second storage cavity. A component insertion unit is installed in the first storage cavity. A slot connected to the second storage cavity is opened on the inner bottom plate of the upper frame for installing test plates. A carrier plate unit is installed in the second storage cavity. A nitrogen spring is installed between the upper and lower frames, and an anti-fall safety device is installed on the inner side wall of the lower frame on the opening side. Handles are installed on both sides of the lower frame, and a locking device is installed between the upper and lower frames.

[0013] Specifically, an opening is provided on the front side of the test frame, and sensors are installed on both sides of the opening. The driving components include a lifting mechanism and a feeding mechanism. The lifting mechanism includes several positioning guide posts, a lifting cylinder, a lifting guide plate, and a feeding plate. Several positioning guide posts are fixedly installed on the test frame at radial intervals. Guide sleeve holes are provided on the feeding plate at positions corresponding to the positioning guide posts. The feeding plate is slidably installed on the test frame by fitting the positioning guide posts through the guide sleeve holes. The lifting guide plate is slidably installed on the bottom of the feeding plate in the horizontal direction, and its plate body is provided with a radially protruding lifting end. The plate body of the feeding plate facing the lifting guide plate is provided with a stop plate that abuts against the lifting guide plate. The lifting cylinder is fixedly installed on the test frame, and its power end is connected to the lifting guide plate. The feeding mechanism includes a feeding cylinder, rolling elements, a lifting and positioning guide sleeve, and a feeding limit block. The carrier plate is slidably mounted on the feeding plate towards the opening of the test frame. The feeding cylinder is fixedly mounted on the feeding plate, and its power end is connected to the carrier plate. Rolling elements are rotatably mounted between the feeding plate and the carrier plate. The carrier plate is provided with a product slot for placing the AI ​​server motherboard under test, and a material sensor is provided in the product slot. The feeding plate is provided with a feeding limit block, and the feeding limit block is located within the trajectory of the carrier plate moving towards the opening of the test frame. A lifting and positioning guide sleeve is installed on the side of the carrier plate facing the test plate. A lifting guide column is installed on the test frame on the side of the test plate at a position corresponding to the lifting and positioning guide sleeve. A limit pressure bar is installed on the test frame on the side of the test plate to limit the distance between the carrier plate and the test plate.

[0014] Specifically, the control unit includes a controller, a touch screen, several operation buttons, a power supply module, and a card slot sensor; the touch screen and several operation buttons are installed on the outside of the test rack, and the controller and power supply module are installed inside the test rack; the card slot sensor is installed on the test board, with its sensing end facing the component card slot of the AI ​​server motherboard under test; the touch screen, several operation buttons, power supply module, and card slot sensor are electrically connected to the controller.

[0015] Compared with the prior art, the beneficial effects of this utility model are: 1. The AI ​​server motherboard testing equipment of this application includes a test rack and test components. The test components include a carrier board unit and a component mating unit. The component mating unit includes a test board, several component docking modules, and a test module. The component docking module includes a mounting base and components; the carrier board unit includes a carrier board and a driving component. The carrier board is movably mounted on the test rack towards the test board via the driving component. This allows the AI ​​server motherboard under test to be mounted on the carrier board, while functional components including a CPU, memory modules, and network cards are mounted on the test board via the CPU test module, memory module insertion / removal module, and network card test module. The carrier board is slid towards the test board via the driving component, enabling automatic mating and insertion of the functional components into the component slots of the server motherboard. The AI ​​server motherboard testing equipment of this application can replace manual insertion of functional components, reducing component installation and disassembly cycles, improving testing efficiency, and reducing personnel workload.

[0016] 2. Based on the foregoing, the test rack of this application includes an upper rack and a lower rack. The upper rack is a hollow cabinet-type structure, and the lower rack is a top-opening, hollow cabinet-type structure. The bottom of the upper rack is hinged to the top opening of the lower rack. The hollow interior of the upper rack forms a first cavity, and a top cover is detachably mounted on the top of the upper rack. The hollow interior of the lower rack forms a second cavity. A component insertion unit is installed in the first cavity, and a slot connected to the second cavity is provided on the inner bottom plate of the upper rack for mounting test boards. A carrier board unit is installed in the second cavity, making the AI ​​server motherboard test equipment of this application compact in structure and providing ample space for component installation. Furthermore, the upper and lower racks are hinged and openable, and the top of the upper rack has a detachable top cover to facilitate component installation and maintenance. A nitrogen spring and a safety device to prevent falls are installed between the upper and lower frames, allowing for easy opening of the upper frame and preventing accidental falls that could cause hand injuries, thus improving testing safety. Additionally, a handling handle is provided on the outside of the lower frame for easy transport and movement of the testing equipment.

[0017] 3. Building upon the foregoing, the test rack of this application has an opening on its front side, with sensors installed on both sides of the opening. The driving mechanism includes a lifting mechanism and a feeding mechanism, enabling the carrier board to move towards the test board via the lifting mechanism, thereby driving the AI ​​server motherboard under test to mate and connect with the functional components on the test board. The feeding mechanism moves the carrier board outwards towards the opening side of the test rack for loading the AI ​​server motherboard under test. The test equipment of this application adopts a drawer-type carrier board loading method, which facilitates manual or automated product placement by a feeding device.

[0018] 4. Based on the foregoing, the CPU testing module of this application includes a first mounting bracket, a first motor, a first mounting base, a heat sink unit, and a floating plate. The first mounting bracket is fixedly mounted on the test board to form the component mounting carrier of the CPU testing module. The first mounting base is slidably mounted on the first mounting bracket via the first motor, serving as the mounting carrier for the heat sink unit. The floating plate is mounted on the heat sink unit to serve as the mounting carrier for the CPU. This application uses a first motor to drive the first mounting base to slide towards the carrier board, thereby automatically inserting the CPU into the CPU slot of the AI ​​server motherboard under test. Simultaneously, the CPU of this application is mounted on the floating plate, and the heat sink unit is always in contact with the CPU, ensuring effective heat dissipation. To prevent the first motor from excessively pushing the CPU downwards, guide posts are installed on the floating plate to achieve a floating positioning structure, improving the alignment accuracy with the CPU slot. This also prevents excessive pushing downwards and damage to the server motherboard. Furthermore, when the CPU needs to be removed after the test is completed and the floating plate is reset, the elastic guide post can stop against the server motherboard under the action of elasticity, so that the CPU can be pulled out of the slot normally and avoid causing the server motherboard to move.

[0019] 5. Based on the foregoing, the heat sink unit of this application includes a mounting plate, a heat sink, a fan radiator, and a water pump. This enables the CPU to be cooled using a water-cooled heat sink, thereby improving heat dissipation performance.

[0020] 6. Based on the foregoing, the memory module insertion / removal module of this application includes a second mounting bracket, a pressing cylinder, a second mounting base, a memory module transfer plate, and a pre-pressure floating plate. The second mounting bracket is fixedly mounted on the test board to form the mounting carrier for the memory module insertion / removal module components. The second mounting base is slidably mounted on the second mounting bracket via the pressing cylinder, forming the mounting carrier for the memory module transfer plate, which is used to install memory modules. This allows the pressing cylinder to drive the second mounting base, causing the memory module to press down and automatically align with the memory module slot of the AI ​​server motherboard under test. Simultaneously, a pre-pressure floating plate is mounted on the second mounting base. A positioning groove is formed on the pre-pressure floating plate at a position corresponding to the memory module slot. The end of the memory module transfer plate away from the memory module extends into the positioning groove to form a mating end. A limit plate is fixedly mounted on the base of the second mounting base facing the carrier board. A compression spring connects the pre-pressure floating plate and the second mounting base. The pre-pressure floating plate of this application, through a compression spring between itself and the second mounting base, forms a floating structure, thereby improving the alignment accuracy between the pre-pressure floating plate and the memory module slot when the memory module adapter is pressed down. Simultaneously, after testing, when the memory module is removed, the pre-pressure floating plate, under the action of the compression spring, abuts against the server motherboard, facilitating the normal removal of the memory module adapter from the slot and preventing displacement of the server motherboard.

[0021] 7. Based on the foregoing, the network interface card (NIC) test module of this application includes a third mounting bracket, a third mounting base, a NIC adapter plate, and a floating preload plate. The third mounting bracket is fixedly mounted on the test board to form the mounting carrier for the NIC test module components. The third mounting base is floatingly mounted on the third mounting bracket via equal-height screws and compression springs, forming the mounting carrier for the NIC adapter plate. The NIC adapter plate is used to install the NIC. In this application, the carrier plate slides towards the test board, and the NIC adapter plate automatically aligns and inserts with the NIC slot of the AI ​​server motherboard under test. To ensure effective alignment between the NIC adapter plate and the NIC slot, a floating preload plate is mounted on the third mounting bracket. This floating preload plate is slidably mounted on the third mounting bracket via elastic pins, and a NIC slot is provided on the floating preload plate at a position corresponding to the NIC slot. This ensures that during alignment, the NIC adapter plate first contacts the motherboard of the server under test via the floating preload plate, positioning itself with the NIC slot and guaranteeing alignment accuracy. When the network card is removed, the elastic pins push the floating preload plate against the server motherboard, allowing the network card to be removed from the slot normally and preventing the server motherboard from shifting. Additionally, to prevent the floating preload plate from damaging components on the server motherboard during insertion, anti-static bars are installed on the side of the floating preload plate facing the carrier board to prevent product damage.

[0022] 8. Based on the foregoing, the control unit of this application includes a controller, a touch screen, several operation buttons, a power supply module, and a card slot sensor. The touch screen and operation buttons enable both manual and automatic testing modes, allowing selection of the appropriate testing mode according to different testing requirements, thus improving the product compatibility of the testing equipment. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the AI ​​server motherboard testing equipment in this embodiment; Figure 2 This is a schematic diagram of the structure of the AI ​​server motherboard testing equipment after the rack is opened in this embodiment; Figure 3 This is a schematic diagram of the lower rack and component insertion unit of the AI ​​server motherboard testing equipment in this embodiment; Figure 4 This is an exploded view of the lower rack and component assembly unit of the AI ​​server motherboard testing equipment in this embodiment; Figure 5 This is a schematic diagram of the structure of the upper rack and some heat sink units of the AI ​​server motherboard testing equipment in this embodiment; Figure 6 This is an exploded view of the upper rack and carrier board unit of the AI ​​server motherboard testing equipment in this embodiment (top cover not shown). Figure 7This is a schematic diagram of the lifting cylinder and lifting guide plate of the AI ​​server motherboard testing equipment in this embodiment; Figure 8 This is a schematic diagram of the feeding mechanism of the AI ​​server motherboard testing equipment in this embodiment; Figure 9 This is a schematic diagram of the mounting structure of the carrier board and the AI ​​server motherboard under test in the AI ​​server motherboard testing equipment of this embodiment; Figure 10 This is a schematic diagram of the lifting state of the lifting mechanism and lifting feeding structure of the AI ​​server motherboard testing equipment in this embodiment; Figure 11 This is a schematic diagram of the CPU test module of the AI ​​server motherboard test equipment in this embodiment; Figure 12 This is an exploded view of the CPU test module of the AI ​​server motherboard test equipment in this embodiment; Figure 13 This is a schematic diagram of the memory module insertion / removal mechanism of the AI ​​server motherboard testing equipment in this embodiment; Figure 14 This is an exploded view of the memory module insertion / removal mechanism of the AI ​​server motherboard testing device in this embodiment; Figure 15 This is a schematic diagram of the network card test module of the AI ​​server motherboard test equipment in this embodiment; Figure 16 This is an exploded view of the network card test module of the AI ​​server motherboard test equipment in this embodiment.

[0024] In the diagram: 1. Test frame; 2. Carrier plate unit; 3. Component insertion unit; 4. Test plate; 5. Test module; 6. Carrier plate; 7. Upper frame; 8. Lower frame; 9. Top cover; 10. Nitrogen spring; 11. Anti-fall safety device; 12. Handling handle; 13. Latch-type quick clamp; 14. Opening; 15. Safety light curtain; 16. Lifting mechanism; 17. Feeding mechanism; 18. Positioning guide post; 19. Lifting cylinder; 20. Lifting guide plate; 21. Feeding plate; 22. Lifting end; 23. Stop plate; 24. Feeding cylinder; 25. Rolling bearing; 26. Lifting positioning guide sleeve; 27. Feeding limit block; 28. AI server motherboard under test; 29. ​​Lifting guide post; 30. Limiting pressure bar; 32. CPU; 33. Memory module; 34. Network card; 35. First mounting bracket; 36. First motor; 37. First mounting base; 38. Heatsink unit; 39. Floating plate; 40. Mounting plate; 41. Heatsink; 42. Fan cooling radiator; 43. Water pump; 44. First guide post; 45. Connecting bolt; 46. Elastic guide post; 47. Second mounting bracket; 48. Downward cylinder; 49. Second mounting base; 50. Memory module transfer plate; 51. Pre-compression floating plate; 52. Limiting plate; 53. Third mounting bracket; 54. Third mounting base; 55. Network card transfer plate; 56. Floating pre-compression plate; 57. Elastic ejector pin; 58. Anti-static voltage rod; 59. Equal height screw; 60. Compression spring; 61. CPU test module; 62. Memory module insertion / removal module; 63. Network card test module; 64. Touch screen; 65. Operation button. Detailed Implementation

[0025] To make the objectives and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the following text is merely used to describe one or more specific embodiments of this utility model and does not strictly limit the scope of protection specifically claimed by this utility model.

[0026] Please see Figures 1-16This embodiment discloses an AI server motherboard testing device, including a test rack 1 and a test component. The test component includes a carrier board unit 2 and a component mating unit 3. The component mating unit includes a test board 4, several component docking modules and a test module 5. The component docking module includes a mounting base and a component. The carrier board unit includes a carrier board 6 and a driving component. The carrier board is movably mounted on the test rack in the direction of the test board by the driving component. The test frame in this embodiment includes an upper frame 7 and a lower frame 8. The upper frame is a hollow cabinet-type box structure, and the lower frame is a hollow cabinet-type box structure with an open top. The bottom box of the upper frame is hinged to the top opening side of the lower frame. The hollow box of the upper frame forms a first storage cavity, and the top box of the upper frame is detachably fitted with a top cover 9. The hollow box of the lower frame forms a second storage cavity. A component insertion unit is installed in the first storage cavity. A plate groove connected to the second storage cavity is opened on the inner bottom plate of the upper frame for installing test plates. A plate carrier unit is installed in the second storage cavity. A nitrogen spring 10 is installed between the upper frame and the lower frame, and an anti-fall safety device 11 is installed on the inner side wall of the lower frame on the opening side. Handles 12 are installed on both sides of the lower frame, and a latch-type quick clamp 13 is installed between the upper frame and the lower frame. In addition, the test frame in this embodiment has an opening 14 on its front side, and safety light curtains 15 are installed on both sides of the opening. The driving components include a lifting mechanism 16 and a feeding mechanism 17. The lifting mechanism includes four positioning guide posts 18, a lifting cylinder 19, a lifting guide plate 20, and a feeding plate 21. The four positioning guide posts are fixedly installed at radial intervals at the bottom of the lower frame. The feeding plate has guide sleeves at positions corresponding to the positioning guide posts, and guide sleeve holes are provided on the guide sleeves. The feeding plate is slidably installed on the lower frame by being fitted onto the positioning guide posts through the guide sleeve holes. The lifting guide plate is slidably installed on the bottom of the feeding plate in the horizontal direction, and its plate body has a lifting end 22 that protrudes radially. The plate body of the feeding plate facing the lifting guide plate has a stop plate 23 that abuts against the lifting guide plate. The lifting cylinder is fixedly installed on the test frame, and its power end is connected to the lifting guide plate. The feeding mechanism of this embodiment includes a feeding cylinder 24, a rolling bearing 25, a lifting and positioning guide sleeve 26, and a feeding limit block 27. The carrier plate 6 is slidably mounted on the feeding plate towards the opening of the test frame. The feeding cylinder is fixedly mounted on the feeding plate, and its power end is connected to the carrier plate. A rolling bearing is rotatably mounted between the feeding plate and the carrier plate. The carrier plate is provided with a product slot for placing the AI ​​server motherboard 28 to be tested, and a material sensing element is provided in the product slot. The feeding plate is provided with a feeding limit block, and the feeding limit block is located within the trajectory of the carrier plate moving towards the opening of the test frame. A lifting and positioning guide sleeve 26 is installed on the plate body facing the test plate. A lifting guide column 29 is installed on the test frame on the test plate side at a position corresponding to the lifting and positioning guide sleeve. A limit pressure bar 30 is installed on the test frame on the test plate side to limit the distance between the carrier plate and the test plate.

[0027] The AI ​​server motherboard under test is mounted on a carrier board. Several component docking modules in this embodiment include a CPU testing module 61, a memory module insertion / removal module 62, and a network card testing module 63. A CPU 32 is mounted on the CPU testing module, and the CPU corresponds to the CPU slot of the AI ​​server motherboard under test. A memory module 33 is mounted on the memory module, and the memory module corresponds to the memory slot of the AI ​​server motherboard under test. A network card 34 is mounted on the network card testing module, and the network card corresponds to the network card slot of the AI ​​server motherboard under test. The testing module includes test probes and a control unit. The test probes are mounted on the test board. The control unit includes a controller, a touchscreen 64, several operation buttons 65, a power supply module, and a slot sensor. The touchscreen and several operation buttons are mounted on the outside of the test rack, while the controller and power supply module are mounted inside the test rack. The slot sensor is mounted on the test board, with its sensing end facing the component slot of the AI ​​server motherboard under test. The touchscreen, several operation buttons, power supply module, and slot sensor are electrically connected to the controller.

[0028] Preferably, the CPU test module in this embodiment includes a first mounting bracket 35, a first motor 36, a first mounting base 37, a heat sink unit 38, and a floating plate 39; the first mounting bracket is fixedly mounted on the test board, and the first mounting base is slidably mounted on its frame towards the carrier board; the first motor is fixedly mounted on the first mounting bracket, and its power end is connected to the first mounting base; the heat sink unit is mounted on the first mounting base, the floating plate is fixedly mounted on the heat sink unit, and the CPU is mounted on the floating plate.

[0029] Furthermore, the heat sink unit in this embodiment includes a mounting plate 40, a heat sink 41, a fan radiator 42, and a water pump 43. A first guide post 44 is mounted on the mounting plate, and a first guide hole is formed on the first mounting base corresponding to the first guide post. A bolt hole is formed on the first mounting base, and a connecting bolt 45 is slidably installed in the bolt hole. A threaded hole is formed on the mounting plate corresponding to the connecting bolt. The mounting plate is threadedly connected to the threaded hole via the connecting bolt and is slidably connected to the first mounting base. The first guide post is slidably installed in the first guide hole. The heat sink is fixedly mounted on the mounting plate, and the fan radiator and water pump are fixedly mounted on the test frame. The heat sink, fan radiator, and water pump are connected in series via connecting water pipes. A floating plate is fixedly mounted on the side of the heat sink facing the carrier plate, and several elastic guide posts 46 are mounted on the side of the floating plate facing the carrier plate. The elastic guide post in this application is preferably a compression type elastic guide post, which is fixedly mounted on the floating plate, and a compression guide post is slidably installed inside it via a spring.

[0030] The memory module insertion / removal module of this embodiment includes a second mounting bracket 47, a pressing cylinder 48, a second mounting base 49, a memory module rotating plate 50, and a pre-pressure floating plate 51. The second mounting bracket is fixedly mounted on the test board, and its frame is provided with a plurality of second guide holes. The second mounting base is fixedly mounted with second guide posts at positions corresponding to the second guide holes, and the second guide posts are slidably mounted in the second guide holes one by one. The pressing cylinder is fixedly mounted on the second mounting bracket, and its power end is connected to the second mounting base. A plurality of memory module rotating plates are mounted on the base of the second mounting base facing the carrier board for installing memory modules. The pre-pressure floating plate is mounted on the base of the second mounting base facing the carrier board. A positioning groove is opened on the pre-pressure floating plate at a position corresponding to the memory module slot. The end of the memory module rotating plate away from the memory module extends into the positioning groove to form a mating end. A limit plate 52 is fixedly mounted on the base of the second mounting base facing the carrier board. A compression spring is connected between the pre-pressure floating plate and the second mounting base.

[0031] The network card test module of this embodiment includes a third mounting bracket 53, a third mounting base 54, a network card adapter plate 55, and a floating preload plate 56. The third mounting bracket is fixedly mounted on the test board, and its frame has several mounting slots corresponding to the network card slots. The third mounting base is installed in the mounting slots one by one. The network card adapter plate is mounted on the third mounting base for installing the network card. The frame of the third mounting bracket facing the carrier board has several elastic pins 57, and a connecting end is slidably mounted on one end of the elastic pin facing the carrier board. The floating preload plate is slidably connected to the third mounting bracket through the connecting end. The floating preload plate has anti-static voltage rods 58 mounted on its plate facing the carrier board, and a network card slot is opened on the floating preload plate corresponding to the network card slot. In this embodiment, the bracket at the location of the slot of the third mounting bracket has a screw mounting hole, and the third mounting base has a connecting thread hole at the corresponding position of the screw mounting hole. The third mounting base is connected to the third mounting bracket by means of a height equalizer 59 passing through the screw mounting hole and the connecting thread hole of the third mounting bracket. A compression spring 60 is fitted on the height equalizer between the third mounting bracket and the third mounting base.

[0032] Working principle: In this embodiment of the AI ​​server motherboard testing equipment, the operator first assembles the CPU, memory modules, and network card into their respective mounting sockets. Then, the operator presets the equipment operating parameters using the touchscreen and operation buttons. Finally, the power supply and water supply are connected to complete the component installation and debugging before testing.

[0033] During testing, the motherboard of the AI ​​server under test is placed onto the carrier plate manually or automatically by a robotic arm. After loading, the equipment is started by pressing the start button. First, the feeding cylinder is activated to drive the feeding plate to retract, thus retracting the carrier plate into the lower frame. Next, the lifting cylinder is activated to drive the lifting guide plate to slide horizontally. As the lifting guide plate slides, the bottom stop plate of the feeding plate slides along the lifting guide plate. When the stop plate slides to the radially protruding lifting end, the feeding plate slides along the positioning guide post towards the test plate on the upper frame. This drives the carrier plate to slide towards the test plate until the lifting positioning guide sleeve on the carrier plate abuts against the lifting guide post on the test plate, and the sliding movement stops under the limiting action of the limiting pressure bar. The lifting and alignment of the carrier plate and the test plate is completed.

[0034] During the lifting and alignment process of the carrier board and test board, the network card (NIC) is the first component to complete the alignment and insertion. In this process, the floating preload plate first contacts the AI ​​server motherboard on the carrier board, and the NIC slot on the floating preload plate snaps onto the outside of the NIC slot on the server motherboard to achieve precise positioning and ensure accurate alignment between the NIC adapter and the NIC slot. Next, as the carrier board continues to lift, the elastic pins between the floating preload plate and the third mounting bracket are compressed, and the NIC adapter begins to insert into the NIC slot. Because the third mounting bracket and the third mounting frame are floating, the NIC adapter automatically aligns during insertion without shifting. Finally, as the carrier board is lifted into position, the bottom of the NIC adapter is fully inserted into the NIC slot.

[0035] Simultaneously, the first motor of the CPU testing module and the downward-pressing cylinder of the memory module insertion / removal module are activated to drive the first and second mounting bases towards the carrier board, respectively, causing the CPU and memory module adapters to be inserted into their corresponding component slots. It is important to note that during the CPU and memory module adapter insertion process, the contact process between the floating plate and the pre-pressure floating plate and the server motherboard is similar to that of the aforementioned floating pre-pressure plate, and will not be elaborated here. The second mounting base will stop pressing down under the limiting action of the limiting plate to ensure effective insertion of the memory module adapter without excessive pressure that could damage the motherboard. After all functional components are inserted, the AI ​​server motherboard's functional tests are automatically performed. After the tests are completed, the aforementioned components reset. During the carrier board's descent and reset, the floating plate of the CPU testing module, the pre-pressure floating plate of the memory module insertion / removal module, and the floating pre-pressure plate of the network card testing module will be held against the server motherboard by the elastic guide posts, elastic pins, and compression springs, preventing the components from displacing the server motherboard during the reset process. Finally, the carrier board is fed out from the opening side of the test rack via the feeding plate, and the AI ​​server motherboard can be removed manually or by a robotic arm.

[0036] The embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments. For those skilled in the art, after learning the contents of the present invention, several equivalent changes and substitutions can be made without departing from the principle of the present invention. These equivalent changes and substitutions should also be considered to fall within the protection scope of the present invention.

Claims

1. An AI server motherboard testing device, comprising a test rack and test components, characterized in that: The test assembly includes a carrier board unit and a component mating unit. The component mating unit includes a test board, several component docking modules, and a test module. The component docking module includes a mounting base and a component. The carrier board unit includes a carrier board and a driving component. The carrier board is movably mounted on the test rack towards the test board direction by the driving component. The AI ​​server motherboard under test is mounted on the carrier board. The mounting base corresponds to the component slot of the AI ​​server motherboard under test, and the component is mounted in the mounting slot facing the component slot. The test module includes a test probe and a control unit. The test probe is mounted on the test board, and the several component docking modules, the driving component, and the test probe are electrically connected to the control unit.

2. The AI ​​server motherboard testing device according to claim 1, characterized in that: The component docking modules include a CPU testing module, a memory module insertion / removal module, and a network card testing module. The CPU testing module is equipped with a CPU, and the CPU corresponds to the CPU slot of the AI ​​server motherboard under test. The memory module insertion / removal module is equipped with a memory module, and the memory module corresponds to the memory slot of the AI ​​server motherboard under test. The network card testing module is equipped with a network card, and the network card corresponds to the network card slot of the AI ​​server motherboard under test.

3. The AI ​​server motherboard testing equipment according to claim 2, characterized in that: The CPU test module includes a first mounting bracket, a first motor, a first mounting base, a heat sink unit, and a floating plate. The first mounting bracket is fixedly mounted on the test board, and the first mounting base is slidably mounted on its frame towards the carrier board. The first motor is fixedly mounted on the first mounting bracket, and its power end is connected to the first mounting base. The heat sink unit is mounted on the first mounting base, the floating plate is fixedly mounted on the heat sink unit, and the CPU is mounted on the floating plate.

4. The AI ​​server motherboard testing device according to claim 3, characterized in that: The radiator unit includes a mounting plate, a radiator, a fan radiator, and a water pump; the mounting plate is equipped with a first guide post, and a first guide hole is opened on the first mounting base at a position corresponding to the first guide post; the first mounting base is provided with bolt holes, and a connecting bolt is slidably installed in the bolt holes; the mounting plate is provided with threaded holes at positions corresponding to the connecting bolts; the mounting plate is threadedly connected to the threaded holes through the connecting bolts, and is slidably connected to the first mounting base; and the first guide post is slidably installed in the first guide hole. The radiator is fixedly installed on the mounting plate, and the fan radiator and water pump are fixedly installed on the test frame. The radiator, fan radiator and water pump are connected in series through connecting water pipes. The floating plate is fixedly installed on the side of the radiator facing the carrier plate, and several elastic guide columns are installed on the plate body of the floating plate facing the carrier plate.

5. The AI ​​server motherboard testing equipment according to claim 2, characterized in that: The memory module insertion / removal module includes a second mounting bracket, a pressing cylinder, a second mounting base, a memory module rotating plate, and a pre-pressure floating plate. The second mounting bracket is fixedly mounted on the test board, and its frame has several second guide holes. Second guide posts are fixedly mounted on the second mounting base at positions corresponding to the second guide holes, and the second guide posts are slidably mounted in the second guide holes. The pressing cylinder is fixedly mounted on the second mounting bracket, and its power end is connected to the second mounting base. Several memory module rotating plates are mounted on the second mounting base facing the carrier board for installing memory modules. A pre-pressure floating plate is mounted on the second mounting base facing the carrier board. A positioning groove is formed on the pre-pressure floating plate at a position corresponding to the memory module slot. The end of the memory module rotating plate away from the memory module extends into the positioning groove to form a mating end. A limit plate is fixedly mounted on the second mounting base facing the carrier board. A compression spring connects the pre-pressure floating plate and the second mounting base.

6. The AI ​​server motherboard testing device according to claim 2, characterized in that: The network card test module includes a third mounting bracket, a third mounting base, a network card adapter plate, and a floating preload plate. The third mounting bracket is fixedly mounted on the test board, and its frame has several mounting slots corresponding to the network card slots. The third mounting bases are installed in the mounting slots one by one. The network card adapter plate is mounted on the third mounting base for installing network cards. The frame of the third mounting bracket facing the carrier board has several elastic pins, and a connecting end is slidably mounted on one end of the elastic pin facing the carrier board. The floating preload plate is slidably connected to the third mounting bracket through the connecting end. Anti-static voltage rods are mounted on the plate facing the carrier board, and network card slots are opened on the floating preload plate at positions corresponding to the network card slots.

7. The AI ​​server motherboard testing device according to claim 6, characterized in that: The mounting slot of the third mounting bracket has a screw mounting hole on the frame. The third mounting base has a connecting threaded hole at the corresponding position of the screw mounting hole. The third mounting base is connected to the third mounting bracket by a height equalizing screw passing through the screw mounting hole and the connecting threaded hole of the third mounting bracket. A compression spring is fitted on the height equalizing screw between the third mounting bracket and the third mounting base.

8. The AI ​​server motherboard testing device according to claim 1, characterized in that: The test frame includes an upper frame and a lower frame. The upper frame is a hollow cabinet-type box structure, and the lower frame is a hollow cabinet-type box structure with an open top. The bottom box of the upper frame is hinged to the top opening side of the lower frame. The hollow box of the upper frame forms a first storage cavity, and the top box of the upper frame is detachably fitted with a top cover. The hollow box of the lower frame forms a second storage cavity. The component insertion unit is installed in the first storage cavity. A slot connected to the second storage cavity is opened on the inner bottom plate of the upper frame for installing test plates. The plate carrier unit is installed in the second storage cavity. A nitrogen spring is installed between the upper frame and the lower frame, and an anti-fall safety device is installed on the inner side wall of the lower frame on the opening side. Handles are installed on both sides of the lower frame, and a locking device is installed between the upper frame and the lower frame.

9. The AI ​​server motherboard testing device according to claim 1, characterized in that: An opening is provided on the front side of the test frame, and sensors are installed on both sides of the opening. The driving mechanism includes a lifting mechanism and a feeding mechanism. The lifting mechanism includes several positioning guide posts, a lifting cylinder, a lifting guide plate, and a feeding plate. Several positioning guide posts are fixedly installed on the test frame at radial intervals. Guide sleeve holes are provided on the feeding plate at positions corresponding to the positioning guide posts. The feeding plate is slidably installed on the test frame by fitting the positioning guide posts through the guide sleeve holes. The lifting guide plate is slidably installed on the bottom of the feeding plate in the horizontal direction, and its plate body is provided with a radially protruding lifting end. The plate body of the feeding plate facing the lifting guide plate is provided with a stop plate that abuts against the lifting guide plate. The lifting cylinder is fixedly installed on the test frame, and its power end is connected to the lifting guide plate. The feeding mechanism includes a feeding cylinder, a rolling element, a lifting and positioning guide sleeve, and a feeding limit block. The carrier plate is slidably mounted on the feeding plate towards the opening of the test frame. The feeding cylinder is fixedly mounted on the feeding plate, and its power end is connected to the carrier plate. A rolling element is rotatably mounted between the feeding plate and the carrier plate. The carrier plate is provided with a product slot for placing the AI ​​server motherboard under test, and a material sensor is provided in the product slot. The feeding plate is provided with a feeding limit block, and the feeding limit block is located within the trajectory of the carrier plate moving towards the opening of the test frame. A lifting and positioning guide sleeve is installed on the plate body facing the test plate. A lifting guide column is installed on the test frame side of the test plate at a position corresponding to the lifting and positioning guide sleeve. A limit pressure bar is installed on the test frame side of the test plate to limit the distance between the carrier plate and the test plate.

10. The AI ​​server motherboard testing device according to claim 1, characterized in that: The control unit includes a controller, a touch screen, several operation buttons, a power supply module, and a card slot sensor; the touch screen and several operation buttons are installed on the outside of the test rack, and the controller and power supply module are installed inside the test rack; the card slot sensor is installed on the test board, with its sensing end facing the component card slot of the AI ​​server motherboard under test; the touch screen, several operation buttons, power supply module, and card slot sensor are electrically connected to the controller.

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