A semiconductor chip testing fixture

Abstract

The utility model discloses a kind of semiconductor chip test fixtures, including main body, shell, locking bolt, bent plate, slide bar, baffle, pressing plate, first rubber pad, second rubber pad, heat dissipation fin, water inlet pipe, water outlet pipe, water tank and pump body, the pump body is fixedly connected with water tank. The utility model is provided with main body, shell, heat dissipation fin, locking bolt water inlet pipe, water outlet pipe, water tank and pump body, when needing to detect semiconductor chip, operator first connects external power supply of pump body, starts pump body, pump body sends the water in water tank to the cavity in main body by water inlet pipe, water in cavity can be cooled by heat dissipation fin to semiconductor chip in upper test, which improves the working effect of semiconductor chip test fixture, and heat dissipation fin can be conveniently removed from main body for maintenance, facilitating operator to use the semiconductor chip test fixture.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor chip testing equipment, and in particular to a semiconductor chip testing fixture. Background Technology

[0002] A semiconductor chip is an electronic device that integrates a large number of miniature electronic components (such as transistors, resistors, and capacitors) on a semiconductor material (usually silicon). It is the "brain" and "heart" of modern electronic devices.

[0003] Currently, semiconductor chips typically require testing fixtures for testing. However, semiconductor chips may generate heat during testing, which can cause fluctuations in their performance. This leads to a decrease in the testing results and reduces the effectiveness of the semiconductor chip testing fixtures. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor chip testing fixture.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A semiconductor chip testing fixture includes a main body, a housing, locking bolts, a bent plate, a sliding rod, a baffle, a pressure plate, a first rubber pad, a second rubber pad, heat dissipation fins, a water inlet pipe, a water outlet pipe, a water tank, and a pump body. The surface of the main body is in contact with the housing. Both ends of the housing are fixedly connected to the main body by corresponding locking bolts. The lower end of the housing is fixedly connected to the heat dissipation fins. One end of the main body is fixedly connected to the water inlet pipe, and the other end of the main body is fixedly connected to the water outlet pipe. Both ends of the housing are fixedly connected to the water inlet pipe and the water outlet pipe, respectively. The other end of each water outlet pipe is fixedly connected to the water tank. The other end of the water inlet pipe is fixedly connected to the pump body, and the pump body is fixedly connected to the water tank.

[0007] Preferably, the upper end of the main body is fixedly connected to the curved plate.

[0008] Preferably, a sliding rod is movably passed through the surface of the bent plate.

[0009] Preferably, the surface of the slide bar is fixedly connected to the baffle.

[0010] Preferably, a second rubber pad is adhered to the lower end of the baffle.

[0011] Preferably, the lower end of the slide bar is fixedly connected to the pressure plate.

[0012] Preferably, a first rubber pad is adhered to the lower end of the pressure plate.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. The system consists of a main body, housing, heat dissipation fins, locking bolts, inlet pipe, outlet pipe, water tank, and pump. When testing a semiconductor chip, the operator first connects the external power supply to the pump and starts it. The pump then sends water from the water tank through the inlet pipe into the cavity inside the main body. The water in the cavity cools the semiconductor chip being tested above through the heat dissipation fins. The water in the cavity is then recycled back to the water tank through the outlet pipe, allowing the cooling water to be reused. When maintenance of the heat dissipation fins is required, the operator unscrews the two locking bolts from the main body and removes the housing from the main body. Since the heat dissipation fins are fixed at the bottom of the housing, the operator can replace or maintain them. This method allows the heat dissipation fins to cool the semiconductor chip being tested, preventing temperature rise from affecting semiconductor performance. This improves the working efficiency of the semiconductor chip testing fixture. Furthermore, the heat dissipation fins can be easily removed from the main body for maintenance, making it convenient for operators to use the semiconductor chip testing fixture.

[0015] 2. With the included curved plate, sliding rod, baffle, pressure plate, first rubber pad, and second rubber pad, when a semiconductor chip needs to be placed inside the housing on the main body, the operator first pulls the sliding rod upward, causing the pressure plate to move the first rubber pad below away from the main body. Then, the semiconductor chip is placed on the housing. After that, the sliding rod is released, and the pressure plate moves downward under the influence of gravity. When the first rubber pad below the pressure plate presses against the semiconductor chip, the pressure plate stops moving. At the same time, when the size of the semiconductor chip is small, the baffle can prevent the sliding rod from moving downward too far, thus preventing the sliding rod from sliding out of the curved plate. The second rubber pad can also prevent the baffle from colliding hard with the curved plate. This makes it convenient for the operator to use the semiconductor chip testing fixture. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a semiconductor chip testing fixture proposed in this utility model;

[0017] Figure 2 for Figure 1 A partial left-view diagram;

[0018] Figure 3 for Figure 2 Right-side bottom-view sectional diagram;

[0019] Figure 4 for Figure 2 A magnified view of part A in the middle;

[0020] Figure 5 for Figure 2 A partial side view sectional diagram.

[0021] In the diagram: 1. Main body; 2. Shell; 3. Locking bolt; 4. Bend plate; 5. Slide rod; 6. Baffle; 7. Pressure plate; 8. First rubber pad; 9. Second rubber pad; 10. Heat dissipation fins; 11. Water inlet pipe; 12. Water outlet pipe; 13. Water tank; 14. Pump body. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Example 1, referring to Figures 1 to 5A semiconductor chip testing fixture includes a main body 1, a housing 2, locking bolts 3, a bent plate 4, a sliding rod 5, a baffle 6, a pressure plate 7, a first rubber pad 8, a second rubber pad 9, heat dissipation fins 10, an inlet pipe 11, an outlet pipe 12, a water tank 13, and a pump body 14. The surface of the main body 1 is in contact with the housing 2, and the housing 2 is mounted on the main body 1. Both ends of the housing 2 are fixedly connected to the main body 1 by corresponding locking bolts 3, which can fix the housing 2 inside the main body 1. The lower end of the housing 2 is fixedly connected to the heat dissipation fins 10, which can cool the housing 2, thereby cooling the semiconductor chip. One end of the main body 1 is connected to the inlet pipe 11, the outlet pipe 12, the water tank 13, and the pump body 14. Water pipe 11 is fixedly connected, and water inlet pipe 11 can deliver cooling water into the cavity inside the main body 1. The other end of the main body 1 is fixedly connected to water outlet pipe 12. Both ends of the shell 2 are fixedly connected to water inlet pipe 11 and water outlet pipe 12 respectively. Water inlet pipe 11 and water outlet pipe 12 can deliver cooling water into the shell 2. The other end of water outlet pipe 12 is fixedly connected to water tank 13, so that cooling water can circulate into water tank 13. The other end of water inlet pipe 11 is fixedly connected to pump body 14. The model of pump body 14 is selected according to actual needs, and only needs to meet the working requirements are selected. Pump body 14 can deliver cooling water into water inlet pipe 11. Pump body 14 is fixedly connected to water tank 13. When testing semiconductor chips, the operator first connects the external power supply to the pump body 14 and starts the pump body 14. The pump body 14 sends water from the water tank 13 to the cavity inside the main body 1 through the water inlet pipe 11. At this time, the water in the cavity can dissipate heat and cool the semiconductor chip being tested above through the heat dissipation fins 10. The water in the cavity can be recycled back to the water tank 13 through the water outlet pipe 12, so that the cooling water can be recycled. When the heat dissipation fins 10 need to be maintained, the operator unscrews the two locking bolts 3 from the main body 1 and then removes the housing 2 from the main body 1. Since the heat dissipation fins 10 are fixed at the bottom of the housing 2, the operator can replace and maintain the heat dissipation fins 10. In the above way, the heat dissipation fins 10 can cool the semiconductor chip being tested, thereby avoiding the impact of temperature rise on semiconductor performance. This improves the working effect of the semiconductor chip testing fixture. Moreover, the heat dissipation fins 10 can be easily removed from the main body 1 for maintenance, making it convenient for the operator to use the semiconductor chip testing fixture.

[0024] In this embodiment, the upper end of the main body 1 is fixedly connected to the curved plate 4. A sliding rod 5 is movably passed through the surface of the curved plate 4. The sliding rod 5 slides in the curved plate 4. The surface of the sliding rod 5 is fixedly connected to the baffle 6. The baffle 6 can prevent the sliding rod 5 from sliding out of the curved plate 4. A second rubber pad 9 is attached to the lower end of the baffle 6. The second rubber pad 9 can prevent the baffle 6 from making hard contact with the curved plate 4. The lower end of the sliding rod 5 is fixedly connected to the pressure plate 7. The sliding rod 5 drives the pressure plate 7 to move. A first rubber pad 8 is attached to the lower end of the pressure plate 7. The first rubber pad 8 can prevent the pressure plate 7 from crushing the semiconductor chip.

[0025] The working principle of this embodiment is as follows: During use, the operator first pulls the slide bar 5 upwards, causing the pressure plate 7 to move the first rubber pad 8 away from the main body 1. Then, the semiconductor chip is placed on the housing 2. Afterwards, the slide bar 5 is released, and the pressure plate 7 moves downwards under gravity. When the first rubber pad 8 under the pressure plate 7 presses against the semiconductor chip, the pressure plate 7 stops moving. Simultaneously, when the semiconductor chip is small, the baffle 6 prevents the slide bar 5 from moving downwards too far, thus preventing the slide bar 5 from sliding out of the curved plate 4. The second rubber pad 9 prevents the baffle 6 from colliding hard with the curved plate 4. Afterwards, the operator first adds cooling water to the water tank 13, and then connects the external power supply to the pump body 14. The pump body 14 is started, and the pump body 14 sends the water in the water tank 13 to the cavity inside the main body 1 through the water inlet pipe 11. At this time, the water in the cavity can dissipate heat and cool down the semiconductor chip being tested above through the heat dissipation fins 10. The water in the cavity can be recycled back to the water tank 13 through the water outlet pipe 12, so that the cooling water can be recycled. When the heat dissipation fins 10 need to be maintained, the operator unscrews the two locking bolts 3 from the main body 1, and then removes the housing 2 from the main body 1. Since the heat dissipation fins 10 are fixed at the bottom of the housing 2, the operator can replace and maintain the heat dissipation fins 10. The above method facilitates the operator to test the semiconductor chip fixture.

[0026] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor chip testing fixture, comprising a main body (1), a housing (2), locking bolts (3), a bent plate (4), a sliding rod (5), a baffle (6), a pressure plate (7), a first rubber pad (8), a second rubber pad (9), heat dissipation fins (10), a water inlet pipe (11), a water outlet pipe (12), a water tank (13), and a pump body (14), characterized in that, The surface of the main body (1) is in contact with the shell (2). The two ends of the shell (2) are fixedly connected to the main body (1) by corresponding locking bolts (3). The lower end of the shell (2) is fixedly connected to the heat dissipation fins (10). One end of the main body (1) is fixedly connected to the water inlet pipe (11). The other end of the main body (1) is fixedly connected to the water outlet pipe (12). The two ends of the shell (2) are fixedly connected to the water inlet pipe (11) and the water outlet pipe (12) respectively. The other end of the water outlet pipe (12) is fixedly connected to the water tank (13). The other end of the water inlet pipe (11) is fixedly connected to the pump body (14). The pump body (14) is fixedly connected to the water tank (13).

2. The semiconductor chip testing fixture according to claim 1, characterized in that, The upper end of the main body (1) is fixedly connected to the curved plate (4).

3. A semiconductor chip testing fixture according to claim 1, characterized in that, The surface of the bent plate (4) is movably penetrated by a slide rod (5).

4. A semiconductor chip testing fixture according to claim 1, characterized in that, The surface of the slide bar (5) is fixedly connected to the baffle (6).

5. A semiconductor chip testing fixture according to claim 1, characterized in that, A second rubber pad (9) is adhered to the lower end of the baffle (6).

6. A semiconductor chip testing fixture according to claim 1, characterized in that, The lower end of the slide bar (5) is fixedly connected to the pressure plate (7).

7. A semiconductor chip testing fixture according to claim 1, characterized in that, The lower end of the pressure plate (7) is attached with a first rubber pad (8).

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