check plate

Abstract

The utility model relates to the technical field of aging test, specifically disclose a check board, in the check board, circuit board includes board body and is located board body is used for simulating the heat quantity of chip in the testing process target device, cooling part has the flow channel, and the flow channel inside has the flowing coolant to take away the heat of target device, heating assembly includes heating block, heating part and temperature detection piece, heating part and temperature detection piece install on heating block, and heating block is at least partly used for with target device connection, and heating part generates heat to heat target device, and temperature detection piece is used for detecting the temperature of target device, and the temperature control program of aging equipment is examined into resource board, and the check board is carried out analog aging test, and the temperature control curve is tested according to the temperature detection piece in the check board, thereby can obtain the check data, avoid the problem that direct test in aging equipment leads to burning machine, damages electronic device, thereby avoid causing the problem of bigger economic loss.

Description

Technical Field

[0001] This utility model relates to the field of aging test technology, and in particular to a calibration plate. Background Technology

[0002] Aging tests involve loading multiple electronic components, such as chips, that require aging into an aging board, placing the aging board in an extreme environment, and then using a resource board to provide test signals to the aging board to enable the electronic components to perform simulation calculations for a certain period of time.

[0003] Aging equipment typically provides electronic devices with extreme high / low temperature environments. Before the aging equipment is put into use, the temperature control function needs to be verified and calibrated. If the temperature control function is directly verified in the aging equipment using an aging board, there is a possibility of burning out the device or damaging the electronic devices, resulting in significant economic losses.

[0004] Therefore, there is an urgent need for a calibration board that can simulate aging environments and reduce the risks of temperature control verification. Utility Model Content

[0005] The purpose of this invention is to provide a calibration board to solve the problem of burning out the machine and damaging electronic components caused by directly using an aging board to verify the temperature control function in an aging device in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A verification board, comprising:

[0008] A circuit board, the circuit board including a board body and a target device disposed on the board body for simulating the heat generated by the chip during the test process;

[0009] A cooling component having a flow channel with a flowing coolant inside the flow channel to remove heat from the target device;

[0010] A heating assembly includes a heating block, a heating element, and a temperature detection element. The heating element and the temperature detection element are both mounted on the heating block. The heating block is at least partially used to connect with the target device. The heating element generates heat to heat the target device. The temperature detection element is used to detect the temperature of the target device.

[0011] As an optional technical solution for a calibration plate, the heating block has a first mounting hole, and the heating element is disposed in the first mounting hole; and / or,

[0012] The heating block has a second mounting hole, and the temperature sensing element is disposed in the second mounting hole.

[0013] As an optional technical solution for a verification board, the second mounting hole is located between the first mounting hole and the target device; and / or,

[0014] The heating block has at least two first mounting holes, and the heating assembly has at least two heating elements, with each heating element corresponding to each of the first mounting holes.

[0015] As an optional technical solution for the calibration plate, the heating block has a first locking hole communicating with the first mounting hole and a second locking hole communicating with the second mounting hole. A first fastener passes through the first locking hole and abuts against the heating element, and a second fastener passes through the second locking hole and abuts against the temperature detection element.

[0016] As an optional technical solution for a verification board, the heating block is located on the side of the target device away from the board body, and the cooling component is located on the side of the heating block away from the target device.

[0017] As an optional technical solution for the verification board, the heating assembly further includes a first heat-conducting element, which is sandwiched between the heating block and the target device; and / or,

[0018] The heating assembly includes a second heat-conducting element, which is sandwiched between the heating block and the cooling element.

[0019] As an optional technical solution for the verification board, the bottom of the heating block is provided with several feet, which abut against the board body. The feet are distributed around the outer periphery of the target device, and their heights are all greater than the height of the target device.

[0020] As an optional technical solution for the calibration plate, the heating block has a receiving groove on the side facing the cooling component, and the second heat-conducting component is located in the receiving groove.

[0021] As an optional technical solution for a calibration board, the circuit board includes several target devices, and the calibration board includes several heating components, with each heating component and each target device arranged in a one-to-one correspondence; the cooling component covers the side of all the heating components away from the target devices, and the coolant in the flow channel of the cooling component flows through all the heating components.

[0022] As an optional technical solution for a calibration plate, the flow rate of the coolant inside the flow channel is constant.

[0023] This utility model has at least the following beneficial effects:

[0024] This utility model provides a calibration board, which includes a circuit board, a cooling component, and a heating assembly. The circuit board includes a board body and a target device disposed on the board body for simulating the heat generated by the chip during the testing process. The cooling component has a flow channel with a flowing coolant inside the channel to remove the heat from the target device. The heating assembly includes a heating block, a heating element, and a temperature detection element. The heating element and the temperature detection element are both mounted on the heating block. The heating block is at least partially used to connect with the target device. The heating element generates heat to heat the target device, and the temperature detection element is used to detect the temperature of the target device.

[0025] The target device is used to simulate a chip that generates heat. When in use, the temperature control program of the aging equipment can be copied into the resource board, and the calibration board can be subjected to simulated aging tests. The temperature control curve can be obtained based on the temperature detection device in the calibration board, thereby obtaining calibration data. This avoids the problem of burning out the device and damaging electronic components due to direct testing in the aging equipment, thus avoiding significant economic losses. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of the verification plate in an embodiment of this utility model;

[0028] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0029] Figure 3 This is a schematic diagram of the cooling component and heating assembly in the embodiments of this utility model;

[0030] Figure 4 This is a schematic diagram of the heating block in an embodiment of the present invention;

[0031] In the picture:

[0032] 100. Circuit board; 110. Board body; 120. Target device;

[0033] 200. Cooling components;

[0034] 300, Heating assembly; 310, Heating element; 320, Temperature detection element; 330, Heating block; 331, First mounting hole; 332, Second mounting hole; 333, First locking hole; 334, Second locking hole; 335, Support leg; 336, Receiving groove; 340, First heat-conducting element; 350, Second heat-conducting element. Detailed Implementation

[0035] Before explaining any implementation of this application in detail, it should be understood that this application is not limited to its application to the structural details and component arrangements set forth in the following description or shown in the above drawings.

[0036] In this application, the terms "comprising," "including," "having," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0037] In this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "and / or" relationship.

[0038] In this application, the terms "connection," "combination," "coupling," and "installation" can refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, a direct connection refers to two parts or components being connected together without the need for an intermediary, while an indirect connection refers to two parts or components each being connected to at least one intermediary, with the connection achieved through the intermediary. Furthermore, "connection" and "coupling" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.

[0039] In this application, those skilled in the art will understand that relative terms (e.g., “about,” “approximately,” “basically,” etc.) used in conjunction with quantities or conditions are to include the values ​​and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances associated with the particular value due to manufacturing, assembly, use, etc. Such terms should also be considered as disclosing a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​not using relative terms should also be disclosed as specific values ​​with tolerances. Furthermore, “basically” when expressing relative angular relationships (e.g., substantially parallel, substantially perpendicular) may refer to a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) added to or subtracted from the indicated angle.

[0040] In this application, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0041] In this application, the directional terms "upper," "lower," "left," "right," "front," and "rear" are used to describe the orientation and positional relationships shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when an element is mentioned as being connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as upper side, lower side, left side, right side, front side, and rear side not only represent positive orientation but can also be understood as lateral orientation. For example, "below" can include directly below, lower left, lower right, lower front, and lower rear.

[0042] like Figures 1 to 4 As shown, this embodiment provides a calibration board, which includes a circuit board 100, a cooling component 200, and a heating component 300. The circuit board 100 includes a board body 110 and a target device 120 disposed on the board body 110. The cooling component 200 has a flow channel with a flowing coolant inside to remove heat from the target device 120. The heating component 300 includes a heating component 310 and a temperature detection component 320. The heating component 310 generates heat to heat the target device 120, and the temperature detection component 320 is used to detect the temperature of the target device 120 and is communicatively connected to the heating component 310.

[0043] Among them, the target device 120 is used to simulate a chip that can generate heat. When in use, the temperature control program of the aging equipment can be copied into the resource board and the calibration board can be simulated for aging tests. The temperature control curve is tested according to the temperature detection device 320 in the calibration board, thereby obtaining calibration data. This avoids the problem of burning out the device and damaging electronic components due to direct testing in the aging equipment, thus avoiding significant economic losses.

[0044] The coolant flowing inside the flow channel can also remove the heat from the heating element 310. Specifically, it can be connected to an external water chiller or refrigerant chiller through the liquid inlet and outlet ports on the cooling element 200, ensuring that the cooling capacity of the cooling element 200 remains within the required range.

[0045] It should be noted that the temperature detection element 320 can be a temperature sensor, which is communicatively connected to the controller to detect the temperature of the target device 120 in real time and record the temperature change of the target device 120 over time using a data recording device. Other conventional methods in the art can also be used to plot the temperature control curve using the temperature detection element 320, and are not limited here.

[0046] In some embodiments, the heating assembly 300 further includes a heating block 330 having a first mounting hole 331. A heating element 310 is disposed in the first mounting hole 331 so that the heat generated by the heating element 310 can be transferred to the heating block 330 through the sidewall of the first mounting hole 331, increasing the contact area between the heating element 310 and the heating block 330, thereby improving the heat transfer efficiency. The heating element 310 is a heating rod.

[0047] The heating block 330 has a second mounting hole 332, in which a temperature sensing element 320 is disposed to facilitate temperature detection of the heating block 330. This also helps protect the temperature sensing element 320 from damage caused by external impacts. For ease of installation, silicone grease can be applied to the openings of the first mounting hole 331 and the second mounting hole 332.

[0048] Considering that the target device 120 of the analog chip has a certain temperature during use, which will affect the temperature of the heating block 330, and that the aging test is actually to test the chip's operation at different temperatures, in some embodiments, the second mounting hole 332 is located between the first mounting hole 331 and the target device 120, so as to be closer to the target device 120, thereby making the temperature detected by the temperature sensing element 320 closer to the temperature of the target device 120.

[0049] To improve heating efficiency, in some embodiments, the heating block 330 has at least two first mounting holes 331, and the heating assembly 300 has at least two heating elements 310, with each heating element 310 corresponding to one of the first mounting holes 331. For example, the heating block 330 has two first mounting holes 331, which are arranged horizontally at intervals, allowing the heating block 330 to be heated more quickly by the two heating elements 310. In this embodiment, a second mounting hole 332 is located between the two first mounting holes 331 in the horizontal direction.

[0050] To ensure the connection strength between the heating block 330 and the heating element 310 and the temperature sensing element 320, in some embodiments, the heating block 330 has a first locking hole 333 communicating with the first mounting hole 331 and a second locking hole 334 communicating with the second mounting hole 332. A first fastener passes through the first locking hole 333 and abuts against the heating element 310, and a second fastener passes through the second locking hole 334 and abuts against the temperature sensing element 320. Both the first and second fasteners are screws, and both the first and second locking holes 333 and 334 are screw holes. In some embodiments, the heating block 330 has a plurality of first locking holes 333, each first mounting hole 331 correspondingly communicating with two first locking holes 333, and the two first locking holes 333 are spaced apart along the extending direction of the first mounting hole 331, thereby improving the fixation of the heating element 310.

[0051] In some embodiments, the heating block 330 is located on the side of the target device 120 away from the plate body 110, and the cooling element 200 is located on the side of the heating block 330 away from the target device 120, so that the temperature of the heating element 310 can be transferred to the target device 120 as soon as possible, reducing temperature control delay and improving temperature control accuracy; in addition, it reduces heat waste.

[0052] The heating assembly 300 also includes a first thermally conductive element 340, which is sandwiched between the heating block 330 and the target device 120, so that the heat from the heating block 330 can be transferred to the target device 120 by heat transfer, thereby improving the efficiency of heat transfer. The first thermally conductive element 340 is made of thermally conductive silicone.

[0053] The heating assembly 300 includes a second heat-conducting element 350, which is sandwiched between the heating block 330 and the cooling element 200. This allows the heat from the heating block 330 to be transferred to the cooling element 200 when it is high, improving the efficiency of heat transfer and ensuring more precise temperature control of the heating block 330. The second heat-conducting element 350 is made of thermally conductive silicone.

[0054] The bottom of the heating block 330 is provided with several support legs 335, which abut against the plate body 110. These support legs 335 are distributed around the outer periphery of the target device 120, and their height is greater than that of the target device 120 to accommodate the target device 120 and the first heat-conducting element 340. Simultaneously, this arrangement ensures a relatively fixed distance between the heating block 330 and the plate body 110, preventing the first heat-conducting element 340 from being clamped and deformed when the distance between them decreases. Conversely, if the distance between the heating block 330 and the plate body 110 increases, gaps will appear between them, preventing heat transfer. The fixing screws pass through the mounting holes on the plate body 110 and are screwed into the fixing screw holes on the support legs 335.

[0055] Similarly, in some embodiments, the heating block 330 is provided with a receiving groove 336 on the side facing the cooling member 200, and the second heat-conducting member 350 is located in the receiving groove 336 to ensure that both sides of the second heat-conducting member 350 always abut against the heating block 330 and the cooling member 200.

[0056] The circuit board 100 includes several target devices 120, and the calibration board includes several heating components 300, with each heating component 300 corresponding to one of the target devices 120. A cooling element 200 covers the side of all heating components 300 away from the target devices 120, and coolant in the flow channel of the cooling element 200 flows through all heating components 300. By having one cooling element 200 correspond to several heating blocks 330, control complexity and equipment cost are reduced. Furthermore, the flow rate of coolant inside the flow channel is constant, simplifying the control program.

[0057] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A verification board, characterized in that, include: The circuit board (100) includes a board body (110) and a target device (120) disposed on the board body (110) for simulating the heat generated by the chip during the test process. Cooling component (200) having a flow channel with a flowing coolant inside the flow channel to remove heat from the target device (120); A heating assembly (300) includes a heating block (330), a heating element (310), and a temperature detection element (320). The heating element (310) and the temperature detection element (320) are both mounted on the heating block (330). The heating block (330) is at least partially used to connect with the target device (120). The heating element (310) generates heat to heat the target device (120). The temperature detection element (320) is used to detect the temperature of the target device (120).

2. The verification board according to claim 1, characterized in that, The heating block (330) has a first mounting hole (331), and the heating element (310) is disposed in the first mounting hole (331); and / or, The heating block (330) has a second mounting hole (332), and the temperature sensing element (320) is disposed in the second mounting hole (332).

3. The verification board according to claim 2, characterized in that, The second mounting hole (332) is located between the first mounting hole (331) and the target device (120); and / or, The heating block (330) has at least two first mounting holes (331), and the heating assembly (300) has at least two heating elements (310), with each heating element (310) corresponding to each of the first mounting holes (331).

4. The verification board according to claim 2, characterized in that, The heating block (330) has a first locking hole (333) communicating with the first mounting hole (331) and a second locking hole (334) communicating with the second mounting hole (332). A first fastener passes through the first locking hole (333) and abuts against the heating element (310), and a second fastener passes through the second locking hole (334) and abuts against the temperature detection element (320).

5. The verification board according to claim 1, characterized in that, The heating block (330) is located on the side of the target device (120) away from the plate body (110), and the cooling component (200) is located on the side of the heating block (330) away from the target device (120).

6. The verification board according to claim 5, characterized in that, The heating assembly (300) further includes a first thermally conductive element (340), which is sandwiched between the heating block (330) and the target device (120); and / or, The heating assembly (300) includes a second heat-conducting element (350), which is sandwiched between the heating block (330) and the cooling element (200).

7. The verification board according to claim 6, characterized in that, The bottom of the heating block (330) is provided with several feet (335), the feet (335) abut against the plate body (110), the feet (335) are distributed on the outer periphery of the target device (120), and the height of each foot (335) is greater than the height of the target device (120).

8. The verification board according to claim 6, characterized in that, The heating block (330) has a receiving groove (336) on the side facing the cooling component (200), and the second heat-conducting component (350) is located in the receiving groove (336).

9. The verification board according to any one of claims 1-8, characterized in that, The circuit board (100) includes a plurality of target devices (120), and the calibration board includes a plurality of heating components (300), with each heating component (300) and each target device (120) arranged in a one-to-one correspondence; the cooling component (200) covers the side of all the heating components (300) away from the target devices (120), and the coolant in the flow channel of the cooling component (200) flows through all the heating components (300).

10. The verification board according to claim 9, characterized in that, The flow rate of the coolant inside the flow channel is constant.

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