Stage management system and lithography system

Abstract

The utility model relates to a kind of machine table management system and photoetching system, relate to the technical field of semiconductor production, machine table management system includes machine table service device and multiple measuring machine table, machine table service device obtains the measurement data of the photoetching process measured by measuring machine table and carries out analysis processing to measurement data, and the photoetching machine table of photoetching process is analyzed based on measurement data compliance. Since the measurement data of different parameters in different measuring machine table are all processed by machine table service device, only one management personnel can manage machine table management system, greatly reduces labor cost, measurement data collection accuracy is high by machine table service device, avoids the information error caused by artificial record, and all measurement data are received by processor, management personnel can query analysis result immediately, significantly improve the accuracy and reliability of photoetching machine table compliance verification.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a machine management system and a lithography system. Background Technology

[0002] In actual wafer fab production, when a new product is transferred to mass production, it usually needs to undergo a small-scale pilot run (pi-run) on semiconductor process equipment, which is a small-scale trial production before formal mass production.

[0003] Generally, the data that needs to be collected for small-batch verification of semiconductor process equipment is determined according to the process layer. Engineers evaluate the data according to the quality requirements, and once the evaluation is passed, the equipment can be listed as compliant and transferred to mass production.

[0004] However, existing process flows typically include dozens of process layers. The large number of process layers inevitably leads to a complex measurement process. Data verification for each process layer requires manual management, which makes it easy for omissions and errors to occur when verifying multiple process layers. Furthermore, due to manpower limitations, engineers are often unable to monitor small-batch verification data in real time, resulting in data errors and further causing detection anomalies in semiconductor process equipment verification. Utility Model Content

[0005] Therefore, it is necessary to provide a machine management system and a lithography system to address the problem of detection anomalies caused by human error in semiconductor process equipment verification.

[0006] To achieve the above objectives, on the one hand, this utility model provides a machine tool management system, which includes:

[0007] Multiple measurement equipment, each of which is used to measure measurement data of different parameters in the photolithography process;

[0008] The equipment service device includes an equipment access module and a processor. The equipment access module includes multiple first interfaces, and different first interfaces are used to access different measurement equipment. The processor is connected to the equipment access module and is used to perform compliance analysis on the lithography equipment of the lithography process based on the measurement data of the multiple measurement equipment.

[0009] In one embodiment, the machine service device further includes:

[0010] The first memory is used to define the card control specifications of the lithography machine and is connected to the processor.

[0011] In one embodiment, the machine service device further includes:

[0012] An alarm device, connected to the processor, is used to issue an alarm when the measurement data does not match the card control specifications.

[0013] In one embodiment, the machine service device further includes:

[0014] A second memory, connected to the processor, is used to store the analysis results of analyzing the lithography machine based on the measurement data.

[0015] In one embodiment, the machine management system further includes:

[0016] A display, connected to the memory, is used to display the analysis results of the lithography machine based on the measurement data.

[0017] In one embodiment, the second memory is also connected to the machine access module for storing the measurement data.

[0018] In one embodiment, the machine service device further includes:

[0019] The second interface is used to connect to the lithography machine used in the lithography process.

[0020] The controller, connected to the second interface, is used to control the working status of the lithography machine.

[0021] In one embodiment, the second controller is also connected to the measuring machine and is used to control the working state of the measuring machine.

[0022] In one embodiment, the measuring instrument includes any one or more of the following: a critical dimension measuring instrument, an overlay accuracy measuring instrument, an electrical testing measuring instrument, and a pattern defect measuring instrument.

[0023] On the other hand, this utility model also provides a photolithography system, the photolithography system comprising:

[0024] Photolithography equipment;

[0025] The equipment management system is used to perform compliance analysis on the lithography equipment, and the equipment management system is any of the equipment management systems described above.

[0026] Compared with existing technologies, the above technical solution has the following advantages:

[0027] The equipment management system provided in this application includes an equipment service device and multiple measurement equipment. Different measurement equipment are used to measure measurement data of different parameters in the lithography process. The equipment service device includes an equipment access module and a processor. The equipment access module has multiple first interfaces, different first interfaces for connecting to different measurement equipment. The equipment access module is connected to the processor, which analyzes and processes the measurement data measured by the measurement equipment and performs compliance analysis on the lithography equipment in the lithography process based on the measurement data.

[0028] Since measurement data of different parameters in different measurement equipment are transmitted to the processor for processing through the equipment access module in the equipment service device, only one manager is needed to manage the equipment management system, which greatly reduces labor costs. The measurement data collected through the equipment access module has a high accuracy rate, avoiding information errors caused by human recording. Furthermore, all measurement data is received by the processor, and the manager can query and analyze the results in real time, which significantly improves the accuracy and reliability of lithography equipment compliance verification. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of a machine tool management system provided in an embodiment of this application;

[0031] Figure 2 This is a schematic diagram of another machine tool management system provided in an embodiment of this application;

[0032] Figure 3 This is a schematic diagram of another machine management system provided in an embodiment of this application;

[0033] Figure 4 This is a schematic diagram of another machine management system provided in an embodiment of this application;

[0034] Figure 5 This is a schematic diagram of another machine management system provided in an embodiment of this application;

[0035] Figure 6 This is a schematic diagram of another machine management system provided in an embodiment of this application;

[0036] Figure 7 This is a schematic diagram of the structure of a photolithography system provided in an embodiment of this application;

[0037] Figure 8 A flowchart illustrating the management process of a machine tool management system provided in this application embodiment;

[0038] Figure 9 This is a flowchart illustrating another machine management system provided in an embodiment of this application. Detailed Implementation

[0039] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0041] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0042] Based on the background information, a complete lithography process at 90nm and below typically involves at least 30 process layers, each requiring photolithography. Since photolithography data can be optimized by adding photoresist, data verification for photolithography processes where small-batch validation data deviates from baseline data is crucial. Engineers can optimize the lithography process based on this small-batch validation data, increasing product yield. However, due to the large number of process layers, compliance analysis of the lithography process requires a significant amount of verification work and consumes substantial human resources.

[0043] Based on this, this application provides a machine tool management system, including a machine tool service device and multiple measurement machines. Different measurement machines are used to measure measurement data of different parameters in the lithography process. The machine tool service device includes a machine tool access module and a processor. The machine tool access module has multiple first interfaces, different first interfaces for connecting different measurement machines. The machine tool access module is connected to the processor, which analyzes and processes the measurement data measured by the measurement machines and performs compliance analysis on the lithography machines in the lithography process based on the measurement data.

[0044] Since measurement data of different parameters in different measurement equipment are transmitted to the processor for processing through the equipment access module in the equipment service device, only one manager is needed to manage the equipment management system, which greatly reduces labor costs. The measurement data collected through the equipment access module has a high accuracy rate, avoiding information errors caused by human recording. Furthermore, all measurement data is received by the processor, and the manager can query and analyze the results in real time, which significantly improves the accuracy and reliability of lithography equipment compliance verification.

[0045] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] Please refer to Figure 1 , Figure 1 This application provides a schematic diagram of the structure of a machine tool management system; the machine tool management system includes:

[0047] Multiple measurement equipment, each used to measure different parameters of the photolithography process.

[0048] The equipment service device includes an equipment access module and a processor. The equipment access module includes multiple first interfaces, and different first interfaces are used to connect to different measurement equipment. The processor is connected to the equipment access module and is used to perform compliance analysis on the lithography equipment in the lithography process based on the measurement data of multiple measurement equipment.

[0049] Specifically, in this embodiment, when a new product rolls off the production line, a small-batch verification of the lithography machine is performed to verify the lithography process of the lithography machine, and this machine management system is used for this purpose.

[0050] In this equipment management system, multiple measuring machines can be of different types, or a combination of some of the same type and some of different types. Measuring machines of the same type are used to measure the same parameter, while measuring machines of different types are used to measure different parameters.

[0051] Optionally, in another embodiment of this application, the plurality of measuring instruments includes any one or more of the following: a critical dimension measuring instrument, an overlay accuracy measuring instrument, an electrical parameter measuring instrument, and a pattern defect measuring instrument.

[0052] Specifically, multiple measurement equipment can be any one or several of the following: critical dimension measurement equipment, overlay accuracy measurement equipment, electrical parameter measurement equipment, and pattern defect measurement equipment. For lithography equipment, the verification of critical dimensions, overlay accuracy, and electrical parameters is a necessary data verification for the lithography process. Different measurement equipment is used during measurement according to the specific verification data required.

[0053] It should be noted that the photolithography process can include multiple process layers. Different process layers can use the same measurement equipment to measure the same parameter, or different process layers can use different measurement equipment to measure the same parameter, or different process layers or the same process layer can use different types of measurement equipment to measure different parameters. There are no specific limitations on this. The number and type of measurement equipment can be set according to specific needs.

[0054] The machine tool service device includes a machine tool access module, which comprises multiple first interfaces. It should be noted that different first interfaces connect to different measurement machines. The number of first interfaces can be the same as or more than the number of measurement machines. Extra first interfaces can be used as preset interfaces to connect other machines when needed. Furthermore, the number of first interfaces can also be set according to the type of measurement machine; no specific limitation is made here. It should be noted that the machine tool access module is used to capture or acquire measurement data.

[0055] The equipment service unit also includes a processor connected to the equipment access module. After the equipment access module captures measurement data, it transmits the measurement data to the processor. The processor processes and analyzes the measurement data, enabling it to determine whether the lithography equipment used in the lithography process is compliant based on measurement data from multiple measurement equipment. It should also be noted that the equipment access module and processor include, but are not limited to, web-based systems built using programming languages ​​such as Python and machine learning libraries (e.g., NumPy, Pandas, Scikit-learn) for data capture and analysis.

[0056] In one embodiment, the measurement equipment includes a critical dimension measurement equipment, an overlay accuracy measurement equipment, an electrical parameter measurement equipment, and a pattern defect measurement equipment. The equipment access module captures measurement data from the lithography process. A processor performs compliance analysis on the lithography equipment based on the critical dimension measurement data, overlay accuracy measurement data, electrical parameter measurement data, and pattern defect measurement data. The processor includes, but is not limited to, functions such as measurement data analysis, graphical reporting, and compliance assessment. Furthermore, the processor can analyze the measurement data and propose parameter adjustment and optimization suggestions for the critical dimension measurement data and overlay accuracy measurement data through defined algorithms such as PA / PB calculation feedback.

[0057] Optional, see reference Figure 2 , Figure 2 This is a schematic diagram of another machine tool management system provided in an embodiment of this application; in another embodiment of this application, the machine tool service device further includes:

[0058] Controller.

[0059] The machine access module also includes a second interface for connecting to a lithography machine for the lithography process. The controller is connected to the second interface to control the working status of the lithography machine.

[0060] Optionally, in another embodiment of this application, the controller is also connected to a measuring machine for controlling the working state of the measuring machine.

[0061] Specifically, the equipment access module also includes a second interface for connecting to the lithography equipment used in the lithography process. It should be noted that the number of second interfaces is not specifically limited; in this embodiment, there can be one second interface for connecting to the lithography equipment. The equipment access module can capture and manage various data from the lithography equipment and the metrology equipment in real time. The controller connects to the second interface and can further control the status of the lithography equipment, thereby tracking its progress in real time. The controller also connects to the metrology equipment used to measure the lithography process and controls its progress. It should be noted that the controller can rationally allocate the workload between the lithography equipment and the metrology equipment based on urgency. It should also be noted that the controller includes, but is not limited to, using the Spring Boot framework or the Django framework to build a RESTful API to handle the management logic of the lithography process and the interaction functions with the memory.

[0062] Optional, see reference Figure 3 , Figure 3 This is a schematic diagram of another machine tool management system provided in an embodiment of this application; in another embodiment of this application, the machine tool service device further includes:

[0063] The first memory, connected to the processor, is used to define the card control specifications of the lithography machine.

[0064] Specifically, the first memory is connected to the processor and is used to define the control specifications of the lithography machine. The control specifications are the process standards of the lithography machine set in advance by the engineer, including key dimension measurement data, overlay accuracy measurement data, electrical parameter measurement data, and pattern defect measurement data. When the lithography machine is obtained by analyzing the measurement data based on the lithography process, the processor can compare the data of the lithography machine with the control specifications of the first memory to determine whether the lithography machine meets the production process standards.

[0065] Optional, see reference Figure 4 , Figure 4 This is a schematic diagram of another machine tool management system provided in an embodiment of this application; in another embodiment of this application, the machine tool service device further includes:

[0066] The warning device, connected to the processor, is used to issue an alarm when the measurement data does not match the card control specifications.

[0067] Specifically, the alarm system connects to the processor. The processor compares the measurement data of the card control specifications with the lithography process. When the measurement data is within the range of the card control specifications, it determines that the measurement data matches the card control specifications. When the measurement data is outside the range of the card control specifications, it determines that the measurement data does not match the card control specifications. At this time, the alarm system will sound an alarm to report the potential problem. Engineers can then take timely action and make decisions after receiving the alarm. It should be noted that the alarm system can be an audible alarm, a visual alarm, or use email services for alarm notification, etc., without specific limitations. It should also be noted that when alarm notifications are implemented via email services, the alarm system includes, but is not limited to, integrating Prometheus and Grafana for monitoring and data visualization.

[0068] Optional, see reference Figure 5 , Figure 5 This is a schematic diagram of another machine tool management system provided in an embodiment of this application; in another embodiment of this application, the machine tool service device further includes:

[0069] The second memory, connected to the processor, is used to store the analysis results of the lithography machine based on the measurement data.

[0070] Optionally, in another embodiment of this application, the second memory is also connected to the machine access module for storing measurement data.

[0071] Specifically, the second memory is connected to both the processor and the machine access module. It stores the analysis results and measurement data from the measurement of the lithography machine. The memory can also store historical verification data after multiple verifications, parameters of the measurement machine, parameters of the lithography machine, and other data from the machine service devices. When data backtracking is required, rapid data retrieval and analysis can be achieved. It should be noted that the second memory includes, but is not limited to, using MySQL or PostgreSQL to store structured data, and Elasticsearch to process logs and unstructured data.

[0072] It should be noted that the data stored in the second memory can provide a basis for tracking and feedback of the first batch of lithography process data after the lithography machine complies with regulations. Furthermore, it can provide timely warnings and reduce the risks of the lithography machine in the lithography process.

[0073] Optional, see reference Figure 6 , Figure 6 This is a schematic diagram of another machine tool management system provided in an embodiment of this application; in another embodiment of this application, the machine tool management system further includes:

[0074] The display, connected to a second memory, is used to display the analysis results of the lithography machine based on measurement data.

[0075] Specifically, the display is connected to the memory and is used to display the analysis results of the lithography machine based on measurement data. It should be noted that the display provides an intuitive and user-friendly interface for human-machine interaction. Engineers can use the display to manage the lithography process, define the machine, and monitor and query data. The display includes, but is not limited to, a system user interface developed using the React or Vue framework, which can improve the convenience and efficiency of engineer-system interaction.

[0076] This machine management system, through machine access modules, controllers, processors, a second memory, an early warning device, and a first memory, enables lithography machines to successfully complete compliance verification and be put into production while meeting the measurement data requirements of different parameters, significantly improving the accuracy and reliability of compliance verification.

[0077] Based on the above machine management system, and referring to Figure 7 , Figure 7 This application provides a schematic diagram of a photolithography system according to an embodiment of the present application; the present application also provides a photolithography system, the photolithography system comprising:

[0078] Photolithography machine.

[0079] A machine management system is connected to a lithography machine, and the machine management system is any of the machine management systems described above.

[0080] Specifically, when a new product rolls off the production line, a small batch of lithography equipment is used to obtain the lithography process. The lithography process is measured through the equipment management system. After capturing the measurement data, the lithography equipment is subjected to compliance analysis based on the measurement data.

[0081] The following specific embodiment will be used to illustrate the machine management system. After a new product rolls off the production line, the first step is to provide the lithography process and machine information that require compliance verification for the lithography machine. The prepared lithography process flow for the lithography machine is then imported into the machine management system. The controller establishes the machine selection, lithography process, and data measurement information corresponding to the lithography process.

[0082] In this embodiment, the selected equipment includes a critical dimension measurement equipment, an overlay accuracy measurement equipment, an electrical parameter measurement equipment, and a pattern defect measurement equipment. The equipment access module captures critical dimension measurement data, overlay accuracy measurement data, electrical parameter measurement data, and pattern defect measurement data of the lithography process. The captured critical dimension measurement data, overlay accuracy measurement data, electrical parameter measurement data, and pattern defect measurement data are transmitted to the processor. The processor performs report analysis and generates results using a preset working template and the required card control specifications defined in the first memory. The second memory stores the measurement data and analysis results for subsequent backtracking. The second memory also stores the production data of the lithography equipment. The display shows the analysis results of the lithography equipment obtained based on the measurement data analysis for engineers to make decisions. Engineers can query the analysis results of the lithography equipment in the equipment management system and further judge the compliance of the equipment in combination with the card control specifications.

[0083] refer to Figure 8 , Figure 8 This is a flowchart illustrating the management process of a machine tool management system provided in this application embodiment; firstly, the process flow of the lithography process of the lithography machine tool to be verified and the data of the lithography machine tool are provided.

[0084] S101: Fill the prepared photolithography process data into the system and set the specified measurement equipment.

[0085] In this step, the specified measuring equipment includes critical dimension measuring equipment, overlay accuracy measuring equipment, and electrical parameter measuring equipment.

[0086] S102: Set the card control specifications.

[0087] In this step, the control specifications include the offsets of key dimension measurement data, overlay accuracy measurement data, and electrical parameter measurement data. These offsets can be an average drift of less than Nsigma. This sigma must meet the system's sigma quality control requirements, where N > 0.

[0088] S103: The machine access module captures measurement data from multiple measurement machines.

[0089] This step includes capturing parameter values ​​of key dimension measurement data, overlay accuracy measurement data, and electrical parameter measurement data of the photolithography process through the first interface of the measurement equipment based on the address of the measurement equipment.

[0090] S104: The processor processes the acquired measurement data.

[0091] This step includes analyzing and processing multiple acquired measurement data using a pre-set working template, and comparing the acquired measurement data with reference data using a comparison program. The reference data includes historical reference data from the lithography machine.

[0092] S105: Determine whether multiple measurement data deviate from the reference data; if yes, proceed to S107, otherwise proceed to S106.

[0093] This step includes determining whether the parameter values ​​of the key dimensions, overlay accuracy, and electrical parameters of the lithography machine match the reference data.

[0094] S106: Lithography equipment is compliant.

[0095] In this step, the parameter values ​​of the key dimension measurement data, overlay accuracy measurement data, and electrical parameter measurement data of the lithography machine are matched with the reference data and conform to the card control specifications.

[0096] S107: Obtain the compensation value for the deviation from the reference data according to the card control specifications, and feed the compensation value back to the lithography machine for rework.

[0097] In this step, the overshoot baseline data of key dimension measurement data, overlay accuracy measurement data, and electrical parameter measurement data are used to obtain overlay error compensation value and exposure dose compensation value based on the control specifications set in S102. The overlay error compensation value and exposure dose compensation value are fed back to the lithography system, the lithography machine reworks the lithography process, and then the verification in step S103 is repeated.

[0098] After the first batch of lithography process verification lithography machines have passed compliance verification, the measurement data of the compliant lithography processes from these machines will be supplemented and fed back to the machines so that they can perform lithography processes based on the compliant data. To ensure subsequent mass production, multiple batches of lithography process verification will continue. (Reference) Figure 9 , Figure 9 This is a flowchart illustrating another machine management system provided in an embodiment of this application.

[0099] S201: Fill the prepared multiple batches of photolithography process data into the system and set the specified measurement equipment.

[0100] In this step, the specified measuring equipment also includes critical dimension measuring equipment, overlay accuracy measuring equipment, and electrical parameter measuring equipment.

[0101] S202: Based on the measurement data of the lithography process of the first batch of compliant lithography machines, optimize the overlay error compensation value and exposure dose compensation value, and feed them back to the lithography process of subsequent batches.

[0102] In this step, based on the measurement data of the lithography process of the first batch of compliant lithography machines, the overlay error compensation value and exposure dose compensation value are further optimized, and the optimized overlay error compensation value and exposure dose compensation value are fed back to the lithography process of the third batch, thus realizing multi-batch feedback in sequence.

[0103] S203: Determine whether the measurement data of multiple batches of photolithography processes deviate from the reference data; if so, proceed to S205, otherwise proceed to S204.

[0104] This step includes determining whether the parameter values ​​of the key dimensions, overlay accuracy, and electrical parameters of the lithography machine match the reference data.

[0105] S204: Lithography equipment is compliant.

[0106] In this step, the parameter values ​​of the key dimension measurement data, overlay accuracy measurement data, and electrical parameter measurement data of the lithography machine are matched with the reference data and conform to the card control specifications.

[0107] S205: The alarm is triggered.

[0108] In this step, the lithography machine was found to be non-compliant, failing to meet the control specifications, triggering an alarm. The engineer then confirmed the cause of the offset.

[0109] S206: Determine whether the problem is caused by differences in the lithography machine. If so, proceed to S207; otherwise, proceed to S208.

[0110] S207: The lithography machine is non-compliant.

[0111] S208: Manually filter out error points and recalculate the deviation value.

[0112] S209: Determine if it is compliant. If yes, proceed to S204; otherwise, proceed to S207.

[0113] After multiple batches of photolithography process verification, if the photolithography machine is deemed compliant, it can be released for mass production of new products. If it is not compliant, a new photolithography machine will be selected, and a small-batch verification process will be conducted again.

[0114] This machine management system integrates all data from the lithography process for comprehensive analysis and processing. Only one engineer is needed to perform small-batch verification of all lithography processes. This verification process utilizes intelligent lithography machine unloading, data machine learning comparison, and AI big data analysis, effectively achieving intelligent management of the machine management system. It significantly reduces labor costs, and the intelligent collection of measurement data boasts high accuracy. Alarms enable timely data optimization, and data processing is convenient and fast. Optimized parameters can be effectively and accurately applied to subsequent lithography processes, avoiding information errors caused by manual recording.

[0115] In the description of this specification, references to terms such as "one embodiment," "another embodiment," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0116] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0117] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A machine management system, characterized in that, The machine management system includes: Multiple measurement equipment, each of which is used to measure measurement data of different parameters in the photolithography process; The equipment service device includes an equipment access module and a processor. The equipment access module includes multiple first interfaces, and different first interfaces are used to access different measurement equipment. The processor is connected to the equipment access module and is used to perform compliance analysis on the lithography equipment of the lithography process based on the measurement data of the multiple measurement equipment.

2. The machine management system according to claim 1, characterized in that, The machine service device also includes: The first memory, connected to the processor, is used to define the card control specifications of the lithography machine.

3. The machine management system according to claim 2, characterized in that, The machine service device also includes: An alarm device, connected to the processor, is used to issue an alarm when the measurement data does not match the card control specifications.

4. The machine management system according to claim 1, characterized in that, The machine service device also includes: A second memory, connected to the processor, is used to store the analysis results of analyzing the lithography machine based on the measurement data.

5. The machine management system according to claim 4, characterized in that, The machine management system also includes: A display, connected to the second memory, is used to display the analysis results of the lithography machine based on the measurement data.

6. The machine management system according to claim 4, characterized in that, The second memory is also connected to the machine access module and is used to store the measurement data.

7. The machine management system according to claim 1, characterized in that, The machine service device also includes: Controller; The machine access module also includes a second interface for connecting to the lithography machine for the lithography process. The controller is connected to the second interface for controlling the working status of the lithography machine.

8. The machine management system according to claim 7, characterized in that, The controller is also connected to the measuring machine and is used to control the working status of the measuring machine.

9. The machine management system according to claim 1, characterized in that, The plurality of measuring instruments include any one or more of the following: critical dimension measuring instrument, overlay accuracy measuring instrument, electrical parameter measuring instrument, and graphic defect measuring instrument.

10. A photolithography system, characterized in that, The photolithography system includes: Photolithography equipment; A machine management system is used to perform compliance analysis on the lithography machine, and the machine management system is the machine management system as described in any one of claims 1-9.

Images