Integrated lightweight multi-mode fusion matrix host

Abstract

The utility model discloses a light -duty multi -mode fusion matrix host computer of integration, including the plugging cover (12) of the surface of the shell (11) is used to the plugging of opening, the shell (11) and plugging cover (12) are sheet metal material, small -size host computer (2) it includes a plurality of PCB board (21) and is located on the interface unit (22) of PCB board (21) piece, operating unit (23), core processor, mounting structure is used for with the shell (11) inside connection of small -size host computer (2), a plurality of PCB evenly distributes in the shell (11) inside through mounting structure, the light -duty device shell (1) is equipped with a plurality of small -size host computer (2), and every small -size host computer (2) can work independently.

Description

Technical Field

[0001] This utility model relates to the field of electrical equipment, specifically an integrated lightweight multi-mode fusion matrix host. Background Technology

[0002] Currently, traditional PC mainframes are widely used in studios, data centers, industrial control, and personal computing. Their core function is to achieve data processing, storage, and peripheral control by integrating hardware modules such as a central processing unit (CPU), motherboard, memory, hard drive, power supply, and cooling system. Traditional mainframes typically use standard ATX or Micro-ATX chassis designs with a fixed internal structure. The various hardware modules are connected through standardized interfaces and rely on physical cooling components such as fans and heatsinks to maintain stable operation.

[0003] While traditional PCs offer significant advantages in performance and compatibility, their design has noticeable drawbacks in certain application scenarios. First, existing PCs are generally large; for example, a standard ATX chassis typically exceeds 180mm × 400mm × 500mm, making them difficult to deploy flexibly in space-constrained environments such as studios. This occupies valuable equipment placement space and limits the possibility of multiple devices working simultaneously. Second, traditional PCs often weigh over 10kg, and their fixed internal structure requires disassembling external cables and taking shock-absorbing measures when moving them, significantly increasing transportation costs and operational complexity, especially in on-site production scenarios requiring frequent equipment relocation (such as outdoor live streaming and mobile command centers). Furthermore, the highly rigid form factor and functional modules of existing PCs make it difficult to flexibly configure them according to actual needs (such as miniaturized video editing workstations or distributed computing nodes), resulting in low resource utilization. Summary of the Invention

[0004] To solve the above problems, this utility model provides the following technical solution:

[0005] An integrated lightweight multi-mode fusion matrix host, characterized in that it includes:

[0006] The lightweight device housing includes an outer shell with an opening on its surface, and a sealing cap disposed on the surface of the outer shell for sealing the opening, wherein both the outer shell and the sealing cap are made of sheet metal.

[0007] A small host computer includes several PCB boards, as well as interface units, operation units, and core processors mounted on the PCB boards.

[0008] The mounting structure is used to connect the small host to the inside of the housing, and several of the PCBs are evenly distributed inside the housing through the mounting structure;

[0009] The lightweight device has several small main units inside its casing, each of which can work independently.

[0010] Based on the above technical solution, the present invention can be further improved as follows.

[0011] Furthermore, the outer casing surface is provided with a cover plate connection structure, and the sealing cover can be installed on the outer casing surface through the cover plate connection structure.

[0012] Furthermore, the spacing between adjacent PCBs remains consistent, and adjacent PCBs are parallel to each other.

[0013] Furthermore, the surface of the outer casing is provided with ventilation and heat dissipation vents, which can connect the gap between adjacent PCB boards to the outside of the outer casing.

[0014] Furthermore, the operating unit includes, but is not limited to, a power switch and a reset button.

[0015] Furthermore, the interface unit includes, but is not limited to, a headphone jack, a USB port, an HDMI port, and a power input port.

[0016] Furthermore, the outer casing has openings at the top and sides, and the sealing cover includes a top cover plate and a side cover plate on the surface of the outer casing. The side cover plate has openings on its surface that are compatible with the operating unit and the interface unit.

[0017] Furthermore, the PCB board surface is provided with a cooling fan, and the outer casing surface is provided with an opening for connecting the power cord to the cooling fan. This opening is located on the outer casing surface near the top cover plate.

[0018] Furthermore, the mounting structure includes a mounting groove located inside the housing and a connector capable of connecting the PCB board to the mounting groove.

[0019] Beneficial effects

[0020] Compared with existing technologies, this solution effectively reduces volume and improves space utilization by using a combination of open and sealed covers in the outer shell, replacing horizontal expansion with multi-layer PCB vertical stacking internally, and connecting various functional modules with standardized interfaces. At the same time, the PCB boards are evenly distributed through the mounting structure and positioning guide grooves, and air circulation gaps are reserved, which not only balances the center of gravity of the equipment, but also reduces the risk of temperature rise through uniform heat dissipation paths. The collaborative design of lightweight shell, modular stacking architecture and dynamic distribution mounting structure solves the problems of bulky traditional equipment, high transportation costs and low resource utilization. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional structural diagram of the utility model;

[0023] Figure 2 This is a schematic diagram of the internal three-dimensional structure of the utility model;

[0024] Figure 3 This is a three-dimensional structural diagram of the utility model;

[0025] The attached diagram lists the components represented by each number as follows:

[0026] 1. Lightweight device housing; 11. Housing body; 12. Sealing cover; 13. Ventilation vent; 2. Miniature host; 21. PCB board; 22. Interface unit; 221. Headphone jack; 222. USB interface; 223. HDMI interface; 224. Power input interface; 23. Operation unit; 231. Power switch; 232. Reset button. Detailed Implementation

[0027] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] It should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the technical product is in use. They are used only for the convenience of describing the technology and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the technology. Furthermore, the terms "horizontal," "vertical," and "suspended," etc., do not mean that the component must be absolutely horizontal or suspended, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0031] Please see Figure 1-3 The integrated lightweight multi-mode fusion matrix host includes a lightweight device housing 1, a small host 2 located inside the lightweight device housing 1, and an installation structure connecting the small host 2 and the lightweight device housing 1.

[0032] The lightweight device housing 1 includes an outer shell 11 with an opening on its surface, and a sealing cover 12 on the surface of the housing 11 for sealing the opening. The lightweight device housing 1 houses several small main units 2, each of which can operate independently. To ensure normal operation, hardware integration is achieved through PCB stacking technology, increasing the deployment density per rack. Both the outer shell 11 and the sealing cover 12 are made of sheet metal, which may include aluminum alloy, magnesium alloy, or high-strength composite materials. The small main units 2 are compact but functionally integrated hardware units, with their core components being multi-layer PCBs. The PCB board 21 includes an embedded processor, an interface unit 22, an operation unit 23, and a core processor. The mounting structure connects the small host 2 to the inside of the housing 11. Several PCBs are evenly distributed inside the housing 11 through the mounting structure. Specifically, the mounting structure may include a slide rail mounting groove inside the housing 11 and a protruding buckle on the bottom of the PCB board 21. Quick assembly is achieved by pushing the slide rail in and rotating to lock it. Alternatively, screws can be used to pass through the through holes of the mounting groove and fix them to the threaded holes on the PCB board 21, aiming to ensure that an appropriate gap is maintained between multiple PCB boards 21.

[0033] The combination of a lightweight casing and a modular miniature host 2 solves the problems of large size and heavy weight of traditional devices. The evenly distributed design of the mounting structure improves the utilization of internal space and reduces the risk of heat buildup; the integrated layout of the interface unit 22 and the operation unit 23 simplifies the complexity of external connections, while the opening design of the sealing cover 12 ensures ease of operation. The overall solution significantly reduces the size and weight of the device while ensuring performance, making it suitable for rapid deployment needs in mobile scenarios.

[0034] To facilitate users to open the interior of the outer casing 11 for inspection and replacement of the small host 2, a cover plate connection structure is provided on the surface of the outer casing 11. The sealing cover 12 can be installed on the surface of the outer casing 11 through the cover plate connection structure. Openings are provided at the top and sides of the outer casing 11. The sealing cover 12 includes a top cover plate and a side cover plate provided on the surface of the outer casing 11. The surface of the side cover plate is provided with openings that are compatible with the operating unit 23 and the interface unit 22.

[0035] Meanwhile, considering the heat dissipation effect between PCB boards 21, the spacing between adjacent PCB boards 21 is kept consistent, and the adjacent PCB boards 21 are parallel to each other. At the same time, ventilation and heat dissipation vents 13 are provided on the surface of the outer shell 11, which can connect the gap between adjacent PCB boards 21 with the outside of the outer shell 11.

[0036] The operation unit 23 includes, but is not limited to, a power switch 231 and a reset button 232. The power switch 231 forms a circuit with the power management module on the PCB board 21 through conductive contacts. The interface unit 22 includes, but is not limited to, a headphone jack 221, a USB interface 222, an HDMI interface 223, and a power input interface 224. The USB interface 222 can be electrically connected to the core processor through a flexible ribbon cable. The interface unit 22 and the operation unit 23 in the miniature host 2 need to be directly soldered to the PCB board 21 through wires or printed circuits, and then interact with external devices or operators through openings on the surface of the outer casing 11. The interface unit 22, the operation unit 23, and the core processor together constitute the core functional modules of the PCB board 21: the interface unit 22 realizes data interaction and power access with external devices through standardized design, the operation unit 23 provides users with the function of directly controlling the device through physical buttons (such as the power switch 231 and the reset button 232), and the core processor acts as the computing center, coordinating the signal processing and instruction execution of each module through the bus system. The three components form a closed-loop control system through the PCB circuit network. The user triggers the device to start or reset through the operation unit 23. The core processor analyzes the external input signal and drives the interface unit 22 to complete data transmission or multimedia output. At the same time, the system stability is ensured by dynamically adjusting the computing load and heat dissipation design. Ultimately, the device achieves an organic unity in terms of functional integrity, interactive convenience and performance efficiency.

[0037] The PCB board 21 is equipped with a cooling fan on its surface, and the outer casing 11 is equipped with an opening for connecting the power cord of the cooling fan on its surface. The mounting structure includes a mounting groove inside the outer casing 11 and a connector that can connect the PCB board 21 to the mounting groove. The limiting step of the mounting groove ensures that the mounting positions of each PCB board 21 are spaced at the same distance, and the horizontal guide rail keeps the plane of the PCB board 21 parallel. This design avoids uneven heat dissipation or signal interference caused by overlapping or misalignment of the PCB boards 21, and facilitates subsequent maintenance and expansion.

[0038] In the description of this technology, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this technology based on the specific circumstances.

[0039] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An integrated lightweight multi-mode fusion matrix host, characterized in that, include The lightweight device housing (1) includes an outer shell (11) with an opening on its surface, and a sealing cap (12) disposed on the surface of the outer shell (11) for sealing the opening. Both the outer shell (11) and the sealing cap (12) are made of sheet metal. The small host (2) includes several PCBs (21), and an interface unit (22), an operation unit (23), and a core processor disposed on the PCBs (21); The mounting structure is used to connect the small host (2) to the inside of the housing (11), and several of the PCBs are evenly distributed inside the housing (11) through the mounting structure; The lightweight device housing (1) contains several small main units (2), each of which can work independently.

2. The integrated lightweight multi-mode fusion matrix host according to claim 1, characterized in that: The outer shell (11) is provided with a cover plate connection structure, and the sealing cover (12) can be installed on the surface of the outer shell (11) through the cover plate connection structure.

3. The integrated lightweight multi-mode fusion matrix host according to claim 1, characterized in that: The spacing between adjacent PCB boards (21) is consistent, and adjacent PCB boards (21) are parallel to each other.

4. The integrated lightweight multi-mode fusion matrix host according to claim 1, characterized in that: The outer casing (11) has ventilation and heat dissipation vents (13) on its surface, which can connect the gap between adjacent PCB boards (21) to the outside of the outer casing (11).

5. The integrated lightweight multi-mode fusion matrix host according to claim 1, characterized in that: The operation unit (23) includes, but is not limited to, a power switch (231) and a reset button (232).

6. The integrated lightweight multi-mode fusion matrix host according to claim 1, characterized in that: The interface unit (22) includes, but is not limited to, a headphone jack (221), a USB interface (222), an HDMI interface (223), and a power input interface (224).

7. The integrated lightweight multi-mode fusion matrix host according to claim 1, characterized in that: The outer shell (11) has openings at the top and sides. The sealing cover (12) includes a top cover plate and a side cover plate on the surface of the outer shell (11). The side cover plate has openings that are compatible with the operating unit (23) and the interface unit (22).

8. The integrated lightweight multi-mode fusion matrix host according to claim 1, characterized in that: The PCB board (21) is provided with a cooling fan, and the outer shell (11) is provided with an opening for connecting the power cord to the cooling fan. The opening is located on the surface of the outer shell (11) near the top cover.

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