Dual fan cooled ops computer module

Abstract

The utility model belongs to computer hardware technical field discloses a kind of OPS computer module of double-fan heat dissipation, to solve the problem of insufficient heat dissipation and unstable operation of existing OPS module due to the use of high-performance domestic processor, including PCB mainboard, the domestic multicore processor of the first area of mainboard is set, and the power supply circuit of the second area of mainboard is set, further including a set of heat dissipation component, the heat dissipation component has a radiator that covers first and second area integrally, and first and second heat dissipation fan are installed on the radiator side by side, first fan carries out targeted heat dissipation to processor, and second fan carries out targeted heat dissipation to power supply circuit. The utility model is through the innovative partition type active heat dissipation design, significantly improves the heat dissipation efficiency in compact space, guarantees the stable operation and long service life of entire module under high load.

Description

Technical Field

[0001] This utility model relates to the field of computer hardware technology, and in particular to an OPS computer module based on a domestic processor and featuring a pluggable modular design, specifically a heat dissipation structure for its internal core components. Background Technology

[0002] OPS computer modules are standardized pluggable computer modules that can be easily integrated into devices such as large-size LCD monitors, electronic whiteboards, and digital signage to achieve intelligent integration of computing and display. With the rapid development of the information technology application innovation industry, OPS modules using domestic processors such as Phytium and Loongson are gradually becoming the mainstream in the market.

[0003] However, existing OPS computer modules have the following technical problems: 1) The size of the OPS module is strictly limited, the internal space is extremely compact, and the air circulation is poor, which makes it easy for heat to accumulate.

[0004] 2) As the performance of domestic multi-core processors becomes increasingly powerful, their power consumption and heat generation also increase significantly. At the same time, the power supply circuit that provides stable power to the processor is also a huge heat source under high load. The processor and the power supply circuit, these two core heat sources, are closely arranged on the motherboard, forming an area with highly concentrated heat.

[0005] 3) Traditional OPS modules mostly use a single fan or a simple passive heatsink. Single-fan cooling solutions are difficult to cover both the processor and the power supply circuit, which can easily create heat dissipation blind spots. This can cause components such as the power supply circuit to overheat and reduce their frequency or even be damaged, affecting the stability and lifespan of the entire system. Passive cooling is completely unable to meet the heat dissipation requirements of the new generation of high-performance domestic processors.

[0006] Therefore, how to efficiently and evenly dissipate heat for domestically produced high-performance processors and their peripheral key circuits within a standardized and compact space has become a technical challenge that urgently needs to be solved in this field. Summary of the Invention

[0007] The purpose of this invention is to overcome the shortcomings of the prior art and provide a dual-fan cooling OPS computer module, which aims to solve the problems of uneven heat dissipation and system instability caused by the compact space and concentrated heat of core components in the existing OPS module.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: An OPS computer module with dual-fan cooling includes: a PCB motherboard; a domestically produced multi-core processor installed in a first area of ​​the PCB motherboard; a power supply circuit disposed on the PCB motherboard and adjacent to the domestically produced multi-core processor for supplying power to the domestically produced multi-core processor, the power supply circuit being located in a second area of ​​the PCB motherboard; and a heat dissipation assembly covering the first and second areas.

[0009] The heat dissipation component includes an integrated heat sink, and a first cooling fan and a second cooling fan mounted side by side on the heat sink. The airflow of the first cooling fan is mainly used to dissipate heat from the domestic multi-core processor in the first area, while the airflow of the second cooling fan is mainly used to dissipate heat from the power supply circuit in the second area, thus forming a zoned, collaborative active heat dissipation system.

[0010] As a preferred technical solution, the domestically produced multi-core processor is the Phytium D2000 / 8 desktop processor, which has multiple cores and generates a lot of heat under high load.

[0011] As a preferred technical solution, the power supply circuit is composed of multiple high-heat components such as MOSFETs, inductors, and capacitors. The second cooling fan directly and efficiently removes the heat generated during operation from the second area where these components are located through vertical airflow, ensuring stable power supply.

[0012] As a preferred technical solution, the integrated heat sink is made of aluminum extrusion or copper material with good thermal conductivity. Its flat bottom is in close contact with the top cover of the domestic multi-core processor. At the same time, through the structural extension, it is integrally molded to cover the adjacent power supply circuit, forming a unified heat conduction and heat dissipation platform.

[0013] As a preferred technical solution, the PCB motherboard is also equipped with other components such as memory slots and M.2 solid-state drive interfaces. These components are cleverly arranged downstream of or within the airflow path of the heat dissipation components, so that after the strong airflow generated by the dual fans dissipates heat for the core components, the residual waves can still flow through these components, providing them with effective auxiliary heat dissipation and improving the reliability of the whole machine operation.

[0014] As a preferred technical solution, the PCB motherboard is further provided with at least one memory slot, which is located downstream of the airflow path of the heat dissipation component, so as to use the mixed airflow generated by the first cooling fan and the second cooling fan to assist in heat dissipation of the memory module.

[0015] As a preferred technical solution, the first cooling fan and the second cooling fan are connected to the PCB motherboard through a four-pin PWM fan interface, and the motherboard intelligently adjusts the speed according to the temperature of the domestic multi-core processor.

[0016] As a preferred technical solution, the module conforms to the open pluggable specification, and one end of it is provided with an 80-pin JATEX 25-80Pin interface for signal transmission and power supply.

[0017] As a preferred technical solution, the PCB motherboard also integrates an M.2 MKey interface and an M.2 EKey interface, which are located within the airflow coverage area of ​​the heat dissipation component.

[0018] Compared with the prior art, this utility model has the following advantages: 1. This utility model adopts a dual-fan design, with a total air volume far greater than that of a single-fan solution. Through the innovative layout of partitioned heat dissipation, one fan is dedicated to the CPU and the other fan is dedicated to the power supply circuit, achieving precise targeting of the two core heat sources, avoiding heat accumulation and the bottleneck effect, and greatly improving the overall heat dissipation efficiency of the machine.

[0019] 2. The precise and efficient heat dissipation of this utility model ensures that the domestic processor can run stably at a high frequency without throttling due to overheating. At the same time, the sufficient heat dissipation of the power supply circuit ensures the purity and stability of the power supply, avoids failures caused by overheating and aging of power supply components, and significantly extends the fault-free operation time and service life of the entire OPS module.

[0020] 3. The heat dissipation structure of this utility model is compact and fully compatible with the standard OPS module housing size. The integrated heat sink and side-by-side fan layout make full use of the limited internal space and maximize heat dissipation performance without changing the standardized interface and shape of OPS. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a dual-fan cooling OPS computer module provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the PCB motherboard structure of the OPS computer module after the heat dissipation components have been removed, according to an embodiment of this utility model.

[0022] In the diagram: 1-PCB motherboard, 2-domestic multi-core processor, 3-power supply circuit, 4-heat dissipation component, 5-integrated heat sink, 6-first cooling fan, 7-second cooling fan, 8-memory slot, 9-JATEX 25-80Pin interface. Detailed Implementation

[0023] To make the objectives, technical solutions and advantages of this utility model clearer, the utility model will be described in further detail below with reference to the accompanying drawings.

[0024] Please see Figure 1 and Figure 2 This embodiment discloses a dual-fan cooling OPS computer module. The module strictly follows the OPS standard size design and can be easily inserted into a display device with an OPS slot. The core of the module is a PCB motherboard 1, on which all electronic components are integrated.

[0025] At the core location of the motherboard 1, namely the first area, a domestically produced high-performance multi-core processor 2 is installed. In this embodiment, it is specifically a Phytium D2000 / 8 eight-core desktop processor. This processor 2 is the computing core of the entire module and also the largest heat source.

[0026] Adjacent to the Phytium D2000 / 8 processor 2, a power supply circuit 3, also known as the second area, is laid out on the motherboard 1. This power supply circuit 3 includes components such as multi-phase power supply MOSFETs, inductors, and solid capacitors. Under high load, the temperature of this power supply circuit 3 will rise sharply, making it the second largest heat source on the motherboard 1.

[0027] To solve the heat dissipation problem of the two heat sources mentioned above, this utility model designs an innovative heat dissipation component 4, which consists of an integrated heat sink 5 and two cooling fans.

[0028] The heatsink 5 is made of a single piece of aluminum through extrusion, ensuring excellent thermal conductivity. Its bottom is polished so that it can fit tightly with the top cover of the Phytium D2000 / 8 processor 2. The main body of the heatsink 5 extends upward with dense heat dissipation fins. At the same time, its structure is extended horizontally, covering the adjacent power supply circuit 3 area in one piece, so that the heat from the processor 2 and the power supply circuit 3 can be efficiently transferred to this unified heatsink 5.

[0029] The key feature of heat dissipation component 4 is that a first cooling fan 6 and a second cooling fan 7 are mounted side-by-side on the heat sink 5, from... Figure 1 The layout of the two fans can be clearly seen in the image: The first cooling fan 6 is positioned directly opposite the first area where the Phytium D2000 / 8 processor 2 is located. The vertical airflow it generates can concentrate and efficiently blow through the heat sink fins below, quickly removing the core heat of the processor 2.

[0030] The second cooling fan 7 is positioned directly opposite the second area where the power supply circuit 3 is located. The airflow it generates is also concentrated on the heat sink 5 covering the power supply circuit 3, which is specifically responsible for cooling the power supply components such as MOSFETs and inductors, thereby ensuring that the processor 2 can still obtain a stable and reliable power supply under high load.

[0031] This zoned collaborative design enables targeted treatment of different heat sources, avoiding the predicament of neglecting one aspect while addressing another when using traditional single-fan cooling.

[0032] The first cooling fan 6 and the second cooling fan 7 are connected to the PCB motherboard 1 through a four-pin PWM fan interface, and the motherboard intelligently adjusts the speed according to the temperature of the domestic multi-core processor 2.

[0033] In addition, from Figure 1 As can be seen from the overall layout, the two SO-DIMM memory slots 8 on the PCB motherboard 1 are positioned downstream of the airflow path of the heat dissipation component 4, utilizing the mixed airflow generated by the first cooling fan 6 and the second cooling fan 7 to assist in cooling the memory modules. The PCB motherboard 1 also integrates M.2 MKey and M.2 EKey interfaces, which are located within the airflow coverage area of ​​the heat dissipation component 4; components such as the M.2 2280 solid-state drive slot and the M.2 2230 wireless network card slot are also located around the airflow channel formed by the dual-fan heat dissipation component 4. The powerful airflow generated by the two fans working together, after completing the cooling of the core area, diffuses outwards, forming an internal micro-circulation airflow covering most of the motherboard 1, effectively assisting in cooling the memory modules, solid-state drives, and other components, further improving the overall system stability.

[0034] In terms of interfaces, this module conforms to the open, pluggable standard, with an 80-pin JATEX 25-80Pin interface on one end for signal transmission and power supply. This interface is used to connect display devices, transmit video signals, USB signals, audio signals, serial data, and obtain power. The module also provides a rich set of external I / O interfaces, such as HDMI, DP, USB 3.0, and RJ45 network interfaces, to meet diverse usage needs.

[0035] In summary, this utility model effectively solves the heat dissipation problem of domestic high-performance OPS computer modules in a compact space by cleverly combining the integrated heat sink 5 with dual-fan regional heat dissipation, providing a reliable guarantee for the stable and efficient operation of information technology application innovation terminal equipment.

[0036] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A dual-fan cooling OPS computer module, characterized in that, include: A PCB motherboard (1); A domestically produced multi-core processor (2) is installed in the first area of ​​the PCB motherboard (1); A power supply circuit (3) is provided on the PCB motherboard (1) and adjacent to the domestic multi-core processor (2) for supplying power to the domestic multi-core processor (2). The power supply circuit (3) is located in the second area of ​​the PCB motherboard (1). And a heat dissipation assembly (4), the heat dissipation assembly (4) covering the first region and the second region, the heat dissipation assembly (4) comprising: An integrated heat sink (5); And a first cooling fan (6) and a second cooling fan (7) mounted side by side on the radiator (5); The airflow of the first cooling fan (6) is mainly used to cool the domestic multi-core processor (2) in the first area, and the airflow of the second cooling fan (7) is mainly used to cool the power supply circuit (3) in the second area, thereby realizing zoned active cooling.

2. The OPS computer module with dual-fan cooling according to claim 1, characterized in that: The domestically produced multi-core processor (2) is the Phytium D2000 series desktop processor.

3. The OPS computer module with dual-fan cooling according to claim 1, characterized in that: The power supply circuit (3) consists of multiple MOSFETs, inductors and capacitors. The second cooling fan (7) is positioned directly in the second area where the MOSFETs and inductors are located, so as to directly remove the heat generated by them.

4. The OPS computer module with dual-fan cooling according to claim 1, characterized in that: The integrated heat sink (5) is a single piece of extruded aluminum or copper material, with its bottom flatly contacting the domestic multi-core processor (2), and covering the power supply circuit (3) through its extended portion.

5. The OPS computer module with dual-fan cooling according to claim 1, characterized in that: The PCB motherboard (1) is also provided with at least one memory slot (8), which is located downstream of the airflow path of the heat dissipation component (4) to use the mixed airflow generated by the first heat dissipation fan (6) and the second heat dissipation fan (7) to assist in heat dissipation of the memory module.

6. The OPS computer module with dual-fan cooling according to claim 1, characterized in that: The first cooling fan (6) and the second cooling fan (7) are connected to the PCB motherboard (1) through a four-pin PWM fan interface, and the motherboard intelligently adjusts the speed according to the temperature of the domestic multi-core processor (2).

7. The OPS computer module with dual-fan cooling according to claim 1, characterized in that: The module conforms to the open pluggable specification, and one end of it is provided with an 80-pin JATEX 25-80Pin interface (9) for signal transmission and power supply.

8. The OPS computer module with dual-fan cooling according to claim 1, characterized in that: The PCB motherboard (1) also integrates an M.2MKey interface and an M.2EKey interface, which are located within the airflow coverage area of ​​the heat dissipation component (4).

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