High-thermal-conductivity notebook heat-pipe hinge device

Abstract

The utility model discloses a high heat conduction notebook heat pipe hinge device relates to heat pipe hinge technical field, including hinge component, fixed frame component and heat pipe component, one end of hinge component is connected and is installed with fixed frame component, heat pipe component horizontal penetration with the fixed frame component far away from the middle of hinge component one end. This high heat conduction notebook heat pipe hinge device, through the structural setting of heat pipe component, when notebook runs high load task, can rapidly conduct the heat of CPU, GPU etc. chip to radiating fin, then is discharged by fan, effectively prevented the performance decline or hardware damage due to overheating, through the structural setting of fixed frame component and hinge component, not only realized the stable connection and flexible rotation between notebook screen and fuselage, effectively promoted the heat dissipation of hinge part, and guarantee structure strength, can also ensure the overall high heat conduction and practicality.

Description

Technical Field

[0001] This utility model relates to the field of heat pipe hinge technology, specifically a high thermal conductivity laptop heat pipe hinge device. Background Technology

[0002] Laptop heat pipes are highly efficient heat-conducting components primarily used to quickly transfer heat generated by chips such as the CPU and GPU to the heatsink fins, which are then exhausted by the fan. Their core principle is based on phase change heat transfer, achieving efficient heat dissipation through the evaporation-condensation cycle of the internal working fluid.

[0003] The laptop heat pipe hinge device is an innovative heat dissipation structure that combines a heat pipe with a laptop hinge, mainly used to solve the heat dissipation bottleneck problem caused by space constraints in traditional laptops.

[0004] Conventional heat pipe hinge devices are often limited by the simplicity of their structural design, making it difficult to simultaneously achieve both heat dissipation efficiency and structural strength. Especially when laptops are running under high load for extended periods, traditional heat pipe hinges are prone to performance degradation due to overheating, and may even lead to hardware failure. Utility Model Content

[0005] The purpose of this invention is to provide a high thermal conductivity laptop heat pipe hinge device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high thermal conductivity notebook heat pipe hinge device, comprising a hinge component, a fixed frame component, and a heat pipe component. One end of the hinge component is connected to and installed with the fixed frame component. The heat pipe component horizontally passes through the middle of the fixed frame component at the end away from the hinge component. The heat pipe component includes a heat pipe body, a combination joint, a rotary joint, a deflection joint, and a mating joint. The left and right ends of the heat pipe body are provided with combination joints, and the end of the combination joint away from the heat pipe body is mated with a rotary joint. The end of the rotary joint away from the combination joint is connected with a deflection joint, and the end of the deflection joint away from the rotary joint is provided with a mating joint.

[0007] Furthermore, the hinge component includes a damping hinge body, a first mounting plate, a second mounting plate, and a thermally conductive coating. One end of the damping hinge body is connected to the first mounting plate, and the end of the damping hinge body away from the first mounting plate is connected to the second mounting plate. Moreover, the surfaces of the damping hinge body, the first mounting plate, and the second mounting plate are all coated with a thermally conductive coating.

[0008] Furthermore, the damping hinge body, the first assembly plate, and the second assembly plate are integrated into a single structure, and the thermally conductive coating is a graphene-based heat dissipation coating.

[0009] Furthermore, both ends of the first and second assembly plates are provided with holes for bolt installation. The hinge components and fixed frame components are movably connected and tightly fitted, and the hinge components are made of nickel-plated copper alloy.

[0010] Furthermore, the fixed frame component includes a connecting frame structure, a fixed corner plate structure, a stabilizing frame structure, and a heat-conducting pad. The fixed corner plate structure is connected to the side of the connecting frame structure near the heat-conducting pipe component, and a stabilizing frame structure is provided at the connection between the fixed corner plate structure and the connecting frame structure. Moreover, a heat-conducting pad is attached to the inner wall surface of the stabilizing frame structure.

[0011] Furthermore, the connecting frame structure, the fixed corner plate structure, and the stabilizing frame structure are integrated into one structure. The connecting frame structure has a slot structure and two sets of holes for bolt installation on one end surface near the second assembly plate. Both ends of the fixed corner plate structure have holes for bolt installation. The connecting frame structure, the fixed corner plate structure, and the stabilizing frame structure are made of high thermal conductivity.

[0012] Furthermore, the inner wall of the heat pipe body is made of sintered copper powder or a grooved capillary structure to enhance liquid reflux efficiency and reduce thermal resistance. The heat pipe body and the combination joint are integrally structured, and the combination joint and the rotary joint are threaded together.

[0013] Furthermore, the mating joint and the swivel joint are fixedly connected, and the mating joint adopts a quick-connect structure.

[0014] This utility model provides a high thermal conductivity laptop heat pipe hinge device, which has the following beneficial effects: 1. This utility model, through the structural design of the heat pipe component, utilizes sintered copper powder or a grooved capillary structure in the heat pipe body to effectively enhance liquid reflux efficiency and reduce thermal resistance, thereby ensuring the high efficiency and stability of the heat pipe body in the heat conduction process. This design allows the laptop to quickly conduct the heat generated by chips such as the CPU and GPU to the heat sink fins when running high-load tasks, and then exhaust it through the fan, effectively preventing performance degradation or hardware damage caused by overheating. Simultaneously, the design of the combination joints, rotary joints, directional joints, and butt joints in the heat pipe component makes the heat pipe installation and connection process more flexible and convenient. The threaded and fixed connections ensure both stability and ease of disassembly and replacement, improving maintainability and upgradeability. Furthermore, the modular design of the heat pipe components facilitates customized production based on different laptop models and cooling requirements, enhancing product versatility and market competitiveness. Additionally, the slotted structure on the end of the connecting frame near the second assembly plate significantly improves installation convenience. Technicians can directly insert the second assembly plate into the slot during assembly, using the bolt holes for quick fixation, effectively shortening assembly time, reducing operational difficulty, and ensuring the stability of the structural assembly.

[0015] 2. This utility model, through the structural arrangement of fixed frame components and hinge components, including the combination of a damping hinge body, a first assembly plate, a second assembly plate, and a thermally conductive coating, utilizes a damping hinge body. Combined with the design of the first and second assembly plates, this not only achieves a stable connection and flexible rotation between the laptop screen and the chassis, but also further enhances the device's heat dissipation performance through the thermally conductive coating. The use of this graphene-based heat dissipation coating allows the hinge component to effectively disperse heat to the surrounding environment while conducting heat, improving overall heat dissipation efficiency. The thermally conductive coating effectively enhances the heat dissipation performance of the hinge section. This design allows heat generated in the hinge area during frequent screen opening and closing to be promptly conducted away through the thermally conductive coating, preventing heat buildup in the hinge area, thus extending the hinge's lifespan and improving the overall heat dissipation of the laptop. In addition, the design of the connecting frame structure, fixed corner plate structure, stabilizing frame structure, and thermal pad in the fixed frame provides a stable mounting base for the heat pipe components. By utilizing the integrated design of the above structures and the application of thermal pads, the structural strength of the device is ensured, and the thermal conductivity of the thermal pads conducts heat from the heat pipe components to the fixed frame components, and then further dissipates it into the surrounding environment. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the main body of a high thermal conductivity notebook heat pipe hinge device according to the present invention; Figure 2 This is a schematic diagram of the hinge component structure of a high thermal conductivity notebook heat pipe hinge device according to this utility model; Figure 3 This is a three-dimensional structural diagram of the fixing frame component of a high thermal conductivity notebook heat pipe hinge device according to the present invention; Figure 4 This is a three-dimensional structural diagram of the heat pipe component of a high thermal conductivity notebook heat pipe hinge device according to this utility model.

[0017] In the diagram: 1. Hinge component; 101. Damping hinge body; 102. First assembly plate; 103. Second assembly plate; 104. Thermally conductive coating; 2. Fixing frame component; 201. Connecting frame structure; 202. Fixed corner plate structure; 203. Stabilizing frame structure; 204. Thermally conductive pad; 3. Thermal pipe component; 301. Heat pipe body; 302. Combined joint; 303. Rotary joint; 304. Deflecting joint; 305. Butt joint. Detailed Implementation

[0018] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0019] like Figures 1 to 4As shown, a high thermal conductivity laptop heat pipe hinge device includes a hinge component 1, a fixed frame component 2, and a heat pipe component 3. One end of the hinge component 1 is connected to and mounted with the fixed frame component 2. The heat pipe component 3 horizontally passes through the middle of the end of the fixed frame component 2 away from the hinge component 1. The heat pipe component 3 includes a heat pipe body 301, a combination joint 302, a rotary joint 303, a deflector joint 304, and a mating joint 305. Combination joints 302 are provided at both ends of the heat pipe body 301, and the end of the combination joint 302 away from the heat pipe body 301 is mated with the rotary joint 303. The end of the rotary joint 303 away from the combination joint 302 is connected to the deflector joint 304, and the end of the deflector joint 304 away from the rotary joint 303 is provided with the mating joint 305. The inner wall of the heat pipe body 301 is made of sintered copper. The powder or grooved capillary structure is used to enhance liquid reflux efficiency and reduce thermal resistance. The heat pipe body 301 and the combination joint 302 are integrated into one structure. The combination joint 302 and the rotary joint 303 are threaded together. The butt joint 305 and the diverter joint 304 are fixedly connected. The butt joint 305 adopts a quick-connect structure. The sintered copper powder or grooved capillary structure of the heat pipe body 301 effectively enhances the liquid reflux efficiency and reduces thermal resistance. The design of the combination joint 302, rotary joint 303, diverter joint 304 and butt joint 305 in the heat pipe component 3 makes the heat pipe more flexible and convenient during installation and connection. The threaded and fixed connections between these joints ensure the stability of the connection and facilitate disassembly and replacement when needed.

[0020] like Figures 1 to 4As shown, the hinge component 1 includes a damping hinge body 101, a first mounting plate 102, a second mounting plate 103, and a thermally conductive coating 104. One end of the damping hinge body 101 is connected to the first mounting plate 102, and the end of the damping hinge body 101 away from the first mounting plate 102 is connected to the second mounting plate 103. Furthermore, the surfaces of the damping hinge body 101, the first mounting plate 102, and the second mounting plate 103 are all coated with the thermally conductive coating 104. The components 3 are integrated into a single structure, and the thermally conductive coating 104 is a graphene-based heat dissipation coating. Both ends of the first assembly plate 102 and the second assembly plate 103 have holes for bolt installation. The hinge component 1 and the fixing frame component 2 are movably connected and tightly fitted. The hinge component 1 is made entirely of nickel-plated copper alloy. The fixing frame component 2 includes a connecting frame structure 201, a fixing corner plate structure 202, a stabilizing frame structure 203, and a thermally conductive pad 204. The connecting frame structure 201 is located near the heat-conducting pipe component 3. A fixed corner plate structure 202 is connected to the side, and a stabilizing frame structure 203 is provided at the connection between the fixed corner plate structure 202 and the connecting frame structure 201. A heat-conducting pad 204 is attached to the inner wall surface of the stabilizing frame structure 203. The connecting frame structure 201, the fixed corner plate structure 202, and the stabilizing frame structure 203 are integrated into one structure. The connecting frame structure 201 has a slot structure and two sets of holes for bolt installation on one end surface near the second assembly plate 103. Both ends of the fixed corner plate structure 202 have... It has a hole structure for bolt installation, and the connecting frame structure 201, the fixed corner plate structure 202, and the stabilizing frame structure 203 are made of high thermal conductivity structure. The hinge component 1 adopts a damping hinge body 101. With the design of the first assembly plate 102 and the second assembly plate 103, it not only realizes the stable connection and flexible rotation between the laptop screen and the body, but also further enhances the heat dissipation performance of the device through the setting of the thermal conductive coating 104. In addition, the fixed frame component 2 provides a stable installation base for the heat pipe component 3.

[0021] In summary, as Figures 1 to 4 As shown, when using this high thermal conductivity notebook heat pipe hinge device, the hinge component 1, the fixing frame component 2 and the heat pipe component 3 are first combined. The connecting frame structure 201 of the fixing frame component 2 of the hinge component 1 is inserted into the corresponding slot structure near the second assembly plate 103, and the connecting frame structure 201 is further tightened to the second assembly plate 103 by bolts to ensure that the fixing frame component 2 and the hinge component 1 are tightly connected. Meanwhile, the first assembly plate 102, the second assembly plate 103, and the fixed corner plate structure 202 are fixed to the corresponding positions of the laptop body and screen with bolts. The holes on their surfaces are used to achieve a stable installation. Then, the heat pipe component 3 is horizontally inserted through the middle of the fixed frame component 2 away from the hinge component 1, so that the combination joints 302 at both ends of the heat pipe body 301 are respectively connected to the rotary joints 303. The rotary joints 303 are then connected to the diverter joints 304. Finally, the docking joints 305 with quick connector structure are fixedly connected to the diverter joints 304 to complete the installation of the heat pipe component 3. The heat pipe component 3 is connected to the internal heat dissipation system of the laptop. During the operation of the laptop, the heat generated by the CPU, GPU and other chips is conducted to the heat pipe body 301. The sintered copper powder or grooved capillary structure on the inner wall of the heat pipe body 301 enhances the liquid return efficiency and reduces the thermal resistance, so that the heat can be conducted quickly. The thermally conductive coating 104 disperses the heat generated by the hinge component 1 to the surrounding environment, and the thermal pad 204 further dissipates the heat conducted by the heat pipe component 3. The heat is then discharged from the laptop by the fan, achieving efficient heat dissipation and ensuring the stable operation of the laptop.

[0022] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A high thermal conductivity notebook heat pipe hinge device, comprising a hinge component (1), a fixing frame component (2), and a heat pipe component (3), characterized in that: One end of the hinge component (1) is connected to a fixed structure component (2). The heat pipe component (3) is horizontally inserted through the middle of the fixed structure component (2) away from the hinge component (1). The heat pipe component (3) includes a heat pipe body (301), a combination joint (302), a rotary joint (303), a turning joint (304), and a docking joint (305). The left and right ends of the heat pipe body (301) are provided with combination joints (302), and the end of the combination joint (302) away from the heat pipe body (301) is connected to a rotary joint (303). The end of the rotary joint (303) away from the combination joint (302) is connected to a turning joint (304), and the end of the turning joint (304) away from the rotary joint (303) is provided with a docking joint (305).

2. The high thermal conductivity laptop heat pipe hinge device according to claim 1, characterized in that, The hinge component (1) includes a damping hinge body (101), a first mounting plate (102), a second mounting plate (103), and a thermally conductive coating (104). One end of the damping hinge body (101) is connected to the first mounting plate (102), and the end of the damping hinge body (101) away from the first mounting plate (102) is connected to the second mounting plate (103). Furthermore, the surfaces of the damping hinge body (101), the first mounting plate (102), and the second mounting plate (103) are all coated with a thermally conductive coating (104).

3. The high thermal conductivity laptop heat pipe hinge device according to claim 2, characterized in that, The damping hinge body (101), the first assembly plate (102), and the second assembly plate (103) are integrated into one structure, and the thermal conductive coating (104) is a graphene-based heat dissipation coating.

4. A high thermal conductivity notebook heat pipe hinge device according to claim 2, characterized in that, Both ends of the first assembly plate (102) and the second assembly plate (103) are provided with holes for bolt installation. The hinge component (1) and the fixed frame component (2) are movably connected and tightly fitted. The hinge component (1) is made of nickel-plated copper alloy.

5. A high thermal conductivity notebook heat pipe hinge device according to claim 1, characterized in that, The fixed frame component (2) includes a connecting frame structure (201), a fixed corner plate structure (202), a stabilizing frame structure (203), and a heat-conducting pad (204). The connecting frame structure (201) is connected to the fixed corner plate structure (202) on the side near the heat-conducting pipe component (3), and a stabilizing frame structure (203) is provided at the connection between the fixed corner plate structure (202) and the connecting frame structure (201). The inner wall surface of the stabilizing frame structure (203) is covered with a heat-conducting pad (204).

6. A high thermal conductivity notebook heat pipe hinge device according to claim 5, characterized in that, The connecting frame structure (201), the fixed corner plate structure (202), and the stabilizing frame structure (203) are integrated into one structure. The connecting frame structure (201) has a slot structure and two sets of holes for bolt installation on one end surface near the second assembly plate (103). The fixed corner plate structure (202) has holes for bolt installation at both ends. The connecting frame structure (201), the fixed corner plate structure (202), and the stabilizing frame structure (203) are made of high thermal conductivity.

7. A high thermal conductivity notebook heat pipe hinge device according to claim 1, characterized in that, The inner wall of the heat pipe body (301) is made of sintered copper powder or grooved capillary structure to enhance liquid reflux efficiency and reduce thermal resistance. The heat pipe body (301) and the combination joint (302) are integrated into one structure, and the combination joint (302) and the rotary joint (303) are threaded together.

8. A high thermal conductivity laptop heat pipe hinge device according to claim 1, characterized in that, The docking joint (305) and the swivel joint (304) are fixedly connected, and the docking joint (305) adopts a quick-connect structure.

Images