Intelligent card with built-in graphic information

Abstract

The utility model provides a kind of built-in graphic information smart card, including chip layer and respectively setting first printing layer and second printing layer on the opposite two sides of chip layer, smart card further includes graphic substrate layer, graphic substrate layer is set between first printing layer and chip layer and / or between second printing layer and chip layer;The pattern of graphic substrate layer is formed by cutting, and graphic substrate layer is connected and fixed by hot pressing with chip layer;The light transmittance of first printing layer and / or second printing layer is better than the light transmittance of graphic substrate layer.The built-in graphic information smart card preparation process is simple, production cost is low, material source is extensive, without using special material can be prepared, and different types of graphic substrate layer can be customized according to user needs.

Description

Technical Field

[0001] This utility model relates to the field of smart card manufacturing, specifically to a smart card with built-in graphic and textual information. Background Technology

[0002] Most card personalization features on the market are based on surface-level displays. Cards with internal personalization are still relatively rare. However, surface-level personalization wears off over time, causing the personalization to disappear. Currently, achieving internal card personalization is often complex and technically challenging. Therefore, it is essential to invent a smart card with a simple manufacturing process and good display quality that integrates graphic and textual information. Utility Model Content

[0003] The purpose of this invention is to provide a smart card with built-in graphic information to solve the problems of short lifespan of external graphic information and complex manufacturing process of built-in graphic information in existing cards.

[0004] To achieve the above objectives, this utility model provides a smart card with built-in graphic information, including a chip layer and a first printing layer and a second printing layer respectively disposed on opposite sides of the chip layer. The smart card also includes a graphic substrate layer, which is disposed between the first printing layer and the chip layer and / or between the second printing layer and the chip layer. The pattern of the graphic substrate layer is formed by cutting, and the graphic substrate layer is connected and fixed to the chip layer by hot pressing. The light transmittance of the first printing layer and / or the second printing layer is better than that of the graphic substrate layer.

[0005] As can be seen from the above scheme, the smart card of this utility model utilizes an image substrate layer to display personalized content. The image substrate layer is located between the printed layer and the chip layer, and does not directly contact the outside. The image substrate layer is cut to form a pattern, and the pattern forming process is simple. The image substrate layer can be fixedly connected to the chip layer by thermoforming, which is a common and mature process in existing smart card manufacturing. The thermoforming method ensures the stability of the image substrate layer's position, preventing displacement during manufacturing and ensuring the uniformity of mass-produced smart cards, thus improving manufacturing quality. This utility model utilizes the difference in light transmittance between different layers. The printed layer is transparent or light-colored, allowing more optical fiber to pass through, while the image substrate layer is dark-colored, thereby achieving better display of the image and text information on the image substrate layer.

[0006] A further option is to prepare the graphic substrate layer from one of PVC, PC, or PET.

[0007] As can be seen from the above scheme, the above materials are widely available, low in cost, and suitable for hot pressing.

[0008] A further approach is to package the chip and antenna within the chip layer.

[0009] As can be seen from the above scheme, the chip layer achieves seamless integration of communication and functional assurance through the integrated design of the chip and antenna. This structure directly encapsulates the microelectronic chip and built-in antenna within the card base, eliminating the need for external connecting wires. This ensures both the stability of data transmission and enables contactless communication. The chip is responsible for data storage, encryption operations, and logic control, while the antenna is matched to a specific frequency through a resonant circuit to ensure efficient energy coupling and signal interaction with the card reader.

[0010] A further approach is to make the chip layer more transparent than the image substrate layer.

[0011] As can be seen from the above scheme, the light transmittance of the chip layer is better than that of the image substrate layer, further highlighting the image effect of the image substrate layer.

[0012] A further embodiment is that the image substrate layer is disposed between the first printed layer and the chip layer, and the image substrate layer and the first printed layer are fixedly connected by thermoforming; and / or the image substrate layer is disposed between the second printed layer and the chip layer, and the image substrate layer and the second printed layer are fixedly connected by thermoforming.

[0013] As can be seen from the above scheme, the graphic substrate layer and the printing layer are also fixedly connected by hot pressing. The process is mature and the preparation is simple.

[0014] A further embodiment is that a first protective film layer is provided on the side of the first printed layer away from the chip layer; and a second protective film layer is provided on the side of the second printed layer away from the chip layer.

[0015] As can be seen from the above scheme, the protective film layer improves the service life of the smart card.

[0016] A further approach is to have the first protective film layer and / or the second protective film layer have better light transmittance than the image substrate layer.

[0017] As can be seen from the above scheme, the light transmittance of the protective film layer is better than that of the graphic substrate, which ensures the display effect of the graphic substrate.

[0018] A further option is that the first protective film and the first printed layer are fixedly connected by heat pressing; the second protective film and the second printed layer are fixedly connected by heat pressing.

[0019] As can be seen from the above scheme, the protective film and the printed layer are also connected by hot pressing, which can be carried out simultaneously with the hot pressing of the printed layer and the graphic substrate layer, saving steps and making the process simpler and more efficient.

[0020] A further embodiment is that the smart card includes, from top to bottom, a first protective film layer, a first printed layer, a graphic substrate layer, a chip layer, a second printed layer, and a second protective film layer.

[0021] As can be seen from the above scheme, excellent graphic effects can be presented by including only one graphic substrate layer.

[0022] A further embodiment is that the image substrate layer includes a first image substrate layer and a second image substrate layer; the smart card includes a first protective film layer, a first printing layer, a first image substrate layer, a chip layer, a second image substrate layer, a second printing layer, and a second protective film layer arranged sequentially from top to bottom; wherein the first image substrate layer and the second image substrate layer are arranged symmetrically about the length direction of the chip layer.

[0023] As can be seen from the above scheme, it includes two symmetrically arranged image and text substrate layers, which makes the image and text presentation effect better. Attached Figure Description

[0024] Figure 1 This is a structural schematic diagram of the first embodiment of the present invention.

[0025] Figure 2 This is an exploded cross-sectional view of the first embodiment of this utility model.

[0026] Figure 3 This is an exploded cross-sectional view of the second embodiment of this utility model.

[0027] The present invention will be further described below with reference to specific embodiments. Detailed Implementation

[0028] First Embodiment See Figure 1 and Figure 2 The smart card with built-in graphic information provided in this embodiment includes a first protective film layer 11, a first printing layer 12, a graphic substrate layer 13, a chip layer 14, a second printing layer 15, and a second protective film layer 16 arranged sequentially from top to bottom.

[0029] The pattern of the graphic substrate layer 13 is formed by cutting, and the graphic substrate layer 13 is connected and fixed to the chip layer 14 by hot pressing.

[0030] The light transmittance of the first protective film layer 11, the first printed layer 12, the chip layer 14, the second printed layer 15, and the second protective film layer 16 is better than that of the image substrate layer 13. Specifically, when using the card, the user can clearly see the pattern on the image substrate 13 through the first protective film layer 11 and the second printed layer 12. Preferably, the chip layer 14, the second printed layer 15, and the second protective film layer 16 will not affect the user's observation of the image substrate 13. Patterns can be printed on the first printed layer 12, but the patterns printed on the first printed layer 12 are required to be lighter in color to ensure the light transmittance of the first printed layer 12. Patterns can also be printed on the image substrate layer 13, but darker in color than the pattern on the first printed layer 12, to ensure its display effect. Furthermore, anti-counterfeiting patterns can also be printed to increase the anti-counterfeiting effect of the smart card.

[0031] Preferably, the first protective film layer 11, the first printed layer 12, the chip layer 14, the second printed layer 15, and the second protective film layer 16 are all transparent layers.

[0032] Preferably, the graphic substrate layer 13 is prepared from one of PVC, PC, and PET.

[0033] Chip 141 and antenna 142 are packaged within chip layer 14.

[0034] The method for preparing a smart card with built-in graphic information in this embodiment includes: S1: According to design requirements, cut the graphic substrate layer 13 to the required shape, and further print patterns and information as needed; S2: The graphic substrate layer 13 and the chip layer 14 are preheated and pressed at a temperature of 150℃~153℃ for 15min~25min, followed by cold pressing for 20min~25min to obtain the sandwich substrate. S3: The first protective film layer 11, the first printed layer 12, the interlayer substrate, the second printed layer 15, and the second protective film layer 16 are arranged and bound in sequence and then hot-pressed. The hot-pressing temperature is 130℃~150℃ and the hot-pressing time is 20min~25min. Then, cold-pressing is performed for 20min~25min to obtain a semi-finished smart card. Patterns and information can be pre-printed on the first printed layer 12 and the second printed layer 15. S4: Cut and trim the semi-finished smart card to obtain the smart card with built-in graphic information in this embodiment.

[0035] Second Embodiment See Figure 3The difference between this embodiment and the first embodiment is that the image substrate layer of the smart card with built-in image and text information in this embodiment includes a first image substrate layer 23 and a second image substrate layer 25; the smart card includes, from top to bottom, a first protective film layer 21, a first printing layer 22, a first image substrate layer 23, a chip layer 24, a second image substrate layer 25, a second printing layer 26, and a second protective film layer 27. The first image substrate layer 23 and the second image substrate layer 25 are symmetrically arranged about the length direction of the chip layer 24.

[0036] The patterns of the first graphic substrate layer 23 and the second graphic substrate layer 25 are formed by cutting, and the first graphic substrate layer 23 and the second graphic substrate layer 25 are completely overlapped when stacked. The first graphic substrate layer 23 and the second graphic substrate layer 25 are connected and fixed to the chip layer 24 by hot pressing.

[0037] The light transmittance of the first protective film layer 21, the first printed layer 22, the chip layer 24, the second printed layer 26, and the second protective film layer 27 is better than that of the first graphic substrate layer 23 and the second graphic substrate layer 26. Patterns can be printed on the first printed layer 22 and the second printed layer 26, but the patterns printed on the first printed layer 22 and the second printed layer 26 must be light-colored to ensure the light transmittance of the first printed layer 22 and the second printed layer 26. Patterns can also be printed on the first graphic substrate layer 23 and the second graphic substrate layer 26, but the printed patterns must be darker than the colors of the patterns on the first printed layer 22 and the second printed layer 26 to ensure their display effect. Furthermore, anti-counterfeiting patterns can also be printed to increase the anti-counterfeiting effect of the smart card.

[0038] Preferably, the first protective film layer 21, the first printed layer 22, the chip layer 24, the second printed layer 26, and the second protective film layer 27 are all transparent layers.

[0039] Preferably, the first graphic substrate layer 23 and the second graphic substrate layer 25 are prepared from one of PVC, PC and PET, respectively.

[0040] Chip 241 and antenna 242 are packaged within chip layer 24.

[0041] The method for preparing a smart card with built-in graphic information in this embodiment includes: S1: According to design requirements, the first graphic substrate layer 23 and the second graphic substrate layer 25 are shaped as needed, and patterns and information can be further printed as needed; S2: The first graphic substrate layer 23, the second graphic substrate layer 25 and the chip layer 24 are preheated and pressed at a temperature of 150℃~153℃ for 15min~25min, followed by cold pressing for 20min~25min to obtain the sandwich substrate. S3: The first protective film layer 21, the first printed layer 22, the interlayer substrate, the second printed layer 26, and the second protective film layer 27 are arranged and bound in sequence and then hot-pressed. The hot-pressing temperature is 130℃~150℃ and the hot-pressing time is 20min~25min. Then, cold-pressing is performed for 20min~25min to obtain a semi-finished smart card. Patterns and information can be pre-printed on the first printed layer 22 and the second printed layer 26. S4: Cut and trim the semi-finished smart card to obtain the smart card with built-in graphic information in this embodiment.

[0042] The smart card manufacturing process with built-in graphic information in the above two embodiments is simple, has low production cost, and uses widely available materials. It can be manufactured without the use of special materials. Different types of graphic substrate layers can be customized according to user needs. In addition to displaying graphic effects, the graphic substrate layer can also be further printed with anti-counterfeiting patterns to increase the anti-counterfeiting effect.

[0043] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A smart card with built-in graphic information, comprising a chip layer and a first printed layer and a second printed layer respectively disposed on opposite sides of the chip layer, characterized in that: The smart card further includes a graphic substrate layer, which is disposed between the first printed layer and the chip layer and / or between the second printed layer and the chip layer; The pattern of the graphic substrate layer is formed by cutting, and the graphic substrate layer is connected and fixed to the chip layer by hot pressing. The light transmittance of the first printed layer and / or the second printed layer is better than that of the graphic substrate layer.

2. A smart card with built-in graphic information as described in claim 1, characterized in that: The graphic substrate layer is prepared from one of PVC, PC, and PET.

3. A smart card with built-in graphic information as described in claim 1, characterized in that: The chip layer contains a chip and an antenna.

4. A smart card with built-in graphic information as described in claim 1, characterized in that: The light transmittance of the chip layer is better than that of the graphic substrate layer.

5. A smart card with built-in graphic information as described in claim 1, characterized in that: The graphic substrate layer is disposed between the first printed layer and the chip layer, and the graphic substrate layer and the first printed layer are fixedly connected by thermo-pressing. And / or the graphic substrate layer is disposed between the second printed layer and the chip layer, and the graphic substrate layer and the second printed layer are fixedly connected by thermoforming.

6. A smart card with built-in graphic information as described in any one of claims 1 to 5, characterized in that: A first protective film layer is provided on the side of the first printed layer away from the chip layer; A second protective film layer is provided on the side of the second printed layer away from the chip layer.

7. A smart card with built-in graphic information as described in claim 6, characterized in that: The light transmittance of the first protective film layer and / or the second protective film layer is better than that of the graphic substrate layer.

8. A smart card with built-in graphic information as described in claim 6, characterized in that: The first protective film and the first printed layer are fixedly connected by heat pressing; The second protective film and the second printed layer are fixedly connected by heat pressing.

9. A smart card with built-in graphic information as described in claim 6, characterized in that: The smart card includes, from top to bottom, a first protective film layer, a first printed layer, a graphic substrate layer, a chip layer, a second printed layer, and a second protective film layer.

10. A smart card with built-in graphic information as described in claim 6, characterized in that: The image substrate layer includes a first image substrate layer and a second image substrate layer; The smart card includes, from top to bottom, a first protective film layer, a first printing layer, a first graphic substrate layer, a chip layer, a second graphic substrate layer, a second printing layer, and a second protective film layer; The first image substrate layer and the second image substrate layer are arranged symmetrically about the length direction of the chip layer.

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