A high modulus supported folding screen support structure

Abstract

The application provides a high-modulus supported folding screen support structure, and belongs to the technical field of flexible folding screen terminal accessories. The high-modulus supported folding screen support structure comprises a support layer and a buffer layer; the support layer serves as a bearing structure of a support piece; the buffer layer comprises an alloy layer and a double-sided adhesive, and the alloy layer is attached to the double-sided adhesive. The traditional PI adhesive layer structure is abandoned, a hard alloy layer and a double-sided OCA adhesive are combined to form a composite buffer layer, a support layer with a grid stress release area is combined, the characteristics of high modulus, high flatness and strong resilience of the hard alloy are utilized, and multiple requirements such as rigid support, bending adaptation, appearance flatness, buffer protection and the like are met.

Description

Technical Field

[0001] This application relates to the field of flexible foldable screen terminal accessories, and more specifically, to a high-modulus support structure for foldable screens. Background Technology

[0002] Currently, as foldable screen phones gradually become mainstream mobile terminals, their advantages in visual experience and usage form brought by foldable large screens are widely recognized by the market. To achieve stable and reliable folding performance, flexible screens rely on the coordinated operation of multiple layers of structures, among which the flexible screen support component is the core load-bearing component, mainly used to provide effective support for the flexible screen body;

[0003] In existing technologies, a layer of PI adhesive is usually applied to the surface of the flexible screen support component to provide support for the screen during folding, relieve bending stress, improve the bending performance of the large screen, and thus enhance the overall durability and flatness of the foldable screen after unfolding.

[0004] The existing technical solutions mentioned above have the following drawbacks: conventional PI adhesive generally has a low modulus. When used as a support material, it has the defects of insufficient structural support performance and weak resistance to deformation. After repeated bending, it is easy to cause obvious creases on the screen, making it difficult to guarantee the flatness and display effect of the foldable screen after long-term use, and failing to meet the use requirements of high-end foldable screen products for appearance and reliability. Utility Model Content

[0005] To overcome the above shortcomings, this application provides a high-modulus support structure for foldable screens, which aims to improve the problems of insufficient support performance, easy crease formation, and poor flatness in existing flexible screen support structures.

[0006] This application provides a high-modulus support structure for a foldable screen, including a support layer and a buffer layer;

[0007] The support layer serves as the load-bearing structure of the support component; the buffer layer includes an alloy layer and a double-sided adhesive, with the alloy layer and the double-sided adhesive being bonded together.

[0008] Traditionally, large-area perforations are required to achieve bending, but these perforations directly weaken the overall rigidity and load-bearing capacity of the metal layer, making it prone to localized collapse and deformation under pressure during use, failing to balance support strength and bending performance. Therefore, this application uses high-modulus rigid materials such as titanium alloy, stainless steel, and carbon fiber for the bottom support layer, which independently undertakes the core functions of load-bearing, pressure resistance, and anti-collapse, ensuring the structural stability of the screen during daily use. The bending area of ​​the support layer features a perforated grid to specifically release bending stress, ensuring smooth bending. The upper hard alloy buffer layer focuses on rebound, surface shielding, and auxiliary support. These three layers function independently, preserving the excellent bending adaptability of the perforated structure while avoiding the weakening of overall support strength by perforations.

[0009] The support layer features a perforated grid to release stress, while a hard alloy layer is bonded to the grid area. The hard alloy is formed by chemical etching, resulting in a highly flat and dense surface that completely covers the grid outline below. The grid texture cannot be transmitted upwards to the flexible screen, eliminating defects such as mold marks and indentations, and ensuring a clean display effect and a complete and beautiful appearance.

[0010] In a preferred embodiment of this utility model, the area of ​​the foldable screen of the support layer is provided with a grid area for the support member to bend synchronously with the screen, and the alloy layer is disposed in the grid area; for releasing bending stress and allowing the support member to bend synchronously with the screen.

[0011] In a preferred embodiment of this invention, the thickness of the buffer layer is 60-70 μm.

[0012] In a preferred embodiment of this utility model, the double-sided adhesive is provided in two sets, and the two sets of double-sided adhesive are respectively attached to the front and back sides of the alloy layer.

[0013] In a preferred embodiment of this invention, the alloy layer is a hard alloy, possessing high modulus, high flatness, and self-rebound properties upon bending. It abandons the traditional PI adhesive layer, employing high-modulus hard alloys such as SUS, titanium alloys, and liquid metals as the core buffer matrix, whose elastic modulus is far superior to PI material. After hundreds of thousands of repeated bending cycles of the foldable screen, the alloy layer will not undergo permanent plastic deformation and can automatically spring back to a flat state after bending, preventing screen warping and bulging, reducing the risk of stress aging in the flexible screen, and significantly improving the service life of the support structure and the entire foldable screen.

[0014] In a preferred embodiment of the present invention, the alloy layer is made of at least one of SUS, titanium alloy and liquid metal, and the thickness of the alloy layer is 15-25 μm.

[0015] In a preferred embodiment of this invention, the double-sided adhesive has a thickness of 22-27 μm and is made of OCA optical adhesive. The use of double-sided OCA optical adhesive to form upper and lower buffer bonding layers differs from the simple bonding structure of traditional single-layer PI adhesive. This effectively absorbs the impact and vibration generated by drops, bumps, and pressure, weakening the direct effect of external forces on the flexible display screen, reducing the probability of screen breakage and pixel damage, and enhancing screen protection capabilities.

[0016] In a preferred embodiment of this utility model, the buffer layer is fixedly attached to the upper surface of the support layer, and a flexible display screen is fixed to the upper surface of the buffer layer.

[0017] In a preferred embodiment of this utility model, the buffer layer and the support layer are stacked together to form an integral composite structure, with the layers fixedly positioned relative to each other.

[0018] In a preferred embodiment of this utility model, the alloy layer is integrally formed by chemical etching process, and then bonded and assembled with the double-sided adhesive after forming; after the overall assembly is completed, the shape is trimmed by laser cutting process so that the shape and size of the buffer layer are completely matched with the support layer.

[0019] In a preferred embodiment of this utility model, the perforated grid in the grid area is any one of regular hexagon, rectangle or rhombus, the grid is evenly arrayed, and the perforation rate of the grid is 30% to 50%.

[0020] In a preferred embodiment of this utility model, the OCA double-sided adhesive has anti-aging and high and low temperature resistance properties, with a working temperature range of -20℃ to 70℃, and no delamination or overflow phenomenon after long-term use.

[0021] In a preferred embodiment of this invention, the support layer is made of any one of the high-modulus rigid materials selected from titanium alloy, stainless steel, and carbon fiber composite materials.

[0022] Beneficial effects:

[0023] 1. Abandoning the traditional PI adhesive layer structure, a composite buffer layer composed of a hard alloy layer and double-sided OCA colloid is adopted, combined with a support layer with a grid stress release zone. Utilizing the high modulus, high flatness, and strong resilience of hard alloy, it takes into account multiple requirements such as rigid support, bending adaptation, flat appearance, and buffer protection, and is suitable for the high-frequency repeated bending usage scenarios of foldable screen phones.

[0024] 2. Due to its high hardness, cemented carbide provides strong support, making mold marks invisible on the assembled support components. Furthermore, its higher modulus compared to polypropylene (PI) allows it to spring back automatically after repeated bending, returning to a flat state. It serves to support and protect the screen of foldable phones, while also meeting the requirements of repeated screen bending. The support layer and buffer layer work together to balance high modulus support strength with bending adaptability. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a cross-sectional schematic diagram of the high-modulus support structure for foldable screens provided in the embodiments of this application;

[0027] Figure 2 This is a schematic diagram of the cross-sectional structure of a flexible display screen provided in an embodiment of this application.

[0028] In the diagram: 100, alloy layer; 200, double-sided colloid; 300, flexible display screen. Detailed Implementation

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0030] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0031] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0032] Please see Figures 1-2 This utility model provides a high-modulus support structure for foldable screens, including a support layer and a buffer layer;

[0033] In this embodiment, the support layer, as the core load-bearing structure of the support component, is made using existing conventional technology. Its specific material is not specially limited. High modulus rigid materials, including but not limited to titanium alloys, stainless steel, carbon fiber composite materials, etc., can be selected according to actual usage requirements. The above materials ensure that the support layer has sufficient structural strength and modulus to achieve stable support for the foldable screen and avoid deformation and collapse during screen use.

[0034] The support layer serves as the load-bearing structure of the support component; the buffer layer includes an alloy layer 100 and a double-sided adhesive 200, with the alloy layer 100 bonded to the double-sided adhesive 200. By replacing the traditional PI adhesive layer with a hard alloy layer 100, combined with a hollowed-out mesh stress-relieving structure and a double-sided OCA adhesive buffer bonding structure, it works collaboratively in five dimensions: load-bearing support, bending adaptation, rebound reset, buffering and shock absorption, and appearance shielding, adapting to all operating conditions of foldable screen phones.

[0035] In a specific embodiment of this utility model, the area of ​​the foldable screen phone screen in the support layer is provided with a grid area for the support component to bend synchronously with the screen. The alloy layer 100 is disposed in the grid area; it is used to release bending stress and allow the support component to bend synchronously with the screen. The support layer bending area is provided with an array of hollowed-out grids, which can effectively release bending stress and prevent the support layer and buffer layer from cracking or breaking due to stress concentration; the grid structure is flexible in deformation, and the support component can bend smoothly synchronously with the screen, perfectly adapting to the opening and closing action of the foldable screen, with excellent bending adaptability.

[0036] In this embodiment, in order to enable the support component to match the screen bending action of the foldable screen phone, a grid area is provided on the support layer corresponding to the bending trajectory of the foldable screen phone screen. This grid area adopts a hollow grid structure design, which releases the stress generated during the bending process through the deformation space of the grid. This does not affect the overall support performance of the support layer, and ensures that the support component can follow the screen to complete multiple repeated bending actions, thereby improving the compatibility between the support component and the foldable screen phone.

[0037] In a specific embodiment of this utility model, the thickness of the buffer layer is 60-70 μm.

[0038] In a specific embodiment of this utility model, the double-sided adhesive 200 is provided in two sets, and the two sets of double-sided adhesive 200 are respectively attached to the front and back sides of the alloy layer 100.

[0039] In a specific embodiment of this utility model, the alloy layer 100 is a hard alloy, which has high modulus, high flatness and bending springback characteristics.

[0040] In this embodiment, the PI adhesive layer is replaced by an alloy layer 100 as the buffer layer. The alloy layer 100 can be made of materials such as SUS, titanium alloy, or liquid metal, which have high elastic modulus and certain support properties. The surface of the foldable screen using the alloy layer 100 is smoother than that using PI, completely concealing the grid structure molding in the bending area.

[0041] In a specific embodiment of this utility model, the alloy layer 100 is made of at least one of SUS, titanium alloy, and liquid metal, and the thickness of the alloy layer 100 is 15-25 μm. The double-sided adhesive 200 has a thickness of 22-27 μm and is made of OCA optical adhesive.

[0042] The alloy layer is limited to a thickness of 15μm to 25μm, the single piece of OCA colloid is 22μm to 27μm, and the overall thickness of the buffer layer is controlled within 60μm to 70μm, with precise and controllable thickness parameters. This meets the requirements of the overall thin and light design of foldable screen phones, reducing bending resistance and improving the bending feel, while ensuring that each functional layer has sufficient structural strength and will not fail due to excessive thickness.

[0043] In a specific embodiment of this utility model, the buffer layer is fixedly attached to the upper surface of the support layer, and a flexible display screen 300 is fixed to the upper surface of the buffer layer.

[0044] In a specific embodiment of this utility model, the buffer layer and the support layer are stacked as an integral composite structure, with the layers fixedly positioned relative to each other. The support layer and the buffer layer are bonded together as an integral composite structure. Combined with a high and low temperature resistant OCA colloid, it can work stably in a wide temperature range of -20℃ to 70℃. Under long-term repeated bending and alternating hot and cold environments, it will not experience delamination, debonding, slippage, or other failures. The overall structural integrity and environmental adaptability are significantly better than traditional stacked structures.

[0045] In a specific embodiment of this utility model, the alloy layer 100 is integrally formed by chemical etching process, and then bonded and assembled with the double-sided adhesive 200 after forming; after the overall assembly is completed, the shape is trimmed by laser cutting process so that the shape and size of the buffer layer are completely matched with the support layer.

[0046] In a specific embodiment of this utility model, the hollowed-out grid in the grid area is any one of regular hexagon, rectangle or rhombus, the grid is evenly arrayed, and the grid hollowing rate is 30% to 50%.

[0047] In a specific embodiment of this utility model, the OCA double-sided adhesive 200 has anti-aging and high and low temperature resistance properties, and its working temperature range is -20℃ to 70℃. It does not delaminate or overflow after long-term use.

[0048] In a specific embodiment of this utility model, the support layer is made of any one of the high-modulus rigid materials selected from titanium alloy, stainless steel, and carbon fiber composite materials.

[0049] In this embodiment, the alloy layer 100 is formed by chemical etching. After forming, double-sided adhesive 200 material is bonded to both sides of the alloy layer 100. After this step, the entire material is bonded to the upper surface of the support layer. After bonding, laser cutting is performed to make the size and shape of the buffer layer correspond to the support layer. This buffers the force between the screen and the support layer, reduces bending and impacts and vibrations during use, further protects the foldable screen, and improves the stability and lifespan of the foldable screen.

[0050] The alloy layer 100 is formed by chemical etching and the whole is cut and trimmed by laser. It has high processing precision and good dimensional consistency. It can be precisely matched with the support layer and flexible screen, reducing the difficulty of mass production assembly, improving the production yield, and controlling the production and manufacturing costs.

[0051] The alloy layer 100 can be flexibly selected from a variety of materials such as SUS stainless steel, titanium alloy, and liquid metal. The support layer can also be selected from materials such as stainless steel, carbon fiber, and titanium alloy according to the product positioning. It can be adapted to high-end and mid-range inward and outward folding screen phones with different positioning, and the product has a high degree of universality.

[0052] The support layer focuses on rigid load bearing, while the alloy buffer layer focuses on bending resilience, appearance shielding, and buffer protection. The two layers complement each other and work together to meet the five core requirements of strong support, easy bending, high resilience, no mold marks, and impact resistance. The overall performance surpasses that of traditional PI-based support structures.

[0053] The working principle of this high-modulus supported foldable screen support structure:

[0054] As the core load-bearing matrix of the entire support structure, the support layer is made of high-modulus rigid materials such as titanium alloy, stainless steel, and carbon fiber, possessing excellent structural strength and resistance to deformation. After assembly, the support layer is located at the bottom layer, bearing the entire load of the flexible display screen 300 and the buffer layer. It can effectively resist the external forces generated by user pressing and gripping, preventing the flexible screen from collapsing or denting from the bottom, and providing stable rigid support for the screen.

[0055] The support layer features a perforated grid area corresponding to the bending trajectory of the foldable screen, with the grid employing an array-style perforation design. When the foldable phone completes its opening and closing motion, the bending area of ​​the support layer deforms synchronously with the screen. The perforated grid allows for deformation space, promptly releasing internal stress generated during bending and preventing the support layer from cracking or breaking due to stress concentration. At the same time, the flexible deformation characteristics of the grid area ensure that the entire support layer can smoothly bend along with the screen without hindering the folding action.

[0056] The alloy layer 100 is positioned directly above the grid area of ​​the support layer. The hard alloy itself has high hardness and an extremely smooth surface, which can completely cover the hollow grid outline of the support layer below, blocking the grid texture from being transmitted upward to the flexible screen and eliminating grid molding defects on the screen surface from the root.

[0057] Meanwhile, the elastic modulus of hard alloy is much higher than that of traditional PI material. During repeated bending of the screen, the alloy layer 100 bends synchronously with the grid area. When the foldable screen is unfolded and reset, it generates elastic recovery force by relying on its own high modulus mechanical properties, and automatically rebounds to a completely flat state without plastic permanent deformation, ensuring that the screen always remains flat after unfolding, avoiding edge warping and arching problems.

[0058] The alloy layer 100 is bonded to both sides with double-sided adhesive 200, forming a sandwich structure. The lower OCA adhesive layer ensures a tight bond between the alloy layer 100 and the support layer, while the upper OCA adhesive layer ensures a firm bond between the alloy layer 100 and the flexible display screen 300. The three-layer structure forms an integrated composite whole, preventing interlayer slippage and delamination. The OCA adhesive itself has flexible cushioning properties. When the phone is dropped, bumped, or subjected to localized pressure, the adhesive can absorb and dissipate the impact load and vibration energy, preventing external forces from directly impacting the flexible screen and providing cushioning protection. The thickness of the two sets of OCA adhesives is controlled between 22μm and 27μm, combined with the 15μm to 25μm thick alloy layer 100, so that the overall thickness of the buffer layer is precisely controlled between 60μm and 70μm. The thickness is uniform, the bending resistance is low, and the design is both thin and light, while maintaining structural strength.

[0059] The alloy layer 100 is formed by chemical etching process, which has high processing precision, no burrs on the surface and excellent flatness. After the alloy layer 100 is bonded and assembled with the double-sided adhesive 200, the overall shape is trimmed by laser cutting, which can ensure that the dimensions of the buffer layer, the support layer and the screen are accurately matched and the mass production assembly is highly consistent.

[0060] The integrated composite structure, combined with high and low temperature resistant OCA colloid, ensures that the interlayer bonding strength remains stable under the daily high and low temperature environment of mobile phones and the repeated bending conditions of hundreds of thousands of times, without delamination, delamination, or glue overflow. The alloy layer 100 has minimal deformation after tens of thousands of bending cycles, and its mechanical properties do not show significant attenuation, ensuring the long-term stable operation of the support structure.

[0061] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

Claims

1. A high-modulus support structure for foldable screens, characterized in that, include A support layer, which serves as the load-bearing structure of the support member; A buffer layer comprising an alloy layer (100) and a double-sided adhesive (200), wherein the alloy layer (100) is bonded to the double-sided adhesive (200).

2. The high-modulus support structure for a foldable screen according to claim 1, characterized in that, The support layer has a grid area in the area corresponding to the foldable screen of the mobile phone, which allows the support to bend synchronously with the screen. The alloy layer (100) is disposed in the grid area to release bending stress and allow the support to bend synchronously with the screen.

3. The high-modulus support structure for a foldable screen according to claim 1, characterized in that, The thickness of the buffer layer is 60-70 μm.

4. The high-modulus support structure for a foldable screen according to claim 1, characterized in that, The double-sided adhesive (200) is provided in two sets, and the two sets of double-sided adhesive (200) are respectively attached to the front and back sides of the alloy layer (100).

5. The high-modulus support structure for a foldable screen according to claim 1, characterized in that, The alloy layer (100) is a hard alloy with high modulus, high flatness and bend springback characteristics.

6. The high-modulus support structure for a foldable screen according to claim 1, characterized in that, The alloy layer (100) is made of at least one of SUS, titanium alloy and liquid metal, and the thickness of the alloy layer (100) is 15-25 μm.

7. The high-modulus support structure for a foldable screen according to claim 1, characterized in that, The double-sided adhesive (200) has a thickness of 22-27 μm and is prepared using OCA optical adhesive.

8. The high-modulus support structure for a foldable screen according to claim 1, characterized in that, The buffer layer is fixedly attached to the upper surface of the support layer, and a flexible display screen (300) is fixed to the upper surface of the buffer layer.

9. The high-modulus support structure for a foldable screen according to claim 1, characterized in that, The buffer layer and the support layer are stacked together to form an integrated composite structure, with the layers fixed relative to each other.

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