Integrated black conductive film and electronic device

Abstract

The utility model relates to photoelectricity technical field especially an integrated black conductive film and electronic equipment, integrated black conductive film includes substrate layer and sets up first structure layer on substrate layer, is equipped with a plurality of first graphical recess on the side of first structure layer away from substrate layer, the first graphical recess includes at least one layer realizing integrated black effect's colored layer and the conductive layer adjacent with colored layer in, colored layer is adsorbed in the inner surface of first graphical recess and / or is adsorbed on the surface of conductive layer, is used to reduce the reflectivity of conductive layer surface. Utilize capillary adsorption effect, colored layer is fully surrounded in conductive layer or half surrounded in conductive layer, the colored layer on the surface of conductive layer still can be used as protective layer, has oxidation -resistant, sulfurization etc. effect. Can set up the relative position, thickness and tonal of colored layer according to actual demand, simple process, has reduced the manufacturing cost, green environmental protection, can satisfy large -scale industrialization application.

Description

Technical Field

[0001] This utility model relates to the field of optoelectronic technology, and in particular to an integrated black conductive film and electronic device. Background Technology

[0002] Transparent conductive films are functional materials that combine conductivity and optical transparency, and are widely used in display touch, solar photovoltaic, electrochromic, electromagnetic shielding, and flexible electronics. In existing technologies, transparent conductive films mainly employ the following material systems: ITO (indium tin oxide) films, whose sheet resistance is typically greater than 30 ohms; increasing the film thickness is necessary to improve conductivity, but this significantly reduces the film's transmittance; silver nanowire films, which easily form light scattering networks under low sheet resistance conditions, leading to increased haze and increased energy consumption when applied to displays; and metal (Cu, Ag, etc.) films, which, while exhibiting excellent conductivity, suffer from noticeable electrode patterns due to light reflection from the metal surface in non-lit states, affecting display quality, particularly in high-end applications such as automotive displays and personal consumer electronics. To address these issues, some research has attempted to combine integrated black coatings or plating to reduce reflection; however, multi-layer stacked structures increase process complexity, potentially affecting the mechanical stability of the conductive film, and the manufacturing process is complex, often resulting in high costs and environmental pollution, making large-scale industrial applications difficult.

[0003] Therefore, the monolithic black performance of existing conductive films is limited by the intrinsic properties of the materials and the structural design, making it difficult to simultaneously achieve high conductivity and excellent monolithic black performance. There is an urgent need for a conductive film that integrates high conductivity, high light transmittance, and low reflection to meet the needs of next-generation optoelectronic devices. Utility Model Content

[0004] Based on this, the present invention provides an integral black conductive film, comprising: a substrate layer and a first structural layer disposed on the substrate layer. The first structural layer has a plurality of first patterned grooves on the side away from the substrate layer. Each first patterned groove includes at least one coloring layer for achieving an integral black effect and a conductive layer adjacent to the coloring layer. The coloring layer is adsorbed on the inner surface of the first patterned groove and / or adsorbed on the surface of the conductive layer to reduce the reflectivity of the conductive layer surface.

[0005] In one feasible implementation, the width of the first patterned groove ranges from 1.5 μm to 10 μm, and the depth of the first patterned groove ranges from 1.5 μm to 12 μm.

[0006] In one feasible implementation, the coloring layer employs nanoparticles, including one or more of carbon nanoparticles and metal nanoparticles.

[0007] In one feasible implementation, the thickness of the coloring layer ranges from 0.5 μm to 2 μm.

[0008] In one feasible implementation, when the coloring layer is adsorbed onto the surface of the conductive layer, the upper surface of the coloring layer does not exceed the upper surface of the first patterned groove.

[0009] In one feasible implementation, the conductive layer is made of a conductive polymer material, including one or more of silver nanoparticle paste, copper nanoparticle paste, and graphene paste.

[0010] In one feasible implementation, the thickness of the conductive layer ranges from 1 μm to 8 μm.

[0011] In one feasible implementation, a second structural layer is further provided on the substrate layer, and the first structural layer and the second structural layer are disposed on the same side or opposite sides of the substrate layer; when the first structural layer and the second structural layer are disposed on the same side of the substrate layer, a transparent insulating support layer is provided between the first structural layer and the second structural layer.

[0012] In one feasible implementation, the second structural layer is provided with a plurality of second patterned grooves. Each second patterned groove includes at least one coloring layer that achieves a uniform black effect and a conductive layer adjacent to the coloring layer. The coloring layer is adsorbed on the inner surface of the second patterned groove and / or adsorbed on the surface of the conductive layer to reduce the reflectivity of the conductive layer surface.

[0013] This invention also provides an electronic device comprising any of the aforementioned integral black conductive films.

[0014] Compared with the prior art, the beneficial effects of this utility model include: 1. By setting patterned grooves on the structural layer, the capillary effect and adsorption of nanoparticles are utilized. A mixture of nanoparticles is filled by fluid dragging at the interface of the structural layer. After low-temperature baking, the nanoparticles are adsorbed on the inner surface of the patterned grooves and / or on the surface of the conductive layer, thereby forming a coloring layer with a uniform black effect and reducing the reflectivity of the conductive layer surface.

[0015] 2. The coloring layer can be set to fully surround or partially surround the conductive layer according to actual needs, thereby controlling the color of the integrated black conductive film. The coloring layer on the surface of the conductive layer can serve as a protective layer, which can protect the conductive layer structure and also has the functions of anti-oxidation and anti-sulfurization.

[0016] 3. The integrated black conductive film of this utility model has inconspicuous electrode patterns when not lit, which enhances the display effect. In addition, the manufacturing process is simple and the production cost is reduced, which can meet the needs of large-scale industrial applications and multiple scenarios.

[0017] 4. During the fabrication of the integrated black conductive film, by removing the residual nanoparticles outside the patterned groove area in the structural layer and recycling the cleaning water, it can be reused repeatedly, avoiding waste of nanoparticles, saving production costs, improving material utilization, and making it more environmentally friendly. Attached Figure Description

[0018] Figure 1 This is a schematic cross-sectional view of the integral black conductive film in Example 1; Figure 2 This is a magnified cross-sectional view of the patterned grooves in the integral black conductive film of Embodiment 1. Figure 3 This is a schematic diagram of the process for preparing the integrated black conductive film in Example 2; Figure 4 This is a scanning electron microscope image of the integral black conductive film structure in Example 2; Figure 5a This is a schematic cross-sectional view of the integral black conductive film in Example 3; Figure 5b This is a magnified cross-sectional view of the patterned grooves in the integral black conductive film of Example 3; Figure 6 This is a comparative schematic diagram of the integral black conductive film sample in Example 4; Figure 7 This is a schematic cross-sectional view of the integrated black conductive film in Example 5; Figure 8 This is a schematic cross-sectional view of the integrated black conductive film in Example 8; Figure 9 This is a schematic cross-sectional view of the integrated black conductive film in Example 9; Figure 10 This is a schematic cross-sectional view of the integral black conductive film in Example 11; Figure 11 This is a schematic cross-sectional view of the integral black conductive film in Example Thirteen; Figure 12 This is a schematic cross-sectional view of the integral black conductive film in Example 15; Figure 13 This is a schematic cross-sectional view of the integral black conductive film in Example 17.

[0019] In the picture: 1. Substrate layer; 2. First structural layer; 21. First patterned groove; 211. Coloring layer; 2111. First coloring layer; 2112. Second coloring layer; 212. Conductive layer; 2', Second structural layer; 21', Second patterned groove; 211', Color layer; 2111', First color layer; 2112', Second color layer; 212', Conductive layer; 3. Transparent insulating support layer; 4. Graphic mold. Detailed Implementation

[0020] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0021] Example 1 Please refer to Figures 1 to 2 As shown, this embodiment provides an integral black conductive film, including a substrate layer 1 and a first structural layer 2 disposed on the substrate layer 1. A plurality of first patterned grooves 21 are provided on the side of the first structural layer 2 away from the substrate layer 1. The first patterned groove 21 includes at least one coloring layer 211 for achieving an integral black effect and a conductive layer 212 adjacent to the coloring layer 211. The coloring layer 211 is adsorbed on the inner surface of the first patterned groove 21 to reduce the reflectivity of the conductive layer 212 surface.

[0022] In this embodiment, the substrate layer 1 is made of a transparent material with high light transmittance, such as polyethylene terephthalate (PET), polycarbonate (PC), or polymethyl methacrylate (PMMA), etc. This utility model does not limit this.

[0023] In this embodiment, the first structural layer 2 is made of materials such as UV adhesive or thermosetting adhesive. The width w of the first patterned groove 21 on the first structural layer 2 ranges from 1.5μm to 10μm. For example, the width w is 1.5μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, or 10μm. The depth h of the first patterned groove 21 ranges from 1.5μm to 12μm. For example, the depth h is 1.5μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, 11μm, or 12μm. The depth h of the first patterned groove 21 is less than the height of the first structural layer 2. The cross-section of the first patterned groove 21 is arc-shaped. In other embodiments, the cross-section of the first patterned groove 21 can also be rectangular, square, trapezoidal, irregular, etc., and is not limited thereto.

[0024] The thickness h1 of the coloring layer 211 ranges from 0.5 μm to 2 μm; for example, the thickness h1 is 0.5 μm, 1 μm, 1.5 μm, or 2 μm. The coloring layer 211 uses nanoparticle materials, including one or more of carbon nanoparticles and metal nanoparticles. Due to the small size of the nanoparticles, incident light can be scattered multiple times into the interior of the nanoparticles or the surrounding medium, increasing the absorption rate of the incident light. At the same time, under the action of van der Waals forces, nanoparticles often exist in an aggregated and disordered structure, forming micro-nano-scale surface roughness, causing light to undergo multiple reflections and refractions on the surface, reducing direct reflection.

[0025] Furthermore, due to the small width w of the first patterned groove 21 on the first structural layer 2, multiple first patterned grooves 21 form multiple capillary channels. After mixing the nanoparticle material with water to obtain a mixture, the nanoparticle mixture is filled at the interface of the first structural layer 2 using fluid dragging. Under capillary adsorption, the nanoparticles flow with the mixture into the first patterned groove 21. Through low-temperature baking, water evaporates from the first patterned groove 21 outwards, forming a capillary flow from the inside out, continuously transporting the nanoparticles into the first patterned groove 21, so that the nanoparticles are ultimately adsorbed on the inner surface of the first patterned groove 21. Simultaneously, the van der Waals forces between the nanoparticles inside the first patterned groove 21 help improve the filling capacity of the nanoparticles.

[0026] In this embodiment, a conductive layer 212 is disposed on the coloring layer 211. The conductive layer 212 is made of a conductive polymer material, including one or more of silver nanoparticle paste, copper nanoparticle paste, and graphene paste. The thickness h2 of the conductive layer 212 ranges from 1μm to 8μm; for example, the thickness h2 is 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, or 8μm. The conductive layer 212 is disposed using metal growth or coating methods, which enhances the adsorption force of the conductive polymer material and results in a conductive layer 212 with high surface smoothness. The coloring layer 211 partially surrounds the conductive layer 212, and the integral black conductive film appears black when viewed from below.

[0027] In other embodiments, the relative position, thickness, and chromaticity of the coloring layer 211 can be set according to actual needs. Since there is a difference in refractive index between the air layer, the substrate layer 1, and the coloring layer 211, by setting the relative position and thickness of the coloring layer 211, a gradient refractive index can be formed between the layers, thereby reducing reflection and controlling the chromaticity of the integral black conductive film.

[0028] Example 2 Please refer to Figure 3 As shown, this embodiment provides a method for preparing an integral black conductive film, the specific steps of which are as follows: S1: Provide a substrate layer 1, and apply an adhesive layer 20 to one side of the substrate layer 1.

[0029] In one feasible implementation, the substrate layer 1 is made of materials such as PET, PC or PMMA, and the adhesive layer 20 is made of materials such as UV adhesive or thermosetting adhesive.

[0030] S2: Using a pre-made graphic mold 4, the adhesive layer 20 is imprinted and cured to form a first structural layer 2 with multiple first graphic grooves 21.

[0031] In one feasible implementation, the surface of the prefabricated patterned mold 4 has multiple protrusions, the cross-section of which can be arc-shaped, rectangular, square, trapezoidal, or irregularly shaped. The side surface of the mold 4 with multiple protrusions is pressed down towards the substrate layer 1, imprinting the protrusions onto the adhesive layer 20, forming a first structural layer 2 with multiple first patterned grooves 21. The multiple first patterned grooves 21 correspond to the multiple protrusions and have the same depth; the depth of the first patterned grooves 21 is less than the thickness of the first structural layer 2. Then, curing is performed. The curing method for the first structural layer 2 can be ultraviolet curing or thermosetting, depending on whether the adhesive layer 20 uses UV adhesive or thermosetting adhesive, but is not limited to these methods.

[0032] S3: A coloring layer 211 and a conductive layer 212 are disposed within a plurality of first patterned grooves 21 in the first structural layer 2, specifically including the following steps: S31: A nanoparticle mixture is provided, which is then filled onto the interface of the first structural layer 2 by fluid dragging and baked at a low temperature. After the water evaporates, the remaining nanoparticles are adsorbed onto the inner surface of the first patterned groove 21 to form a coloring layer 211.

[0033] S32: Clean the nanoparticle residue outside the area of ​​the first patterned groove 21 and dry it.

[0034] In one feasible implementation, the coloring layer 211 uses nanoparticle materials, including one or more of carbon nanoparticles and metal nanoparticles. In step S32, the cleaned liquid can be recycled and reused, avoiding waste of nanoparticles, saving manufacturing costs, improving material utilization, and being more environmentally friendly.

[0035] S33: A conductive layer 212 is disposed on the coloring layer 211.

[0036] In one feasible implementation, a conductive polymer material is deposited on the coloring layer 211 using methods such as metal growth or coating, and then sintered and cured to form a conductive layer 212. The conductive polymer material is one or more of silver nanoparticle paste, copper nanoparticle paste, and graphene paste.

[0037] The integral black conductive film prepared using the method of this embodiment has a coloring layer 211 made of carbon nanoparticles and a conductive layer 212 made of silver nanoparticle paste, as shown in the specific structure. Figure 4 As shown.

[0038] The performance test data of the integral black conductive film and the uncolored silver conductive film prepared using the method of this embodiment are as follows: In this embodiment, the Lab value is used to evaluate the performance of the conductive film. According to the comparison of performance test results, it can be seen that the integrated black conductive film of this invention can maintain high transmittance after the coloring layer is set, while effectively reducing the surface reflection of the conductive layer.

[0039] Example 3 Please refer to Figure 5a and 5b As shown, this embodiment provides an integral black conductive film. The difference from Embodiment 1 is that the first patterned groove 21 includes a first coloring layer 2111, a conductive layer 212, and a second coloring layer 2112 (for ease of understanding, the second coloring layer 2112 is shown as a gray area in the accompanying drawings). The second coloring layer 2112 is adsorbed onto the conductive layer 212. The thickness h3 of the second coloring layer 2112 ranges from 0.5 μm to 2 μm; for example, the thickness h3 is 0.5 μm, 1 μm, 1.5 μm, or 2 μm. The upper surface of the second coloring layer 2112 does not exceed the upper surface of the first patterned groove 21, meaning the second coloring layer 2112 is entirely contained within the first patterned groove 21. The nanoparticle material used in the second coloring layer 2112 can be the same as or different from the nanoparticle material used in the first coloring layer 2111. The first coloring layer 2111 and the second coloring layer 2112 completely surround the conductive layer 212. The second coloring layer 2112 not only reduces reflection but also acts as a protective layer to ensure that the structure of the conductive layer 212 is not damaged, and it also has anti-oxidation and anti-sulfurization effects. The integral black conductive film appears black on both sides when viewed from a top or bottom angle.

[0040] Example 4 Please continue to refer to Figure 3 and Figure 5a As shown, this embodiment provides a method for preparing an integral black conductive film. The difference from Embodiment 2 is that, after step S33, steps S31 to S32 can be repeated on the conductive layer 212 to form a second coloring layer 2112. The second coloring layer 2112 may use the same or different nanoparticle material as the first coloring layer 2111.

[0041] The performance test data of the integral black conductive film (where the coloring layers are all made of carbon nanoparticles and the conductive layer 212 is made of silver nanoparticle paste) prepared using the method of this embodiment and the silver conductive film without coloring layers are as follows: In this embodiment, the Lab value is used to evaluate the performance of the conductive film. Based on the performance test results, it can be seen that the integrated black conductive film of this invention, after adding two coloring layers, can maintain high transmittance while effectively reducing reflection. A comparison is made between the integrated black conductive film sample prepared using this embodiment and a silver conductive film sample without coloring layers. Figure 6 As shown.

[0042] Example 5 Please refer to Figure 7 As shown, this embodiment provides an integral black conductive film. The difference from Embodiment 1 is that a conductive layer 212 is first formed in the first patterned groove 21 of the first structural layer 2 using methods such as metal growth or coating. Then, a coloring layer 211 is formed using capillary adsorption, adsorbing onto the surface of the conductive layer 212. The coloring layer 211 not only reduces reflection but also acts as a protective layer to ensure the structure of the conductive layer 212 is not damaged, and it also has anti-oxidation and anti-sulfurization properties. From a top view, the integral black conductive film appears black.

[0043] Example 6 This embodiment provides a method for preparing an integral black conductive film, which differs from Embodiment 2 in that, in step S3: a coloring layer 211 and a conductive layer 212 are disposed within a plurality of first patterned grooves 21 in the first structural layer 2, including the following steps: S31': A conductive layer 212 is formed in the first patterned groove 21 by metal growth or scraping.

[0044] S32': A nanoparticle mixture is provided. The nanoparticle mixture is filled on the interface of the first structural layer 2 by fluid dragging and baking at low temperature. After the water evaporates, the remaining nanoparticles are adsorbed on the surface of the conductive layer 212 to form a coloring layer 211.

[0045] S33': Clean the nanoparticle residue outside the area of ​​the first patterned groove 21 and dry it.

[0046] Example 7 Please refer to Figure 8 As shown, this embodiment provides an integral black conductive film. The difference from Embodiment 1 is that a second structural layer 2' is also provided on the substrate layer 1. The first structural layer 2 and the second structural layer 2' are stacked sequentially on the same side of the substrate layer 1.

[0047] In this embodiment, the second structural layer 2' is provided with a plurality of second patterned grooves 21'. The cross-sectional shape of the second patterned grooves 21' in the second structural layer 2' is the same as the cross-sectional shape of the first patterned groove 21 in the first structural layer 2, both being arc-shaped. The width of the second patterned grooves 21' ranges from 1.5μm to 10μm, and the depth of the second patterned grooves 21' ranges from 1.5μm to 12μm. In other embodiments, the cross-sectional shape of the second patterned grooves 21' in the second structural layer 2' may also be different from that of the first patterned grooves 21 in the first structural layer 2. The cross-sectional shape of the second patterned grooves 21' in the second structural layer 2' can be rectangular, square, trapezoidal, irregular, etc. The depth of the second patterned grooves 21' in the second structural layer 2' is less than the height of the second structural layer 2', which can ensure insulation from the first structural layer 2. The heights of the first structural layer 2 and the second structural layer 2' can be the same or different.

[0048] The second patterned groove 21' includes a coloring layer 211' and a conductive layer 212'. The coloring layer 211' is adsorbed on the inner surface of the second patterned groove 21' to reduce the reflectivity of the conductive layer surface. The coloring layer 211' is made of nanoparticles, including one or more of carbon nanoparticles and metal nanoparticles, and the thickness of the coloring layer 211' ranges from 0.5 μm to 2 μm. The conductive layer 212' is made of conductive polymer materials, including one or more of silver nanoparticle paste, copper nanoparticle paste, and graphene paste, and the thickness of the conductive layer 212' ranges from 1 μm to 8 μm.

[0049] The coloring layer 211' in the second patterned groove 21' of the second structural layer 2' and the coloring layer 211 in the first patterned groove 21 of the first structural layer 2' may use the same or different nanoparticle materials; the conductive layer 212' in the second patterned groove 21' of the second structural layer 2' and the conductive layer 212 in the first patterned groove 21 of the first structural layer 2' may use the same or different conductive polymer materials, which can be set according to actual needs.

[0050] In other embodiments, a conductive layer may be first disposed in the patterned groove of both structural layers, and then a coloring layer may be disposed on the conductive layer; or a conductive layer may be first disposed in the patterned groove of one of the structural layers, and then a coloring layer may be disposed on the conductive layer.

[0051] Example 8 Please continue to refer to Figure 3 and Figure 8 As shown, this embodiment provides a method for preparing an integral black conductive film. The difference from Embodiment 2 is that, after step S3, an adhesive layer is applied to the first structural layer 2 on the side away from the substrate layer 1, and steps S2 to S3 are repeated to form the second structural layer 2'.

[0052] Example 9 Please refer to Figure 9 As shown, this embodiment provides an integrated black conductive film. The difference from Embodiment 7 is that a transparent insulating support layer 3 can be disposed between the first structural layer 2 and the second structural layer 2'. The transparent insulating support layer 3 uses resin materials such as UV adhesive, which can significantly improve the insulation effect between the first structural layer 2 and the second structural layer 2', effectively preventing short circuits, increasing the anti-bending performance of the integrated black conductive film, further enhancing the product's stability, and expanding its application scenarios, making it suitable for the needs of fields such as flexible electronic devices.

[0053] Example 10 Please continue to refer to Figure 3 and Figure 9 As shown, this embodiment provides a method for preparing an integral black conductive film. The difference from Embodiment 2 is that, after step S3, an adhesive layer is coated on the side of the first structural layer 2 away from the substrate layer 1 to form a transparent insulating support layer 3. An adhesive layer is then coated on the side of the transparent insulating support layer 3 away from the first structural layer 2, and steps S2 to S3 are repeated to form a second structural layer 2'.

[0054] Example 11 Please refer to Figure 10 As shown, this embodiment provides an integral black conductive film, which differs from Embodiment 7 in that a first coloring layer 2111, a conductive layer 212, and a second coloring layer 2112 are disposed in the first patterned groove 21 of the first structural layer 2, and the second coloring layer 2112 is adsorbed on the surface of the conductive layer 212. A first coloring layer 2111', a conductive layer 212', and a second coloring layer 2112' are disposed in the second patterned groove 21' of the second structural layer 2', and the second coloring layer 2112' is adsorbed on the surface of the conductive layer 212'.

[0055] In other embodiments, a second coloring layer may be provided on the conductive layer within the patterned groove of any structural layer, depending on actual needs. That is, a second coloring layer 2112 may be provided on the conductive layer 212 within the first patterned groove 21 of the first structural layer 2, while no second coloring layer 2112' may be provided on the conductive layer 212' within the second patterned groove 21' of the second structural layer 2'; or no second coloring layer 2112 may be provided on the conductive layer 212 within the first patterned groove 21 of the first structural layer 2, while a second coloring layer 2112' may be provided on the conductive layer 212' within the second patterned groove 21' of the second structural layer 2'; a transparent insulating layer 3 may also be provided between the first structural layer 2 and the second structural layer 2'. This invention does not limit this.

[0056] Example 12 Please continue to refer to Figure 3 and Figure 10As shown, this embodiment provides a method for preparing an integral black conductive film. The difference from embodiment four is that, after step S3, an adhesive layer is applied to the first structural layer 2 on the side away from the substrate layer 1, and steps S2 to S3 are repeated to form the second structural layer 2'.

[0057] Example 13 Please refer to Figure 11 As shown, this embodiment provides an integral black conductive film. The difference from embodiment seven is that in this embodiment, the coloring layer 211 in the first patterned groove 21 of the first structural layer 2 is adsorbed on the surface of the conductive layer 212; the coloring layer 211' in the second patterned groove 21' of the second structural layer 2' is adsorbed on the surface of the conductive layer 212'.

[0058] In other embodiments, a transparent insulating layer 3 may also be provided between the first structural layer 2 and the second structural layer 2', and the present invention does not limit this.

[0059] Example 14 This embodiment provides a method for preparing an integral black conductive film. The difference from Embodiment Six is ​​that, after step S3, an adhesive layer is applied to the first structural layer 2 on the side away from the substrate layer 1, and steps S2 to S3 are repeated to form the second structural layer 2'.

[0060] Example 15 Please refer to Figure 12 As shown, this utility model provides an integrated black conductive film. The difference from Embodiment 7 is that the first structural layer 2 and the second structural layer 2' are disposed on opposite sides of the substrate layer 1. The arrangement of the first patterned groove 21 in the first structural layer 2 and the arrangement of the second patterned groove 21' in the second structural layer 2' are the same as in Embodiment 7, and will not be described again here.

[0061] In other embodiments, a conductive layer may be first set in the patterned groove of the two structural layers, and then a coloring layer may be set on the conductive layer; or a conductive layer may be first set in the patterned groove of one of the structural layers, and then a coloring layer may be set on the conductive layer.

[0062] Example 16 Please continue to refer to Figure 3 and Figure 12 As shown, this utility model provides a method for preparing an integral black conductive film. The difference from Example 8 is that after step S3, an adhesive layer is applied to the substrate layer 1 on the side away from the first structural layer 2, and steps S2 to S3 are repeated to form the second structural layer 2'.

[0063] Example 17 Please refer to Figure 13As shown, this utility model provides an integrated black conductive film. The difference from Embodiment 11 is that the first structural layer 2 and the second structural layer 2' are disposed on opposite sides of the substrate layer 1. The arrangement of the first patterned groove 21 in the first structural layer 2 and the arrangement of the second patterned groove 21' in the second structural layer 2' are the same as those in Embodiment 11, and will not be described again here.

[0064] Example 18 Please continue to refer to Figure 3 and Figure 13 As shown, this utility model provides a method for preparing an integral black conductive film. The difference from Example 12 is that, after step S3, an adhesive layer is applied to the substrate layer 1 on the side away from the first structural layer 2, and steps S2 to S3 are repeated to form the second structural layer 2'.

[0065] Example 19 An electronic device includes the aforementioned integrated black conductive film. In this embodiment, the electronic device includes a touchscreen display, a conference screen, a smart blackboard, a mobile screen, a computer, a tablet, in-vehicle equipment, medical equipment, etc.

[0066] In summary, this invention, by setting multiple patterned grooves on the structural layer and utilizing capillary effect and nanoparticle adsorption, employs a fluid dragging method to fill the nanoparticle mixture at the structural layer interface. After low-temperature baking, the nanoparticles are adsorbed onto the inner surface of the patterned grooves and / or the surface of the conductive layer, increasing the absorption rate of incident light and reducing reflection. The coloring layer fully or partially surrounds the conductive layer, and the coloring layer on the surface of the conductive layer also serves as a protective layer, providing anti-oxidation and anti-sulfurization effects. The relative position, thickness, and hue of the coloring layer can be set according to actual needs. The process is simple, reduces manufacturing costs, and is environmentally friendly, making it applicable to fields such as display touch control, solar photovoltaics, electrochromic, electromagnetic shielding, and flexible electronics.

[0067] The same layer name in different products or embodiments does not necessarily mean that their material, composition, thickness, pattern, or other related parameters are the same. They may be the same or different, and can be selected or manufactured according to actual needs. The technical features of the embodiments described above can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification.

[0068] In the accompanying drawings, the dimensions and relative dimensions of layers and regions are exaggerated for clarity. It should be understood that when an element, such as a layer, region, or substrate, is referred to as "formed on," "disposed on," or "located on" another element, the element may be directly disposed on said other element, or there may be intermediate elements present. Conversely, when an element is referred to as "directly formed on" or "directly disposed on" another element, there are no intermediate elements.

[0069] In this document, the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inner", "outer", "vertical", and "horizontal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the purpose of clarifying the technical solution and for the convenience of description, and therefore should not be construed as limiting the present utility model.

[0070] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0071] In this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0072] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A one-piece black conductive film, characterized in that, include: The first structural layer is provided on the substrate layer and a first structural layer disposed on the substrate layer. The first structural layer has a plurality of first patterned grooves on the side away from the substrate layer. The first patterned groove includes at least one coloring layer that achieves a uniform black effect and a conductive layer adjacent to the coloring layer. The coloring layer is adsorbed on the inner surface of the first patterned groove and / or adsorbed on the surface of the conductive layer to reduce the reflectivity of the conductive layer surface.

2. The integrated black conductive film as described in claim 1, characterized in that, The width of the first patterned groove ranges from 1.5μm to 10μm, and the depth of the first patterned groove ranges from 1.5μm to 12μm.

3. The integrated black conductive film as described in claim 1, characterized in that, The coloring layer uses nanoparticles, including one or more of carbon nanoparticles and metal nanoparticles.

4. The integrated black conductive film as described in claim 1, characterized in that, The thickness of the coloring layer ranges from 0.5 μm to 2 μm.

5. The integrated black conductive film as described in claim 1, characterized in that, When the coloring layer is adsorbed onto the surface of the conductive layer, the upper surface of the coloring layer does not exceed the upper surface of the first patterned groove.

6. The integrated black conductive film as described in claim 1, characterized in that, The conductive layer is made of conductive polymer materials, including one or more of silver nanoparticle paste, copper nanoparticle paste, and graphene paste.

7. The integrated black conductive film as described in claim 1, characterized in that, The thickness of the conductive layer ranges from 1 μm to 8 μm.

8. The integral black conductive film according to any one of claims 1-7, characterized in that, The substrate layer is further provided with a second structural layer, and the first structural layer and the second structural layer are disposed on the same side or opposite sides of the substrate layer; when the first structural layer and the second structural layer are disposed on the same side of the substrate layer, a transparent insulating support layer is provided between the first structural layer and the second structural layer.

9. The integrated black conductive film as described in claim 8, characterized in that, The second structural layer is provided with a plurality of second patterned grooves. Each second patterned groove includes at least one coloring layer that achieves a uniform black effect and a conductive layer adjacent to the coloring layer. The coloring layer is adsorbed on the inner surface of the second patterned groove and / or adsorbed on the surface of the conductive layer to reduce the reflectivity of the conductive layer surface.

10. An electronic device, characterized in that, Includes the integral black conductive film as described in any one of claims 1-9.

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