A laminated glass fibre insulation board

Abstract

The utility model provides a kind of laminated glass fiber insulation board, it is related to insulation board technical field, including insulation matrix, the insulation matrix is integrated plate structure, it is made of resin curing layer and reinforcing framework composite;The reinforcing framework is the three-dimensional integral braids of continuous fiber weaving forming, the three-dimensional integral braids have the Z direction fiber that continuously penetrates along the thickness direction of the insulation board;The resin curing layer is covered and solidified in the three-dimensional integral braids, and the resin curing layer is dispersed with nano reinforcing body;By being designed as integrated plate structure to insulation matrix, it is made of resin curing layer and the three-dimensional integral braids reinforcing framework of continuous fiber weaving forming composite, and three-dimensional integral braids have the Z direction fiber that continuously penetrates along the thickness direction of insulation board, effectively overcome the problem that traditional FR-4 material mainly relies on two-dimensional plane lamination mode, and the performance is not good between layer (Z axis direction).

Description

Technical Field

[0001] This utility model relates to the field of insulation board technology, and in particular to a laminated fiberglass insulation board. Background Technology

[0002] In traditional electrical insulation materials, laminated fiberglass insulation boards (such as FR-4) are widely used in various electronic devices. These materials are composite materials made by impregnating fiberglass cloth with resin, stacking them layer by layer, and hot pressing them. Although FR-4 has obvious advantages in manufacturing cost and mechanical strength, it mainly relies on two-dimensional planar stacking, which leads to poor performance between layers (i.e., in the Z-axis direction).

[0003] Specifically, this material has inherent weaknesses in terms of interlayer delamination resistance, thermal conductivity in the Z-axis direction, and impact toughness. These weaknesses limit the application range of FR-4 under extremely high or extreme mechanical and thermal conditions, such as the needs of high power density devices, high-quality servers, aerospace and other fields. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing an improved electrical insulation material structure to enhance its overall performance in the Z-axis direction and expand its application scenarios.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A laminated fiberglass insulation board includes an insulation matrix, wherein the insulation matrix is ​​an integrated plate structure composed of a resin curing layer and a reinforcing skeleton;

[0007] The reinforcing skeleton is a three-dimensional integral braid formed by continuous fiber weaving, and the three-dimensional integral braid has Z-direction fibers that continuously penetrate along the thickness direction of the insulation board;

[0008] The resin curing layer covers and cures the three-dimensional integral woven body, and nano-reinforcement is dispersed in the resin curing layer. The nano-reinforcement is attached to the surface of the continuous fiber and fills the gaps therebetween.

[0009] Furthermore, the three-dimensional integral braided body is a 2.5D interlayer angular interlocking braided structure or a three-dimensional orthogonal braided structure.

[0010] Furthermore, the continuous fiber comprises high-strength glass fiber or quartz fiber.

[0011] Furthermore, the three-dimensional integral braided body has aramid fiber layers woven in the non-electrical pathway areas.

[0012] Furthermore, the aramid fiber layer can be replaced with a polyacrylonitrile-based carbon fiber layer.

[0013] Furthermore, the nano-reinforcement is a carbon nanotube or graphene nanosheet with a surface modified with carboxyl or hydroxyl groups.

[0014] Furthermore, the volume of the Z-axis fiber accounts for 3% to 8% of the total volume of the three-dimensional integral braid.

[0015] Furthermore, the thickness of the insulating substrate is 1.6 mm or 3.2 mm.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] By designing the insulating substrate as an integrated plate structure, which is composed of a resin-cured layer and a three-dimensional integral braided skeleton formed by continuous fiber weaving, and the three-dimensional integral braided skeleton has Z-axis fibers that run continuously along the thickness direction of the insulating board, the problem of poor performance between layers (Z-axis direction) of traditional FR-4 materials, which mainly rely on two-dimensional planar stacking, is effectively overcome.

[0018] Specifically, the presence of Z-axis fibers significantly enhances the material's resistance to delamination between layers, making it less prone to separation under external forces and improving structural stability. Simultaneously, Z-axis fibers provide channels for heat conduction along the Z-axis. Combined with the nano-reinforcements dispersed and attached to the surface of the continuous fibers and filling their gaps in the resin-cured layer, this effectively improves the material's thermal conductivity along the Z-axis, helping to quickly dissipate heat generated by the equipment and ensuring its normal operation. Furthermore, the synergistic effect of the three-dimensional integral braided structure and the nano-reinforcements enhances the material's impact resistance and improves its toughness.

[0019] Through the above improvements, the overall performance of the laminated fiberglass insulation board of this invention in the Z-axis direction is greatly enhanced, which can meet the application requirements of high power density equipment, high-quality servers, aerospace and other applications under extremely high or extreme mechanical and thermal conditions, thus expanding the application scenarios of laminated fiberglass insulation board. Attached Figure Description

[0020] Figure 1 A schematic diagram of the overall structure of a laminated fiberglass insulation board provided by this utility model;

[0021] Figure 2 A partially enlarged schematic diagram of structure A of a laminated fiberglass insulation board provided for this utility model;

[0022] Figure 3 A schematic diagram of the non-electrical pathway area structure of a laminated fiberglass insulation board provided by this utility model.

[0023] Legend: 1. Insulating substrate;

[0024] 2. Resin curing layer; 21. Nano-reinforcement;

[0025] 3. Reinforced skeleton; 31. Continuous fiber; 311. Aramid fiber layer; 32. Three-dimensional integral braid; 33. Z-direction fiber. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0027] To facilitate understanding of this utility model, a more comprehensive description of this utility model will be provided below with reference to relevant embodiments, and several embodiments of this utility model will be given. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this utility model more thorough and complete.

[0028] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0030] Example 1

[0031] like Figure 1-3 As shown, this utility model provides a technical solution: a laminated fiberglass insulation board, including an insulation substrate 1, which is an integrated plate structure. This integrated design abandons the traditional two-dimensional planar stacking mode of materials and improves the continuity and stability of material performance from the overall structure. It is composed of a resin curing layer 2 and a reinforcing skeleton 3, which are closely combined to give the insulation board excellent performance.

[0032] The reinforcing skeleton 3 is a three-dimensional integral braided body 32 woven from continuous fibers 31. Compared with the traditional two-dimensional layering, this three-dimensional integral braiding method is more complex and compact in structure and can withstand external forces from multiple dimensions. The three-dimensional integral braided body 32 has Z-direction fibers 33 that run continuously along the thickness direction of the insulation board. The Z-direction fibers 33 are like a "bridge" built inside the material, which allows heat and stress to be better transferred and dispersed in the Z-axis direction, effectively solving the problem of weak performance of traditional materials in the Z-axis direction.

[0033] The resin-cured layer 2 encapsulates and cures within the three-dimensional integral braid 32, serving both filling and fixing functions. It tightly wraps the three-dimensional integral braid 32, forming a complete whole. Furthermore, nano-reinforcements 21 are dispersed within the resin-cured layer 2, adhering to the surface of the continuous fibers 31 and filling their gaps. The addition of nano-reinforcements 21 further enhances the material's performance. Adhering to the surface of the continuous fibers 31 strengthens the bond between the fibers and the resin, while filling the gaps fills microscopic defects in the material, improving its density and uniformity.

[0034] Example 2

[0035] like Figure 1-3 As shown, based on Example 1, the design is further optimized. The three-dimensional integral braid 32 is a 2.5D interlayer angular interlocking braid structure or a three-dimensional orthogonal braid structure. The 2.5D interlayer angular interlocking braid structure can improve the interlayer shear performance of the material while ensuring a certain strength. The three-dimensional orthogonal braid structure has the characteristic of good isotropy and can withstand relatively uniform force in all directions. The appropriate braid structure can be selected according to different application scenarios and performance requirements.

[0036] Continuous fiber 31 includes high-strength glass fiber or quartz fiber. High-strength glass fiber has high strength and good heat resistance, which can meet the requirements of general electronic equipment for the strength and heat resistance of insulation materials. Quartz fiber has higher high temperature resistance and chemical stability, and is suitable for high-end fields with more demanding performance requirements.

[0037] The three-dimensional integral braided body 32 has an aramid fiber layer 311 woven in the non-electrical pathway area. Aramid fibers have excellent properties such as high strength, high modulus, and high temperature resistance. Weaving the aramid fiber layer 311 in the non-electrical pathway area can further improve the mechanical properties and heat resistance of the area and enhance the overall stability of the material.

[0038] The aramid fiber layer 311 can be replaced with a polyacrylonitrile-based carbon fiber layer. Polyacrylonitrile-based carbon fiber has higher strength and modulus, as well as better electrical conductivity (its conductivity can be used for special design in areas where electrical insulation requirements are not strict). Depending on the actual application scenario and performance requirements, either the aramid fiber layer 311 or the polyacrylonitrile-based carbon fiber layer can be flexibly selected.

[0039] Nano-reinforcement 21 is carbon nanotubes or graphene nanosheets with carboxyl or hydroxyl groups on their surface. Nano-reinforcement 21 with carboxyl or hydroxyl groups on its surface can better combine with resin and fiber, improve interfacial bonding strength, and give full play to the reinforcing effect of nano-reinforcement 21. Both carbon nanotubes and graphene nanosheets have excellent mechanical and thermal conductivity properties, which can significantly improve the overall performance of the material.

[0040] The volume of Z-direction fiber 33 accounts for 3% to 8% of the total volume of the three-dimensional integral braid 32. After a large number of experiments and studies, it was found that when the volume of Z-direction fiber 33 is within this range, the thermal conductivity, anti-delamination ability and impact toughness of the material in the Z-axis direction can achieve a good balance. This ensures that the material has sufficient performance improvement in the Z-axis direction, and does not affect other properties of the material due to excessive Z-direction fiber 33.

[0041] The thickness of the insulating substrate 1 is 1.6mm or 3.2mm. These two thickness specifications can meet the requirements of different electronic devices for the thickness of the insulating board. The 1.6mm insulating board is suitable for equipment with more compact space requirements, while the 3.2mm insulating board is suitable for equipment with higher requirements for insulation performance and mechanical strength and relatively more space.

[0042] The working process of this utility model is as follows: When using a laminated glass fiber insulation board, firstly, according to the specific application scenario and performance requirements of the electronic device, select the appropriate three-dimensional integral braided body 32 structure (2.5D interlayer corner interlocking braided structure or three-dimensional orthogonal braided structure), continuous fiber 31 type (high-strength glass fiber or quartz fiber), and whether to braid aramid fiber layer 311 or polyacrylonitrile-based carbon fiber layer in non-electrical path areas.

[0043] Next, the three-dimensional integral braid 32 is woven according to the design requirements, ensuring that the volume ratio of Z-axis fibers 33 is within the range of 3% to 8% in order to obtain good Z-axis performance;

[0044] Then, the raw materials for preparing the resin curing layer 2 are prepared, and carbon nanotubes or graphene nanosheets with carboxyl or hydroxyl groups modified on the surface are uniformly dispersed in the resin raw materials as nano-reinforcement 21.

[0045] Then, the woven three-dimensional integral braid 32 is immersed in a resin raw material containing nano-reinforcement 21, so that the resin fully covers the three-dimensional integral braid 32 and fills its internal gaps.

[0046] Next, the impregnated material is placed in a hot press mold and hot-pressed according to the set temperature, pressure and time parameters to cure the resin and form an integrated insulating matrix 1. It is then processed into a thickness of 1.6mm or 3.2mm as required.

[0047] Finally, the laminated fiberglass insulation board is subjected to quality inspection, including appearance inspection, dimensional measurement, and performance testing (such as thermal conductivity testing, anti-delamination ability testing, impact toughness testing, etc.). After passing the inspection, the laminated fiberglass insulation board can be installed in the corresponding electronic equipment to give full play to its excellent electrical insulation and comprehensive performance.

[0048] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A laminated fiberglass insulation board, comprising an insulating substrate (1), characterized in that: The insulating substrate (1) is an integrated plate structure, composed of a resin curing layer (2) and a reinforcing skeleton (3); The reinforcing skeleton (3) is a three-dimensional integral braid (32) woven from continuous fibers (31), and the three-dimensional integral braid (32) has Z-direction fibers (33) that continuously penetrate along the thickness direction of the insulating plate. The resin curing layer (2) covers and cures within the three-dimensional integral braid (32), and nano-reinforcement (21) is dispersed in the resin curing layer (2). The nano-reinforcement (21) is attached to the surface of the continuous fiber (31) and fills its gaps.

2. The laminated fiberglass insulation board according to claim 1, characterized in that: The three-dimensional integral braid (32) is a 2.5D interlayer corner interlocking braid structure or a three-dimensional orthogonal braid structure.

3. The laminated fiberglass insulation board according to claim 1, characterized in that: The continuous fiber (31) includes high-strength glass fiber or quartz fiber.

4. The laminated fiberglass insulation board according to claim 3, characterized in that: The three-dimensional integral braid (32) has an aramid fiber layer (311) woven in the non-electrical pathway area.

5. The laminated fiberglass insulation board according to claim 4, characterized in that: The aramid fiber layer (311) can be replaced with a polyacrylonitrile-based carbon fiber layer.

6. The laminated fiberglass insulation board according to claim 1, characterized in that: The nano-reinforcement (21) is a carbon nanotube or graphene nanosheet with carboxyl or hydroxyl groups modified on its surface.

7. The laminated fiberglass insulation board according to claim 1, characterized in that: The volume of the Z-axis fiber (33) accounts for 3% to 8% of the total volume of the three-dimensional integral braid (32).

8. The laminated fiberglass insulation board according to claim 1, characterized in that: The thickness of the insulating substrate (1) is 1.6 mm or 3.2 mm.

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