Thin film resistor lead

Abstract

The utility model relates to resistance lead wire technical field discloses a film resistance lead wire, including the lead body, the lead body is composed by nickel core stick, silver palladium alloy layer and palladium layer, silver palladium alloy layer, the outer cylinder surface and the end face of nickel core stick are wrapped, and nickel core stick is completely covered, palladium layer, the outer cylinder surface and the end face of silver palladium alloy layer are wrapped. The utility model discloses a nickel core stick can provide excellent mechanical strength and thermal stability for resistance lead wire, by setting up silver palladium alloy layer at the outer wall of nickel core stick, make its resistance lead wire have good conductivity and oxidation resistance, prevent silver migration, and the composite structure of resistance lead wire gives consideration to conductivity, weldability and structural strength, meets the strict requirement of film resistance to temperature drift, by the surface of resistance lead wire electroplating a layer of palladium layer, can better inhibit the diffusion and oxidation of silver, improves long -term stability, prolongs the service life of film resistance lead wire.

Description

Technical Field

[0001] This utility model relates to the field of resistor lead technology, and in particular to a thin-film resistor lead. Background Technology

[0002] Resistors are commonly used electronic components installed in electronic products. As electronic products become smaller and require higher precision, the demands on the resistors used also increase. They must not only fit the product's size but also meet the required accuracy. Furthermore, assembling resistors in electronic products often involves preparing a large number of resistors and then assembling them sequentially. Thin-film resistors are currently the most widely used type of resistor due to their high precision, stable performance, and simple, lightweight structure. They play an indispensable role in the electronics industry and in high-precision fields such as military and aerospace. The leads of a thin-film resistor are metal leads soldered to both ends of the resistor body for connecting to the circuit.

[0003] As a type of precision resistor, the conductivity, stability, and weldability of the lead structure directly affect the overall performance of the resistor. Traditional leads often use a single metal material or a simple multilayer vapor-deposited structure, which has problems such as difficulty in balancing conductivity and mechanical strength, poor weldability, and susceptibility to oxidation or resistance drift after long-term use. To address these issues, a thin-film resistor lead is proposed. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a thin-film resistor lead, which aims to solve the problems of existing resistor leads, which mostly use a single metal material or a simple multilayer vapor deposition structure, resulting in difficulty in balancing conductivity and mechanical strength, poor weldability, and easy oxidation or resistance drift after long-term use.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a thin-film resistor lead wire, comprising a lead wire body, wherein the lead wire body is composed of a nickel core rod, a silver-palladium alloy layer and a palladium layer;

[0006] The silver-palladium alloy layer is wrapped around the outer cylindrical surface and end face of the nickel core rod, completely covering the nickel core rod;

[0007] The palladium layer is wrapped around the outer cylindrical surface and end face of the silver-palladium alloy layer, completely covering the silver-palladium alloy layer.

[0008] As a further description of the above technical solution: the silver-palladium alloy layer includes an alloy tube and a sealing plate;

[0009] The inner wall of the alloy tube is fixedly connected to the outer wall of the nickel core rod;

[0010] The sidewall of the sealing plate is fixedly connected to the end of the nickel core rod, and the sidewall of the sealing plate is fixedly connected to the end of the alloy tube.

[0011] As a further description of the above technical solution: the palladium layer includes a tube layer and a sealing layer;

[0012] The inner wall of the tube layer is fixedly connected to the outer wall of the alloy tube;

[0013] The sidewall of the sealing layer is fixedly connected to the side of the sealing plate, and the sidewall of the sealing layer is fixedly connected to the end of the pipe layer.

[0014] As a further description of the above technical solution: the diameter of the nickel core rod is 0.1 to 0.3 mm.

[0015] As a further description of the above technical solution: the thickness of the silver-palladium alloy layer is 0.01 to 0.03 mm.

[0016] As a further description of the above technical solution: the thickness of the palladium layer is 0.02 to 0.03 mm.

[0017] This utility model has the following beneficial effects:

[0018] 1. In this utility model, by setting a nickel core rod, the resistance lead can be provided with excellent mechanical strength and thermal stability. By setting a silver-palladium alloy layer on the outer wall of the nickel core rod, the resistance lead has both good conductivity and oxidation resistance, preventing silver migration. The composite structure adopted by the resistance lead takes into account conductivity, weldability and structural strength, meeting the stringent requirements of thin film resistors for temperature drift.

[0019] 2. In this invention, by electroplating a palladium layer on the surface of the resistor leads, the diffusion and oxidation of silver can be better suppressed, long-term stability can be improved, and the service life of the thin-film resistor leads can be extended. Attached Figure Description

[0020] Figure 1 This is a front view of a thin-film resistor lead proposed in this utility model;

[0021] Figure 2 This is a schematic diagram of the cross-sectional structure of a thin-film resistor lead proposed in this utility model;

[0022] Figure 3 This is a schematic diagram of the cross-sectional structure of the lead wire of a thin film resistor proposed in this utility model.

[0023] Legend:

[0024] 1. Lead body; 11. Nickel core rod; 12. Silver-palladium alloy layer; 1201. Alloy tube; 1202. Sealing plate; 13. Palladium layer; 1301. Tube layer; 1302. Sealing layer. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Reference Figure 1 - Figure 3 One embodiment of this utility model is a thin-film resistor lead wire, which includes a lead wire body 1, the lead wire body 1 being composed of a nickel core rod 11, a silver-palladium alloy layer 12 and a palladium layer 13;

[0027] The silver-palladium alloy layer 12 is wrapped around the outer cylindrical surface and end face of the nickel core rod 11, completely covering the nickel core rod 11. The silver-palladium alloy layer 12 makes the resistance leads have both good conductivity and oxidation resistance, preventing silver migration.

[0028] The palladium layer 13 is wrapped around the outer cylindrical surface and end face of the silver-palladium alloy layer 12, completely covering the silver-palladium alloy layer 12. The palladium layer 13 can better suppress the diffusion and oxidation of silver, improve long-term stability, and extend the service life of the thin film resistor leads.

[0029] The silver-palladium alloy layer 12 includes an alloy tube 1201 and a sealing plate 1202. The inner wall of the alloy tube 1201 is fixedly connected to the outer wall of the nickel core rod 11, and the side wall of the sealing plate 1202 is fixedly connected to the end of the nickel core rod 11. The side wall of the sealing plate 1202 is fixedly connected to the end of the alloy tube 1201. The sealing plate 1202 can seal the end of the nickel core rod 11.

[0030] The palladium layer 13 includes a tube layer 1301 and a sealing layer 1302. The inner wall of the tube layer 1301 is fixedly connected to the outer wall of the alloy tube 1201, and the side wall of the sealing layer 1302 is fixedly connected to the side of the sealing plate 1202. The side wall of the sealing layer 1302 is fixedly connected to the tube end of the tube layer 1301. The sealing layer 1302 can seal the tube end of the silver-palladium alloy layer 12, effectively inhibiting the oxidation of silver.

[0031] The nickel core rod 11 has a diameter of 0.1 to 0.3 mm, the silver-palladium alloy layer 12 has a thickness of 0.01 to 0.03 mm, and the palladium layer 13 has a thickness of 0.02 to 0.03 mm.

[0032] The method for preparing thin-film resistor leads in this embodiment:

[0033] A silver-palladium alloy with a palladium content of 5% is obtained and hot-forged and cold-rolled into a silver-palladium alloy plate.

[0034] Silver-palladium alloy plates are rolled into coarse alloy tubes in the annealed state. The seams of the resulting coarse alloy tubes are welded using oxyhydrogen welding, and the welds are then shaped.

[0035] The silver-palladium alloy tubes are drawn into regular shapes with a diameter of 15mm-20mm, a wall thickness of 0.5mm, and a length of 150mm-200mm on a drawing machine. The silver-palladium alloy tubes are then cleaned and prepared for use.

[0036] Pure nickel is melted in a vacuum melting furnace and poured into a silver-palladium alloy tube. After the nickel melt cools, the alloy rod is annealed in a vacuum at a temperature of 600℃-750℃ for 2 hours. The annealed alloy rod is then cooled to room temperature.

[0037] The alloy rod is electroplated with a layer of palladium using an electroplating device.

[0038] The palladium-plated alloy rod is rolled on a roll pass mill, with each deformation of the alloy rod being 3%-5%, and the total deformation being controlled at 50%-60%.

[0039] The alloy bar after vacuum rolling is annealed again at a temperature of 600℃-750℃ for 2 hours, and then rolled again until its diameter is rolled to 4.0 mm.

[0040] Vacuum annealing is performed on the 4.0mm alloy rod, and then wire drawing is performed on the 4.0mm alloy rod. The deformation amount of each pass is 3%-5%, and the total deformation amount of the alloy rod is controlled at 50%-60%. Vacuum annealing is performed after each wire drawing pass until the alloy rod is drawn to the finished size.

[0041] The alloy wire was annealed in a vacuum at 500℃-550℃ for 20 minutes.

[0042] Cut both ends of the alloy wire, immerse both ends in the molten silver-palladium alloy, and immediately remove them to form a sealing ring 1202. After the silver-palladium alloy solution cools, immerse both ends in the molten palladium metal, and immediately remove them to form a sealing layer 1302, thus obtaining the finished resistor lead wire.

[0043] Working principle: The nickel core rod 1 provides excellent mechanical strength and thermal stability for the resistance leads. The silver-palladium alloy layer 12 on the outer wall of the nickel core rod 1 gives the resistance leads both good conductivity and oxidation resistance, preventing silver migration. The composite structure of the resistance leads balances conductivity, weldability, and structural strength, meeting the stringent requirements of thin-film resistors for temperature drift. The palladium layer 13 electroplated on the surface of the resistance leads further suppresses silver diffusion and oxidation, improves long-term stability, and extends the service life of the thin-film resistor leads.

[0044] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A thin-film resistor lead, comprising a lead body (1), characterized in that: The lead body (1) is composed of a nickel core rod (11), a silver-palladium alloy layer (12), and a palladium layer (13); The silver-palladium alloy layer (12) wraps around the outer cylindrical surface and end face of the nickel core rod (11), completely covering the nickel core rod (11); The palladium layer (13) is wrapped around the outer cylindrical surface and end face of the silver-palladium alloy layer (12), completely covering the silver-palladium alloy layer (12).

2. The thin-film resistor lead according to claim 1, characterized in that: The silver-palladium alloy layer (12) includes an alloy tube (1201) and a sealing plate (1202); The inner wall of the alloy tube (1201) is fixedly connected to the outer wall of the nickel core rod (11); The sidewall of the sealing plate (1202) is fixedly connected to the end of the nickel core rod (11), and the sidewall of the sealing plate (1202) is fixedly connected to the end of the alloy tube (1201).

3. A thin-film resistor lead according to claim 1, characterized in that: The palladium layer (13) includes a tube layer (1301) and a sealing layer (1302); The inner wall of the tube layer (1301) is fixedly connected to the outer wall of the alloy tube (1201); The sidewall of the sealing layer (1302) is fixedly connected to the side of the sealing plate (1202), and the sidewall of the sealing layer (1302) is fixedly connected to the end of the tube layer (1301).

4. A thin-film resistor lead according to claim 1, characterized in that: The diameter of the nickel core rod (11) is 0.1 to 0.3 mm.

5. A thin-film resistor lead according to claim 1, characterized in that: The thickness of the silver-palladium alloy layer (12) is 0.01 to 0.03 mm.

6. A thin-film resistor lead according to claim 1, characterized in that: The thickness of the palladium layer (13) is 0.02 to 0.03 mm.

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