A laminated capacitor

Abstract

The utility model discloses a laminated capacitor relates to capacitor technical field, including resin shell, the resin shell upside is provided with the heat dissipation rib plate, the resin shell inside verticality is provided with the outer electrode, the outer electrode opposite side horizontal surface is provided with the inner electrode, the outer electrode downside fixedly connected with the pin, the pin is integrative on the convex disc, the utility model discloses the pin and the convex disc of setting, make the convex disc on the pin welds the pin, welds the connection of convex disc and welding position, improves the connection strength of pin and welding area whole, avoids the fracture.

Description

Technical Field

[0001] This utility model relates to the field of capacitor technology, specifically to a multilayer capacitor. Background Technology

[0002] Multilayer ceramic capacitors are electronic components formed by alternating layers of ceramic dielectric and metal electrodes. Their core structure consists of an internal electrode layer, a ceramic dielectric layer, and an external electrode.

[0003] In existing multilayer capacitors, the leads are thin metal pieces. When soldering, the connection strength between the leads and the soldering area is generally weak. After prolonged use, the leads are prone to breakage at the soldering contact point, affecting the safe operation of the capacitor. In addition, the heat dissipation effect of existing multilayer capacitors is affected by the outer ceramic and resin layers, which in turn affects the heat dissipation performance. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the existing defects and provide a multilayer capacitor. By setting the pins and the raised disk, the raised disk on the pin is welded to the welding position when the pin is soldered, which improves the overall connection strength between the pin and the welding area and avoids breakage. This can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a multilayer capacitor, comprising a resin shell, a heat dissipation rib provided on the upper side of the resin shell, an external electrode vertically disposed inside the resin shell, an internal electrode horizontally disposed on the opposite side of the external electrode, a pin fixedly connected to the lower side of the external electrode, and a raised disk integrally formed on the pin.

[0006] Furthermore, a ceramic dielectric layer is disposed in the cavity between the inner electrodes, and the upper side of the outer electrode is connected to the heat dissipation fins by thermally conductive adhesive.

[0007] Furthermore, the cross-section of the raised disk is a frustum structure, and the resin shell wraps around the outer electrode and the outermost inner electrode.

[0008] Furthermore, thin plate structures are vertically and evenly spaced on the upper side of the heat dissipation rib, and the ceramic dielectric layer is filled between the inner electrodes.

[0009] Furthermore, there are five raised disks on the pin.

[0010] Furthermore, the resin shell has a thickness of 1 mm.

[0011] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model, through the setting of pins and raised discs, enables the raised discs on the pins to be welded to the welding position when the pins are welded, thereby improving the overall connection strength between the pins and the welding area and avoiding breakage. 2. This utility model uses heat dissipation fins to ensure close contact between the heat dissipation fins and the upper side of the external electrode, thereby allowing the heat generated by the capacitor to be quickly dissipated through the heat dissipation fins, improving the heat dissipation effect, and thus ensuring the operational stability of the capacitor. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This utility model Figure 1 Schematic diagram of the main sectional structure; Figure 3 This utility model Figure 1 A schematic diagram of the main cross-sectional structure of the middle pin.

[0013] In the diagram: 1. Resin housing; 2. Pins; 3. Raised disk; 4. External electrode; 5. Internal electrode; 6. Ceramic dielectric layer; 7. Heat dissipation fins. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Please see Figure 1-3 This embodiment provides a technical solution: a multilayer capacitor, including a resin shell 1, a heat dissipation rib 7 on the upper side of the resin shell 1, an external electrode 4 vertically arranged inside the resin shell 1, an internal electrode 5 horizontally arranged on the opposite side of the external electrode 4, a pin 2 fixedly connected to the lower side of the external electrode 4, and a raised disk 3 integrally formed on the pin 2.

[0016] like Figure 1-3 As shown, during use, pin 2 is soldered to the circuit board. During soldering, the soldering position can be moved to the raised disk 3 using a soldering gun, so that pin 2 is soldered to the conductive structure on the circuit board through the structure of the raised disk 3, ensuring the strength of the connection position and preventing pin 2 from breaking after long-term use. The heat dissipation fin 7 can quickly dissipate the heat generated by the external electrode 4, improve heat dissipation efficiency, and ensure the stability of capacitor operation.

[0017] A ceramic dielectric layer 6 is disposed in the cavity between the inner electrodes 5, and the upper side of the outer electrode 4 is connected to the heat dissipation fin 7 by thermally conductive adhesive.

[0018] The raised disc 3 has a frustum cross-section, and the resin shell 1 is wrapped around the outer electrode 4 and the outermost inner electrode 5.

[0019] Thin plate structures are vertically and evenly spaced on the upper side of the heat dissipation fin 7, and the ceramic dielectric layer 6 is filled between the inner electrodes 5.

[0020] There are five raised disks 3 on pin 2.

[0021] The resin outer shell 1 has a thickness of 1mm.

[0022] The working principle of the multilayer capacitor provided by this utility model is as follows: Figures 1-3 As shown, during use, pin 2 is soldered to the circuit board. During soldering, the soldering position can be moved to the raised disk 3 using a soldering gun, so that pin 2 is soldered to the conductive structure on the circuit board through the structure of the raised disk 3, ensuring the strength of the connection position and preventing pin 2 from breaking after long-term use. The heat dissipation fin 7 can quickly dissipate the heat generated by the external electrode 4, improve heat dissipation efficiency, and ensure the stability of capacitor operation.

[0023] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A multilayer capacitor, comprising a resin casing (1), characterized in that: The resin shell (1) is provided with a heat dissipation rib (7) on the upper side. An external electrode (4) is vertically arranged inside the resin shell (1). An internal electrode (5) is horizontally arranged on the opposite side of the external electrode (4). A pin (2) is fixedly connected to the lower side of the external electrode (4). A raised disc (3) is integrally formed on the pin (2).

2. A multilayer capacitor according to claim 1, characterized in that: A ceramic dielectric layer (6) is provided in the cavity between the inner electrodes (5), and the upper side of the outer electrode (4) is connected to the heat dissipation rib (7) by thermally conductive adhesive.

3. A multilayer capacitor according to claim 1, characterized in that: The raised disc (3) has a frustum cross-section, and the resin shell (1) wraps around the outer electrode (4) and the outermost inner electrode (5).

4. A multilayer capacitor according to claim 2, characterized in that: The heat dissipation rib (7) has thin plate structures vertically opened at equal intervals on its upper side, and the ceramic dielectric layer (6) fills the spaces between the inner electrodes (5).

5. A multilayer capacitor according to claim 1, characterized in that: There are five raised disks (3) on the pin (2).

6. A multilayer capacitor according to claim 1, characterized in that: The resin shell (1) has a thickness of 1 mm.

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