A patch capacitor

CN224803763UActive Publication Date: 2026-09-25DONGGUAN A FRIEND IND CO LTD
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Patent Information

Application Number
CN202521990931.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-16
Publication Date
2026-09-25
Estimated Expiration
2035-09-16

AI Technical Summary

Technical Problem

[0003]现有的贴片式电容在使用时,电容的正极和负极下侧面为平面结构,在将电容与电路板进行焊接时,融化的锡料与正负极下侧面连接,正负极下侧面与电路板之间的连接强度一般,使得电容与电路板之间容易脱落

Benefits of technology

1、该实用新型通过设置的正极、负极和圆孔槽,使得正极和负极与电路板锡焊连接时,熔融的锡焊料可以渗入圆孔槽内,凝固后的锡料可以稳定卡紧在正负极的圆孔槽内,进而提高正负极与电路板的连接强度,避免电容脱落。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of patch type capacitors, it is related to patch type capacitor technical field, including solid sintered block, solid sintered block inside is inserted with tantalum rod, the positive pole is welded in the tantalum rod far from the solid sintered block one end, the solid sintered block outside is wrapped with dielectric film, the dielectric film outside is provided with manganese dioxide electrolyte, the graphite layer is wrapped outside the manganese dioxide electrolyte, the silver coating is provided on the graphite layer outside. The utility model is provided with positive pole, negative pole and round hole groove, so that when positive pole and negative pole are connected with circuit board soldering, molten soldering material can penetrate into round hole groove, and solidified tin material can be stably clamped in the round hole groove of positive and negative pole, thereby improving the connection strength of positive and negative pole and circuit board, to avoid capacitor drop.
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Description

Technical Field

[0001] This utility model relates to the field of surface mount capacitor technology, specifically a surface mount capacitor. Background Technology

[0002] Surface mount tantalum capacitors, a type of electrolytic capacitor, are widely used in various electronic products, especially in high-density assembled products with limited internal space, such as mobile phones and portable printers. Surface mount tantalum capacitors use tantalum (Ta) as the anode material and can be further divided into foil type and sintered tantalum type according to the different anode structures.

[0003] In existing surface mount capacitors, the bottom surfaces of the positive and negative terminals are planar. When soldering the capacitor to the circuit board, the molten solder connects with the bottom surfaces of the positive and negative terminals. The connection strength between the bottom surfaces of the positive and negative terminals and the circuit board is generally weak, making it easy for the capacitor to detach from the circuit board. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the existing defects and provide a surface-mount capacitor. By setting a positive electrode, a negative electrode, and a circular slot, when the positive and negative electrodes are soldered to the circuit board, the molten solder can penetrate into the circular slot, and the solidified solder can be stably clamped in the circular slot of the positive and negative electrodes, thereby improving the connection strength between the positive and negative electrodes and the circuit board, preventing the capacitor from falling off, and effectively solving the problems in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a surface-mount capacitor, comprising a solid sintered block, a tantalum rod inserted inside the solid sintered block, a positive electrode welded to the end of the tantalum rod away from the solid sintered block, a dielectric film wrapped around the outside of the solid sintered block, a manganese dioxide electrolyte disposed outside the dielectric film, a graphite layer wrapped around the manganese dioxide electrolyte, a silver coating disposed outside the graphite layer, a negative electrode disposed on the upper side of the silver coating, a silver paste layer disposed between the negative electrode and the silver coating, and a circular groove formed on the lower side of the lower ends of the positive and negative electrodes.

[0006] Furthermore, the outermost layer of the silver coating is covered with an epoxy resin layer, and a polarity marking area is provided on the upper side of the epoxy resin layer.

[0007] Furthermore, a gasket is fitted around the dielectric film outside the tantalum rod, and the positive and negative electrodes are made of silver material.

[0008] Furthermore, the dielectric film is tantalum pentoxide, the solid sintered block has a porous tantalum particle structure, and the gasket is made of polytetrafluoroethylene material.

[0009] Furthermore, the cross-section of the circular groove is a frustum structure, and the negative electrode is connected to the silver coating through the silver paste layer.

[0010] Furthermore, a raised epoxy resin layer structure is provided between the lower horizontal portions of the positive electrode and the negative electrode.

[0011] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model, through the setting of positive and negative electrodes and circular slots, allows molten solder to penetrate into the circular slots when the positive and negative electrodes are soldered to the circuit board. The solidified solder can be stably clamped in the circular slots of the positive and negative electrodes, thereby improving the connection strength between the positive and negative electrodes and the circuit board and preventing the capacitor from falling off. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the main cross-sectional structure of this utility model; Figure 3 This utility model Figure 1 A schematic diagram of the positive electrode structure viewed from below.

[0013] In the diagram: 1. Positive electrode; 2. Negative electrode; 3. Epoxy resin layer; 4. Tantalum rod; 5. Gasket; 6. Dielectric membrane; 7. Manganese dioxide electrolyte; 8. Graphite layer; 9. Silver coating; 10. Silver paste layer; 11. Polarity marking area; 12. Solid sintered block; 13. Circular groove. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Please see Figure 1-3 This embodiment provides a technical solution: a surface-mount capacitor, including a solid sintered block 12, a tantalum rod 4 inserted inside the solid sintered block 12, a positive electrode 1 welded to the end of the tantalum rod 4 away from the solid sintered block 12, a dielectric film 6 wrapped around the outside of the solid sintered block 12, a manganese dioxide electrolyte 7 disposed outside the dielectric film 6, a graphite layer 8 wrapped around the manganese dioxide electrolyte 7, a silver coating 9 disposed outside the graphite layer 8, a negative electrode 2 disposed on the upper side of the silver coating 9, a silver paste layer 10 disposed between the negative electrode 2 and the silver coating 9, and a circular groove 13 opened on the lower side of the lower end of the positive electrode 1 and the negative electrode 2.

[0016] The outermost layer of the silver coating 9 is covered by an epoxy resin layer 3, and a polarity marking area 11 is provided on the upper side of the epoxy resin layer 3.

[0017] A gasket 5 is fitted on the outside of the dielectric film 6 outside the tantalum rod 4, and the positive electrode 1 and the negative electrode 2 are made of silver.

[0018] The dielectric film 6 is tantalum pentoxide, the solid sintered block 12 has a porous tantalum particle structure, and the gasket 5 is made of polytetrafluoroethylene.

[0019] The cross-section of the circular slot 13 is a frustum structure, and the negative electrode 2 and the silver coating 9 are connected through the silver paste layer 10.

[0020] An epoxy resin layer 3 protrusion structure is provided between the lower horizontal portions of the positive electrode 1 and the negative electrode 2.

[0021] The working principle of the surface-mount capacitor provided by this utility model is as follows: Figures 1-3 As shown, during use, the positive electrode 1 and negative electrode 2 are soldered to the circuit board using solder paste. The tantalum rod 4 is connected to the solid sintered block 12, which serves as the anode and the manganese dioxide electrolyte 7 as the cathode. The gasket 5 supports the tantalum rod 4, and the dielectric film 6 separates the solid sintered block 12 from the manganese dioxide electrolyte 7. When the lower sides of the positive electrode 1 and negative electrode 2 are soldered to the circuit board, the molten solder enters the circular groove 13 and solidifies, making the circuit board firmly connected to the positive electrode 1 and negative electrode 2 and preventing the capacitor from falling off the circuit board.

[0022] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A surface-mount capacitor, comprising a solid sintered block (12), characterized in that: A tantalum rod (4) is inserted inside the solid sintered block (12). A positive electrode (1) is welded to the end of the tantalum rod (4) away from the solid sintered block (12). A dielectric film (6) is wrapped around the outside of the solid sintered block (12). A manganese dioxide electrolyte (7) is disposed on the outside of the dielectric film (6). A graphite layer (8) is wrapped around the outside of the manganese dioxide electrolyte (7). A silver coating (9) is disposed on the outside of the graphite layer (8). A negative electrode (2) is disposed on the upper side of the silver coating (9). A silver paste layer (10) is disposed between the negative electrode (2) and the silver coating (9). A circular groove (13) is opened on the lower side of the lower end of the positive electrode (1) and the negative electrode (2).

2. A surface mount capacitor according to claim 1, characterized in that: The outermost layer of the silver coating (9) is covered by an epoxy resin layer (3), and a polarity marking area (11) is provided on the upper side of the epoxy resin layer (3).

3. A surface mount capacitor according to claim 2, characterized in that: A gasket (5) is fitted on the outside of the dielectric film (6) outside the tantalum rod (4), and the positive electrode (1) and the negative electrode (2) are made of silver.

4. A surface mount capacitor according to claim 3, characterized in that: The dielectric film (6) is tantalum pentoxide, the solid sintered block (12) is a porous tantalum particle structure, and the gasket (5) is made of polytetrafluoroethylene.

5. A surface-mount capacitor according to claim 4, characterized in that: The cross-section of the circular groove (13) is a frustum structure, and the negative electrode (2) and the silver coating (9) are connected through the silver paste layer (10).

6. A surface mount capacitor according to claim 2, characterized in that: The epoxy resin layer (3) protrusion structure is provided between the lower horizontal portion of the positive electrode (1) and the negative electrode (2).