Miniaturized permanent magnet focusing velocity modulation tube, microwave power module and system

Abstract

The utility model provides a kind of miniaturization permanent magnet focusing klystron, microwave power module and system.The klystron includes electron gun, high-frequency component, output waveguide, output window and integrated collector, and the cavity of the collector is used to collect electron beam from high-frequency component;The collector body forming cavity includes heat dissipation part, and the heat dissipation part includes heat dissipation surface for conduction heat dissipation.The collector is designed in one piece, with the body as the conduction medium, and heat dissipation is achieved through direct contact between the heat dissipation surface and the cooling plate, without the need for additional water jacket or other heat dissipation structures, effectively solving the problems of complex structure and difficult processing caused by heat dissipation components in existing microwave tubes, while meeting the design requirements of miniaturization and array.

Description

Technical Field

[0001] This utility model relates to the field of microwave vacuum electronic device technology. More specifically, it relates to a miniaturized permanent magnet focusing klystron, a microwave power module, and a system. Background Technology

[0002] As the core final-stage power amplifier of microwave electronic systems, klystrons are widely used in high-power microwave equipment, non-destructive testing equipment, and medical treatment equipment. Their modular application is a key direction for improving system integration efficiency.

[0003] Traditional klystrons with peak power ranging from hundreds of kilowatts to megawatts employ electromagnetic focusing designs, resulting in weights in the hundreds of kilograms and large sizes, making them completely unsuitable for modular applications. Although the industry has achieved initial breakthroughs in miniaturization by reducing the weight to tens of kilograms through permanent magnet focusing technology, even higher standards for klystron miniaturization are still needed to truly meet the requirements of modular applications. Utility Model Content

[0004] In view of the above problems, one object of this utility model is to provide a miniaturized permanent magnet focusing klystron.

[0005] Another objective of this invention is to provide a microwave power module.

[0006] Another objective of this invention is to provide a microwave power array system.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: According to one aspect of the present invention, a miniaturized permanent magnet focusing klystron is provided, the klystron comprising: an electron gun, a high-frequency component, an output waveguide, an output window, and an integrated collector electrode. The integrated collecting electrode has a cavity and a heat dissipation section. The cavity is used to collect the electron beam after interaction, and the heat dissipation section provides a heat dissipation surface for contact with the cooling plate. The collecting electrode dissipates heat to the cooling plate through the heat dissipation surface to achieve heat dissipation. Alternatively, the cavity wall on the side near the heat dissipation surface can be sloped to allow the cavity wall near the heat dissipation surface to trap more electrons.

[0008] Alternatively, at least a portion of the transverse cross-section of the collecting electrode gradually decreases in size along the direction away from the heat dissipation surface; and / or At least a portion of the longitudinal cross-section of the collecting electrode gradually decreases in size along the direction away from the high-frequency component.

[0009] Alternatively, the collecting electrode can be fabricated from bulk oxygen-free copper.

[0010] Alternatively, the heat dissipation part may have a mounting portion, and the mounting portion may have mounting holes.

[0011] Alternatively, the output waveguide may have a long side that is 0.75-1.0 times the long side of the standard waveguide of the klystron, and a short side that is 0.2-0.9 times the short side of the standard waveguide of the klystron. One side of the output window is connected to the output waveguide, and the other side provides a standard waveguide interface.

[0012] Alternatively, the output waveguide can be connected to the output cavity of the high-frequency component to convert the radial output of the output cavity into an axial output.

[0013] Alternatively, the thickness of the thinnest part of the collecting electrode cavity wall can be 2-4 mm.

[0014] Alternatively, the klystron may also include an input window, which uses an angled SMA connector to convert radial input of the input cavity into axial input.

[0015] Alternatively, the klystron may include a periodic permanent magnet focusing system.

[0016] Alternatively, the klystron can have an average output power in the hundreds of watts range.

[0017] Alternatively, the klystron can operate in the Ku band, have a peak output power of 500kW, and an overall weight of ≤1.1kg. The klystron operates in the X-band, has a peak output power of 600kW, and weighs approximately 1.4kg; or The klystron operates in the C-band, has a peak output power of 500kW, and an overall weight of ≤2.5kg. Alternatively, the output waveguide of the klystron can be welded and fixed to the collector electrode.

[0018] Alternatively, the outer surface of the collector electrode may further include a plane extending along the collector electrode axis, and at least a portion of the output waveguide extends axially along this plane.

[0019] According to another aspect of the present invention, a microwave power module is provided, including a power supply, a cooling plate, and a plurality of miniaturized permanent magnet focusing klystrons as described above, wherein the cooling plate is provided with a cooling surface, and the heat dissipation surface of the collecting electrode of the klystron is in contact with the cooling surface of the cooling plate.

[0020] According to another aspect of the present invention, a microwave power array system is provided, the system comprising a plurality of microwave power modules arranged in an array as described above.

[0021] The beneficial effects of this utility model are as follows: To address the technical problems existing in the prior art, this utility model provides a miniaturized permanent magnet focusing klystron and microwave power module. The collector electrode adopts an integrated design, using the material of the collector electrode body as the conduction medium and the cooling plate used in the power module as the carrier for heat transfer and diffusion. Heat is transferred through direct contact or welding between the heat dissipation surface of the collector electrode and the cooling surface of the cooling plate, achieving heat dissipation of the collector electrode. Compared with water-cooled collector electrodes, the collector electrode of this invention eliminates the need for an additional water jacket structure and water circulation system, effectively solving the problems of multiple water inlet and outlet interfaces, complex assembly, and leakage risk caused by the complex structure of water cooling systems in existing microwave tubes and high-power modules. Compared with air-cooled collector electrodes, the collector electrode of this invention omits heat dissipation structures such as fins, reducing its volume by more than 50%, thereby significantly reducing the volume and weight of the microwave tube.

[0022] In this invention, the minimum heat dissipation area of ​​the collector electrode heat dissipation surface is determined by the design power of the microwave tube, the operating temperature of the cooling plate, and the material of the collector electrode body, to ensure that the collector electrode quickly and fully dissipates the heat generated by the electron beam at the collector electrode. The heat dissipation effect of the collector electrode provided by this invention depends on the size of the heat dissipation surface area but not on the shape of the heat dissipation surface, which greatly facilitates the design of the collector electrode heat dissipation surface shape and the shape of the collector electrode body. Designers can flexibly design the shape of the collector electrode, the shape of the heat dissipation surface, and the shape of the microwave tube according to the space requirements of the power module, so as to make full use of the limited space of the power module and realize miniaturized power modules and high-power-density, arrayed microwave power systems.

[0023] In this invention, the cavity wall of the collector electrode cavity near the heat dissipation surface has an angle with respect to the central axis of the electron beam. The cavity wall near the heat dissipation surface can capture more electrons, which can further improve the heat dissipation efficiency of the collector electrode. The local maximum temperature rise of the collector electrode can be reduced by 17.8% compared with the symmetrical cavity structure. This provides an integrated collector electrode that is more conducive to the miniaturization design of the collector electrode and the miniaturization design of the power module. Attached Figure Description

[0024] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0025] Figure 1 A front view of the klystron provided in Embodiment 1 is shown.

[0026] Figure 2 A top view of the klystron provided in Embodiment 1 is shown.

[0027] Figure 3 A side view of the klystron provided in Embodiment 1 is shown.

[0028] Figure 4A schematic diagram of the collection pole side provided in Embodiment 1 is shown.

[0029] Figure 5 A front view of the klystron provided in Embodiment 2 is shown.

[0030] Figure 6 A top view of the klystron provided in Embodiment 2 is shown.

[0031] Figure 7 A side view of the klystron provided in Embodiment 2 is shown.

[0032] Figure 8 A schematic diagram of the collection pole side provided in Embodiment 2 is shown.

[0033] Figure 9 A front view of the klystron provided in Embodiment 3 is shown.

[0034] Figure 10 A top view of the klystron provided in Embodiment 3 is shown.

[0035] Figure 11 A side view of the klystron provided in Embodiment 3 is shown.

[0036] Figure 12 A schematic diagram of the collecting electrode provided in Example 3 is shown.

[0037] Figure 13A A longitudinal cross-sectional view of the collecting electrode of Example 4 is shown. Figure 13B Show Figure 13A The electron beam distribution in the collecting cavity is shown. Figure 13C Show Figure 13A The thermal analysis diagram of the collecting electrode and cooling plate is shown.

[0038] Figure 14A A longitudinal cross-sectional view of the collecting electrode of Example 5 is shown. Figure 14B Show Figure 14A The electron beam distribution in the collecting cavity is shown. Figure 14C Show Figure 14A The thermal analysis diagram of the collecting electrode and cooling plate is shown.

[0039] Figure 15 A schematic diagram of the microwave power module provided in Embodiment 6 of this utility model is shown. Detailed Implementation

[0040] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0041] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or a connection through an intermediate medium or gap; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0042] In this invention, unless otherwise expressly specified and limited, the first feature being "above" or "below" the second feature may include direct contact between the first and second features, or contact between the first and second features not being in direct contact but through another feature between them.

[0043] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0044] To enhance the power of high-power microwave systems while reducing their size and weight, phase scanning is required. Multi-element klystron integrated arrays can achieve phase scanning of the antenna by adjusting the phase at the input using a low-power phase shifter. Improving the operational effectiveness of microwave systems is crucial, particularly in maximizing the output power-to-mass ratio of individual power modules. Therefore, miniaturized integrated high-peak-power microwave tubes have become an ideal power source for microwave systems. Providing small, lightweight high-peak-power microwave tubes is fundamental to improving the applicability of microwave tube arrays in high-power microwave systems and reducing the overall size and weight of the system.

[0045] Microwave tubes are core components in fields such as radar, communications, and microwave heating. Their collectors generate a significant amount of heat during operation, and the effectiveness of heat dissipation directly impacts device performance and lifespan. Currently, the two main heat dissipation methods are water cooling and air cooling.

[0046] For example, water cooling requires components such as water nozzles and water pipes to remove the heat generated by the collector during operation through water circulation. While suitable for high-power applications, the additional water circuit components significantly increase structural complexity, and the water jacket manufacturing requires high-precision sealing and flow channel design, increasing the manufacturing difficulty. At the same time, the water circuit components occupy a lot of space, which contradicts the miniaturization requirements of microwave tubes. In array applications, the pipe layout is prone to mutual interference, making it difficult to achieve dense arrangement.

[0047] Air cooling relies on fans, heat sinks, and airflow channels to accelerate heat exchange and is mostly used in low- to medium-power devices. However, its heat dissipation structure requires specific design for the installation of heat sinks and fans, as well as the matching of airflow channels, which increases structural complexity and manufacturing costs. Furthermore, the presence of heat sinks and fans increases the size of the device, which not only hinders the miniaturization of microwave tubes, but also requires consideration of airflow interference between heat dissipation structures when designing arrays. Airflow interference affects heat dissipation efficiency and cannot meet the requirements of high-density applications.

[0048] To address the shortcomings of existing technologies, this utility model provides a miniaturized permanent magnet focusing klystron, combined with... Figure 1-12 As shown, the klystron includes a high-frequency component 2, an output waveguide 4, an output window 5, an integrated collector 1, and an electron gun 7. The collector 1 is an integrated or integrally molded structure used to collect and dissipate the electron beam after interaction, converting it into heat energy.

[0049] Figure 13A The present invention illustrates a collector electrode 100 according to Embodiment 4. The collector electrode 100 is an integral metal structure or a one-piece molded structure, used to collect and dissipate the electron beam after interaction, converting it into heat energy. For ease of description, the integral collector electrode is simply referred to as the collector electrode. The collector electrode 100 has a cavity 110 and a body forming the cavity, the body having a heat dissipation portion 120 providing a heat dissipation surface. The cavity 110 is located within the body of the collector electrode 100 and extends symmetrically along the direction of electron beam travel (also referred to herein as the axial direction, longitudinal direction), used to collect the electron beam after interaction from high-frequency components, such as... Figure 13B As shown. The portion of the collector electrode 100 body including the heat dissipation surface 121 is called the heat dissipation section 120. The collector electrode uses the body as a conduction medium, and contacts the cooling plate 3 through the heat dissipation surface 121 to transfer the heat generated during the operation of the collector electrode 100, thus conducting heat dissipation to the collector electrode. The heat dissipation section is designed such that the area of ​​the heat dissipation surface is sufficient to allow the collector electrode to dissipate heat to the cooling plate through conduction using the body as a conduction medium. The heat dissipation surface 121 is preferably a plane, in close contact with the cooling surface of the cooling plate 3, and is fixed by bolts or welding. Figure 13C The diagram shows the thermal analysis of a klystron with an average power in the hundreds of watts range, the collector electrode 100, and the cooling plate 3 in steady state. It can be seen that the collector electrode of this invention uses a metal body as the conductive medium, and heat dissipation is achieved through the heat dissipation surface 121 and the cooling plate, thus effectively cooling the collector electrode. This solves the problems of existing technologies where collector electrodes rely on water jackets or air cooling structures for water or air cooling, resulting in complex structures, large size, heavy weight, and difficult manufacturing. It provides a small and lightweight collector electrode, which is beneficial for the miniaturization of microwave tubes and their application in modular and array-based systems.

[0050] As a specific example, the wall thickness of the side 130 of the collector body away from the heat dissipation surface 121 can be less than the thickness of the heat dissipation part 120, and the size of the side 131 of the collector body away from the direction of the high frequency component gradually decreases, thereby reducing the height and weight of the collector.

[0051] Figure 14A The present invention illustrates a collector electrode 200 according to Embodiment 5. This collector electrode 200 is a one-piece metal structure, comprising a cavity 210 and a body forming the cavity. The body has a heat dissipation portion 220 providing a heat dissipation surface. Unlike the collector electrode 100 of Embodiment 1, the cavity 210 of the collector electrode 200 extends along the electron beam propagation direction and is arranged with an axially asymmetrical structure. The cavity wall 211 on the side near the heat dissipation surface is inclined relative to the cavity wall 212 on the side away from the heat dissipation surface. The cavity size decreases along the direction away from the high-frequency component, so that the cavity wall near the heat dissipation surface intercepts more electrons. Specifically, the cavity wall on the side near the heat dissipation surface of the cavity 210 is sloped. The lower sidewall of the cavity is close to the heat dissipation surface, which can improve heat dissipation efficiency. Figure 14B The collection of polar electron beam trajectory and Figure 14C Thermal analysis shows that the local maximum temperature rise of collector 200 can be reduced by 17.8% compared with the symmetrical cavity structure of collector 100.

[0052] In a specific embodiment, such as Figure 13C ,14C and Figure 1-12 As shown, the heat dissipation sections 120 and 220 are formed including mounting sections 122 for fixing. The mounting sections 122 are the edge portions on both sides of the heat dissipation section along the electron beam travel direction. Essentially, they provide a portion of the heat dissipation surface 121. This allows the heat dissipation surface 121 to both fit and contact the cooling plate 3, increasing its heat dissipation area, and to be connected and fixed to the cooling plate 3, ensuring effective contact between the heat dissipation surface 121 and the cooling plate 3. It should be noted that the size of the heat dissipation surface 121 needs to be specifically set according to the heat dissipation requirements of the collector electrode 1. The larger the heat dissipation surface 121, the higher the heat dissipation efficiency. However, an excessively large heat dissipation surface 121 will have an adverse effect on the miniaturization and array design of the microwave tube.

[0053] The minimum heat dissipation area of ​​the collector electrode heat dissipation surface of this invention is determined by the design power of the microwave tube, the operating temperature of the cooling plate, and the material of the collector electrode body. The heat dissipation surface area is larger than this minimum heat dissipation area to ensure that the collector electrode can quickly and fully dissipate the heat generated by the electron beam at the collector electrode. The heat dissipation effect of the collector electrode of this invention mainly depends on the size of the heat dissipation surface area, not on the shape of the heat dissipation surface. This characteristic provides great convenience for the shape design and miniaturization design of the collector electrode.

[0054] When designing the shape of the heat dissipation surface, the overall volume of the microwave tube and its arraying requirements must also be considered. Designers can flexibly design the shape of the collector electrode, the shape of the heat dissipation surface, and the shape of the microwave tube based on the actual application's requirements for microwave tube performance, the space size of the power module, and the shape requirements of the power module for the microwave tube. This allows for full utilization of the limited space of the power module, enabling miniaturized power modules and high-density microwave power array systems. In other words, this invention provides possibilities for the structural design of the collector electrode and microwave tube, the miniaturization of microwave power modules, and the arraying of power modules.

[0055] In this invention, the output waveguide 4 is a miniaturized output waveguide, a narrow waveguide with a cross-sectional area smaller than that of a standard rectangular waveguide. In one specific embodiment, the long side of the cross-section of the output waveguide 4 is 0.75-1.0 times, preferably 0.75-0.8 times, the long side of the cross-section of the standard waveguide of the klystron, and the short side is 0.2-0.9 times, preferably 0.2-0.4 times, the short side of the cross-section of the standard waveguide of the klystron. This miniaturized output waveguide can match the cavity height and cavity width of the output cavity and cooperate with the miniaturized collector electrode, meeting the miniaturization design requirements of the klystron. In one embodiment, the output waveguide 4 can be directly connected to the output window 5, eliminating the need for a stepped waveguide from the output cavity to the standard waveguide, thereby reducing the overall volume and weight of the conventional output window and output waveguide, meeting the miniaturization design requirements.

[0056] In one specific embodiment, one side of the output window 5 is connected to the output waveguide 4, while the other side provides a standard waveguide interface for connection to a standard waveguide. The output window 5 adopts an asymmetrical design, with the transmission waveguides on both sides of the output window 5 being of different sizes. This design eliminates the need for a stepped waveguide while ensuring stable microwave transmission, allowing the output waveguide 4 to connect to the output window 5. This achieves the conversion from a miniaturized waveguide to a standard waveguide, reducing the overall size and weight of the output window 5 and the output waveguide 4, and improving the adaptability of miniaturized traveling wave tube applications.

[0057] In one specific embodiment, the output waveguide 4 is connected to the output cavity 21 of the high-frequency component 2, converting the radial output of the output cavity into an axial output. At least a portion of the output waveguide 4 extends axially along the klystron. In another specific embodiment, the output window 5 is located on the side of the collector 1 furthest from the high-frequency component 2, and is connected to the output cavity via the output waveguide 4. The structure of the output waveguide 4 is primarily used to reduce the radial dimension of the klystron, providing sufficient space for array applications of the klystron.

[0058] Specifically, in one embodiment, such as Figure 5 , Figure 9As shown, the output waveguide 4 includes a first waveguide section 41, which extends along the axial direction of the klystron. The end of the first waveguide 41 away from the high-frequency component 2 is connected to the output window 5.

[0059] In another embodiment, such as Figure 1 As shown, the output waveguide 4 includes a first waveguide section 41 and a second waveguide section 42. The first waveguide section 41 extends along the axial direction of the klystron. One end of the first waveguide section 41 is hermetically connected to the output cavity, and the other end is bent downwards to form the second waveguide section 42. The end of the second waveguide section 42 away from the first waveguide section 41 is hermetically connected to the output window 5. By bending the output waveguide, the overall height of the klystron can be reduced.

[0060] In another embodiment (not shown), the output waveguide bends from the output cavity towards the collector side and extends parallel to the collector axis, as needed. The output waveguide and collector are fixed together by welding with a support rod. In another embodiment (not shown), the output waveguide extends from the output cavity perpendicular to the klystron axis, as needed. By reducing the size of the output waveguide and collector, the klystron can be miniaturized and made lighter.

[0061] In one specific embodiment, the klystron further includes an input window, which employs an angled SMA connector 8 to convert radial input of the input cavity 22 into axial input, effectively reducing the radial dimension of the klystron and making it suitable for array applications of klystrons. Specifically, the connector 8 includes a first connecting portion 81 extending radially along the klystron and a second connecting portion 82 extending axially along the klystron.

[0062] In one embodiment, the klystron further includes a periodic permanent magnet focusing system (not shown in the figure). The periodic permanent magnet focusing system is sleeved on the outside of the high-frequency component 2. Compared with other focusing methods, it can reduce the radial dimension of the klystron and is suitable for array applications of klystrons.

[0063] In one specific embodiment, the heat dissipation part 12 further includes a mounting part 122 for fixing. The mounting part 122 is the edge portion extending from the heat dissipation surface 121 on both sides in the electron beam travel direction. Essentially, it is part of the heat dissipation surface 121. It serves both to increase the heat dissipation area of ​​the collector electrode by contacting the cooling plate 3, and to connect and fix it to the cooling plate 3, ensuring effective contact between the heat dissipation surface 121 and the cooling plate 3. It should be noted that the size of the heat dissipation surface 121 needs to be set according to the heat dissipation requirements of the collector electrode 1. The larger the heat dissipation surface 121, the higher the heat dissipation efficiency; however, an excessively large heat dissipation surface 121 will have an adverse effect on the miniaturization and array design of the klystron. Therefore, when designing the size of the heat dissipation surface 121, it is also necessary to consider the overall volume of the klystron and its array requirements.

[0064] In one specific embodiment, the mounting part 122 has a mounting hole 1221, which can be fixedly connected to the cooling plate 3 by bolts, thereby ensuring effective contact between the heat dissipation surface 121 and the cooling plate 3 and improving heat dissipation efficiency. The advantage of screwing the mounting part 122 to the cooling plate 3 through the mounting hole 1221 is that it can be easily disassembled, facilitating subsequent maintenance and replacement. As another specific embodiment, the mounting part 122 and the cooling plate 3 can be fixedly connected by welding, which has a simpler structure and can also ensure effective contact between the heat dissipation surface 121 and the cooling plate 3, improving heat dissipation efficiency.

[0065] In one embodiment, at least a portion of the transverse cross-section of the collecting electrode 1 gradually decreases in size along the direction away from the heat dissipation surface. Specifically, the transverse dimension of the collecting electrode 1 gradually decreases along the direction away from the heat dissipation surface 121.

[0066] In one embodiment, at least a portion of the longitudinal cross-section of the collecting electrode 1 gradually decreases in size along the direction away from the high-frequency component 2. Specifically, the longitudinal dimension of the collecting electrode 1 gradually decreases along the direction away from the high-frequency component 2.

[0067] In this embodiment, the heat dissipation surface is located at the bottom of the collector electrode. The lateral dimension of the collector electrode 1 can be understood as its dimension in the first direction (X direction), and the longitudinal dimension of the collector electrode 1 can be understood as its dimension in the third direction (Y direction). Specifically, the first direction is the direction perpendicular to the plane formed by the second direction and the third direction, the second direction is the electron beam propagation direction (Z direction), and the third direction is the direction perpendicular to the heat dissipation surface 121. It should be noted that the lateral dimension of the collector electrode 1 mentioned in this embodiment refers to the lateral dimension of the collector electrode 1 body, not the dimension of the cavity. Similarly, the longitudinal dimension of the collector electrode 1 mentioned in this embodiment refers to the longitudinal dimension of the collector electrode 1 body, specifically the dimension of the collector electrode 1 from the high-frequency component side to the end of the collector electrode.

[0068] In this embodiment, heat dissipation of the collecting electrode 1 is mainly achieved through the heat dissipation surface 121 in contact with the cooling surface of the cooling plate and the heat dissipation portion 12 providing the heat dissipation surface 121. Experiments show that reducing the size of the portion of the collecting electrode away from the heat dissipation portion does not substantially affect the heat dissipation effect. Furthermore, the lateral dimension of the collecting electrode 1 decreases in the cavity portion along the direction away from the heat dissipation surface 121, which can achieve weight reduction of the collecting electrode 1 without affecting the heat dissipation effect, thus meeting the design requirements of miniaturization and lightweighting. Figure 13A and 14A As shown, the inner diameter of cavities 110 and 210 also shows a gradual decreasing trend at the ends far from the high-frequency components. The variation law of the longitudinal dimension of the collector electrode, combined with the structure of the cavity, can also reduce the weight of the collector electrode without affecting the heat dissipation effect, thus achieving the requirements of miniaturization and lightweight design of the collector electrode.

[0069] In one embodiment, the outer surface of the collector 1 also includes a plane 13 extending along the axial direction of the collector 1. This plane is generally disposed opposite to the heat dissipation surface 121 and is used to provide space for the setting of the output waveguide 4. The output waveguide 4 is generally a rectangular waveguide. The output waveguide 4 is disposed in close to the plane 13 and extends along the electron beam travel direction. It is welded and fixed to the plane 13, which can reduce the overall radial dimension of the klystron. At the same time, it can also provide some heat dissipation for the collector 1 by contacting the collector 1, further improving the heat dissipation efficiency.

[0070] Furthermore, in one embodiment, the output waveguide 4 and the collector 1 are welded together by a support rod 6. One end of the support rod 6 is welded to the plane 13, and the other end is welded to the plane of the output waveguide 4. The support rod 6 can provide support for the output waveguide 4 and can also transfer heat between the collector 1 and the output waveguide 4, providing some heat dissipation for the collector 1 and further improving the heat dissipation efficiency.

[0071] In one embodiment, the integrated collector electrode is fabricated from bulk oxygen-free copper. The integrated collector electrode provided by this invention has a simple structure and can be easily fabricated using bulk materials through machining or laser processing. For array-type integrated microwave power devices requiring hundreds or thousands of klystrons, the integrated collector electrode of this invention can save processing costs, shorten the processing cycle, and improve the yield rate.

[0072] In one embodiment, the thickness of the collector cavity wall at its thinnest point is 2-4 mm. Reducing the thickness of the collector body in the cavity portion, for example, reducing the thickness of the side of the collector away from the heat dissipation surface, can further reduce the weight of the collector while ensuring that the strength of the collector cavity is sufficient to withstand the strength of the electron beam. This satisfies the requirements for heat dissipation, miniaturization, and arraying of the collector.

[0073] The miniaturized klystron provided in the embodiments of this utility model will be described in detail below through examples.

[0074] Example 1 The operating frequency band is Ku-band, and the miniaturized klystron has a peak output power of 500kW and an average power of hundreds of watts. The overall weight is ≤1.1kg.

[0075] like Figure 1-4 As shown, the miniaturized klystron includes an electron gun 7, a collector electrode 1, a high-frequency component 2, an output waveguide 4, and an output window 5.

[0076] The collector 1 is a one-piece molded structure, including a cavity located within the body of the collector 1 and extending along the direction of electron beam travel. The cavity is used to collect electron beams from the high-frequency component 2.

[0077] The collector electrode 1 body is provided with a heat dissipation part 12 for conducting heat dissipation. The heat dissipation part 12 includes a heat dissipation surface 121 that provides contact area and a mounting part 122 for fixing. The heat dissipation surface 121 is a plane and is located at the bottom of the collector electrode. The mounting part 122 is the edge portion of the heat dissipation surface 121 on both sides along the electron beam travel direction. The mounting part 122 has mounting holes 1221 for fixed connection with the cooling surface of the cooling plate 3. The heat dissipation surface is in close contact with the cooling surface of the cooling plate.

[0078] The lateral dimension of collector 1 decreases in the direction away from heat dissipation surface 121, and the longitudinal dimension of collector 1 decreases in the direction away from high-frequency component 2, such as... Figure 2 As shown, the four corners of the heat dissipation surface 121 are all provided with chamfered structures to reduce the weight of the collector electrode 1 without affecting the heat dissipation efficiency, which is more in line with the miniaturization and lightweight design concept.

[0079] like Figure 1 As shown, the output waveguide 4 includes a first waveguide section 41 and a second waveguide section 42. The first waveguide section 41 extends along the axial direction of the klystron. One end of the first waveguide section 41 is hermetically connected to the output cavity 21, and the other end is bent downward to form the second waveguide section 42. The second waveguide section 42 is hermetically connected to the output window 5.

[0080] The output waveguide 4 is welded and fixed to the collector electrode 1. The outer surface of the collector electrode 1 includes a plane 13 extending along the axial direction of the collector electrode 1. The plane of the first waveguide part 41 is welded and fixed to the plane 13, which can effectively reduce the radial dimension of the klystron, fix the position of the output waveguide 4, and also allow the output waveguide 4 to contact the collector electrode 1, providing some heat dissipation for the collector electrode 1 and further improving the heat dissipation efficiency.

[0081] In this embodiment, the maximum lateral dimension a of the collecting electrode 1 is approximately 37 mm, which is greater than the maximum lateral dimension b of the output window 5. The maximum radial dimension L of the klystron is approximately 39 mm, and the radial dimension of the klystron meets the requirements of miniaturization design.

[0082] Example 2 The miniaturized klystron operates in the X-band, has a peak output power of 600kW and an average power in the hundreds of watts range, and weighs approximately 1.4kg.

[0083] like Figure 5-8 As shown, the miniaturized klystron includes an electron gun 7, a collector electrode 1, a high-frequency component 2, an output waveguide 4, and an output window 5.

[0084] The collector 1 is a one-piece molded structure, including a cavity located within the body of the collector 1 and extending along the direction of electron beam travel. The cavity is used to collect electron beams from the high-frequency component 2.

[0085] The collector electrode 1 body is provided with a heat dissipation part 12 for conducting heat dissipation. The heat dissipation part 12 includes a heat dissipation surface 121 that provides contact area and a mounting part 122 for fixing. The heat dissipation surface 121 is a plane, and the mounting part 122 is the edge portion of the heat dissipation surface 121 on both sides along the electron beam travel direction. The mounting part 122 has a mounting hole 1221 and is fixedly connected to the cooling plate 3. The heat dissipation surface is in close contact with the cooling surface of the cooling plate.

[0086] The longitudinal dimension of the collector electrode 1 gradually decreases in the direction away from the high-frequency component 2, so as to reduce the weight of the collector electrode 1 without affecting the heat dissipation efficiency, which is more in line with the miniaturization and lightweight design concept.

[0087] like Figure 5 As shown, the output waveguide 4 includes a first waveguide portion 41, which extends axially along the klystron. The end of the first waveguide portion 41 away from the output cavity 21 is hermetically connected to the output window. The output waveguide 4 is welded and fixed to the collector electrode 1. The outer surface of the collector electrode 1 includes a plane 13 extending axially along the collector electrode 1. The plane of the first waveguide portion 41 is welded and fixed to the plane 13, which can effectively reduce the radial dimension of the klystron, fix the position of the output waveguide 4, and also allow the output waveguide 4 to contact the collector electrode 1, providing some heat dissipation for the collector electrode 1 and further improving the heat dissipation efficiency.

[0088] In this embodiment, the maximum lateral dimension a of the collecting electrode 1 is 41 mm, which is greater than the maximum lateral dimension b of the output window 5. The maximum radial dimension L of the klystron is 49 mm, and the radial dimension of the klystron meets the requirements of miniaturization design.

[0089] Example 3 The miniaturized klystron operates in the C-band, with a peak output power of 500kW and an average power in the hundreds of watts range, and weighs ≤2.5kg.

[0090] like Figure 9-12 As shown, the miniaturized klystron includes an electron gun 7, a collector electrode 1, a high-frequency component 2, an output waveguide 4, and an output window 5.

[0091] The collector 1 is a one-piece molded structure, including a cavity located within the body of the collector 1 and extending along the direction of electron beam travel. The cavity is used to collect electron beams from the high-frequency component 2.

[0092] The collector electrode 1 body is provided with a heat dissipation part 12 for conducting heat dissipation. The heat dissipation part 12 includes a heat dissipation surface 121 that provides contact area and a mounting part 122 for fixing. The heat dissipation surface 121 is a plane, and the mounting part 122 is the edge portion of the heat dissipation surface 121 on both sides along the electron beam travel direction. The mounting part 122 has mounting holes 1221 and is fixedly connected to the cooling plate 3. The heat dissipation surface is in close contact with the cooling surface of the cooling plate.

[0093] The lateral dimension of the collector electrode 1 gradually decreases in the direction away from the heat dissipation surface 121, and the longitudinal dimension of the collector electrode 1 gradually decreases in the direction away from the high-frequency component 2. The four corners of the heat dissipation surface 121 are provided with chamfered structures to reduce the weight of the collector electrode 1 without affecting the heat dissipation efficiency, which is more in line with the miniaturization and lightweight design concept.

[0094] like Figure 9 As shown, the output waveguide 4 includes a first waveguide section 41, which extends axially along the klystron. The end of the first waveguide section 41 furthest from the output cavity 21 is hermetically connected to the output window. The output waveguide 4 is welded to the collector 1 via a support rod 6. The outer surface of the collector 1 includes a plane 13 extending axially along the collector 1. One end of the support rod 6 is welded to the plane 13, and the other end is welded to the plane of the first waveguide section 41. The support rod 6 provides support for the output waveguide 4 and also transfers heat between the collector 1 and the output waveguide 4, providing some heat dissipation for the collector 1 and further improving heat dissipation efficiency.

[0095] Since the larger the transmitted band, the larger the output window 5 is, in this embodiment, the maximum lateral dimension a of the collector 1 is smaller than the maximum lateral dimension b of the output window 5. The maximum lateral dimension of the output window 5 is 68mm, and the maximum radial dimension L of the klystron is 74.2mm, which is close to the value of the maximum lateral dimension b of the output window 5. Therefore, the radial dimension of the klystron in this embodiment meets the miniaturization design requirements.

[0096] Example 6 Another embodiment of this utility model provides a microwave power module, such as Figure 15 As shown, the microwave power module includes a power supply (not shown), four miniaturized klystrons provided in the above embodiment, and a cooling plate 3. Multiple klystrons share a single cooling plate, which can be installed on one side of the cooling plate or on both sides as needed. The cooling plate 3 has an inlet and an outlet (not shown), and a cooling surface 31. The cooling surface 31 is in close contact with the heat dissipation surface 121 of the microwave tubes to conduct heat generated during the operation of the collector electrode 1, thus dissipating heat. Utilizing the cooling plate 3, which is used to cool the power supply in the power module, to dissipate heat from multiple microwave tubes simplifies the structure of the microwave tube collector electrode, reduces the size and weight of the power module, and provides space for the output waveguide 4. This enables the miniaturization and array design of the power module, giving the microwave power module provided in this embodiment the advantages of small size, compact structure, and simple installation.

[0097] Compared to existing technologies that use water-cooled collectors with one inlet and one outlet for each klystron, this invention's conductive heat dissipation collector reduces the number of water interface ports for each microwave tube in the power module. The power module of this invention uses a single cooling plate, requiring only one coolant inlet and one coolant outlet to cool both the power supply and multiple microwave tubes. This simplifies piping connections within the power module, facilitates microwave tube installation and maintenance, reduces the risk of interface leakage, and improves the reliability of the power module.

[0098] Another embodiment of this utility model provides a microwave power array system (not shown), which includes multiple microwave power modules arranged in an array as described above. The microwave tubes used in the power modules employ a collector electrode that uses the collector electrode body as the conductive medium to achieve heat dissipation through conduction. This design features a simple structure, small size, light weight, and flexible structural design, enabling the realization of a high-power-density microwave array system with miniaturization, lightweight, array-based design, and high reliability.

[0099] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. All obvious variations or modifications derived from the technical solutions of this utility model are still within the protection scope of this utility model.

Claims

1. A miniaturized permanent magnet focusing klystron, characterized in that, The klystron includes an electron gun, a high-frequency component, an output waveguide, an output window, and an integrated collector. The integrated collecting electrode has a cavity and a heat dissipation section. The cavity is used to collect the electron beam after interaction, and the heat dissipation section provides a heat dissipation surface for contact with the cooling plate. The collecting electrode dissipates heat to the cooling plate through the heat dissipation surface to achieve heat dissipation.

2. The klystron according to claim 1, characterized in that, The cavity wall near the heat dissipation surface is sloped to allow the cavity wall near the heat dissipation surface to trap more electrons.

3. The klystron according to claim 1, characterized in that, At least a portion of the transverse cross-section of the collecting electrode gradually decreases in size along the direction away from the heat dissipation surface; and / or At least a portion of the longitudinal cross-section of the collecting electrode gradually decreases in size along the direction away from the high-frequency component.

4. The klystron according to claim 1, characterized in that, The collecting electrode is made of bulk oxygen-free copper.

5. The klystron according to claim 1, characterized in that, The heat dissipation section has a mounting portion for fixing, and the mounting portion is provided with mounting holes.

6. The klystron according to claim 1, characterized in that, The long side of the output waveguide is 0.75-1.0 times the long side of the standard waveguide of the klystron, and the short side is 0.2-0.9 times the short side of the standard waveguide of the klystron. One side of the output window is connected to the output waveguide, and the other side provides a standard waveguide interface; and / or The output waveguide is connected to the output cavity of the high-frequency component, converting the radial output of the output cavity into an axial output; and / or The klystron also includes an input window, which uses an angled SMA connector, through which the klystron provides axial input.

7. The klystron according to claim 1, characterized in that, The klystron has an average output power in the hundreds of watts range.

8. The klystron according to claim 1, characterized in that, The klystron operates in the Ku band, has a peak output power of 500kW, and an overall weight of ≤1.1kg; The klystron operates in the X-band, has a peak output power of 600kW, and weighs approximately 1.4kg; or The klystron operates in the C-band, has a peak output power of 500kW, and weighs ≤2.5kg.

9. A microwave power module, characterized in that, include power supply; A cooling plate, the cooling plate being provided with a cooling surface; and Multiple miniaturized permanent magnet focusing klystrons according to any one of claims 1-8, wherein the heat dissipation surface of the collecting electrode of each klystron is in close contact with the cooling surface of the cooling plate.

10. A microwave power system, characterized in that, The system includes Multiple microwave power modules as described in claim 9 are arranged in an array.

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