Heating plate device and electric vehicle

CN224803973UActive Publication Date: 2026-09-25BEIJING YANCHEN THERMAL MANAGEMENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202522133412.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-09
Publication Date
2026-09-25
Estimated Expiration
2035-10-09

AI Technical Summary

Technical Problem

[0004]本申请实施例提供了一种加热板装置及电动汽车,可以解决现有技术中的加热板装置内的换热介质与加热板之间的换热效率低的问题,所述技术方案如下:

Benefits of technology

在本申请中,通过在基板背离加热膜片的一侧上设置多个扰流结构,且多个扰流结构包括突出于基板的第一凸起和/或自基板向内凹陷的凹坑,则不管是第一凸起还是凹坑,均可以有效破坏换热介质在靠近基板壁面位置的流动边界层与热边界层,从而提高换热介质流动的湍流强度,以减小流动边界层和热边界层的厚度,进而提高换热介质与加热板之间的换热速率,由此减少加热板受热损坏的概率。

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Abstract

The application discloses a heating plate device and an electric vehicle, and belongs to the field of liquid heating. The heating plate device comprises a first shell, a second shell and a heating plate. The second shell is connected with the first shell and surrounds a heat exchange space. The heating plate is arranged in the heat exchange space and comprises a substrate and a heating film. The heating film is arranged on one side of the substrate close to the first shell. A plurality of turbulence structures are arranged on the surface of the substrate facing the second shell. The turbulence structures comprise first protrusions and / or recesses. By arranging the first protrusions protruding from the substrate and / or the recesses recessed inward from the substrate on the substrate, the flow boundary layer and the thermal boundary layer of the heat exchange medium close to the wall surface of the substrate can be effectively destroyed. The turbulence intensity of the flow of the heat exchange medium is improved, the thickness of the flow boundary layer and the thermal boundary layer is reduced, and the heat exchange rate between the heat exchange medium and the heating plate is improved, thereby reducing the probability of damage of the heating plate caused by heat.
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Description

Technical Field

[0001] This application relates to the field of liquid heating technology, and in particular to a heating plate device and an electric vehicle. Background Technology

[0002] In recent years, electric vehicles have developed rapidly. Safety, efficiency, range, and intelligence are particularly important in the process of popularizing electric vehicles. Various car manufacturers have designed battery thermal management systems for power batteries and air conditioning thermal management systems for heating and defrosting. Heating plate devices are an important component of battery thermal management systems and air conditioning thermal management systems.

[0003] A heating plate device typically includes a first housing, a heating plate, and a second housing, through which the heat exchange medium is heated. Existing heating plate devices usually lack any turbulence-inducing structures on the heating plate. Therefore, as the heat exchange medium flows through the heating plate, a thick flow boundary layer and thermal boundary layer are formed, resulting in low heat exchange efficiency between the heat exchange medium and the heating plate, thus posing a higher risk of heat-related damage to the heating plate. Utility Model Content

[0004] This application provides a heating plate device and an electric vehicle, which can solve the problem of low heat exchange efficiency between the heat exchange medium and the heating plate in existing heating plate devices. The technical solution is as follows: On one hand, a heating plate device is provided, comprising a first housing, a second housing, and a heating plate. The second housing and the first housing are disposed opposite to each other along a first direction, and the second housing and the first housing are connected to form a heat exchange space; the heating plate is disposed within the heat exchange space, and the heating plate includes a substrate and a heating film disposed on one side of the substrate, the heating film being disposed on the side of the substrate near the first housing. The surface of the substrate facing the second housing is provided with a plurality of turbulence-disrupting structures, the plurality of turbulence-disrupting structures including a first protrusion protruding from the substrate and / or a recess recessed inward from the substrate.

[0005] In some possible implementations, the plurality of perturbation structures are arrayed on the substrate along a second direction and a third direction, wherein the second direction, the third direction, and the first direction intersect each other.

[0006] In some possible implementations, the projection shape of the first protrusion on the substrate is circular, elliptical, or fin-shaped.

[0007] In some possible implementations, the projection shape of the recess on the substrate is circular, elliptical, or fin-shaped.

[0008] In some possible implementations, a plurality of the recesses are provided on the surface of the substrate facing the second housing, and a plurality of second protrusions are provided on the bottom wall inside the second housing, each of the second protrusions corresponding to one of the recesses.

[0009] In some possible implementations, the projection shape of the second protrusion onto the second housing is circular, elliptical, or fin-shaped.

[0010] In some possible implementations, the second housing includes a second main body and a plurality of second flow channel plates disposed within the second main body. The plurality of second flow channel plates are spaced apart along a second direction, and each second flow channel plate extends along a third direction, with the second direction, the third direction, and the first direction intersecting each other. One end of each second flow channel plate is connected to a side wall of the second main body, and the other end is spaced apart from a side wall of the second main body. Adjacent second flow channel plates are respectively connected to two opposite side walls of the second main body disposed in the third direction. The plurality of second flow channel plates and the second main body together form an S-shaped second flow channel. A second protrusion is disposed on the bottom wall of the second main body, and the plurality of first protrusions are spaced apart along the extension direction of the second flow channel. The second protrusions are located on one side of the second flow channel plate in the second direction.

[0011] In some possible implementations, the height of the second protrusion is less than the height of the second flow channel plate.

[0012] In some possible implementations, the first housing includes a first body and a plurality of first flow channel plates disposed within the first body. The plurality of first flow channel plates are spaced apart along the second direction, and each first flow channel plate extends along the third direction. One end of each first flow channel plate is connected to a side wall of the first body, and the other end is spaced apart from a side wall of the first body. Adjacent first flow channel plates are respectively connected to two side walls of the first body disposed opposite each other in the third direction. The plurality of first flow channel plates and the first body together form an S-shaped first flow channel, and the first flow channel communicates with the second flow channel.

[0013] In some possible implementations, a plurality of third protrusions are provided on the bottom wall of the first body, the plurality of third protrusions being spaced apart in the extension direction of the first flow channel, and the third protrusions being located on one side of the first flow channel plate in the second direction.

[0014] In some possible implementations, the heating diaphragm is provided with a heating resistor, a first positive electrode, a first negative electrode, a second positive electrode, and a second negative electrode. The first positive electrode and the first negative electrode form a first circuit with the corresponding heating resistor, and the second positive electrode and the second negative electrode form a second circuit with the corresponding heating resistor. The first housing is provided with a first interface and a second interface. The first positive electrode and the first negative electrode pass through the first interface and protrude from the first housing for connection to an external power source, and the second positive electrode and the second negative electrode pass through the second interface and protrude from the first housing for connection to an external power source.

[0015] On the other hand, an electric vehicle is provided that includes any of the heating plate devices described above.

[0016] The beneficial effects of the technical solutions provided in this application are: In this application, by providing multiple turbulence structures on the side of the substrate away from the heating film, and the multiple turbulence structures including a first protrusion protruding from the substrate and / or a pit recessed from the substrate inward, both the first protrusion and the pit can effectively disrupt the flow boundary layer and thermal boundary layer of the heat exchange medium near the substrate wall, thereby increasing the turbulence intensity of the heat exchange medium flow, reducing the thickness of the flow boundary layer and thermal boundary layer, and thus increasing the heat exchange rate between the heat exchange medium and the heating plate, thereby reducing the probability of the heating plate being damaged by heat. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is an exploded perspective view of a heating plate device provided in an embodiment of this application; Figure 2 This is a schematic diagram of the front structure of a heating plate provided in an embodiment of this application; Figure 3 This is a schematic diagram of the back structure of a heating plate provided in an embodiment of this application; Figure 4 This is a schematic diagram of the back structure of another heating plate provided in an embodiment of this application; Figure 5 This is a schematic diagram of the internal structure of a second housing provided in an embodiment of this application; Figure 6 This is a schematic diagram of the internal structure of another second housing provided in an embodiment of this application; Figure 7 This is a schematic diagram of the internal structure of a first housing provided in an embodiment of this application.

[0019] The reference numerals in the attached figures are explained as follows: 100. Heating plate device; 10. First shell; 11. First body; 12. First flow channel plate; 13. Inlet pipe section; 14. Outlet pipe section; 15. First interface; 16. Second interface; T1. First flow channel; P4. Third protrusion; 20. Second shell; 21. Second body; 22. Second flow channel plate; P3. Second protrusion; T2. Second flow channel; 30. Heating plate; 31. Substrate; 32. Heating film; 33A. First positive electrode; 33B. First negative electrode; 34A. Second positive electrode; 34B. Second negative electrode; P1. First protrusion; P2. Dent; L1, first direction; L2, second direction; L3, third direction. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0021] This application provides a heating plate device that can be an important component of the battery thermal management system and / or air conditioning thermal management system of an electric vehicle. Of course, this heating plate device can also be an important component of the thermal management system of other devices or systems, and this application does not limit this to that.

[0022] Please refer to Figure 1 , Figure 1 This is an exploded perspective view of a heating plate device provided in an embodiment of this application. The heating plate device 100 includes a first housing 10, a second housing 20, and a heating plate 30. The second housing 20 is disposed opposite to the first housing 10 along a first direction L1, and the second housing 20 is connected to the first housing 10 to form a heat exchange space, which is used to contain a heat exchange medium.

[0023] The heating plate 30 is disposed in the heat exchange space and divides the heat exchange space into two interconnected parts so that the heat exchange medium can flow in the two parts, thereby enabling the heat exchange medium to exchange heat with the heating plate 30 on both sides of the heating plate 30 respectively.

[0024] To see the structure of the heating plate 30 more clearly, please refer to [reference needed]. Figures 2 to 4 , Figure 2 This is a front structural diagram of a heating plate provided in an embodiment of this application. Figure 3This is a schematic diagram of the back structure of a heating plate provided in an embodiment of this application. Figure 4 This is a schematic diagram of the back structure of another heating plate provided in the embodiment of this application. The heating plate 30 includes a substrate 31 and a heating film 32 disposed on one side of the substrate 31. The heating film 32 is disposed on the side of the substrate 31 near the first housing 10.

[0025] The substrate 31 can be made of materials such as steel, aluminum alloy and ceramic, and is manufactured by processes such as die casting, cutting and dry pressing. The heating film 32 can be set on the substrate 31 by screen printing.

[0026] The substrate 31 has multiple turbulence structures on its surface facing the second housing 20. These turbulence structures include a first protrusion P1 protruding from the substrate 31 and / or a recess P2 recessed inward from the substrate 31. That is, the turbulence structures are located on the side of the substrate 31 facing away from the heating film 32.

[0027] Understandably, only the first protrusion P1, only the recess P2, or both the first protrusion P1 and the recess P2 can be provided on the surface of the substrate 31 facing the second housing 20. This application embodiment does not limit this.

[0028] In related technologies, the side of the heating plate away from the heating film is usually a smooth plate structure without any turbulence structure. Therefore, when the heat exchange medium flows through the heating plate, the flow boundary layer and thermal boundary layer of the heat exchange medium cannot be broken, resulting in low heat exchange efficiency between the heat exchange medium and the heating plate.

[0029] The flow boundary layer refers to the region where the fluid velocity near the solid surface gradually transitions from zero (adhesion condition) to free flow velocity due to the viscosity of the fluid. The thermal boundary layer, on the other hand, refers to the region where the fluid temperature near the solid surface gradually transitions from the solid surface temperature to the fluid temperature due to heat conduction. In other words, the flow boundary layer focuses on velocity distribution, while the thermal boundary layer focuses on temperature distribution. Their thicknesses are typically different and they influence each other. Furthermore, both the flow and thermal boundary layers directly affect heat transfer: a thicker flow boundary layer results in a lower fluid velocity near the wall, leading to a decrease in convective heat transfer capacity, i.e., lower heat transfer efficiency for low-velocity fluids; conversely, a thicker thermal boundary layer reduces the temperature gradient near the wall, resulting in a decrease in heat flux and thus lower heat transfer efficiency.

[0030] In this embodiment, by providing multiple turbulence structures on the side of the substrate 31 away from the heating film 32, and the multiple turbulence structures including a first protrusion P1 protruding from the substrate 31 and / or a pit P2 recessed from the substrate 31 inward, both the first protrusion P1 and the pit P2 can effectively disrupt the flow boundary layer and thermal boundary layer of the heat exchange medium near the wall of the substrate 31, thereby increasing the turbulence intensity of the heat exchange medium flow, reducing the thickness of the flow boundary layer and thermal boundary layer, and thus increasing the heat exchange rate between the heat exchange medium and the heating plate 30, thereby reducing the probability of the heating plate 30 being damaged by heat.

[0031] In one possible implementation, such as Figure 2 As shown, at least one first temperature sensor 35 is disposed on the side of the heating diaphragm 32 facing away from the substrate 31. The first temperature sensor 35 is disposed in the middle region of the heating diaphragm 32 and is used to monitor the temperature of the heating plate 30. By setting an appropriate control strategy, the heating plate 30 is prevented from burning out due to excessive temperature. The temperature control strategy can monitor the temperature difference between the inlet and outlet of the heat exchange medium at the inlet and outlet of the heating plate device 100. When the temperature difference exceeds a set upper limit value, the heating plate device 100 is controlled to reduce the heating power.

[0032] In one possible implementation, such as Figure 3 and Figure 4 As shown, multiple disturbance structures are arrayed on the substrate 31 along the second direction L2 and the third direction L3, that is, multiple disturbance structures are uniformly distributed on the substrate 31. Among them, the second direction L2, the third direction L3 and the first direction L1 intersect each other, such as the second direction L2, the third direction L3 and the first direction L1 can be perpendicular to each other.

[0033] In this embodiment, multiple turbulence structures are arranged in an array on the substrate 31, which can effectively disrupt the flow boundary layer and thermal boundary layer of the heat exchange medium at different locations, thereby enabling the heat exchange medium to exchange heat evenly with different parts of the heating plate 30 and avoiding the impact of excessively high local temperatures on the heating plate 30.

[0034] In one possible implementation, such as Figure 3 As shown, the projection shape of the first protrusion P1 on the substrate 31 can be circular, elliptical, or fin-shaped. When the projection shape of the first protrusion P1 on the substrate 31 is elliptical, the long axis of the first protrusion P1 is parallel to the flow direction of the heat exchange medium within the second housing 20. This effectively increases the turbulence intensity of the heat exchange medium, promoting the mixing degree of the heat exchange medium within the second housing 20. This increases the temperature difference between the heat exchange medium and the heating plate 30, thereby increasing the heat exchange rate between the heat exchange medium and the heating plate 30, and thus reducing the probability of heat damage to the heating plate 30.

[0035] In one possible implementation, such as Figure 2 As shown, the projection shape of the pit P2 on the substrate 31 can be circular, elliptical, or fin-shaped. When the projection shape of the pit P2 on the substrate 31 is elliptical, the long axis of the pit P2 is parallel to the flow direction of the heat exchange medium within the second housing 20. This effectively increases the turbulence intensity of the heat exchange medium, promoting the mixing degree of the heat exchange medium within the second housing 20. This increases the temperature difference between the heat exchange medium and the heating plate 30, thereby increasing the heat exchange rate between the heat exchange medium and the heating plate 30, and thus reducing the probability of heat damage to the heating plate 30.

[0036] In one possible implementation, please refer to Figure 4 and Figure 5 , Figure 5 This is a schematic diagram of the internal structure of a second housing provided in an embodiment of this application. A plurality of recesses P2 are provided on the surface of the substrate 31 facing the second housing 20. A plurality of second protrusions P3 are provided on the bottom wall inside the second housing 20, and each second protrusion P3 corresponds to a recess P2.

[0037] In this embodiment, the recess P2 can effectively disrupt the flow boundary layer and thermal boundary layer of the heat exchange medium near the wall surface of the substrate 31, thereby increasing the turbulence intensity of the heat exchange medium in the flow boundary layer and thermal boundary layer, and thus increasing the heat transfer rate between the heat exchange medium and the heating plate 30. The second protrusion P3, disposed opposite to the recess P2, can effectively increase the turbulence intensity of the heat exchange medium flow within the second housing 20, thereby promoting the mixing degree of the heat exchange medium within the second housing 20, increasing the temperature difference between the heat exchange medium and the walls within the second housing 20, and thus increasing the heat transfer rate between the heat exchange medium and the heating plate 30.

[0038] In one possible implementation, such as Figure 5 As shown, the projection shape of the second protrusion P3 on the second housing 20 can be circular, elliptical, or fin-shaped. When the projection shape of the second protrusion P3 on the second housing 20 is elliptical, the long axis of the second protrusion P3 is parallel to the flow direction of the heat exchange medium within the second housing 20. This effectively increases the turbulence intensity of the heat exchange medium, promoting the mixing degree of the heat exchange medium within the second housing 20, thereby further increasing the heat exchange rate between the heat exchange medium and the heating plate 30, and thus reducing the probability of heat damage to the heating plate 30.

[0039] In one possible implementation, please refer to Figure 3 and Figure 6 , Figure 6This is a schematic diagram of the internal structure of another second housing provided in the embodiment of this application. A plurality of first protrusions P1 are provided on the surface of the substrate 31 facing the second housing 20. The second protrusions P3 may not be provided on the bottom wall inside the second housing 20.

[0040] In one possible implementation, such as Figure 5 and Figure 6 As shown, the second housing 20 includes a second body 21 and a plurality of second flow channel plates 22 disposed within the second body 21.

[0041] Multiple second flow channel plates 22 are arranged at intervals along a second direction L2, and each second flow channel plate 22 extends along a third direction L3. One end of each second flow channel plate 22 is connected to the side wall of the second body 21, and the other end is spaced apart from the side wall of the second body 21. Furthermore, two adjacent second flow channel plates 22 are respectively connected to two side walls of the second body 21 that are disposed opposite each other in the third direction L3. In this way, the multiple second flow channel plates 22 together with the second body 21 form an S-shaped second flow channel T2. The heat exchange medium in the second flow channel T2 can exchange heat with the side of the heating plate 30 away from the first housing 10.

[0042] The second flow channel plate 22 is a smooth plate structure, the second protrusion P3 is disposed on the bottom wall of the second body 21, and a plurality of first protrusions 23 are arranged at intervals in the extension direction of the second flow channel T2, and the second protrusion P3 is located on one side of the second flow channel plate 22 in the second direction L2.

[0043] In related technologies, the side walls of the flow channel plate inside the second housing are usually corrugated. Although the corrugated flow channel plate can turbulentize the heat exchange medium, fluid vortex regions are easily formed in the recesses of the corrugated flow channel, leading to localized high temperatures. Therefore, the heat exchange medium may boil after absorbing a large amount of heat at this location, eventually resulting in localized dry burning, which in turn causes uneven heating and damage to the heating plate.

[0044] In this application, since the second flow channel plate 22 is a smooth plate structure and a second protrusion P3 is provided on the bottom wall of the second body 21, the second protrusion P3 is a turbulence structure that can turbulently move the heat exchange medium in the second flow channel T2, so that a fluid vortex region will not be formed in the second flow channel T2, thereby avoiding the problem of the heating plate being damaged due to local dry burning of the fluid.

[0045] In one possible implementation, such as Figure 5 As shown, the height of the second protrusion P3 is less than the height of the second flow channel plate 22. This arrangement serves two purposes: firstly, the second protrusion P3 can be used to disturb the heat exchange medium within the second flow channel T2; secondly, it can reduce material usage and lower manufacturing costs.

[0046] In one possible implementation, please refer to Figure 7 , Figure 7 This is a schematic diagram of the internal structure of a first housing provided in an embodiment of this application. The first housing 10 includes a first body 11 and a plurality of first flow channel plates 12 disposed in the first body 11. The plurality of first flow channel plates 12 are arranged at intervals along a second direction L2, and each first flow channel plate 12 extends along a third direction L3.

[0047] Each first flow channel plate 12 has one end connected to the side wall of the first body 11 and the other end spaced apart from the side wall of the first body 11. Adjacent first flow channel plates 12 are respectively connected to two opposite side walls of the first body 11 on a third direction L3. Thus, the multiple first flow channel plates 12 together with the first body 11 form an S-shaped first flow channel T1. The first flow channel T1 communicates with the second flow channel T2, and the heat exchange medium within the first flow channel T1 can exchange heat with the side of the heating plate 30 facing away from the second shell 20.

[0048] In this embodiment, by forming a first flow channel T1 and a second flow channel T2 on both sides of the heating plate 30, the heat exchange efficiency between the heat exchange medium and the heating plate 30 can be greatly improved.

[0049] In one possible implementation, such as Figure 7 As shown, the first flow channel plate 12 is a smooth plate structure. Multiple third protrusions P4 are provided on the bottom wall of the first main body 11. The multiple third protrusions P4 are arranged at intervals in the extension direction of the first flow channel T1. The third protrusions P4 are located on one side of the first flow channel plate 12 in the second direction L2.

[0050] In this embodiment, since the first flow channel plate 12 is a smooth plate structure and a third protrusion P4 is provided on the bottom wall of the first main body 11, the third protrusion P4 is a turbulence structure, which can turbulently move the heat exchange medium in the first flow channel T1, so that a fluid vortex region will not be formed in the first flow channel T1, thereby avoiding the problem of the heating plate being damaged due to local dry burning of the fluid.

[0051] In one possible implementation, please refer to Figure 2 and Figure 7 The heating film 32 is provided with a heating resistor (not shown), a first positive electrode 33A, a first negative electrode 33B, a second positive electrode 34A, and a second negative electrode 34B.

[0052] The first positive electrode 33A and the first negative electrode 33B form a first circuit with the corresponding heating resistor, and the second positive electrode 34A and the second negative electrode 34B form a second circuit with the corresponding heating resistor, so as to realize the parallel connection between different resistors, so that the heating plate device 100 can still be used normally after some resistors are damaged.

[0053] In one possible implementation, such as Figure 7 As shown, the first housing 10 is provided with a first interface 15 and a second interface 16. A first positive electrode 33A and a first negative electrode 33B pass through the first interface 15 and protrude from the first housing 10 for connection to an external power source. A second positive electrode 34A and a second negative electrode 34B pass through the second interface 16 and protrude from the first housing 10 for connection to an external power source.

[0054] In one possible implementation, such as Figure 7 As shown, a second temperature sensor 17 is respectively installed at a distance from the inlet pipe section 13 and the outlet pipe section 14 of the first main body 11, so as to reduce the resistance of the second temperature sensor 17 to the inlet and outlet of the heating plate device 100.

[0055] The second temperature sensor 17, located at the inlet pipe section 13, is used to monitor the low-temperature heat exchange medium entering the heating plate device 100. The second temperature sensor 17, located at the outlet pipe section 14, can effectively improve the mixing degree of the heat exchange medium in the flow channels on both sides of the heating plate 30 at the outlet pipe section 14, thereby improving the measurement accuracy.

[0056] In one possible implementation, such as Figures 2 to 7 As shown, the bottom wall of the first main body 11 of the first housing 10 is provided with a first connecting hole V1, the bottom wall of the second main body 21 of the second housing 20 is provided with a second connecting hole V2, and the heating plate 30 is provided with a third connecting hole V3. The first housing 10, the heating plate 30, and the second housing 20 are connected by fasteners (bolts) passing through the first connecting hole V1, the second connecting hole V2, and the third connecting hole V3.

[0057] This application also provides an electric vehicle that may include the heating plate device 100 described above. The heating plate device 100 may be integrated into the electric vehicle's battery thermal management system and / or air conditioning thermal management system.

[0058] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0059] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heating plate device, characterized in that, The system includes a first housing (10), a second housing (20), and a heating plate (30). The second housing (20) is disposed opposite to the first housing (10) along a first direction (L1), and the second housing (20) is connected to the first housing (10) to form a heat exchange space. The heating plate (30) is disposed in the heat exchange space. The heating plate (30) includes a substrate (31) and a heating film (32) disposed on one side of the substrate (31). The heating film (32) is disposed on the side of the substrate (31) near the first housing (10). The substrate (31) has a plurality of turbulence structures on its surface facing the second housing (20). The plurality of turbulence structures include a first protrusion (P1) protruding from the substrate (31) and / or a pit (P2) recessed inward from the substrate (31).

2. The heating plate device according to claim 1, characterized in that, The plurality of turbulence structures are arrayed on the substrate (31) along the second direction (L2) and the third direction (L3), and the second direction (L2), the third direction (L3) and the first direction (L1) intersect each other.

3. The heating plate device according to claim 1, characterized in that, The projection shape of the first protrusion (P1) on the substrate (31) is circular, elliptical or fin-shaped; and / or, the projection shape of the pit (P2) on the substrate (31) is circular, elliptical or fin-shaped.

4. The heating plate device according to claim 1, characterized in that, The substrate (31) has a plurality of recesses (P2) on its surface facing the second housing (20), and a plurality of second protrusions (P3) are provided on the bottom wall inside the second housing (20), each of the second protrusions (P3) corresponding to one recess (P2).

5. The heating plate device according to claim 4, characterized in that, The projection shape of the second protrusion (P3) on the second housing (20) is circular, elliptical or fin-shaped.

6. The heating plate device according to claim 4, characterized in that, The second housing (20) includes a second body (21) and a plurality of second flow channel plates (22) disposed within the second body (21). The plurality of second flow channel plates (22) are arranged at intervals along a second direction (L2), and each second flow channel plate (22) extends along a third direction (L3). The second direction (L2), the third direction (L3), and the first direction (L1) intersect each other. One end of each second flow channel plate (22) is connected to the side wall of the second body (21), and the other end is spaced apart from the side wall of the second body (21). Two adjacent second flow channel plates (22) are respectively connected to two sidewalls of the second body (21) that are oppositely arranged in the third direction (L3). The plurality of second flow channel plates (22) together with the second body (21) form an S-shaped second flow channel (T2). The second protrusion (P3) is disposed on the bottom wall of the second body (21). The plurality of first protrusions (23) are arranged at intervals in the extension direction of the second flow channel (T2). The second protrusion (P3) is located on one side of the second flow channel plate (22) in the second direction (L2).

7. The heating plate device according to claim 6, characterized in that, The height of the second protrusion (P3) is less than the height of the second flow channel plate (22).

8. The heating plate device according to claim 6, characterized in that, The first housing (10) includes a first body (11) and a plurality of first flow channel plates (12) disposed within the first body (11). The plurality of first flow channel plates (12) are arranged at intervals along the second direction (L2), and each first flow channel plate (12) extends along the third direction (L3). One end of each first flow channel plate (12) is connected to the side wall of the first body (11), and the other end is spaced apart from the side wall of the first body (11). Two adjacent first flow channel plates (12) are respectively connected to two side walls of the first body (11) that are disposed opposite to each other in the third direction (L3). The plurality of first flow channel plates (12) together with the first body (11) form an S-shaped first flow channel (T1), and the first flow channel (T1) communicates with the second flow channel (T2).

9. The heating plate device according to claim 8, characterized in that, A plurality of third protrusions (P4) are provided on the bottom wall inside the first body (11). The plurality of third protrusions (P4) are arranged at intervals in the extension direction of the first flow channel (T1). The third protrusions (P4) are located on one side of the first flow channel plate (12) in the second direction (L2).

10. The heating plate device according to any one of claims 1-9, characterized in that, The heating film (32) is provided with a heating resistor, a first positive electrode (33A), a first negative electrode (33B), a second positive electrode (34A), and a second negative electrode (33B); the first positive electrode (33A) and the first negative electrode (33B) form a first circuit with the corresponding heating resistor, and the second positive electrode (34A) and the second negative electrode (34B) form a second circuit with the corresponding heating resistor; the first housing (10) is provided with a first interface (15) and a second interface (16), the first positive electrode (33A) and the first negative electrode (33B) pass through the first interface (15) and protrude from the first housing (10) for connection to an external power source, and the second positive electrode (34A) and the second negative electrode (34B) pass through the second interface (16) and protrude from the first housing (10) for connection to an external power source.

11. An electric vehicle, characterized in that, Includes the heating plate device according to any one of claims 1-10.