An ultra-low temperature high-density microwave low-pass filter cluster assembly

Abstract

The utility model discloses an extremely low temperature high density microwave low pass filter cluster assembly, include: low pass filter unit, low pass filter unit contains a plurality of low pass filters, the low pass filter includes filter casing, connector and the PCB board in filter casing, and cluster unit, the cluster unit includes cluster cavity, lattice strip and screw, wherein, the lattice strip and screw cooperate and match for with cluster cavity fastening connection, cluster cavity and lattice strip cooperate and match for centralized restraint all low pass filter, the microwave low pass filter in the utility model passes through cluster unit and arranges multiple microwave low pass filters together, reduces device volume and use area, and easy processing assembly realizes small high density integration, and device performance stable and reliable purpose. Through adopting copper material, makes device can work in limit low temperature non -magnetic environment.

Description

Technical Field

[0001] This utility model relates to the field of filter technology, and in particular to a low-temperature high-density microwave low-pass filter cluster assembly. Background Technology

[0002] Quantum computing and its applications are a hot topic in international research. Microwave components are required in quantum computing devices, with microwave low-pass filters being essential. However, with the development of qubits, more microwave components need to be used in existing dilution refrigerators, increasing the difficulty of allocating internal space. The advantages of clustered modules, such as high integration, small size, and strong heat dissipation, have been widely adopted in high-density quantum computing solutions.

[0003] Compared with existing microwave low-pass filters, this invention achieves miniaturization and high density, with a more compact structure, smaller device size and smaller area, making it easier to process and assemble, and it can still maintain excellent performance in extreme low-temperature and non-magnetic environments.

[0004] Therefore, an ultra-low temperature high-density microwave low-pass filter cluster assembly is provided to solve the above problems. Utility Model Content

[0005] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an ultra-low temperature high-density microwave low-pass filter cluster assembly, comprising: a low-pass filter unit, wherein the low-pass filter unit includes multiple low-pass filters; and, A clustering unit, the clustering unit comprising a clustering cavity, grid strips, and screws; The grid strips and screws work together to securely connect with the cluster cavity, and the cluster cavity and grid strips work together to centrally constrain all the low-pass filters.

[0007] As a preferred embodiment of the ultra-low temperature high-density microwave low-pass filter cluster assembly of this utility model, the low-pass filter includes a filter housing, a connector, and a PCB board disposed within the filter housing.

[0008] In a preferred embodiment of the ultra-low temperature high-density microwave low-pass filter cluster assembly of this utility model, the connector is used to fix the PCB board and the filter housing, and the inner conductor of the connector is soldered to the PCB board.

[0009] As a preferred embodiment of the ultra-low temperature high-density microwave low-pass filter clustering assembly of this utility model, the clustering cavity is provided with a plurality of constraint holes for placing the low-pass filter.

[0010] As a preferred embodiment of the ultra-low temperature high-density microwave low-pass filter clustering assembly of this utility model, the clustering cavity is further provided with a plurality of mounting holes that match screws.

[0011] In a preferred embodiment of the ultra-low temperature high-density microwave low-pass filter clustering assembly of this utility model, the clustering cavity is made of copper material.

[0012] In a preferred embodiment of the ultra-low temperature high-density microwave low-pass filter cluster assembly of this utility model, the filter housing is made of copper material, and the connector is made of copper material.

[0013] In a preferred embodiment of the ultra-low temperature high-density microwave low-pass filter clustering assembly of this utility model, both the input and output ends of the connector are SSMP connectors.

[0014] The beneficial effects of this invention are: achieving high density integration while maintaining good performance even in extreme low-temperature environments. Furthermore, the entire device has simple components, is easy to assemble, and is suitable for mass production. At 300K, the return loss is below -20dB, and the out-of-band rejection is below -30dB in the 1.1-3.5GHz range. Even at the extreme low-temperature environment of 77K, the return loss remains below -20dB, and the out-of-band rejection is below -30dB in the 1.1-3.5GHz range, demonstrating consistently good performance. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a front structural schematic diagram of a low-temperature high-density microwave low-pass filter cluster assembly according to the present invention.

[0016] Figure 2This is a top view of the structure of a low-temperature high-density microwave low-pass filter cluster assembly according to the present invention.

[0017] Figure 3 This is a schematic diagram of the low-pass filter unit in this utility model.

[0018] Figure 4 The results are for the test of the ultra-low temperature high-density microwave low-pass filter cluster assembly at 300K.

[0019] Figure 5 The results are for the test of the ultra-low temperature high-density microwave low-pass filter cluster assembly under liquid nitrogen ultra-low temperature 77K environment.

[0020] Figure descriptions: 100, Bundling unit; 101, Bundling cavity; 101a, Constraint hole; 101b, Mounting hole; 102, Grid strip; 103, Screw; 200, Low-pass filter unit; 201, Filter housing; 202, Connector. Detailed Implementation

[0021] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0022] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0024] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, actual manufacturing should include the three-dimensional spatial dimensions of length, width, and depth.

[0025] Example 1 Reference Figures 1 to 3This is the first embodiment of the present invention. This embodiment provides an ultra-low temperature high-density microwave low-pass filter cluster assembly, which can achieve small-scale high-density clustering, easy processing and assembly, and can still maintain excellent performance in an extreme low temperature and non-magnetic environment. It includes: a low-pass filter unit 200, which contains multiple low-pass filters. The clustering unit 100 includes a clustering cavity 101, grid bars 102, and screws 103. Among them, the grid strip 102 and the screw 103 cooperate to be fastened to the bundle cavity 101, and the bundle cavity 101 and the grid strip 102 cooperate to concentrate and constrain the low-pass filter. The low-pass filter includes a filter housing 201, a connector 202, and a PCB board disposed inside the filter housing 201. The connector 202 is used to fix the PCB board and the filter housing 201, and the inner conductor of the connector 202 is soldered to the PCB board. It should be noted that a low-pass filter consists of resistors and capacitors. The working principle of a low-pass filter is that for high-frequency signals that need to be cut off, the capacitor absorbs the inductor to prevent them from passing through; for low-frequency signals that need to be released, the high resistance of the capacitor and the low resistance of the inductor are used to allow them to pass through. In this way, most of the high-frequency signals are lost, while the low-frequency electromagnetic waves are lost less, thus realizing the function of low-pass filtering. The cluster cavity 101 has multiple constraint holes 101a for placing a low-pass filter, and multiple mounting holes 101b that match the screws 103. (Refer to...) Figure 2 The low-pass filters are respectively set in the constraint holes 101a and are installed in the bundle cavity 101 and grid 102 by screws 103; Among them, the cluster cavity 101 is made of copper, the filter housing 201 is made of copper, and the connector 202 is made of copper. The use of copper high-density microwave low-pass filter cluster components enables the microwave low-pass filter to maintain good performance even in extreme low-temperature environments. The input and output ends of connector 202 are both SSMP connectors.

[0026] This invention employs a clustering unit 100 to reduce device size and footprint, and facilitates processing and installation. The structural design of the microwave low-pass filter clustering assembly makes the overall structure of the microwave low-pass filter very robust and reliable; moreover, the components constituting the microwave low-pass filter are simple, easy to assemble, debug, and mass-produce.

[0027] Example 2 Reference Figure 4 and Figure 5This is the second embodiment of the present invention. Unlike the previous embodiment, it is achieved through… Figure 4 and Figure 5 The comparison shows that the device still has excellent performance indicators in low-temperature environments. Figure 4 and Figure 5 The middle section shows the test results of the SSMP-630M low-pass filter cluster assembly, with the dashed line representing 630MHz. Figure 4 In the 300K environment, the return loss reaches below -20dB, and in the 1.1-3.5GHz range, the out-of-band rejection reaches below -30dB. Figure 5 In the extreme low temperature environment of 77K, the return loss can reach below -20dB, and the out-of-band rejection can reach below -30dB in the 1.1-3.5GHz range, which is still quite good. In summary, this invention employs a copper high-density microwave low-pass filter cluster assembly, which enables the microwave low-pass filter to maintain good performance even in extreme low-temperature environments, thereby ensuring the low-temperature performance of the entire device.

[0028] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0029] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A low-temperature, high-density microwave low-pass filter cluster assembly, characterized in that, include: A low-pass filter unit (200) comprising a plurality of low-pass filters; as well as, The clustering unit (100) includes a clustering cavity (101), grid strips (102), and screws (103). The grid strip (102) and screw (103) cooperate to fasten to the cluster cavity (101), and the cluster cavity (101) and grid strip (102) cooperate to centrally constrain all the low-pass filters. The cluster cavity (101) is provided with a plurality of constraint holes (101a) for placing a low-pass filter. The cluster cavity (101) is also provided with a plurality of mounting holes (101b) that match the screws (103).

2. The ultra-low temperature high-density microwave low-pass filter cluster assembly according to claim 1, characterized in that: The low-pass filter includes a filter housing (201), a connector (202), and a PCB board disposed within the filter housing (201).

3. The ultra-low temperature high-density microwave low-pass filter cluster assembly according to claim 2, characterized in that: The connector (202) is used to fix the PCB board and the filter housing (201), and the inner conductor of the connector (202) is soldered to the PCB board.

4. The ultra-low temperature high-density microwave low-pass filter cluster assembly according to claim 1, characterized in that: The cluster cavity (101) is made of copper.

5. The ultra-low temperature high-density microwave low-pass filter cluster assembly according to claim 2, characterized in that: The filter housing (201) is made of copper, and the connector (202) is made of copper.

6. The ultra-low temperature high-density microwave low-pass filter cluster assembly according to claim 2, characterized in that: The input and output ends of the connector (202) are both SSMP connectors.

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