Substrate for fc package with antenna structure

Abstract

The utility model discloses a kind of FC packaging with carrier plate combination antenna structure, comprising: FC carrier plate, the FC carrier plate has opposite first side and second side, the first side is formed with accommodating recess;Flip chip is set in the accommodating recess, the flip chip is electrically connected in the FC carrier plate, the accommodating recess is filled with plastic sealant, and the plastic sealant is coated in the flip chip;Antenna assembly is installed in the FC carrier plate, and the antenna assembly is electrically connected in the chip.The utility model solves the problem that the module of the existing carrier plate combination antenna has large thickness, which affects the thickness of module assembly finished product.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically to an antenna structure combined with a carrier board for FC packaging. Background Technology

[0002] Modules combining carrier boards and antennas can be used in handheld products, mobile devices, networking equipment, smartphones, and consumer electronics. Generally, carrier boards for antennas are made of fiberglass. During packaging, the bonding of the chip increases the chip's thickness, thus increasing the overall thickness of the packaged module and consequently affecting the final thickness of the assembled module. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, a carrier board combined with an antenna structure for FC packaging is provided to solve the problem that existing carrier board combined antenna modules have large thickness, which affects the thickness of the assembled module.

[0004] To achieve the above objectives, an antenna structure combining a carrier board for FC packaging is provided, comprising: An FC carrier plate having opposing first and second sides, wherein a receiving groove is formed on the first side. A flip chip is disposed in the receiving groove, the flip chip is electrically connected to the FC carrier board, the receiving groove is filled with molding compound, and the molding compound covers the flip chip; An antenna assembly is mounted on the FC carrier board and is electrically connected to the chip.

[0005] Furthermore, the FC carrier board is an FC-BGA carrier board or an FC-CSP carrier board.

[0006] Furthermore, the flip chip is electrically connected to the FC carrier board via pads.

[0007] Furthermore, the space between the flip chip and the bottom of the receiving groove is filled with bottom filler adhesive.

[0008] Furthermore, the antenna assembly is a microstrip antenna, a planar inverted-F antenna, or a dipole antenna.

[0009] Furthermore, a reflective ground plane is installed below the antenna assembly or on the first side.

[0010] Furthermore, the antenna assembly is disposed on the first side or the inner metal layer of the FC carrier plate.

[0011] The beneficial effects of this invention are as follows: The FC packaging carrier board combined with the antenna structure utilizes laser or mechanical cutting techniques to create accommodating grooves on the carrier board for chip placement. The chip's bump pads connect to the carrier board for signal transmission. This effectively reduces the thickness of the packaged module and shortens the connection path between the chip and the carrier board, thereby increasing performance. Furthermore, this FC packaging carrier board combined with the antenna structure uses flip-chip technology and the integration of the antenna and carrier board to reduce the thickness of the packaged module, shorten the connection path between the chip and the carrier board, and increase performance. Attached Figure Description

[0012] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the FC packaging carrier board combined with the antenna structure according to an embodiment of the present invention.

[0013] Figure label: FC carrier board 1, circuit 11, insulating varnish 12; Flip chip 2, molding compound 21, solder pad 22; Antenna assembly 3. Detailed Implementation

[0014] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the relevant utility model and not intended to limit the scope of the utility model. Furthermore, it should be noted that, for ease of description, only the parts relevant to the utility model are shown in the accompanying drawings.

[0015] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0016] Reference Figure 1 As shown, this utility model provides an FC packaging carrier board combined with an antenna structure, including: FC carrier board 1, flip chip 2, and antenna assembly 3.

[0017] In this embodiment, FC carrier 1 is an FC-BGA carrier or an FC-CSP carrier.

[0018] Specifically, the FC carrier plate 1 has opposing first and second sides. The first side of the FC carrier plate 1 is formed with a receiving groove.

[0019] The receiving groove is a groove created on the first side of the FC carrier using techniques such as laser or mechanical cutting.

[0020] A flip chip 2 is disposed in a receiving recess. The flip chip 2 is electrically connected to the FC carrier board 1. The receiving recess is filled with molding compound 21. The molding compound 21 covers the flip chip 2. The molding compound covers the chip and part of the carrier board to provide physical protection and environmental isolation.

[0021] In this embodiment, the flip chip 2 is a chip mounted on the FC carrier board using flip-chip technology.

[0022] The flip chip 2 is electrically connected to the FC carrier board 1 via pad 22, that is, it is connected to the FC carrier board via the bump pad of the flip chip. The active side of the chip faces down, and the electrical connection with the carrier board is achieved through the pad (bump).

[0023] The space between the flip chip 2 and the bottom of the receiving slot is filled with underfill adhesive. This underfilling of the flip chip enhances reliability.

[0024] Package substrates typically use multilayer organic substrates (such as ABF or BT materials) with fine redistribution layers (RDL) and via structures.

[0025] Antenna assembly 3 is mounted on FC carrier board 1. Antenna assembly 3 is electrically connected to the chip.

[0026] This utility model discloses a carrier board combined with an antenna structure for FC packaging. It utilizes laser or mechanical cutting techniques to create accommodating grooves on the carrier board for chip placement. The chip's bump pad connects it to the carrier board for signal transmission. This effectively reduces the thickness of the packaged module and shortens the connection path between the chip and the carrier board, thereby increasing performance. This utility model's carrier board combined with an antenna structure for FC packaging uses flip-chip technology and the integration of the antenna with the carrier board to reduce the thickness of the packaged module, shorten the connection path between the chip and the carrier board, and increase performance.

[0027] The FC packaging carrier board of this utility model adopts antenna-in-Package (AiP) technology. Its structure and manufacturing method are designed to directly integrate antenna components into the interior or surface of the packaging substrate (such as FC-BGA or FC-CSP carrier board) to meet the requirements of high performance, miniaturization and high frequency communication (especially millimeter wave 5G applications).

[0028] In a preferred embodiment, antenna assembly 3 is a microstrip antenna, a planar inverted-F antenna, or a dipole antenna.

[0029] In this embodiment, the antenna assembly 3 is disposed on the first side or inner metal layer of the FC carrier plate 1. Specifically, the antenna pattern of the antenna assembly (Antenna Elements) can be directly fabricated on the outer metal layer or inner metal layer of the carrier plate.

[0030] In a preferred embodiment, a reflector ground plane is mounted below or on the first side of the antenna assembly 3. The reflector ground plane is located below the antenna assembly or on the other side of the carrier board to reflect signals and improve antenna efficiency and directivity, while reducing interference to chips and other circuits.

[0031] The key steps in fabricating the FC packaging carrier combined with the antenna structure of this utility model include: S1, Substrate preparation.

[0032] Specifically, this includes the fabrication of multi-layer FC carrier boards, including core boards, circuit layers, dielectric layers, and electroplating layers.

[0033] Dielectric materials with low dielectric loss are used as antenna supports and interlayer dielectrics to reduce signal loss, especially in high-frequency applications.

[0034] S2, chip flip-chip soldering.

[0035] Specifically, pads are fabricated at predetermined locations on the carrier board (the bottom of the recess), and the chip (with bumps) is mounted onto the substrate using flip-chip bonding processes (such as ball bonding and reflow soldering), followed by underfill to enhance reliability.

[0036] S3, Antenna structure formation.

[0037] S31. The antenna structure is formed on the surface of the carrier board. Antenna metal patterns are formed on the surface of the package or the outer surface of the carrier board using processes such as photolithography, electroplating, and etching.

[0038] S31. The antenna structure is integrated into the interior of the substrate. The antenna pattern is designed and fabricated in the internal metal layer of the substrate and connected to the radio frequency (RF) signal path of the chip through vias.

[0039] S4. Electrical Connection. Ensure that the antenna assembly is reliably electrically connected to the flip-chip RF circuitry via conductive connectors (such as vias, RDL wiring).

[0040] S5. Packaging and Testing. Complete the encapsulation or molding compound covering (if required), and perform final cutting, testing (including RF performance testing), and packaging.

[0041] The integrated manufacturing method of the FC packaging carrier board combined with the antenna structure of this invention can realize a compact, high-performance wireless communication module, which can be widely used in smartphones, IoT devices and millimeter-wave communication systems.

[0042] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the utility model involved in this application is not limited to the technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A carrier board combined with an antenna structure for FC packaging, characterized in that, include: An FC carrier plate having opposing first and second sides, wherein a receiving groove is formed on the first side. A flip chip is disposed in the receiving groove, the flip chip is electrically connected to the FC carrier board, the receiving groove is filled with molding compound, and the molding compound covers the flip chip; An antenna assembly is mounted on the FC carrier board and is electrically connected to the chip.

2. The carrier board combined with the antenna structure for FC packaging according to claim 1, characterized in that, The FC carrier board is either an FC-BGA carrier board or an FC-CSP carrier board.

3. The carrier board combined with the antenna structure for FC packaging according to claim 1, characterized in that, The flip chip is electrically connected to the FC carrier board via solder pads.

4. The carrier board combined with the antenna structure for FC packaging according to claim 3, characterized in that, The space between the flip chip and the bottom of the receiving groove is filled with bottom filler adhesive.

5. The carrier board combined with antenna structure for FC packaging according to claim 1, characterized in that, The antenna assembly is a microstrip antenna, a planar inverted-F antenna, or a dipole antenna.

6. The carrier board combined with the antenna structure for FC packaging according to claim 1, characterized in that, A reflective ground plane is mounted below the antenna assembly or on the first side.

7. The carrier board combined with the antenna structure for FC packaging according to claim 1, characterized in that, The antenna assembly is disposed on the first side or the inner metal layer of the FC carrier plate.

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