A laser pumping source water-cooling heat dissipation structure and a laser pumping source

Abstract

The utility model provides a kind of laser pumping source water-cooling heat dissipation structure and laser pumping source, it is related to laser pumping source technical field, and laser pumping source water-cooling heat dissipation structure includes shell, the bottom surface of the shell is equipped with water-cooling cavity, one side of the shell is equipped with the water inlet hole and water outlet hole that communicate the water-cooling cavity, the shell is equipped with the encapsulation cavity of encapsulation chip, and the encapsulation cavity is located above the water-cooling cavity.Laser pumping source water-cooling heat dissipation structure by the bottom surface of the shell is equipped with water-cooling cavity, the shell is equipped with the encapsulation cavity of encapsulation chip, the encapsulation cavity is located above the water-cooling cavity, and the cooling medium of water-cooling cavity directly removes the heat of chip directly from shell, cancels traditional water-cooling plate, simplifies structure and heat transfer path, eliminates the interface thermal resistance caused by heat-conducting silicone grease, and the distance of cooling water and chip is also closer, effectively improves the heat dissipation performance, reduces the overall energy consumption of laser.

Description

Technical Field

[0001] This utility model relates to the field of laser pump source technology, and in particular to a water-cooled heat dissipation structure for a laser pump source and a laser pump source. Background Technology

[0002] The laser pump source is the primary energy source of a fiber laser. During operation, the laser pump source generates a significant amount of heat. To dissipate heat, traditional laser pump sources primarily employ a heat-conducting shell made of aluminum alloy. This shell has a simple, thin-walled structure, mounted on a cold plate using mounting plates and screws. The shell and cold plate are then in close contact, and heat is conducted through the contact surface between the shell and the cold plate, thus carrying away the heat generated within the pump source. However, due to limitations in manufacturing precision and surface roughness, the contact between the shell and the cold plate is not always perfect, reducing heat conduction capacity. If heat transfer is insufficient, overheating of the pump source can lead to a decrease in power output and even burnout.

[0003] To address these issues, existing technologies typically place thermal grease between the cold plate and the thermally conductive housing. Heat is conducted from the laser chip to the packaging housing, then through the thermal grease to the water-cooled plate, where it is finally transferred to the cooling water. However, the heat transfer from the chip to the cooling water involves multiple media, resulting in significant interfacial thermal resistance and impacting heat dissipation efficiency. Utility Model Content

[0004] In view of this, the present invention proposes a water-cooled heat dissipation structure for a laser pump source and a laser pump source to solve the technical problem mentioned in the background art of the prior art where heat is conducted from the chip to the cooling water through multiple media, resulting in high interfacial thermal resistance and affecting the heat dissipation effect.

[0005] The technical solution of this utility model is implemented as follows: In a first aspect, this utility model provides a water-cooled heat dissipation structure for a laser pump source, including a housing, a water-cooled cavity on the bottom surface of the housing, a water inlet and a water outlet on one side of the housing that connect to the water-cooled cavity, and a packaging cavity for packaging a chip located above the water-cooled cavity.

[0006] In some alternative embodiments, preferably, the housing includes a shell and a cover plate, the shell having a water tank, and the cover plate being sealed to the shell such that the water tank and the cover plate form the water-cooled cavity.

[0007] In some alternative embodiments, preferably, the cover plate is welded integrally with the housing.

[0008] In some optional embodiments, preferably, the water tank includes multiple straight grooves and multiple connecting grooves. The straight grooves are arranged along the length of the shell and are parallel to each other. The two straight grooves at both ends are respectively connected to the water inlet and the water outlet. Adjacent straight grooves are connected by the connecting grooves to form a "snake"-shaped structure with the ends connected.

[0009] In some alternative implementations, the connecting groove is preferably a U-shaped groove.

[0010] In some alternative embodiments, preferably, one side of the housing is provided with an encapsulation hole for encapsulating the optical fiber core.

[0011] In some alternative embodiments, preferably, the side of the housing is provided with an ear mount for mounting, and the ear mount is provided with mounting holes for mounting and fixing.

[0012] Secondly, this utility model provides a laser pump source, including the water-cooled heat dissipation structure of the laser pump source as described in the first aspect.

[0013] The water-cooled heat dissipation structure for the laser pump source of this invention has the following advantages over the prior art: (1) A water-cooled cavity is provided on the bottom surface of the outer shell, and the outer shell is provided with a packaging cavity for packaging the chip. The packaging cavity is located above the water-cooled cavity. The cooling medium of the water-cooled cavity directly carries away the heat of the chip directly from the outer shell, eliminating the traditional water-cooled plate, simplifying the structure and heat transfer path, eliminating the interface thermal resistance caused by thermal grease, and the distance between the cooling water and the chip is also closer, effectively improving the heat dissipation performance and reducing the overall energy consumption of the laser. (2) A water tank is provided in the housing, and the cover plate is sealed to the housing so that the water tank and the cover plate form the water-cooled cavity, thereby integrating the water-cooled cavity inside the housing, eliminating the traditional water-cooled plate and greatly reducing the interface thermal resistance. (3) By welding the cover plate to the housing as a whole, the cover plate and the housing can be effectively sealed, improving the sealing performance of the water-cooled cavity, thereby improving the reliability and stability of the device; (4) The water tank includes multiple straight grooves and multiple connecting grooves. The straight grooves are arranged along the length of the shell and the multiple straight grooves are parallel to each other. The two straight grooves at both ends are connected to the water inlet and the water outlet, respectively. The two adjacent straight grooves are connected by the connecting grooves to form a “snake”-shaped structure with the head and tail connected in sequence. Under the same size shell, the area of ​​the water cooling cavity can be increased, thereby increasing the volume of the water cooling medium and improving the heat dissipation efficiency. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a perspective view of the water-cooled heat dissipation structure of the laser pump source in an embodiment of this utility model; Figure 2 This is an exploded view of the water-cooled heat dissipation structure of the laser pump source in an embodiment of this utility model; Figure 3 This is a bottom view of the water-cooled heat dissipation structure of the laser pump source in an embodiment of this utility model; Figure 4 This utility model Figure 3 AA section view in the middle; Figure 5 This utility model Figure 3 BB section view in the middle; Figure 6 This is a rear view of the housing in an embodiment of the present utility model; Figure 7 This utility model Figure 6 CC section view in the image.

[0016] Explanation of reference numerals in the attached drawings: 1 - Outer casing; 100-Water-cooled cavity; 11-Housing, 111-Water tank, 1111-Straight groove, 1112-Connecting groove, 112-Water inlet, 113-Water outlet, 114-Encapsulation hole, 115-Positioning hole, 116-Ear seat, 1161-Mounting hole, 12-Cover plate. Detailed Implementation

[0017] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0018] Reference Figures 1-7As shown in the first aspect embodiment of this utility model, a water-cooled heat dissipation structure for a laser pump source is proposed, including a housing 1. A water-cooled cavity 100 is provided on the bottom surface of the housing 1. A water inlet 112 and a water outlet 113 communicating with the water-cooled cavity 100 are provided on one side of the housing 1. A chip encapsulation cavity is provided in the housing 1, located above the water-cooled cavity 100. The water inlet 112 and the water outlet 113 can be tapped to form threaded holes, facilitating the connection of external water inlet and outlet pipes and improving assembly convenience.

[0019] The laser pump source water-cooled heat dissipation structure proposed in this embodiment has a water-cooled cavity 100 on the bottom surface of the outer shell 1. The outer shell 1 has a packaging cavity for the packaged chip, which is located above the water-cooled cavity 100. The cooling medium of the water-cooled cavity 100 directly removes the heat of the chip from the outer shell 1, eliminating the need for a traditional water-cooling plate, simplifying the structure and heat transfer path, eliminating the interface thermal resistance caused by thermal grease, and bringing the cooling water closer to the chip, effectively improving heat dissipation performance and reducing the overall energy consumption of the laser.

[0020] In some embodiments, the outer casing 1 includes a housing 11 and a cover plate 12. A water inlet 112 and a water outlet 113 are located on the housing 11. A water tank 111 is provided within the housing 11. The cover plate 12 is sealed to the housing 11, forming a water-cooled cavity 100 between the water tank 111 and the cover plate 12. The water tank 111 for cooling is formed by precision machining of the housing 11. The cover plate 12 covers the housing 11, and after the cover plate 12 and the housing 11 are sealed together, the water-cooled cavity 100 is formed between the water tank 111 and the cover plate 12. This integrates the water-cooled cavity 100 within the outer casing 1, eliminating the need for a traditional water-cooling plate and significantly reducing interfacial thermal resistance.

[0021] In some embodiments, the cover plate 12 is welded integrally with the housing 11. By brazing the cover plate 12 and the housing 11 together, a sealed water-cooled cavity 100 is formed, providing a reliable channel for the circulation of the cooling medium.

[0022] In some embodiments, the water tank 111 includes a plurality of straight grooves 1111 and a plurality of connecting grooves 1112. The straight grooves 1111 are arranged along the length of the housing 11 and are parallel to each other. The two straight grooves 1111 at both ends are respectively connected to the water inlet 112 and the water outlet 113. Adjacent straight grooves 1111 are connected by the connecting grooves 1112, forming a "snake"-like structure with the ends connected. With the above arrangement, the area of ​​the water-cooling cavity 100 can be increased under the same size housing 1, thereby increasing the volume of the water-cooling medium and improving the heat dissipation efficiency.

[0023] In some embodiments, the connecting groove 1112 is a U-shaped groove. The U-shaped groove allows the cooling medium to flow smoothly from one straight groove to the next when flowing between two straight grooves 1111, avoiding eddies at corners, improving the smoothness of the cooling medium flow, and thus improving heat dissipation efficiency.

[0024] In some embodiments, one side of the housing 1 is provided with a sealing hole 114 for sealing the optical fiber core. Positioning holes 115 are provided on both sides of the sealing hole 114 for mating with the connector of the optical fiber core, improving assembly convenience, enhancing the coaxiality of the optical fiber core and the sealing hole 114, and improving the quality and reliability of the sealing.

[0025] In some embodiments, the side of the housing 1 is provided with an ear seat 116 for installation, and the ear seat 116 is provided with a mounting hole 1161 for installation and fixing. Ear seats 116 are provided on opposite sides of the housing 1, and the mounting holes 1161 on the ear seats 116 are used for bolts to pass through for installation and fixing, which is simple and quick to operate and easy to assemble.

[0026] The working principle of the laser pump source water-cooled heat dissipation structure in this embodiment is as follows: cooling medium is input into the water-cooled cavity 100 through the water inlet 112 and discharged through the water outlet 113, realizing the circulation of the cooling medium in the water-cooled cavity 100. The cooling medium in the water-cooled cavity 100 directly removes the heat of the chip from the outer shell 1, eliminating the traditional water-cooling plate, simplifying the structure and heat transfer path, eliminating the interface thermal resistance caused by thermal grease, and bringing the cooling water closer to the chip, effectively improving heat dissipation performance and reducing the overall energy consumption of the laser.

[0027] Based on the same concept, a second aspect of this utility model provides a laser pump source, including a water-cooled heat dissipation structure for the laser pump source as described in the first aspect embodiment.

[0028] The laser pump source proposed in this embodiment eliminates the traditional water-cooled plate, simplifies the structure and heat transfer path, eliminates the interfacial thermal resistance caused by thermal grease, and brings the cooling water closer to the chip, effectively improving heat dissipation performance and reducing the overall energy consumption of the laser.

[0029] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A water-cooled heat dissipation structure for a laser pump source, characterized in that, The device includes a housing, the bottom surface of which is provided with a water-cooled cavity, one side of which is provided with a water inlet and a water outlet connecting to the water-cooled cavity, and the housing is provided with a chip encapsulation cavity located above the water-cooled cavity.

2. The laser pump source water-cooled heat dissipation structure as described in claim 1, characterized in that, The outer casing includes a housing and a cover plate. A water tank is provided in the housing, and the cover plate is sealed to the housing so that the water-cooled cavity is formed between the water tank and the cover plate.

3. The laser pump source water-cooled heat dissipation structure as described in claim 2, characterized in that, The cover plate is welded to the shell as a whole.

4. The laser pump source water-cooled heat dissipation structure as described in claim 2, characterized in that, The water tank includes multiple straight grooves and multiple connecting grooves. The straight grooves are arranged along the length of the shell and are parallel to each other. The two straight grooves at both ends are connected to the water inlet and the water outlet, respectively. Adjacent straight grooves are connected by the connecting grooves to form a "snake"-shaped structure with the ends connected.

5. The laser pump source water-cooled heat dissipation structure as described in claim 4, characterized in that, The connecting groove is a U-shaped groove.

6. The laser pump source water-cooled heat dissipation structure as described in claim 1, characterized in that, One side of the housing is provided with an encapsulation hole, which is used to encapsulate the optical fiber core.

7. The laser pump source water-cooled heat dissipation structure as described in claim 1, characterized in that, The side of the housing is provided with mounting ears, and the mounting ears are provided with mounting holes for installation and fixing.

8. A laser pump source, characterized in that, Includes the laser pump source water-cooled heat dissipation structure as described in any one of claims 1-7.

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