An integrated external cavity laser

Abstract

The utility model discloses an integrated external cavity laser, it includes casing, a plurality of laser components and heat conduction subassembly, the casing includes casing body, the casing body has a accommodating cavity, is equipped with a plurality of light outlets that all with accommodating cavity intercommunication on the casing body, and the central axis of each light outlet is all parallel with each other, each laser component is all arranged in accommodating cavity, and each laser component with each light outlet one to one corresponds, and the laser that laser component emits is used for emitting from light outlet, heat conduction subassembly is arranged in accommodating cavity, and bears each laser component, the utility model has the beneficial effect that: a plurality of laser components are encapsulated in the same casing body, and the laser that each laser component emits can emit from each light outlet one to one, realizes laser multiple channel, multi -wavelength integration encapsulation, can effectively reduce the volume of using a plurality of wavelength's laser.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to an integrated external cavity laser. Background Technology

[0002] An ECL (External Cavity Laser) is a semiconductor laser that achieves narrow linewidth output through an external optical feedback structure. Its core design concept combines a semiconductor gain chip with independent external cavity optical components, utilizing the "selective feedback" of the external cavity to the light field to compress the laser linewidth while simultaneously achieving flexible wavelength tuning. By extending the external cavity length or introducing high-Q filtering elements, the number of round trips of photons within the cavity is increased, phase noise is effectively suppressed, and the linewidth can be reduced to the kHz or even Hz level, making it a typical representative of "narrow linewidth lasers." With its core advantages such as ultra-narrow linewidth and wide tuning, the ECL has become a "core light source" for high-end optoelectronic systems. In some practical applications, it is necessary to use multiple wavelengths of ECL simultaneously. Since existing ECLs (such as the external cavity laser and device disclosed in application number 202411934114.3) have large individual package sizes and high costs, using multiple wavelengths of ECL simultaneously would increase the size of the laser. Utility Model Content

[0003] The purpose of this invention is to overcome the above-mentioned technical deficiencies and propose an integrated external cavity laser to solve the technical problems of large individual package size and high cost of ECL in the prior art, and the increased size of the laser when using ECL with multiple wavelengths.

[0004] To achieve the above technical objectives, the present invention provides an integrated external cavity laser, comprising: The housing includes a housing body having a receiving cavity, and the housing body having a plurality of light-emitting ports that are all communicating with the receiving cavity, and the central axes of each light-emitting port are parallel to each other. Multiple laser components are disposed within the receiving cavity, and each laser component corresponds one-to-one with each light output port. The laser emitted by each laser component is used to exit from the light output port. A heat-conducting component, disposed within the receiving cavity and carrying each of the laser components, is used to conduct the heat generated by each of the laser components to the outside of the housing.

[0005] Furthermore, the optical axis of the laser assembly coincides with the central axis of the light outlet.

[0006] Furthermore, each of the laser components includes a laser emitter, a collimating lens, an etalon, a filter, and a reflector. The laser emitter, the collimating lens, the etalon, the filter, and the reflector are arranged sequentially and located on the same optical axis. The laser emitted by the laser emitter passes sequentially through the collimating lens, the etalon, the filter, and the reflector, and exits from the light outlet.

[0007] Furthermore, each of the laser components also includes a first heat sink and a second heat sink, with the first heat sink disposed on the second heat sink, the laser emitter disposed on the first heat sink, and the collimating lens, the etalon, the filter, and the reflector all disposed on the second heat sink. The heat-conducting component carries each of the second heat sinks, and the first and second heat sinks are used to conduct the heat generated by the laser emitter to the heat-conducting component.

[0008] Furthermore, the heat-conducting component includes a substrate and a plurality of heat-conducting elements, each of which is arranged side by side on the substrate and each of which corresponds to and supports a particular laser component.

[0009] Furthermore, the heat-conducting component is a semiconductor cooling structure.

[0010] Furthermore, the integrated external cavity laser also includes multiple isolators, each of which is disposed within the receiving cavity and corresponds one-to-one with each of the light output ports. The laser emitted by the laser assembly passes through the isolators and is used to exit from the light output ports.

[0011] Furthermore, the integrated external cavity laser also includes multiple optical fibers, each of which is disposed outside the housing and corresponds one-to-one with each of the light output ports. The optical fibers are used to transmit optical signals.

[0012] Furthermore, the integrated external cavity laser also includes multiple collimators, each of which is disposed outside the housing and corresponds one-to-one with each of the light output ports. The collimators are used to collimate the laser and couple it into the optical fiber.

[0013] Furthermore, the housing also includes multiple sleeves, each sleeve being disposed outside the housing body, with one end of each sleeve corresponding to and connected to each of the light outlets, and one end of each optical fiber and each collimator being correspondingly disposed inside each sleeve.

[0014] Compared with the prior art, the beneficial effects of this utility model include: during use, the laser emitted by each laser component can be emitted one by one from each corresponding light outlet; the heat generated by each laser component during operation can be conducted to the outside of the housing through the heat conduction component; the wavelengths of the lasers emitted by each laser component can be the same or different, depending on actual needs. This integrated external cavity laser encapsulates multiple laser components in the same housing, and the lasers emitted by each laser component can be emitted one by one from each corresponding light outlet, realizing the integrated packaging of multi-channel and multi-wavelength lasers, which can effectively reduce the size of lasers using multiple wavelengths. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of an integrated external cavity laser provided by this utility model; Figure 2 This is a three-dimensional structural diagram showing the connection relationship between the laser component and the heat-conducting component provided by this utility model; Figure 3 This is a three-dimensional structural schematic diagram of the laser assembly provided by this utility model; In the diagram: 100 - housing, 110 - housing body, 111 - receiving cavity, 112 - light outlet, 120 - sleeve, 130 - pin, 200 - laser assembly, 210 - laser emitter, 220 - collimating lens, 230 - etalon, 240 - filter, 250 - reflector, 260 - first heat sink, 270 - second heat sink, 300 - thermal conductive component, 310 - substrate, 320 - thermal conductive element, 400 - isolator, 500 - optical fiber. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0017] This invention provides an integrated external cavity laser, the structure of which is as follows: Figure 1 - Figure 3As shown, the device includes a housing 100, multiple laser assemblies 200, and a heat-conducting assembly 300. The housing 100 includes a shell body 110 with a receiving cavity 111. The shell body 110 has multiple light-emitting ports 112, each communicating with the receiving cavity 111, and the central axes of each light-emitting port 112 are parallel to each other. Each laser assembly 200 is disposed within the receiving cavity 111, and each laser assembly 200 corresponds one-to-one with each light-emitting port 112. The laser emitted by each laser assembly 200 is used to exit from the light-emitting port 112. The heat-conducting assembly 300 is disposed within the receiving cavity 111 and carries each laser assembly 200, and is used to conduct the heat generated by each laser assembly 200 to the outside of the housing 100.

[0018] In use, the lasers emitted by each laser component 200 can be emitted one-to-one from each of the corresponding light outlets 112. The heat generated during the operation of each laser component 200 can be conducted to the outside of the housing 110 via the heat conduction component 300. The wavelengths of the lasers emitted by each laser component 200 can be the same or different, depending on actual needs. This integrated external cavity laser encapsulates multiple laser components 200 in the same housing 110, and the lasers emitted by each laser component 200 can be emitted one-to-one from each of the corresponding light outlets 112, realizing the integrated packaging of multi-channel, multi-wavelength lasers, which can effectively reduce the size of lasers using multiple wavelengths.

[0019] As a preferred embodiment, please refer to Figure 1 Each of the light-emitting ports 112 is located at the front end of the housing 110, so that the laser emitted by the laser assembly 200 can be emitted from the light-emitting ports 112.

[0020] As a preferred embodiment, please refer to Figure 1 Each of the laser components 200 is arranged side by side, so that each of the laser components 200 corresponds one-to-one with each of the light output ports 112.

[0021] As a preferred embodiment, please refer to Figure 1 The optical axis of the laser assembly 200 coincides with the central axis of the light outlet 112, which can ensure the laser emission effect.

[0022] As a preferred embodiment, please refer to Figure 1 and Figure 3Each laser assembly 200 includes a laser emitter 210, a collimating lens 220, an etalon 230, a filter 240, and a reflector 250. The laser emitter 210, collimating lens 220, etalon 230, filter 240, and reflector 250 are arranged sequentially and located on the same optical axis. The laser emitted by the laser emitter 210 passes sequentially through the collimating lens 220, etalon 230, filter 240, and reflector 250, and exits from the light outlet 112. The laser output process of the laser assembly 200 involves each of the laser emitters... As a result of the coordinated action of the device components 200 in the "optical path sequence", firstly, the laser emitter 210 emits divergent light; then, the collimating lens 220 converts the divergent light into parallel light, forming the optical path basis; next, the filter 240 initially filters stray light, performing purity pretreatment on the laser; then, the etalon 230 selects the target narrow wavelength, core frequency selection, and narrows the linewidth; finally, the reflector 250 feeds the target wavelength light back to the laser emitter 210, constructing a resonant cavity to achieve oscillation, and part of the light is output from the cleavage surface of the reflector 250 and the laser emitter 210, forming the final laser.

[0023] In a preferred embodiment, the collimating lens 220 can convert divergent light into parallel light. The divergent beam emitted by the laser emitter 210 becomes parallel light after passing through the collimating lens 220, reducing light intensity attenuation and spot diffusion during propagation.

[0024] In a preferred embodiment, the etalon 230 is a Fabry-Perot etalon, a "high-resolution spectral / frequency-selective" element. Its core is based on multi-beam interference, which can achieve fine selection of wavelengths. Its resolution is much higher than that of ordinary gratings. In this scheme, the etalon 230 mainly realizes the function of narrowing the linewidth of the device.

[0025] In a preferred embodiment, the filter 240 is an element in the optical system that "screens specific light signals". By selectively absorbing, reflecting or transmitting, it allows only the target light (such as a specific wavelength, polarization direction, or intensity) to pass through, thereby suppressing interference light. In this solution, the filter 240 mainly suppresses stray light noise.

[0026] In a preferred embodiment, the reflective sheet 250, also known as a partial reflective sheet, is mainly used to reflect a portion of the light into the laser emitter 210 to form laser lasing. It serves to construct the resonant cavity and control the light output.

[0027] In a preferred embodiment, the laser emitter 210 is a laser diode.

[0028] As a preferred embodiment, please refer to Figure 2 and Figure 3 Each of the laser components 200 further includes a first heat sink 260 and a second heat sink 270. The first heat sink 260 is disposed on the second heat sink 270. The laser emitter 210 is disposed on the first heat sink 260. The collimating lens 220, the etalon 230, the filter 240, and the reflector 250 are all disposed on the second heat sink 270. The heat-conducting component 300 carries each of the second heat sinks 270. The first heat sink 260 and the second heat sink 270 are used to conduct the heat generated by the laser emitter 210 to the heat-conducting component 300. The first heat sink 260 and the second heat sink 270 can sink the heat generated by the laser emitter 210 downward, thereby conducting the heat to the heat-conducting component 300, and then to the outside of the housing 110 via the heat-conducting component 300. While conducting heat, the first heat sink 260 also takes into account the electrical connections inside the receiving cavity 111.

[0029] As a preferred embodiment, please refer to Figure 2 and Figure 3 The heat-conducting component 300 includes a substrate 310 and multiple heat-conducting elements 320. Each heat-conducting element 320 is arranged side by side on the substrate 310, and each heat-conducting element 320 corresponds to and supports each laser component 200. The heat-conducting component 300 is a solid-state cooling device based on the Peltier effect. It achieves directional heat transfer through direct current drive. During operation, it transfers heat from the cavity 111. Combined with a thermistor, it achieves a stable internal temperature of the device. The laser emitter 210 emits light and heat. The heat is conducted to the upper surface of the heat-conducting component 300 through the first heat sink 260 and the second heat sink 270. The thermistor provides feedback for temperature monitoring. When the temperature rises, the resistance decreases. When the external driving circuit detects the change in resistance, it can apply a positive or reverse voltage to the heat-conducting component 300 to drive it to work, allowing the device to reach a balanced and stable operating temperature, which simplifies the design of the laser driving circuit.

[0030] In a preferred embodiment, the heat-conducting component 300 is fixed to the housing 110 by eutectic welding to ensure good heat dissipation and installation strength.

[0031] As a preferred embodiment, please refer to Figure 2The heat-conducting component 320 is a semiconductor cooling structure, which is a solid-state cooling device based on the Peltier effect. It achieves directional heat transfer by driving with DC current, transferring the heat inside the housing 100. At the same time, combined with a thermistor, it achieves a stable internal temperature of the device, which can improve the heat conduction effect.

[0032] As a preferred embodiment, please refer to Figure 2 and Figure 3 Each of the heat-conducting components 320 corresponds to one of the second heat sinks 270.

[0033] As a preferred embodiment, please refer to Figure 1 The integrated external cavity laser also includes multiple isolators 400, each of which is disposed within the receiving cavity 111 and corresponds one-to-one with each of the light output ports 112. The laser emitted by the laser assembly 200 passes through the isolators 400 and is used to exit from the light output ports 112. The working principle of the isolator 400 is based on the Faraday effect (magneto-optical effect), which is equivalent to a one-way valve in the optical path. Light can only go out and can prevent light from returning to the laser emitter 210 and causing abnormal performance of the laser emitter 210.

[0034] As a preferred embodiment, please refer to Figure 1 The integrated external cavity laser also includes multiple optical fibers 500, each of which is disposed outside the housing 110 and corresponds one-to-one with each of the light output ports 112. The optical fibers 500 are used to transmit optical signals.

[0035] In a preferred embodiment, the integrated external cavity laser further includes multiple collimators, each of which is disposed outside the housing 110 and corresponds one-to-one with each of the light output ports 112. The collimators are used to collimate the laser and couple it into the optical fiber 500. The reflector 250 feeds the target wavelength light back to the laser emitter 210 to construct a resonant cavity and achieve oscillation. Part of the light is output from the cleavage surface of the reflector 250 and the laser emitter 210 to form the final laser. After the laser passes through the isolator 400, the collimator can receive the laser, collimate it, and couple it into the optical fiber 500 for transmission.

[0036] As a preferred embodiment, please refer to Figure 1The housing 100 also includes a plurality of sleeves 120, each of which is disposed outside the housing body 110, and one end of each sleeve 120 is connected to each of the light outlets 112 in a corresponding manner. One end of each optical fiber 500 and each collimator are arranged in each of the sleeves 120 in a corresponding manner to protect the optical fiber 500 and the collimator.

[0037] As a preferred embodiment, please refer to Figure 1 The housing 100 also includes a plurality of pins 130, each of which is disposed outside the housing body 110 and located at the rear end of the housing body 110. One end of each pin 130 is fixedly connected to the housing body 110, and the other end of each pin 130 is used to provide an electrical interface.

[0038] To better understand this utility model, the following is combined with... Figure 1 - Figure 3 The working principle of the technical solution of this utility model will be described in detail below: The laser output process of the laser assembly 200 is the result of the coordinated action of each laser assembly 200 in the "optical path sequence". First, the laser emitter 210 emits divergent light; then, the collimating lens 220 converts the divergent light into parallel light, forming the optical path basis; next, the filter 240 initially filters stray light, performing purity preprocessing on the laser; then, the etalon 230 selects the target narrow wavelength, core frequency selection, and narrows the linewidth; finally, the reflector 250 feeds the target wavelength light back to the laser emitter 210, constructs a resonant cavity, realizes oscillation, and part of the light is output from the cleavage surface of the reflector 250 and the laser emitter 210, forming the final laser. After the laser passes through the isolator 400, the collimator receives the laser, collimates it, and couples it into the optical fiber 500 for transmission. The laser emitter 210 operates, emitting light and heat. The heat is conducted through the first heat sink 260 and the second heat sink 270 to the upper surface of the heat-conducting component 300. The heat-conducting component 300 then conducts the heat to the outside of the housing 110. The thermistor in the heat-conducting component 300 provides temperature monitoring feedback; as the temperature rises, its resistance decreases. When the external driving circuit detects this resistance change, it can provide feedback to the heat-conducting component 300. The heat-conducting component 300 is driven to work by a forward or reverse voltage, so that the internal temperature of the device reaches a balanced and stable operating temperature. The wavelengths of the lasers emitted by each laser emitter 210 can be the same or different, depending on the actual needs. This integrated external cavity laser encapsulates multiple laser components 200 in the same housing 110, and the lasers emitted by each laser component 200 can be emitted one by one from each of the light outlets 112, realizing the integrated packaging of multi-channel and multi-wavelength lasers, which can effectively reduce the size of lasers using multiple wavelengths.

[0039] The integrated external cavity laser provided by this utility model has the following beneficial effects: (1) In this integrated external cavity laser, the laser output process of the laser component 200 is the result of the coordinated action of each laser component 200 in the "optical path sequence". First, the laser emitter 210 emits divergent light; then, the collimating lens 220 converts the divergent light into parallel light to form the optical path basis; next, the filter 240 initially filters stray light and performs purity pretreatment on the laser; then, the etalon 230 selects the target narrow wavelength, selects the core frequency, and narrows the linewidth; finally, the reflector 250 feeds the target wavelength light back to the laser emitter 210 to construct a resonant cavity and realize oscillation, and part of the light is output from the cleavage surface of the reflector 250 and the laser emitter 210 to form the final laser. (2) In this integrated external cavity laser, the heat-conducting component 300 is a solid-state cooling device based on the Peltier effect. It achieves directional heat transfer through DC current drive. During operation, it transfers the heat inside the housing cavity 111. Combined with the thermistor, it achieves a stable internal temperature state. The laser emitter 210 emits light and heat. The heat is conducted to the upper surface of the heat-conducting component 300 through the first heat sink 260 and the second heat sink 270. The thermistor plays a feedback role in temperature monitoring. When the temperature rises, the resistance value decreases. When the external driving circuit detects the change in resistance, it can apply a positive or reverse voltage to the heat-conducting component 300 to drive it to work, so that the internal temperature of the device reaches a balanced and stable working temperature, which can simplify the design of the laser driving circuit. (3) This integrated external cavity laser encapsulates multiple laser components 200 in the same housing 110, and the laser emitted by each laser component 200 can be emitted from each of the output ports 112 in a one-to-one correspondence, realizing the integrated packaging of multi-channel and multi-wavelength lasers, which can effectively reduce the volume of lasers using multiple wavelengths.

[0040] The specific embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any other corresponding changes and modifications made based on the technical concept of this utility model should be included within the scope of protection of the claims of this utility model.

Claims

1. An integrated external cavity laser, characterized in that, include: The housing includes a housing body having a receiving cavity, and the housing body having a plurality of light-emitting ports that are all communicating with the receiving cavity, and the central axes of each light-emitting port are parallel to each other. Multiple laser components are disposed within the receiving cavity, and each laser component corresponds one-to-one with each light output port. The laser emitted by each laser component is used to exit from the light output port. A heat-conducting component, disposed within the receiving cavity and carrying each of the laser components, is used to conduct the heat generated by each of the laser components to the outside of the housing.

2. The integrated external cavity laser according to claim 1, characterized in that, The optical axis of the laser assembly coincides with the central axis of the light output port.

3. The integrated external cavity laser according to claim 1, characterized in that, Each of the laser components includes a laser emitter, a collimating lens, an etalon, a filter, and a reflector. The laser emitter, the collimating lens, the etalon, the filter, and the reflector are arranged sequentially and located on the same optical axis. The laser emitted by the laser emitter passes sequentially through the collimating lens, the etalon, the filter, and the reflector, and exits from the light outlet.

4. The integrated external cavity laser according to claim 3, characterized in that, Each of the laser components further includes a first heat sink and a second heat sink, the first heat sink being disposed on the second heat sink, the laser emitter being disposed on the first heat sink, the collimating lens, the etalon, the filter, and the reflector being disposed on the second heat sink, and the heat-conducting component carrying each of the second heat sinks, the first heat sink and the second heat sink being used to conduct the heat generated by the laser emitter to the heat-conducting component.

5. The integrated external cavity laser according to claim 1, characterized in that, The heat-conducting component includes a substrate and multiple heat-conducting elements, each of which is arranged side by side on the substrate and each of which corresponds to and supports a laser component.

6. The integrated external cavity laser according to claim 5, characterized in that, The heat-conducting component is a semiconductor cooling structure.

7. The integrated external cavity laser according to claim 1, characterized in that, It also includes multiple isolators, each of which is disposed within the receiving cavity and corresponds one-to-one with each of the light-emitting ports. The laser emitted by the laser assembly passes through the isolators and is used to exit from the light-emitting ports.

8. The integrated external cavity laser according to claim 1, characterized in that, It also includes multiple optical fibers, each of which is disposed outside the housing and corresponds one-to-one with each of the light outlets. The optical fibers are used to transmit optical signals.

9. The integrated external cavity laser according to claim 8, characterized in that, It also includes multiple collimators, each of which is disposed outside the housing and corresponds one-to-one with each of the light outlets. The collimators are used to collimate the laser and couple it into the optical fiber.

10. The integrated external cavity laser according to claim 9, characterized in that, The housing also includes multiple sleeves, each sleeve being disposed outside the housing body, with one end of each sleeve corresponding to and connected to each of the light outlets, and one end of each optical fiber and each collimator being disposed inside each sleeve.

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