Micro-channel liquid cooling heat dissipation device for semiconductor laser

Abstract

The utility model relates to a kind of microchannel liquid cooling heat sink for semiconductor laser, including by upper to lower arrangement and fixed connection cover plate and laser shell, wherein, laser shell side towards cover plate or cover plate side towards laser shell is equipped with microchannel groove, cooling liquid first interface and cooling liquid second interface are respectively set in the short side and long side of cover plate, cover plate side towards laser shell is equipped with first drainage hole and second drainage hole, first drainage hole and second drainage hole are respectively connected with microchannel groove, cooling liquid first interface is connected with first drainage hole, cooling liquid second interface is connected with second drainage hole.Compared with prior art, the utility model can efficiently cover chip heat source area, improve heat dissipation efficiency and cooling effect, and has the advantages of compact structure, good sealing, strong adaptability etc.

Description

Technical Field

[0001] This utility model relates to the field of thermal management technology for electronic devices, and in particular to a microchannel liquid cooling heat dissipation device for semiconductor lasers. Background Technology

[0002] Semiconductor lasers, due to their advantages of small size, high efficiency, and long lifespan, are now widely used in many fields such as optical communication, laser processing, medical aesthetics, national defense, and scientific research instruments. As semiconductor lasers develop towards higher power and higher integration, the heat flux density per unit area increases dramatically, leading to localized temperature rises in the chip. If heat dissipation is not timely, it can easily cause problems such as decreased laser output power, wavelength drift, shortened device lifespan, or even permanent failure. Therefore, a good heat dissipation system is crucial to ensuring the stable performance and reliable operation of semiconductor lasers. Currently, commonly used heat dissipation methods for semiconductor lasers include air cooling, liquid cooling with cold plates, and heat pipe cooling. However, air cooling is limited by its heat dissipation efficiency and cannot meet the cooling requirements of high heat flux density lasers; traditional cold plate liquid cooling has high thermal resistance due to its large flow channel size, limited heat exchange area, and difficulty in achieving efficient local thermal control of devices; microchannel liquid cooling technology, on the other hand, has become an important development direction for thermal management of high power density electronic devices (such as high power lasers and power modules) due to its advantages such as strong heat exchange capacity per unit area, uniform fluid flow, and fast response speed. However, existing heat dissipation structures based on microchannel liquid cooling have the following problems:

[0003] First, the coolant seal is not reliable enough, which can easily lead to leakage and affect the safety of the device.

[0004] Secondly, the microchannel structure is not well matched with the laser chip, resulting in limited heat dissipation efficiency.

[0005] Third, the complex processing and difficult assembly increase manufacturing costs and maintenance difficulties.

[0006] The existing Chinese patent CN120357264A designs a structure with microchannel grooves on the back of the semiconductor laser housing. However, in this design, the cooling fluid has a long flow path and flows through each laser chip in sequence. As a result, most of the downstream laser chips are in contact with the upstream heated cooling fluid, which has a poor cooling effect and is not conducive to improving the overall thermal management level and operational reliability of the semiconductor laser. Utility Model Content

[0007] The purpose of this invention is to overcome the defects of the prior art by providing a microchannel liquid cooling heat dissipation device for semiconductor lasers, which can efficiently cover the heat source area of ​​the chip and improve heat dissipation efficiency and cooling effect.

[0008] The objective of this utility model can be achieved through the following technical solution: A microchannel liquid cooling heat dissipation device for a semiconductor laser includes a cover plate and a laser housing arranged and fixedly connected from top to bottom. A microchannel groove is provided on the side of the laser housing facing the cover plate or on the side of the cover plate facing the laser housing. A first coolant inlet and a second coolant inlet are respectively provided on the short side and the long side of the cover plate. A first drainage hole and a second drainage hole are provided on the side of the cover plate facing the laser housing. The first drainage hole and the second drainage hole are respectively connected to the microchannel groove. The first coolant inlet is connected to the first drainage hole, and the second coolant inlet is connected to the second drainage hole.

[0009] Furthermore, a chip mounting platform and an optical path area are provided on the side of the laser housing facing away from the cover plate. One or more laser chips are installed in the chip mounting platform, and optical elements for adjusting the beam are installed in the optical path area. Connectors, fiber optic through holes and fiber optic fixing holes are respectively provided on the sides of both ends of the laser housing. The connector is used to provide operating current to the semiconductor laser.

[0010] Fiber optic vias are used to guide laser output to external application systems;

[0011] The fiber optic fixing hole is used to prevent the fiber optic cable from shifting during operation, ensuring that the laser output direction and accuracy are stable and reliable.

[0012] Furthermore, the chip mounting platform adopts a multi-level stepped arrangement structure, with the bottom surface of each step structure being parallel to the surface of the laser housing.

[0013] Furthermore, the projected area of ​​the microchannel groove in the vertical direction at least completely covers the entire area of ​​the chip mounting platform.

[0014] Furthermore, the laser housing has a plurality of sequentially connected rib bottom surfaces on the side facing the cover plate, the rib bottom surfaces are distributed in a stepped manner, and there is a height difference between adjacent rib bottom surfaces; a plurality of micro ribs are arranged in an array on the rib bottom surfaces, and microchannels are formed between the micro ribs and / or between the micro ribs and the inner wall of the microchannel groove.

[0015] Furthermore, the microrib is a solid structure, and its outer surface, upper end face, and / or bottom surface are covered with capillary structures. The ratio of the thickness h of the capillary structure to the thickness H of the microrib, h / H, is 0 to 100%, and the thickness h of the capillary structure is greater than or equal to 0. When the h / H ratio is 0, it indicates that the microrib has no capillary structure and maintains its original smooth state; when the h / H ratio is 100%, it indicates that the entire microrib is composed of capillary structures.

[0016] Furthermore, the plurality of microribs are arranged in a linear or interleaved manner;

[0017] Among them, the linear arrangement refers to the regular linear arrangement between the micro-ribs, which is suitable for applications with large coolant flow and low pressure drop requirements;

[0018] The interlocking arrangement refers to the staggered arrangement of microfins, which is suitable for applications requiring high heat flux density and high heat transfer efficiency.

[0019] Furthermore, the cover plate and the laser housing are connected by threaded connection, snap-fit ​​connection, riveting connection or welding connection.

[0020] Furthermore, when the cover plate and the laser housing are connected by a threaded connection, a snap-fit ​​connection or a riveting connection, a sealing gasket is provided between the cover plate and the laser housing. The cover plate or the laser housing is provided with a gasket groove for accommodating the gasket. The sealing gasket is installed inside the gasket groove and is in close contact with the wall surface of the gasket groove. The thickness of the sealing gasket is greater than the depth of the gasket groove.

[0021] Furthermore, when the cover plate and the laser housing are connected by threads, the cover plate is provided with a cover plate through hole, which can be a threaded through hole or a non-threaded through hole, and the laser housing is provided with a housing threaded hole, which can be a threaded through hole or a threaded blind hole; the size, position and number of the cover plate through hole and the housing threaded hole correspond to each other, and a screw is inserted into the cover plate through hole, which is screwed into the housing threaded hole to realize the connection and fixation between the cover plate and the laser housing.

[0022] Compared with the prior art, the present invention has the following advantages:

[0023] This invention features a cover plate and a laser housing arranged and fixedly connected from top to bottom. A microchannel groove is provided on the side of the laser housing facing the cover plate, or vice versa. A first coolant inlet and a second coolant inlet are respectively provided on the short and long sides of the cover plate. A first drainage hole and a second drainage hole are provided on the side of the cover plate facing the laser housing. The first and second drainage holes are connected to the microchannel groove, and the first coolant inlet is connected to the first drainage hole, and the second coolant inlet is connected to the second drainage hole. When coolant flows in from the first or second coolant inlet, it is guided into the microchannel groove through the first or second drainage hole, achieving effective coolant flow. This allows the coolant to flow smoothly into the microchannel groove for heat exchange and absorption of the heat generated during the operation of the semiconductor laser. After heat exchange, the coolant flows out from the second or first coolant inlet, greatly improving heat dissipation efficiency and cooling effect.

[0024] This invention features a chip mounting platform and an optical path area on the front side of the laser housing (the side of the laser housing facing away from the cover). The chip mounting platform houses one or more laser chips, meeting the needs of multi-chip integration. The optical path area contains optical elements for adjusting the laser beam, improving beam alignment accuracy and ensuring the performance of the semiconductor laser. Furthermore, connectors, fiber optic through-holes, and fiber optic fixing holes are located on the sides at both ends of the laser housing. The connectors provide operating current to the semiconductor laser, ensuring normal drive and stable output. The fiber optic through-holes guide the laser output to external application systems. The fiber optic fixing holes are arranged around the fiber optic through-holes and may have internal threaded structures for fastening fixing components or clamps, effectively preventing fiber displacement during operation and ensuring stable and reliable laser output direction and accuracy.

[0025] This invention features a plurality of stepped ribbed bottom surfaces on the side of the laser housing facing the cover plate. Multiple microribbed columns are arranged in an array on the bottom surfaces of the ribbed columns. The microchannel groove is used to accommodate the microribbed columns and their bottom surfaces. Microchannels are formed between the microribbed columns and / or between the microribbed columns and the inner wall of the microchannel groove. The coolant flows in an orderly manner within the microchannels, which enhances heat exchange and improves the overall performance of the heat dissipation device.

[0026] This invention designs the microribs as solid structures, with capillary structures covering the outer surface, upper end face, and / or bottom surface of the microribs. The capillary structures not only significantly increase the heat exchange contact area between the coolant and the solid surface, but also guide the coolant to move along the surface of the microribs covered by the capillary structures through capillary action. Even under conditions of low flow rate or insufficient gravity, the liquid can maintain continuous wetting of the cooling surface, thereby effectively suppressing the occurrence of dry areas and hot spots, and improving the heat exchange capacity and operational reliability under high heat flux density conditions.

[0027] This invention employs either a linear arrangement (i.e., equidistant, straight-line arrangement) or a staggered arrangement (i.e., adjacent rows arranged in a staggered manner) among multiple micro-ribs. The linear arrangement features low flow resistance, simple processing, and a clear liquid flow path, making it suitable for heat dissipation applications with large coolant flow rates and low pressure drop requirements. The staggered arrangement, through the interlaced arrangement of micro-ribs, can create stronger disturbance and remixing effects within the fluid, significantly enhancing convective heat transfer. It is suitable for microchannel cooling systems with high heat flux density and high heat transfer efficiency requirements. Both arrangements can be optimized according to specific heat dissipation goals and system parameters to balance cooling performance and structural adaptability, thereby better meeting different heat transfer needs.

[0028] In this invention, the connection between the laser housing and the cover plate can be selected in various forms according to actual installation requirements, such as threaded connection, snap-fit ​​connection, riveting connection or welding connection, which can flexibly adapt to different application scenarios and processing technology.

[0029] This invention features a gasket groove on the laser housing or cover plate, which contains a sealing gasket. The sealing gasket is compressed and sandwiched between the cover plate and the laser housing, with the sealing gasket in close contact with the inner wall of the gasket groove. The thickness of the sealing gasket is greater than the depth of the gasket groove. Thus, when the cover plate and the laser housing are pressed together by a mechanical connection, the sealing gasket undergoes a certain degree of compression deformation under pressure, filling the gap between them and forming a reliably sealed, airtight space. This airtight space surrounds the entire microchannel groove area, ensuring that the coolant does not leak while achieving efficient heat exchange.

[0030] In this invention, when the laser housing and the cover plate are connected by threads, the cover plate is designed with several through holes, and the laser housing is provided with threaded holes. The size, position, and number of the through holes in the cover plate and the through holes in the housing correspond to each other. Screws pass through the through holes in the cover plate and are screwed into the threaded holes in the housing, thereby achieving a stable connection between the cover plate and the laser housing. The specific size, position, and number of the through holes in the cover plate and the threaded holes in the housing can be flexibly set according to actual structural requirements to adapt to different installation requirements and stress conditions. For example, the threaded holes in the housing are set as threaded through holes at the edge of the laser housing, which can ensure that the cover plate and the laser housing are firmly assembled and accurately positioned. The threaded holes in the housing are set as threaded blind holes corresponding to the internal structural area on the front of the laser housing, and an unprocessed wall thickness of not less than 0.1mm is retained between the bottom of the blind hole and the front of the laser housing, which can effectively avoid interference with the internal structure on the front of the laser housing during the threading process. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0032] Figure 2 This is an exploded view of the overall structure of this utility model;

[0033] Figure 3 This is a schematic diagram of the front view (i.e., the side of the cover plate facing away from the laser housing) of the present invention.

[0034] Figure 4 This is a schematic diagram of the back side of the cover plate of this utility model (i.e., the side of the cover plate facing the laser housing);

[0035] Figure 5 This is a cross-sectional view of the cover plate of this utility model at the first interface of the coolant.

[0036] Figure 6 This is a cross-sectional view of the cover plate of this utility model at the second coolant inlet.

[0037] Figure 7 This is a schematic diagram of the structure of the sealing gasket of this utility model;

[0038] Figure 8 This is a schematic diagram of the overall structure of the sealing gasket and the gasket groove of this utility model in the state of mating;

[0039] Figure 9 for Figure 8 A schematic diagram of the cross-sectional structure;

[0040] Figure 10 This is a schematic diagram of the front view (i.e., the side of the laser housing facing away from the cover plate) of the present invention.

[0041] Figure 11 This is a schematic diagram of the back side (i.e., the side of the laser housing facing the cover plate) of the present invention.

[0042] Figure 12 This is a side view of the laser housing of this utility model.

[0043] Figure 13 This is a cross-sectional view of the laser housing of this utility model.

[0044] Figure 14 This is a schematic diagram of an optional projection shape of the microribbed column of this utility model in the vertical direction;

[0045] Figure 15 This is a schematic diagram of the microribbed column of this utility model when the surface and bottom surface are covered with capillary structures.

[0046] Figure 16 This is a schematic diagram of the sequential arrangement of the microribs of this utility model;

[0047] Figure 17 This is a schematic diagram of the microribbed column arrangement of this utility model;

[0048] Figure 18 This is a schematic diagram of the structure of the laser housing and the cover plate when the microchannel groove of this utility model is set on the laser housing;

[0049] Figure 19 This is a schematic diagram of the structure of the laser housing and the cover plate when the microchannel groove of this utility model is set on the cover plate;

[0050] The markings in the diagram are as follows: 1. Cover plate, 2. Screw, 3. Coolant inlet / outlet connector, 4. Sealing gasket, 5. Laser housing, 11. Cover plate through hole, 12. First coolant interface, 13. First drainage hole, 14. Second coolant interface, 15. Second drainage hole, 16. Gasket groove, 51. Housing threaded hole, 52. Housing through hole, 53. Microchannel groove, 531. Rib bottom surface, 532. Microrib, 5321. Capillary structure, 533. Microchannel, 54. Connector, 55. Chip mounting platform, 56. Optical path area, 57. Fiber optic through hole, 58. Fiber optic fixing hole. Detailed Implementation

[0051] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0052] Example

[0053] like Figure 1-2 As shown, this solution proposes a microchannel liquid cooling heat dissipation device for semiconductor lasers, including a cover plate 1 and a laser housing 5. In this embodiment, the cover plate 1 is installed and fixed to the back of the laser housing 5 by screws 2, and a sealing gasket 4 is provided between the cover plate 1 and the laser housing 5 to achieve effective sealing. In addition, coolant inlet and outlet connectors 3, preferably quick connectors, are installed on the long and short sides of the cover plate 1 for easy disassembly and maintenance. The coolant inlet and outlet connectors 3 are threaded onto the long and short sides of the cover plate 1 to serve as the inlet and outlet of the coolant, realizing the flow of coolant.

[0054] In practical applications, the materials of the cover plate 1 and the laser housing 5 can be selected according to the usage environment and specific requirements. Options include copper, aluminum, aluminum alloy, copper-aluminum alloy, titanium alloy, magnesium alloy, stainless steel, alumina, aluminum nitride, silicon nitride, silicon carbide, silicon, resin, plastic, or glass, to balance thermal conductivity, corrosion resistance, and structural strength. Furthermore, the thickness and shape of the cover plate 1 can be adjusted according to the power level and thermal load requirements of the adapted semiconductor laser. For example, in high-power laser applications, the thickness of the cover plate 1 can be appropriately increased to enhance its overall mechanical strength and sealing performance; in medium- and low-power applications, the cover plate 1 can adopt a relatively thin design to reduce structural weight, lower thermal resistance, and improve heat dissipation efficiency. While ensuring mechanical stability, this effectively improves the thermal management performance of the heat dissipation device, adapting to the usage requirements of semiconductor lasers of different power levels.

[0055] like Figures 3-6As shown, the cover plate 1 is provided with a cover plate through hole 11, a first coolant inlet 12, a first drain hole 13, a second coolant inlet 14, a second drain hole 15, and a gasket groove 16 (for accommodating the installation of a sealing gasket 4). The first coolant inlet 12 and the second coolant inlet 14 are both used to install coolant inlet / outlet connectors 3. The first coolant inlet 12 and the second coolant inlet 14 are located on the side of the cover plate 1 to facilitate the arrangement of coolant pipelines, thereby maintaining the flatness of the back of the cover plate 1 after installation, reducing interference from protruding parts, and improving the appearance and practicality of the device. The arrangement of the first coolant inlet 12 and the second coolant inlet 14 can be flexibly adjusted according to actual usage requirements to balance structural compactness, convenient fluid connection, and the feasibility of assembly operations. In practical applications, the first coolant interface 12 and the second coolant interface 14 can be reliably sealed to the coolant inlet and outlet connectors 3 by means of threaded connection, welding connection, clamp fastening connection or sealant bonding, respectively. The specific form of the coolant inlet and outlet connectors 3 can be selected according to the actual pipeline layout and usage scenario. Straight-through connectors, elbow connectors, flange connectors or quick-connect connectors can be selected to adapt to different connection methods and installation space requirements, ensuring the sealing performance and assembly convenience of the coolant passage.

[0056] In this embodiment, the coolant inlet / outlet connector 3 is a quick connector. This type of connector has the advantages of quick installation and easy disassembly, and is particularly suitable for application scenarios that require frequent replacement or maintenance. Quick connectors are usually equipped with a self-sealing structure, which can effectively prevent coolant leakage when disconnected. They have various interface forms and can be adapted to various hose or rigid pipe connection methods, which helps to improve system integration efficiency and meet diverse external cooling circuit docking requirements.

[0057] The first drainage hole 13 and the second drainage hole 15 are respectively connected to the first coolant inlet 12 and the second coolant inlet 14 provided on the cover plate, for guiding the coolant to flow smoothly into or out of the heat dissipation device. The coolant type includes water, ethylene glycol mixture, liquid nitrogen, molten salt solution, oil-based coolant, or fluoride coolant, etc.; the coolant can be a single-phase liquid or a two-phase working fluid that undergoes a phase change during heat exchange. Based on the working environment, heat dissipation intensity, and safety requirements of the semiconductor laser, the physical properties and phase characteristics of the coolant can be comprehensively considered to flexibly configure it to adapt to the thermal management needs under different power levels and operating conditions.

[0058] In addition, the heat dissipation device proposed in this solution can be connected to an external coolant circulation system to achieve continuous flow and circulation of coolant within the heat dissipation device. The external coolant circulation system may include devices such as flow regulating valves, pumps, temperature control units, and liquid storage units. By controlling the flow rate, pressure, or liquid temperature, the overall heat dissipation system can be finely adjusted and dynamically responded to, further improving cooling efficiency.

[0059] In this embodiment, as Figure 4 As shown, the cover plate through hole 11 is designed as a countersunk through hole, which makes it easy for the screw nut of the screw 2 to be inserted into it, thereby maintaining the flatness of the back of the cover plate 1 and allowing the entire heat dissipation device to be placed stably on other platforms.

[0060] like Figures 7-9 As shown, the shape and size of the gasket groove 16 designed inside the front of the cover plate 1 match the sealing gasket 4, which is used to accurately position and place the sealing gasket 4, preventing it from shifting during the pressing process between the cover plate 1 and the laser housing 5. Specifically, as Figure 9 As shown, the depth of the gasket groove 16 is slightly less than the thickness of the sealing gasket 4, so that the sealing gasket 4 is appropriately higher than the surface of the groove 16 when it is not pressed. This helps it to fully fill the gap between the cover plate 1 and the laser housing 5 during the pressing process, thereby improving the overall sealing effect, preventing coolant leakage and enhancing the reliability of the assembly.

[0061] It should be noted that in practical applications, the gasket groove 16 can also be provided on the laser housing 5, also for accommodating the positioning sealing gasket 4. The sealing gasket 4 forms a reliable sealed space between the cover plate 1 and the laser housing 5, effectively preventing coolant leakage and improving the safety and stability of the heat dissipation device. The sealing gasket 4 is preferably made of a high-temperature resistant and corrosion-resistant material, such as silicone rubber, fluororubber, EPDM rubber, nitrile rubber, polyurethane rubber, polyimide, flexible graphite, or polytetrafluoroethylene.

[0062] like Figures 10-13 As shown, the laser housing 5 is provided with a housing threaded hole 51 and a housing through hole 52. The front is provided with a chip mounting platform 55 (adopting a multi-level stepped arrangement structure) and an optical path area 56. The left side of the laser housing 5 is provided with an optical fiber through hole 57 and optical fiber fixing holes 58 symmetrically distributed around it. The right side of the laser housing 5 is provided with a connector 54. The back of the laser housing 5 is provided with a microchannel groove 53.

[0063] In this embodiment, the housing through hole 52 is a threadless through hole, used to install the external structure of the heat dissipation device or to achieve a stable connection with other equipment; the housing threaded hole 51 is a threaded through hole at the edge of the laser housing 5 to ensure a firm connection and precise positioning between the cover plate 1 and the laser housing 5, and a threaded blind hole is set at the corresponding internal structure area on the front of the laser housing 5 to avoid interfering with the internal structure on the front of the laser housing 5; the housing threaded hole 51 and the cover plate through hole 11 correspond to each other in size, position and number, and the screw 2 can pass through the cover plate through hole 11 and be screwed into the housing threaded hole 51 to achieve the connection between the cover plate 1 and the laser housing 5.

[0064] It should be noted that both the cover plate through hole 11 and the housing threaded hole 51 can be configured as threaded through holes or unthreaded through holes. The specific dimensions, positions, and quantities of the cover plate through hole 11 and the housing threaded hole 51 can be flexibly set according to actual structural requirements to adapt to different installation requirements and stress conditions. In addition, the housing through hole 52 can also be designed as an unthreaded through hole or a threaded through hole. This structural design is beneficial for the laser housing 5 to be firmly fixed to other external structures or equipment by screws, studs, or other fasteners during the installation of the heat dissipation device, thereby ensuring the reliability and stability of the heat dissipation device during use. Similarly, the number, distribution position, and hole diameter of the housing through holes 52 can be set and adjusted according to actual installation requirements to adapt to the assembly requirements in different application scenarios.

[0065] like Figure 10 and Figure 12 As shown, the multi-level stepped chip mounting platform 55 is used to mount one or more laser chips, and the upper surface of each step is parallel to the upper surface of the front of the laser housing 5; the optical path area 56 is used to mount optical elements or other functional devices to improve beam collimation and output accuracy; the fiber optic through-hole 57 is used to guide the laser output to the external application system; the fiber optic fixing hole 58 has a threaded structure inside to securely mount the fiber optic cable, prevent the fiber optic cable from shifting during operation, and ensure the stability of the laser output direction; the connector 54 is used to power the semiconductor laser to ensure its normal operation and output performance.

[0066] like Figure 11 and Figure 13 As shown, the projection range of the microchannel groove 53 on the back of the laser housing 5 in the vertical direction should at least completely cover the area where the chip mounting platform 55 is located on the front of the laser housing 5. The microchannel groove 53 has multiple stepped rib bottom surfaces 531. The rib bottom surfaces 531 are parallel to the chip mounting platform 55, and the number of chip mounting platforms corresponding to the projection area of ​​the rib bottom surfaces 531 in the vertical direction is the same. The vertical height difference between adjacent rib bottom surfaces 531 is equal, so as to achieve the balance of heat transfer distribution in the structure of the microchannel groove 53, thereby matching the stepped layout of the chip mounting platform 55 and optimizing the overall heat dissipation effect.

[0067] In practical applications, the specific shape of the rib base surface 531 can be designed according to the fluid flow characteristics and heat transfer performance requirements. Its projection shape in the vertical direction can be a regular or irregular geometric shape. The distance between the rib base surface 531 and its corresponding chip mounting platform 55 can be minimized as much as possible while meeting the structural strength requirements, based on the selected material, to improve heat dissipation, match the stepped heat flux density distribution of the laser chip, and further improve the overall stability and heat dissipation performance of the heat dissipation device. In addition, surface treatment can be performed on the inner surface of the microchannel groove 53 to improve heat dissipation efficiency and the flow performance of the coolant in the microchannel groove 53, including but not limited to nickel plating, silver plating, electrochemical polishing, anodizing, coating with hydrophobic / hydrophilic coatings, or laser texturing, to optimize surface roughness, enhance corrosion resistance, reduce fluid flow resistance, or improve heat transfer performance.

[0068] Several microribs 532 are vertically arranged in an array on the bottom surface 531 of the ribs, which can significantly increase the heat exchange area during the liquid cooling process, enhance fluid turbulence and heat exchange efficiency, effectively reduce the operating temperature of the laser chip, improve the overall heat dissipation capacity and stability of the system, and meet the heat dissipation requirements of high-power output of multi-chip integration. The top height of the microribs 532 is flush with the back of the laser housing 5 to ensure that the flow channel is not affected when the cover plate 1 is installed. Multiple microchannels 533 of uniform width are formed between the microribs 532 and between the microribs 532 and the inner wall of the microchannel groove 53, which are used to guide the orderly flow of coolant, enhance the heat exchange effect, and thus improve the heat dissipation efficiency.

[0069] like Figure 14 As shown, the projection of the microrib 532 onto the bottom surface 531 of the rib in the vertical direction can be designed according to different thermal management requirements and fluid dynamic characteristics, including rounded rectangles, parallelograms, circles, triangles, S-shapes, ellipses, teardrop-like shapes, or polygons. The three-dimensional shape of the microrib 532 can be one of the following: column, cone, frustum, hemisphere, or umbrella shape. Among them, the projection outline of the S-shape is wavy or serpentine, usually formed by the continuous connection of multiple arc segments in opposite directions; the umbrella structure is a composite rib structure with a top dimension larger than the bottom dimension, and its top and root can be a combination of the same or different shapes. Common forms include cone or frustum-shaped structures with a circular, elliptical, or polygonal top and a circular or rectangular bottom. This shape helps guide the coolant flow and enhances turbulence, thereby improving heat transfer efficiency. In this embodiment, the projection shape of the microrib 532 in the vertical direction is a rounded rectangle.

[0070] like Figure 15As shown, the microrib 532 in this design is a solid structure, and its outer surface, upper end face, and / or bottom surface can be covered with capillary structures 5321. The ratio of the thickness h of the capillary structure 5321 to the thickness H of the microrib is 0–100%, and the value of h satisfies h ≥ 0. When the h / H ratio is 0, it indicates that the microrib 532 does not have capillary structures 5321 and remains in its original smooth state. When the h / H ratio is 100%, it indicates that the entire microrib 532 is composed of capillary structures 5321. The capillary structures 5321 not only significantly increase the heat exchange contact area between the coolant and the solid surface, but also guide the coolant along the surface of the microrib 532 covered by the capillary structures 5321 through capillary action. Even under low flow rate or insufficient gravity conditions, it can maintain continuous wetting of the cooling surface by the liquid, thereby effectively suppressing the occurrence of dry areas and hot spots, and improving the heat exchange capacity and operational reliability under high heat flux density conditions.

[0071] In practical applications, the capillary structure 5321 can be composed of one or more materials such as metal powder, metal wire, metal mesh or metal foam, and a structurally stable and firmly attached capillary layer is formed around the micro ribs through a high-temperature sintering process, thereby constructing a porous network structure with three-dimensional interconnected channels.

[0072] like Figure 16-17 As shown, taking the rounded rectangle shape of the vertical projection of the microribs 532 as an example, the arrangement is illustrated. Specifically, Figure 16 The arrangement shown is a straight line arrangement (i.e., equally spaced linear arrangement). This arrangement has the characteristics of low flow resistance, simple processing, and clear liquid flow path. Figure 17 The arrangement shown is a staggered arrangement (i.e., adjacent rows are arranged in a staggered manner). This arrangement, through the interlacing of the microribs 532, can create stronger turbulence within the fluid, thereby significantly enhancing convective heat transfer energy. The arrows in the figure indicate one flow direction of the coolant within the microchannels 533. In some embodiments, the coolant can also flow in reverse or along a path at a certain angle to the direction shown, depending on specific thermal management requirements, thus adapting to the design requirements of different layouts or heat transfer strategies.

[0073] like Figure 18 As shown, when the microchannel groove 53 is disposed on the laser housing 3, a plurality of microrib bottom surfaces 531 arranged in an array and microrib pillars 532 disposed thereon are all formed within the microchannel groove 53. After assembly, the contact surfaces of the microrib pillars 532 and the cover plate 1 are sealed together, forming a flow channel for the coolant, allowing the coolant to flow within the microchannel 533 and fully contact the microrib pillars 532, thereby achieving efficient flow heat transfer.

[0074] like Figure 19As shown, when the microchannel groove 53 is disposed on the cover plate 1, several arrayed microrib bottom surfaces 531 and microrib pillars 532 are disposed on the back side of the laser housing 5, within the projection area of ​​the microchannel groove 53. At this time, the microchannel groove 53 is used to accommodate the microrib pillars 532 and their bottom surfaces 531. After assembly, the back side of the laser housing 5 and the microchannel groove 53 jointly seal the space, allowing the coolant to flow and exchange heat within the microchannel 533. This design, compared to slotting the back side of the laser housing 5, facilitates the forming and control of the microrib pillars 532, and is beneficial for improving the processing accuracy and efficiency of the microrib pillars 532.

[0075] Applying the above-mentioned heat dissipation device in practice, in specific use, the cover plate 1 is installed on the back of the laser housing 5. The coolant inlet and outlet connectors 3 are respectively threaded onto the coolant first interface 12 and coolant second interface 14 on the side of the cover plate 1. The coolant first interface 12 is connected to the first drainage hole 13, and the coolant second interface 14 is connected to the second drainage hole 15. The first drainage hole 13 and the second drainage hole 15 are respectively connected to the microchannel groove 53. The coolant flows sequentially through the coolant first interface 12 and the first drainage hole 13 / coolant second interface 14 and the second drainage hole 15 into the microchannel groove 53. During the flow process in the microchannel 533, it absorbs the heat generated by the semiconductor laser. After completing the heat exchange, it flows sequentially through the second drainage hole 15 and the coolant second interface 14 / the first drainage hole 13 and the coolant first interface 12, and finally flows out of the heat dissipation device through the coolant inlet and outlet connectors 3, thereby achieving efficient liquid cooling of the laser chip area.

[0076] It should be noted that in this embodiment, the cover plate 1 and the laser housing 5 are connected by a threaded connection. In practical applications, snap-fit ​​connections, riveting connections, or welding connections can also be used. This supports multiple connection methods between the cover plate 1 and the laser housing 5. Combined with the design of the sealing gasket 4 and the gasket groove 16, good sealing can be achieved under different connection structures, preventing coolant leakage and ensuring long-term reliable operation of the device. When using snap-fit ​​or riveting connections, a sealing gasket 4 is also provided between the cover plate 1 and the laser housing 5. When using welding connections, the cover plate 1 and the laser housing 5 are welded together at their mating surfaces to form an integrated structure, achieving reliable fixation and good sealing performance.

[0077] In addition, when a snap-fit ​​connection is used, the cover plate 1 and the laser housing 5 are respectively provided with mutually cooperating snap-fit ​​structures, and the quick connection and fixation of the cover plate 1 and the laser housing 5 can be achieved by the insertion or engagement of the snap-fit ​​structures.

[0078] When riveting is used, riveting holes are provided at corresponding positions on the cover plate 1 and the laser housing 5. A reliable connection between the cover plate 1 and the laser housing 5 is achieved by inserting rivets and riveting them together.

[0079] In summary, this solution primarily improves the coolant flow channels on the cover plate and the internal structure of the microchannel grooves on the laser housing, resulting in advantages such as compact structure, high heat exchange efficiency, and strong adaptability. The materials for the various components of the heat dissipation device, such as the cover plate, laser housing, sealing gaskets, and coolant, are flexible and diverse, allowing for optimized configuration according to different operating environments. This enhances the device's environmental adaptability and operational stability under complex conditions such as high temperature, high humidity, corrosiveness, or high vibration. This solution can be widely applied to the thermal management of semiconductor lasers, precision laser processing systems, and other high heat flux density electronic devices, ensuring long-term stable operation and improving reliability.

Claims

1. A microchannel liquid cooling heat dissipation device for semiconductor lasers, characterized in that, The device includes a cover plate (1) and a laser housing (5) arranged from top to bottom and fixedly connected. The laser housing (5) has a microchannel groove (53) on the side facing the cover plate (1) or the side facing the laser housing (5) of the cover plate (1). The short side and long side of the cover plate (1) are respectively provided with a first coolant inlet (12) and a second coolant inlet (14). The side of the cover plate (1) facing the laser housing (5) is provided with a first drainage hole (13) and a second drainage hole (15). The first drainage hole (13) and the second drainage hole (15) are respectively connected to the microchannel groove (53). The first coolant inlet (12) is connected to the first drainage hole (13), and the second coolant inlet (14) is connected to the second drainage hole (15).

2. The microchannel liquid cooling heat dissipation device for semiconductor lasers according to claim 1, characterized in that, The laser housing (5) has a chip mounting platform (55) and an optical path area (56) on the side facing away from the cover plate (1). One or more laser chips are installed in the chip mounting platform (55), and optical elements for adjusting the beam are installed in the optical path area (56). The sides of both ends of the laser housing (5) are respectively provided with connectors (54), fiber optic through holes (57) and fiber optic fixing holes (58). The connectors (54) are used to provide operating current for the semiconductor laser. The fiber optic via (57) is used to guide the laser output to an external application system; The fiber fixing hole (58) is used to prevent the fiber from shifting during operation, ensuring that the laser output direction and accuracy are stable and reliable.

3. A microchannel liquid cooling heat dissipation device for semiconductor lasers according to claim 1, characterized in that, The chip mounting platform (55) adopts a multi-level stepped arrangement structure, and the bottom surface of each step structure is parallel to the surface of the laser housing (5).

4. A microchannel liquid cooling heat dissipation device for a semiconductor laser according to claim 3, characterized in that, The projection area of ​​the microchannel groove (53) in the vertical direction at least completely covers the entire area of ​​the chip mounting platform (55).

5. A microchannel liquid cooling heat dissipation device for a semiconductor laser according to claim 4, characterized in that, The laser housing (5) has a plurality of sequentially connected rib bottom surfaces (531) on the side facing the cover plate (1). The rib bottom surfaces (531) are distributed in a stepped manner, and there is a height difference between adjacent rib bottom surfaces (531). The rib bottom surfaces (531) are provided with a plurality of micro ribs (532) arranged in an array. The microchannel groove (53) is used to accommodate the micro ribs (532) and the rib bottom surfaces (531). Microchannels (533) are formed between the micro ribs (532) and / or between the micro ribs (532) and the inner wall of the microchannel groove (53).

6. A microchannel liquid cooling heat dissipation device for a semiconductor laser according to claim 5, characterized in that, The microrib (532) is a solid structure. The outer surface, upper end face and / or bottom surface of the microrib (532) are covered with capillary structure (5321). The ratio of the thickness h of the capillary structure (5321) to the thickness H of the microrib (532) is 0 to 100%, and the thickness h of the capillary structure (5321) is greater than or equal to 0. When the h / H ratio is 0, it indicates that the microrib (532) is not provided with capillary structure (5321) and maintains its original smooth state. When the h / H ratio is 100%, it indicates that the entire microrib (532) is composed of capillary structure (5321).

7. A microchannel liquid cooling heat dissipation device for a semiconductor laser according to claim 5, characterized in that, The multiple microribs (532) are arranged in a linear or interlocking manner; Among them, the in-line arrangement refers to the regular linear arrangement between the micro-ribs (532), which is suitable for application scenarios with large coolant flow and low pressure drop requirements; The interlocking arrangement refers to the staggered arrangement between the micro-ribs (532), which is suitable for application scenarios with high heat flux density and high heat exchange efficiency requirements.

8. A microchannel liquid cooling heat dissipation device for a semiconductor laser according to claim 1, characterized in that, The cover plate (1) and the laser housing (5) are connected by threaded connection, snap-fit ​​connection, riveting connection or welding connection.

9. A microchannel liquid cooling heat dissipation device for a semiconductor laser according to claim 8, characterized in that, When the cover plate (1) and the laser housing (5) are connected by thread, snap or riveting, a sealing gasket (4) is provided between the cover plate (1) and the laser housing (5). The cover plate (1) or the laser housing (5) is provided with a gasket groove (16) for accommodating the sealing gasket (4). The sealing gasket (4) is installed inside the gasket groove (16) and is in close contact with the wall of the gasket groove (16). The thickness of the sealing gasket (4) is greater than the depth of the gasket groove (16).

10. A microchannel liquid cooling heat dissipation device for a semiconductor laser according to claim 8, characterized in that, When the cover plate (1) and the laser housing (5) are connected by threads, the cover plate (1) is provided with a cover plate through hole (11), which is a threaded through hole or a non-threaded through hole. The laser housing (5) is provided with a housing threaded hole (51), which is a threaded through hole or a threaded blind hole. The size, position and number of the cover plate through hole (11) and the housing threaded hole (51) are corresponding. A screw (2) is inserted into the cover plate through hole (11), and the screw (2) is screwed into the housing threaded hole (51) to realize the connection and fixation between the cover plate (1) and the laser housing (5).

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