High-stability rectifier bridge module structure
Patent Information
- Application Number
- CN202522049889.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-24
- Publication Date
- 2026-09-25
- Estimated Expiration
- 2035-09-24
AI Technical Summary
现有整流桥模组在实际使用时由于整流二极管工作时会产生大量热量,而现有模组多依赖外壳自然散热,散热效率低,长期使用易导致二极管过热损坏,影响模组稳定性,同时模组在安装及使用过程中,易受设备振动影响,现有固定结构多为刚性连接,缺乏缓冲,长期振动易导致模组内部元件焊接点松动,甚至引脚接触不良,降低模组稳定性
本实用新型整体结构简单,通过散热鳍片、导热硅胶垫、微型散热风扇和氮化铝陶瓷基板相互配合的作用下可以形成“从热量传导到面积扩散再结合强制风冷”的三级散热体系,从而可以使整流二极管工作温度得到有效降低,避免了元件出现过热损坏的情况,通过支撑脚下方防滑垫可以对外部振动能量进行吸收缓冲,从而可以防止模组整体因振动过大造成松动及内部元件焊接点脱落的情况,通过防护外壳、盖板与丁腈橡胶密封垫相互配合的设置能够有效阻挡灰尘和湿气进入,适用于恶劣工业环境。
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Figure CN224804844U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of rectifier bridge technology, and in particular to a highly stable rectifier bridge module structure. Background Technology
[0002] The rectifier bridge module is a core component that converts alternating current (AC) to direct current (DC) and is widely used in various power electronic devices. Existing rectifier bridge modules generate significant heat during operation due to the rectifier diodes. However, existing modules often rely on natural heat dissipation from the casing, resulting in low heat dissipation efficiency. Prolonged use can easily lead to diode overheating and damage, affecting module stability. Furthermore, the module is susceptible to vibration during installation and use. Existing fixed structures are mostly rigid connections lacking buffering, and long-term vibration can cause loosening of internal component solder joints or even poor pin contact, reducing module stability. Therefore, we propose a highly stable rectifier bridge module structure. Utility Model Content
[0003] The purpose of this invention is to address the problems existing in the background technology by proposing a highly stable rectifier bridge module structure.
[0004] The technical solution of this utility model is as follows: A highly stable rectifier bridge module structure includes a housing assembly, which includes a protective shell. A cover plate is provided on the top of the protective shell. A heat dissipation assembly is provided inside the protective shell. The heat dissipation assembly includes a mounting base plate. Multiple sets of heat dissipation fins are provided on the top of the mounting base plate. Thermally conductive silicone pads are provided on the outer sides of the mounting base plate and the heat dissipation fins. Two sets of miniature cooling fans are provided on each side of the protective shell. An aluminum nitride ceramic substrate is provided above the thermally conductive silicone pads inside the protective shell. Multiple sets of rectifier diodes are provided on one side of the top of the aluminum nitride ceramic substrate. A nitrile rubber sealing gasket is provided on one side of the bottom of the cover plate. Port seats are provided on both sides of the top of the cover plate. Support feet are provided at the four corners of the bottom of the protective shell.
[0005] Preferably, one side of the cover plate is tightly fitted to the upper side of the protective shell, two sets of slots are provided on both sides of the upper part of the protective shell, and ear plates are provided on both sides of the cover plate, with the ear plates corresponding to the slots.
[0006] Preferably, the mounting end of the mounting substrate is installed corresponding to the bottom of the inner wall of the protective shell, the mounting end of the heat dissipation fins is installed corresponding to the upper side of the mounting substrate, multiple sets of heat dissipation fins are evenly laid along the mounting substrate, the mounting end of the thermally conductive silicone pad is tightly fitted to the inner wall of the protective shell, the thermally conductive silicone pad is concave, and the mounting substrate and heat dissipation fins are in contact with the concave side of the thermally conductive silicone pad.
[0007] Preferably, the protective shell has two sets of ventilation holes on both sides, the mounting end of the miniature cooling fan is installed corresponding to the inner wall of the ventilation hole, the miniature cooling fan is electrically connected to an external power supply, and a dustproof net is provided on one side of the miniature cooling fan.
[0008] Preferably, the mounting end of the aluminum nitride ceramic substrate is mounted corresponding to the upper side of the micro cooling fan, and the outer periphery of the aluminum nitride ceramic substrate is in contact with the inner wall of the protective shell.
[0009] Preferably, the mounting end of the rectifier diode is mounted corresponding to the upper side of the aluminum nitride ceramic substrate, and multiple sets of rectifier diodes are evenly arranged along the aluminum nitride ceramic substrate. The protective shell has a support groove on both sides corresponding to the support position of each set of rectifier diodes, and the support of the rectifier diode is mounted corresponding to the support groove.
[0010] Preferably, the mounting end of the nitrile rubber sealing gasket is installed corresponding to the lower side of the cover plate, the outer periphery of the nitrile rubber sealing gasket is in contact with the inner wall of the protective shell, the mounting end of the port seat is installed corresponding to the upper side of the cover plate, and wires are connected between the two sets of port seats and the multiple sets of rectifier diodes.
[0011] Preferably, the mounting ends of the support feet are installed at the four corner positions on the lower side of the protective shell, the bottom of the support feet is provided with anti-slip pads, and each set of support feet is provided with an assembly groove.
[0012] Compared with the prior art, the present invention has the following beneficial technical effects: This utility model has a simple overall structure. Through the combined action of heat dissipation fins, thermally conductive silicone pads, miniature cooling fans, and aluminum nitride ceramic substrates, a three-stage heat dissipation system is formed, which involves heat conduction, area diffusion, and forced air cooling. This effectively reduces the operating temperature of the rectifier diodes, preventing overheating and damage to the components. The anti-slip pads under the support feet absorb and buffer external vibration energy, preventing the module from loosening or internal component solder joints from falling off due to excessive vibration. The protective shell, cover plate, and nitrile rubber sealing gasket effectively prevent dust and moisture from entering, making it suitable for harsh industrial environments. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the structure of this utility model from another perspective; Figure 3 This is a partial cross-sectional view of the present invention.
[0014] Reference numerals: 1. Housing assembly; 11. Protective housing; 12. Cover plate; 13. Ear plate; 2. Heat dissipation assembly; 21. Mounting base plate; 22. Heat dissipation fins; 23. Thermally conductive silicone pad; 24. Miniature cooling fan; 3. Aluminum nitride ceramic substrate; 4. Rectifier diode; 5. Nitrile rubber sealing gasket; 6. Port socket; 7. Support foot; 8. Assembly slot. Detailed Implementation
[0015] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments. Example
[0016] like Figure 1-3 As shown, the present invention proposes a highly stable rectifier bridge module structure, including a housing assembly 1, which includes a protective shell 11. A cover plate 12 is provided on the top of the protective shell 11. One side of the cover plate 12 is tightly fitted with the top side of the protective shell 11. One side of the cover plate 12 is installed corresponding to the opening side on the top of the protective shell 11. Two sets of slots are provided on both sides of the top of the protective shell 11. Ear plates 13 are provided on both sides of the cover plate 12. The mounting end of the ear plate 13 is fixedly connected to the cover plate 12. The ear plate 13 is installed corresponding to the slot. The ear plate 13 can make the cover plate 12 more stable when it is assembled with the protective shell 11. The protective shell 11 and the cover plate 12 can protect the components during installation. A heat dissipation assembly 2 is provided inside the protective housing 11. The heat dissipation assembly 2 includes a mounting base 21. The mounting end of the mounting base 21 is installed corresponding to the bottom of the inner wall of the protective housing 11 and is fixedly connected to the bottom of the inner wall of the protective housing 11. Multiple sets of heat dissipation fins 22 are provided on the upper part of the mounting base 21. The mounting ends of the heat dissipation fins 22 are installed corresponding to one side of the upper part of the mounting base 21 and are fixedly connected to one side of the upper part of the mounting base 21. The heat dissipation fins 22 are made of aluminum alloy. The multiple sets of heat dissipation fins 22 are evenly distributed along the mounting base 21. The evenly distributed, multi-group heat dissipation fins 22 increase the heat dissipation area. Thermally conductive silicone pads 23 are provided on the outer sides of the mounting base 21 and the heat dissipation fins 22. The mounting end of the thermally conductive silicone pad 23 is tightly fitted to the inner wall of the protective shell 11, and is fixedly connected to the inner wall of the protective shell 11. The thermally conductive silicone pad 23 is concave, and the mounting base 21 and the heat dissipation fins 22 are in contact with the concave side of the thermally conductive silicone pad 23. The arrangement of the thermally conductive silicone pad 23 reduces the gap between the mounting base 21, the heat dissipation fins 22, and the inner wall of the protective shell 11. The thermally conductive silicone pad 23 is used for filling, which reduces thermal resistance and improves heat conduction efficiency. Two sets of miniature cooling fans 24 are provided on each side of the protective shell 11. Two sets of ventilation holes are opened on each side of the protective shell 11. The mounting ends of the miniature cooling fans 24 are installed corresponding to the inner walls of the ventilation holes and are fixedly connected to the inner walls of the ventilation holes. The miniature cooling fans 24 are electrically connected to an external power supply. A dustproof mesh is provided on one side of the miniature cooling fans 24, and the mounting end of the dustproof mesh is fixedly connected to one side of the miniature cooling fans 24. The dustproof mesh can prevent heat loss. The outer dust is protected and shielded to prevent external dust from entering the protective housing 11 from the position of the miniature cooling fan 24. When the miniature cooling fan 24 is working, it can accelerate the airflow and carry away the heat on the housing and fins, further improving the heat dissipation effect. The mounting base 21, heat dissipation fins 22, thermal conductive silicone pad 23 and miniature cooling fan 24 work together to form a three-level heat dissipation system of "heat conduction to area diffusion and then forced air cooling", which can effectively reduce the operating temperature of the rectifier diode and avoid overheating damage to the components. An aluminum nitride ceramic substrate 3 is disposed above the thermally conductive silicone pad 23 inside the protective housing 11. The mounting end of the aluminum nitride ceramic substrate 3 is installed corresponding to the upper side of the miniature cooling fan 24 and is fixedly connected to it. The outer periphery of the aluminum nitride ceramic substrate 3 is in contact with the inner wall of the protective housing 11 and is fixedly connected to it. Multiple sets of rectifier diodes 4 are disposed on the upper side of the aluminum nitride ceramic substrate 3, with the mounting ends of the rectifier diodes 4 corresponding to the upper side of the aluminum nitride ceramic substrate 3. The mounting end is fixedly connected to the upper side of the aluminum nitride ceramic substrate 3. Multiple sets of rectifier diodes 4 are evenly arranged along the aluminum nitride ceramic substrate 3. The protective shell 11 has a support groove on both sides corresponding to the support position of each set of rectifier diodes 4. The support of the rectifier diodes 4 is installed in the support groove corresponding to the support groove. The support groove can further improve the stability of the rectifier diodes 4 when they are in the assembly state. The aluminum nitride ceramic substrate 3 can directly and quickly conduct the heat dissipated by the multiple sets of rectifier diodes 4 in the working state, so as to cooperate with the heat dissipation component 2 to improve the heat dissipation effect of the rectifier diodes 4. A nitrile rubber sealing gasket 5 is provided on the lower side of the cover plate 12. The mounting end of the nitrile rubber sealing gasket 5 is installed corresponding to the lower side of the cover plate 12 and is fixedly connected to the lower side of the cover plate 12. The outer periphery of the nitrile rubber sealing gasket 5 is in close contact with the inner wall of the protective shell 11. The outer periphery of the nitrile rubber sealing gasket 5 is in close contact with the inner wall of the protective shell 11. Port seats 6 are provided on both sides of the upper part of the cover plate 12. The mounting end of the port seat 6 is installed corresponding to the upper side of the cover plate 12 and is fixedly connected to the upper side of the cover plate 12. Wires are connected between the two sets of port seats 6 and the multiple sets of rectifier diodes 4. The setting of the two sets of port seats 6 allows the operator to connect and combine this rectifier bridge module with other components. Support feet 7 are provided at the four corners of the lower part of the protective housing 11. The mounting ends of the support feet 7 are installed corresponding to the four corners of the lower side of the protective housing 11. The mounting ends of the support feet 7 are fixedly connected to the protective housing 11. The support feet 7 can provide stable support for the protective housing 11 and further prevent the protective housing 11 from being directly subjected to vibration. The bottom of the support feet 7 is provided with anti-slip pads, which are fixedly connected to the support feet 7. The anti-slip pads are made of rubber and can absorb and buffer external vibration energy, thereby preventing the module from loosening due to excessive vibration and the solder joints of internal components from falling off. Each set of support feet 7 is provided with an assembly slot 8. The assembly slot 8 is slot-shaped. The assembly slot 8 is provided to facilitate the operator to adjust and assemble the rectifier bridge module according to the assembly situation, further improving the stability of the device in the assembled state.
[0017] In this embodiment, the operator first fixes the mounting base 21 to the bottom of the inner cavity of the protective shell 11, then evenly fixes multiple sets of heat dissipation fins 22 on the mounting base 21, and then fills the gaps between the mounting base 21, the heat dissipation fins 22 and the inner cavity of the protective shell 11 with thermally conductive silicone pads 23. Next, the aluminum nitride ceramic substrate 3 is fixedly installed on the upper side of the thermally conductive silicone pad 23 to the inner wall of the protective shell 11. Finally, multiple sets of rectifier diodes 4 are installed one by one on the upper side of the aluminum nitride ceramic substrate 3. At this time, each set of rectifier diodes... The legs of tube 4 are aligned with the leg slots on the protective housing 11, so that the end of the rectifier diode 4 extending out of the protective housing 11 is bent into an "L" shape. Finally, the cover plate 12 with the nitrile rubber sealing gasket 5 is assembled with the upper opening side of the protective housing 11, so that the ear plate 13 and the slots on both sides of the protective housing 11 are interlocked, thereby completing the assembly of the device. Then, the operator fixes the device in place according to the assembly requirements by tightening the bolts at the corresponding positions of the assembly slots 8, thereby completing the installation and use of the device.
[0018] The above-described specific embodiments are merely preferred embodiments of the present invention. Based on the technical solution of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above-described specific embodiments.
Claims
1. A highly stable rectifier bridge module structure, comprising a housing assembly (1), characterized in that: The housing assembly (1) includes a protective shell (11), a cover plate (12) is provided on the top of the protective shell (11), a heat dissipation assembly (2) is provided inside the protective shell (11), the heat dissipation assembly (2) includes a mounting base plate (21), a plurality of heat dissipation fins (22) are provided on the top of the mounting base plate (21), a thermally conductive silicone pad (23) is provided on the outside of the mounting base plate (21) and the heat dissipation fins (22), two sets of miniature cooling fans (24) are provided on both sides of the protective shell (11), an aluminum nitride ceramic substrate (3) is provided above the thermally conductive silicone pad (23) inside the protective shell (11), a plurality of rectifier diodes (4) are provided on one side above the aluminum nitride ceramic substrate (3), a nitrile rubber sealing gasket (5) is provided on one side below the cover plate (12), a port seat (6) is provided on both sides above the cover plate (12), and a support foot (7) is provided at the four corners below the protective shell (11).
2. The high-stability rectifier bridge module structure according to claim 1, characterized in that, One side of the cover plate (12) is tightly fitted to the upper side of the protective shell (11). Two sets of slots are provided on both sides of the upper part of the protective shell (11). Ear plates (13) are provided on both sides of the cover plate (12). The ear plates (13) are installed in correspondence with the slots.
3. The high-stability rectifier bridge module structure according to claim 1, characterized in that, The mounting end of the mounting base (21) is installed corresponding to the bottom of the inner wall of the protective shell (11). The mounting end of the heat dissipation fin (22) is installed corresponding to the upper side of the mounting base (21). Multiple sets of heat dissipation fins (22) are evenly laid along the mounting base (21). The mounting end of the thermally conductive silicone pad (23) is tightly attached to the inner wall of the protective shell (11). The thermally conductive silicone pad (23) is concave. The mounting base (21) and the heat dissipation fins (22) are attached to the concave side of the thermally conductive silicone pad (23).
4. The high-stability rectifier bridge module structure according to claim 1, characterized in that, The protective shell (11) has two sets of ventilation holes on both sides. The mounting end of the miniature cooling fan (24) is installed corresponding to the inner wall of the ventilation hole. The miniature cooling fan (24) is electrically connected to an external power supply. A dustproof net is provided on one side of the miniature cooling fan (24).
5. The high-stability rectifier bridge module structure according to claim 1, characterized in that, The mounting end of the aluminum nitride ceramic substrate (3) is installed corresponding to the upper side of the micro heat dissipation fan (24), and the outer periphery of the aluminum nitride ceramic substrate (3) is in contact with the inner wall of the protective shell (11).
6. The high-stability rectifier bridge module structure according to claim 1, characterized in that, The mounting end of the rectifier diode (4) is installed corresponding to the upper side of the aluminum nitride ceramic substrate (3). Multiple sets of the rectifier diodes (4) are evenly arranged along the aluminum nitride ceramic substrate (3). The protective shell (11) has a support groove on both sides corresponding to the support position of each set of rectifier diodes (4). The support of the rectifier diode (4) is installed in the support groove corresponding to the support.
7. The high-stability rectifier bridge module structure according to claim 1, characterized in that, The mounting end of the nitrile rubber sealing gasket (5) is installed corresponding to the lower side of the cover plate (12). The outer periphery of the nitrile rubber sealing gasket (5) is in contact with the inner wall of the protective shell (11). The mounting end of the port seat (6) is installed corresponding to the upper side of the cover plate (12). Both sets of the port seats (6) are connected to multiple sets of rectifier diodes (4) with wires.
8. The high-stability rectifier bridge module structure according to claim 1, characterized in that, The mounting ends of the support feet (7) are installed at the four corner positions on the lower side of the protective shell (11). The bottom of the support feet (7) is provided with anti-slip pads, and each set of support feet (7) is provided with an assembly groove (8).