Power module and power unit with improved electromagnetic compatibility

Abstract

The utility model relates to a kind of power module and power unit for improving electromagnetic compatibility, belong to semiconductor power device technical field.The power module includes: first MOS structure, the S pole of the first MOS structure is connected with AC terminal, D pole is connected with DC terminal positive pole;Second MOS structure, the D pole of the second MOS structure is connected with AC terminal, S pole is connected with DC terminal negative pole X capacitor, one end is connected with DC terminal positive pole, the other end is connected with DC terminal negative pole, and it is grounded by GND.The utility model can effectively suppress differential mode interference and common mode interference by embedding X, Y capacitor inside power module, improve module anti-electromagnetic interference ability, reduce module risk of false opening and open to ensure module safe and stable operation.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor power device technology, and specifically to a power module and power unit for improving electromagnetic compatibility. Background Technology

[0002] Current power device module structures typically involve soldering power chips onto a conductive layer of an insulating substrate. These chips are connected in parallel to achieve high current handling capabilities. The conductive layer of the insulating substrate is divided into several large regions based on the chip polarity, and each region usually serves as a common current path for multiple parallel chips. In short, the insulating substrate serves to handle current and conduct heat. In this existing structure, all parallel power chips share a single current path, which easily leads to EMC (electromagnetic compatibility) problems. This is because the switching oscillations generated by each power chip after parallel connection interfere with each other, increasing the intensity of the oscillations. These oscillations severely affect system reliability, can cause devices to turn on falsely, and increase the risk of short circuits. Utility Model Content

[0003] The purpose of this invention is to provide a power module and power unit with improved electromagnetic compatibility. By embedding X and Y capacitors inside the power module, differential-mode interference and common-mode interference can be effectively suppressed, improving the module's electromagnetic interference immunity, effectively absorbing interference signals during module turn-on and turn-off processes, reducing the risk of accidental module turn-on, and ensuring the safe and stable operation of the module during turn-on.

[0004] To achieve the above objectives, this utility model provides a power module for improving electromagnetic compatibility, the power module comprising: The first MOS structure has its source (S) terminal connected to the AC terminal and its drain (D) terminal connected to the positive terminal of the DC terminal. The second MOS structure has its drain (D) connected to the AC terminal and its source (S) connected to the negative terminal of the DC terminal. The X capacitor has one end connected to the positive terminal of the DC terminal and the other end connected to the negative terminal of the DC terminal, and is grounded through GND.

[0005] Optionally, the power module includes: The first Y capacitor has one end connected to the positive terminal of the DC terminal, and the other end grounded through GND; The second Y capacitor has one end connected to the negative terminal of the DC terminal and the other end grounded through GND.

[0006] Optionally, the power module includes: A substrate, a first MOS structure, a second MOS structure, an X capacitor, a first Y capacitor, and a second Y capacitor are disposed on the substrate and grounded through the substrate. An upper copper foil is disposed on the top surface of the substrate, and a lower copper foil is disposed on the bottom surface. A through hole is disposed on the substrate, and the lower copper foil passes through the through hole and connects to the upper copper foil.

[0007] Optionally, a welding layer is provided on the bottom surface of the lower copper foil.

[0008] Optionally, a DC terminal is provided on one side of the upper copper foil, and an AC terminal is provided on the opposite side of the upper copper foil.

[0009] Optionally, an X capacitor is provided on one side of the DC terminal. The X capacitor is disposed on the upper copper foil, and one end of the X capacitor is connected to the positive terminal of the DC terminal, while the other end is connected to the negative terminal of the DC terminal.

[0010] Optionally, a first Y capacitor and a second Y capacitor are symmetrically arranged on one side of the AC terminal, and are disposed on the upper copper foil. One end of the first Y capacitor and the second Y capacitor are connected to the substrate, and the other end of each is connected to the AC terminal.

[0011] Optionally, the first MOS structure and the second MOS structure are disposed between the DC terminal and the AC terminal.

[0012] On the other hand, the present invention also provides a power unit, which includes a plurality of power modules as described in any one of the above.

[0013] Through the above technical solution, this utility model provides a power module and power unit with improved electromagnetic compatibility. By connecting the source (S) of the first MOS structure to the AC terminal and the drain (D) to the positive terminal of the DC terminal, and connecting the drain (D) of the second MOS structure to the AC terminal and the source (S) to the negative terminal of the DC terminal, one end of the X capacitor is connected to the positive terminal of the DC terminal, and the other end is connected to the negative terminal of the DC terminal and grounded through GND. One end of the first Y capacitor is connected to the positive terminal of the DC terminal, and the other end is grounded through GND. One end of the second Y capacitor is connected to the negative terminal of the DC terminal, and the other end is grounded through GND. By embedding X and Y capacitors inside the power module, differential-mode interference and common-mode interference can be effectively suppressed, improving the module's electromagnetic interference immunity, effectively absorbing interference signals during module turn-on and turn-off processes, reducing the risk of accidental module turn-on, and ensuring safe and stable module operation during turn-on. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the embodiments of the present invention and form part of the specification. They are used together with the following detailed description to explain the embodiments of the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of a power module circuit according to an embodiment of the present invention; Figure 2 This is a schematic diagram of a power module according to an embodiment of the present invention; Figure 3 This is a partial schematic diagram of a power module according to an embodiment of the present invention; Figure 4 This is an exploded view of a power unit according to an embodiment of the present invention.

[0015] Explanation of reference numerals in the attached figures Detailed Implementation

[0016] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of the present invention.

[0017] In this embodiment of the utility model, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used to describe the relative positional relationships of the components in relation to the directions shown in the accompanying drawings or in relation to the vertical, perpendicular, or gravitational directions.

[0018] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0019] like Figure 1 The diagram shown is a schematic diagram of a power module circuit according to an embodiment of this utility model. Figure 1The power module includes a first MOS structure 1, a second MOS structure 2, an X capacitor 3, a first Y capacitor 4, and a second Y capacitor 5. Specifically, the source (S) of the first MOS structure 1 is connected to the AC terminal 8, and the drain (D) is connected to the positive DC terminal 6. The drain (D) of the second MOS structure 2 is connected to the AC terminal 8, and the source (S) is connected to the negative DC terminal 7. One end of the X capacitor 3 is connected to the positive DC terminal 6, and the other end is connected to the negative DC terminal 7, and grounded through GND. One end of the first Y capacitor 4 is connected to the positive DC terminal 6, and the other end is grounded through GND. One end of the second Y capacitor 5 is connected to the negative DC terminal 7, and the other end is grounded through GND. The AC terminal 8 is the U terminal in the circuit diagram, the positive DC terminal 6 is the P1 terminal, and the negative DC terminal 7 is the N1 terminal. The X capacitor 3 can suppress differential-mode interference. When current flows through the circuit, various reasons, such as the switching operation of electrical appliances or other interference sources in the power grid, can cause fluctuations in the power supply voltage, generating high-frequency noise and interference signals. The X capacitor smooths out these voltage fluctuations through its own charging and discharging process. When the voltage rises, the X capacitor charges, storing excess energy; when the voltage drops, the X capacitor discharges, releasing the stored energy, thus maintaining a relatively stable voltage and improving the module's electromagnetic interference immunity. The positive DC terminal 6 and negative DC terminal 7 of the power module are connected via the X capacitor 3. The Y capacitor suppresses common-mode interference. Due to the parasitic capacitance inherent in the module, common-mode interference current is generated. When these interference signals appear, the Y capacitor plays a role, bypassing the interference signal to ground, thereby reducing the impact of interference on the circuit. The positive DC terminal 6 and negative DC terminal 7 of the power module are grounded to GND via the first Y capacitor 4 and the second Y capacitor 5, respectively. By embedding X and Y capacitors inside the power module, differential-mode interference and common-mode interference can be effectively suppressed, improving the module's electromagnetic interference immunity, effectively absorbing interference signals during the module's turn-on and turn-off processes, reducing the risk of accidental turn-on, and ensuring the safe and stable operation of the module during turn-on.

[0020] like Figure 2 The diagram shown is a schematic diagram of a power module according to an embodiment of this utility model. Figure 3 The diagram shown is a partial schematic of a power module according to an embodiment of the present invention. Figure 2 and Figure 3In this embodiment, the power module includes a substrate 9. A first MOS structure 1, a second MOS structure 2, an X capacitor 3, a first Y capacitor 4, and a second Y capacitor 5 are all disposed on the substrate 9 and grounded through the substrate 9. An upper copper foil 11 is disposed on the top surface of the substrate 9, and a lower copper foil 10 is disposed on the bottom surface. A through hole is provided on the substrate 9 so that the lower copper foil 10 passes through the through hole and connects to the upper copper foil 11. Considering the service life of the power module and the effects of overcurrent and heat conduction, in one embodiment of this utility model, the substrate 9 can be made of ceramic material. Ceramic material itself is an excellent insulator with high dielectric strength, which can prevent short circuits, and has high thermal conductivity, making it suitable for applications with extremely stringent requirements for mechanical reliability and thermal cycling.

[0021] In this embodiment, considering that the power module needs to be assembled onto other modules, a solder layer 12 is provided on the bottom surface of the lower copper foil 10 to facilitate the installation of the power module. In this embodiment, a DC terminal is provided on one side of the upper copper foil 11, and an AC terminal 8 is provided on the opposite side of the upper copper foil 11. Through the first MOS structure 1 and the second MOS structure 2, the current flowing from the positive terminal 6 of the DC terminal to the AC terminal 8, or the current flowing from the AC terminal 8 to the negative terminal 7 of the DC terminal, can be controlled.

[0022] In this embodiment, an X capacitor 3 is provided on one side of the DC terminal. The X capacitor 3 is disposed on the upper copper foil 11, and one end of the X capacitor 3 is connected to the positive terminal 6 of the DC terminal, and the other end is connected to the negative terminal 7 of the DC terminal, so that the positive terminal 6 of the DC terminal in the power module is connected to the negative terminal 7 of the DC terminal.

[0023] In this embodiment, a first Y capacitor 4 and a second Y capacitor 5 are symmetrically arranged on one side of the AC terminal 8 and are disposed on the upper copper foil 11. One end of the first Y capacitor 4 and the second Y capacitor 5 are connected to the substrate 9, and the other end of each is connected to the AC terminal 8, so that the positive terminal 6 of the DC terminal and the negative terminal 7 of the DC terminal are grounded to GND through the first Y capacitor 4 and the second Y capacitor 5, respectively.

[0024] In this embodiment, the first MOS structure 1 and the second MOS structure 2 are disposed between the DC terminal and the AC terminal 8, and are arranged symmetrically.

[0025] On the other hand, this utility model also provides a power unit, which includes multiple power modules. Each power module can be as follows: Figures 1 to 3 As shown. In this Figure 1The power module includes a first MOS structure 1, a second MOS structure 2, an X capacitor 3, a first Y capacitor 4, and a second Y capacitor 5. Specifically, the source (S) of the first MOS structure 1 is connected to the AC terminal 8, and the drain (D) is connected to the positive DC terminal 6. The drain of the second MOS structure 2 is connected to the AC terminal 8, and the source (S) is connected to the negative DC terminal 7. One end of the X capacitor 3 is connected to the positive DC terminal 6, and the other end is connected to the negative DC terminal 7, and grounded through GND. One end of the first Y capacitor 4 is connected to the positive DC terminal 6, and the other end is grounded through GND. One end of the second Y capacitor 5 is connected to the negative DC terminal 7, and the other end is grounded through GND. The X capacitor 3 suppresses differential-mode interference. When current flows through the circuit, various factors, such as the switching of electrical appliances or other interference sources in the power grid, can cause fluctuations in the power supply voltage, generating high-frequency noise and interference signals. The X capacitor smooths these voltage fluctuations through its own charging and discharging process. When the voltage rises, capacitor X charges and stores excess energy; when the voltage drops, capacitor X discharges and releases the stored energy, thus maintaining a relatively stable voltage and improving the module's electromagnetic interference immunity. Capacitor X3 connects the positive DC terminal 6 and negative DC terminal 7 of the power module. Capacitor Y suppresses common-mode interference. Due to the parasitic capacitance inherent in the module, common-mode interference current is generated. When these interference signals appear, capacitor Y functions by bypassing the interference signals to ground, thereby reducing the impact of interference on the circuit. Capacitors 6 and 7 of the DC terminal in the power module are grounded to GND via capacitors 4 and 5, respectively. By embedding capacitors X and Y inside the power module, differential-mode interference and common-mode interference can be effectively suppressed, improving the module's electromagnetic interference immunity, effectively absorbing interference signals during module turn-on and turn-off processes, reducing the risk of accidental turn-on, and ensuring safe and stable operation of the module during turn-on.

[0026] like Figure 2 The diagram shown is a schematic diagram of a power module according to an embodiment of this utility model. Figure 3 The diagram shown is a partial schematic of a power module according to an embodiment of the present invention. Figure 2 and Figure 3In this embodiment, the power module includes a substrate 9. A first MOS structure 1, a second MOS structure 2, an X capacitor 3, a first Y capacitor 4, and a second Y capacitor 5 are all disposed on the substrate 9 and grounded through the substrate 9. An upper copper foil 11 is disposed on the top surface of the substrate 9, and a lower copper foil 10 is disposed on the bottom surface. A through hole is provided on the substrate 9 so that the lower copper foil 10 passes through the through hole and connects to the upper copper foil 11. Considering the service life of the power module and the effects of overcurrent and heat conduction, in one embodiment of this utility model, the substrate 9 can be made of ceramic material. Ceramic material itself is an excellent insulator with high dielectric strength, which can prevent short circuits, and has high thermal conductivity, making it suitable for applications with extremely stringent requirements for mechanical reliability and thermal cycling.

[0027] In this embodiment, considering that the power module needs to be assembled onto other modules, a solder layer 12 is provided on the bottom surface of the lower copper foil 10 to facilitate the installation of the power module. In this embodiment, a DC terminal is provided on one side of the upper copper foil 11, and an AC terminal 8 is provided on the opposite side of the upper copper foil 11. Through the first MOS structure 1 and the second MOS structure 2, the current flowing from the positive terminal 6 of the DC terminal to the AC terminal 8, or the current flowing from the AC terminal 8 to the negative terminal 7 of the DC terminal, can be controlled.

[0028] In this embodiment, an X capacitor 3 is provided on one side of the DC terminal. The X capacitor 3 is disposed on the upper copper foil 11, and one end of the X capacitor 3 is connected to the positive terminal 6 of the DC terminal, and the other end is connected to the negative terminal 7 of the DC terminal, so that the positive terminal 6 of the DC terminal in the power module is connected to the negative terminal 7 of the DC terminal.

[0029] In this embodiment, a first Y capacitor 4 and a second Y capacitor 5 are symmetrically arranged on one side of the AC terminal 8, and are disposed on the upper copper foil 11. One end of each of the first Y capacitor 4 and the second Y capacitor 5 is connected to the substrate 9, and the other end is connected to the AC terminal 8, so that the positive terminal 6 and the negative terminal 7 of the DC terminal are grounded to GND through the first Y capacitor 4 and the second Y capacitor 5, respectively. In this embodiment, the first MOS structure 1 and the second MOS structure 2 are disposed between the DC terminal and the AC terminal 8, and are arranged symmetrically.

[0030] Through the above technical solution, this utility model provides a power module and power unit that improves electromagnetic compatibility. By connecting the source (S) of the first MOS structure 1 to the AC terminal 8 and the drain (D) to the positive DC terminal 6, connecting the drain of the second MOS structure 2 to the AC terminal 8 and the source (S) to the negative DC terminal 7, connecting one end of the X capacitor 3 to the positive DC terminal 6 and the other end to the negative DC terminal 7, and grounding it via GND, connecting one end of the first Y capacitor 4 to the positive DC terminal 6 and the other end to GND, and connecting one end of the second Y capacitor 5 to the negative DC terminal 7 and the other end to GND, by embedding X and Y capacitors inside the power module, differential-mode interference and common-mode interference can be effectively suppressed, improving the module's electromagnetic interference immunity, effectively absorbing interference signals during module turn-on and turn-off processes, reducing the risk of accidental turn-on, and ensuring safe and stable operation of the module during turn-on. The exploded view of this power unit can be as follows: Figure 4 As shown.

[0031] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings; however, the present invention is not limited thereto. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention. This includes combining various specific technical features in any suitable manner. To avoid unnecessary repetition, the present invention will not describe the various possible combinations separately. However, these simple modifications and combinations should also be considered as the content disclosed in the present invention and are all within the protection scope of the present invention.

Claims

1. A power module for improving electromagnetic compatibility, characterized in that, The power module includes: The first MOS structure has its source (S) terminal connected to the AC terminal and its drain (D) terminal connected to the positive terminal of the DC terminal. The second MOS structure has its drain (D) connected to the AC terminal and its source (S) connected to the negative terminal of the DC terminal. The X capacitor has one end connected to the positive terminal of the DC terminal and the other end connected to the negative terminal of the DC terminal, and is grounded through GND.

2. The power module according to claim 1, characterized in that, The power module includes: The first Y capacitor has one end connected to the positive terminal of the DC terminal, and the other end grounded through GND; The second Y capacitor has one end connected to the negative terminal of the DC terminal and the other end grounded through GND.

3. The power module according to claim 2, characterized in that, The power module includes: A substrate, a first MOS structure, a second MOS structure, an X capacitor, a first Y capacitor, and a second Y capacitor are disposed on the substrate and grounded through the substrate. An upper copper foil is disposed on the top surface of the substrate, and a lower copper foil is disposed on the bottom surface. A through hole is disposed on the substrate, and the lower copper foil passes through the through hole and connects to the upper copper foil.

4. The power module according to claim 3, characterized in that, A welding layer is provided on the bottom surface of the lower copper foil.

5. The power module according to claim 3, characterized in that, A DC terminal is provided on one side of the upper copper foil, and an AC terminal is provided on the opposite side of the upper copper foil.

6. The power module according to claim 5, characterized in that, An X capacitor is provided on one side of the DC terminal. The X capacitor is disposed on the upper copper foil, and one end of the X capacitor is connected to the positive terminal of the DC terminal, and the other end is connected to the negative terminal of the DC terminal.

7. The power module according to claim 5, characterized in that, A first Y capacitor and a second Y capacitor are symmetrically arranged on one side of the AC terminal and are disposed on the upper copper foil. One end of the first Y capacitor and the second Y capacitor are connected to the substrate, and the other end of each is connected to the AC terminal.

8. The power module according to claim 5, characterized in that, The first MOS structure and the second MOS structure are disposed between the DC terminal and the AC terminal.

9. A power unit, characterized in that, The power unit includes a plurality of power modules as described in any one of claims 1 to 8.

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