AIP structure with waveguide lock and waveguide interlock with AIP structure

Abstract

The utility model discloses AIP structure and waveguide and AIP structure interlocking structure with waveguide locking piece have waveguide locking piece's AIP structure includes mounting piece, waveguide locking piece and plastic package body, is equipped with signal transceiver module on mounting piece, waveguide locking piece is used for locking the medium waveguide cooperation with signal transceiver module, the partial area of plastic package body cladding mounting piece, the partial area of waveguide locking piece and signal transceiver module. Through embedding plastic in plastic package body with waveguide locking piece and signal transceiver module together, make locking reference and signal transceiver module position integral solidification when injection moulding, has saved the process of subsequent installation independent waveguide connector, thereby directly saves assembly man-hour and eliminates the alignment tolerance accumulation, with the common cladding of plastic package body to waveguide locking piece and signal transceiver module, waveguide locking piece can obtain accurate positioning in injection moulding stage, reduces the thermal deformation and mechanical stress because of secondary welding or screw fixed, improves production yield.

Description

Technical Field

[0001] This utility model relates to the field of waveguide transmission technology, and in particular to an AIP structure with a waveguide locking element and an interlocking structure between the waveguide and the AIP structure. Background Technology

[0002] Recently, a novel interconnect method utilizing dielectric waveguides (such as plastic waveguides) for electromagnetic wave transmission has emerged, offering high cost and power efficiency, and enabling high-speed data communication over short distances. Therefore, it has attracted considerable attention as a next-generation interconnect suitable for chip-to-chip or substrate-to-substrate communication.

[0003] like Figure 1 As shown, due to the need to adapt to the waveguide, the existing technology separates the module antenna 91 from the chip package 92. The module antenna 91 has reserved waveguide connector assembly structures around it, which increases the area of ​​the PCB board 94. Moreover, the waveguide connector 93 needs to be assembled separately, which wastes time and also carries the risk of misalignment. Utility Model Content

[0004] The technical problem solved by this utility model is to provide an AIP structure with a waveguide locking component that is easy to manufacture and has a high production yield, as well as an interlocking structure between the waveguide and the AIP structure.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: an AIP structure with a waveguide locking element, comprising:

[0006] The mounting component is equipped with a signal transceiver module.

[0007] A waveguide locking component, wherein the waveguide locking component is used to lock the dielectric waveguide that cooperates with the signal transceiver module;

[0008] A molding compound that encapsulates a portion of the mounting component, a portion of the waveguide locking component, and the signal transceiver module.

[0009] In one embodiment, the area of ​​the waveguide locking member exposed outside the encapsulation is provided with a locking portion for locking the dielectric waveguide.

[0010] In one embodiment, the locking part includes a plurality of locking teeth.

[0011] In one embodiment, the signal transceiver module includes an electrically connected signal transceiver chip and a signal transceiver antenna, and the locking part is provided corresponding to the signal transceiver antenna.

[0012] In one embodiment, the signal transceiver chip is encapsulated within the plastic package, or the signal transceiver chip is exposed outside the plastic package.

[0013] In one embodiment, the signal transceiver chip includes a signal receiving chip and a signal transmitting chip, and the signal transceiver antenna includes a signal receiving antenna and a signal transmitting antenna. The signal receiving chip and the signal receiving antenna are electrically connected to form a signal receiving unit, and the signal transmitting chip and the signal transmitting antenna are electrically connected to form a signal transmitting unit.

[0014] In one embodiment, the molding compound includes a first part and a second part connected together, the first part covering the signal transceiver module and covering a portion of the top surface of the mounting component, and the second part covering a portion of the waveguide locking component.

[0015] In one embodiment, the mounting component is a frame base island, and the area of ​​the frame base island exposed outside the molding compound is configured as a pin electrically connected to the signal transceiver module.

[0016] In one embodiment, the mounting component is a substrate, and the bottom surface of the substrate is provided with BGA ball bearings.

[0017] To solve the above-mentioned technical problems, the second technical solution adopted by this utility model is: a waveguide and AIP structure interlocking structure, including a dielectric waveguide and the above-mentioned AIP structure with waveguide locking member, wherein the dielectric waveguide is fixed on the AIP structure with waveguide locking member by the waveguide locking member.

[0018] The beneficial effects of this utility model are as follows: By embedding the waveguide locking component and the signal transceiver module together in the plastic package, the locking reference and the position of the signal transceiver module are integrally solidified during injection molding, eliminating the need for subsequent installation of independent waveguide connectors, thereby directly saving assembly time and eliminating the accumulation of alignment tolerances; with the joint encapsulation of the waveguide locking component and the signal transceiver module by the plastic package, the waveguide locking component can be accurately positioned during the injection molding stage, reducing thermal deformation and mechanical stress caused by secondary welding or screw fixing, and improving production yield; at the same time, the waveguide locking component is hidden inside the plastic package, and only the locking part that docks with the dielectric waveguide needs to be exposed on the package surface, which significantly reduces the board-level area occupied, realizes a compact chip-waveguide interconnection, and meets the requirements of short-range high-speed data communication systems for low cost, high integration and batch manufacturing consistency. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a simplified structural diagram of a high-speed signal transmission module in the prior art.

[0021] Figure 2 This is a simplified schematic diagram of the AIP structure with waveguide locking element in Embodiment 1. Figure 1 ;

[0022] Figure 3 This is a simplified schematic diagram of the AIP structure with waveguide locking element in Embodiment 1. Figure 2 ;

[0023] Figure 4 This is a simplified schematic diagram of the waveguide and AIP structure interlocking structure in Example 1;

[0024] Figure 5 The fabrication process of the AIP structure with waveguide locking element in Example 1. Figure 1 ;

[0025] Figure 6 The fabrication process of the AIP structure with waveguide locking element in Example 1. Figure 2 ;

[0026] Figure 7 The fabrication process of the AIP structure with waveguide locking element in Example 1. Figure 3 ;

[0027] Figure 8 The fabrication process of the AIP structure with waveguide locking element in Example 1. Figure 4 ;

[0028] Figure 9 This is a simplified schematic diagram of the AIP structure with waveguide locking element in Embodiment 2. Figure 1 ;

[0029] Figure 10 This is a simplified schematic diagram of the AIP structure with waveguide locking element in Embodiment 2. Figure 2 ;

[0030] Figure 11 This is a simplified schematic diagram of the waveguide and AIP structure interlocking structure in Example 2;

[0031] Figure 12 This is a simplified schematic diagram of an AIP structure with a waveguide locking element according to Embodiment 3;

[0032] Figure 13 This is a simplified schematic diagram of another AIP structure with a waveguide locking element in Embodiment 3;

[0033] Figure 14 This is a simplified schematic diagram of an AIP structure with a waveguide locking element according to Embodiment 4;

[0034] Figure 15 This is a simplified schematic diagram of another AIP structure with a waveguide locking element in Embodiment 4.

[0035] Explanation of icon numbers:

[0036] 1. Mounting component; 11. Pins; 12. BGA ball bearings;

[0037] 2. Waveguide locking component; 21. Locking part; 211. Locking tooth;

[0038] 3. Molded body; 31. Part 1; 32. Part 2;

[0039] 4. Signal transmitting unit; 41. Signal transmitting chip; 42. Signal transmitting antenna;

[0040] 5. Signal receiving unit; 51. Signal receiving chip; 52. Signal receiving antenna;

[0041] 6. Dielectric waveguide; 61. Mating tooth;

[0042] 7. Signal transceiver chip;

[0043] 8. Signal transceiver antenna.

[0044] 91. Modular antenna; 92. Chip packaging; 93. Waveguide connector; 94. PCB board. Detailed Implementation

[0045] The purpose, features, and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0046] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0047] It should be noted that if the embodiments of this utility model involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.

[0048] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0049] Furthermore, if the meaning of "and / or" in the entire text is to include three parallel solutions, taking "and A / or B" as an example, it includes solution A, solution B, and a solution that simultaneously satisfies both A and B. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0051] Example 1

[0052] Please refer to Figures 2 to 8 One embodiment of this utility model is an AIP structure with a waveguide locking component, including a mounting component 1, a waveguide locking component 2, and a molding compound 3. The mounting component 1 is provided with a signal transceiver module. The waveguide locking component 2 is used to lock the dielectric waveguide 6 that cooperates with the signal transceiver module. The molding compound 3 covers a portion of the mounting component 1, a portion of the waveguide locking component 2, and the signal transceiver module. The area of ​​the waveguide locking component 2 exposed in the molding compound 3 is provided with a locking part 21 for locking the dielectric waveguide 6.

[0053] Optionally, the locking part 21 includes a plurality of locking teeth 211. In this embodiment, the locking part 21 includes a plurality of locking teeth 211. In other embodiments, the locking part 21 may also have other structural forms. For example, the locking part 21 may not have locking teeth 211, but may simply hold the dielectric waveguide 6.

[0054] Specifically, the signal transceiver module includes an electrically connected signal transceiver chip 7 and a signal transceiver antenna 8, and the locking part 21 is provided corresponding to the signal transceiver antenna 8.

[0055] In one or more embodiments, the signal transceiver chip 7 includes a signal receiving chip 51 and a signal transmitting chip 41, and the signal transceiver antenna 8 includes a signal receiving antenna 52 and a signal transmitting antenna 42. The signal receiving chip 51 and the signal receiving antenna 52 are electrically connected to form a signal receiving unit 5, and the signal transmitting chip 41 and the signal transmitting antenna 42 are electrically connected to form a signal transmitting unit 4. It is readily understood that the signal receiving unit 5 and the signal transmitting unit 4 constitute the signal transceiver module. In other embodiments, the signal transceiver chip 7 can be a single duplex chip capable of both signal transmission and signal reception; similarly, the signal transceiver antenna 8 can also be a shared transmit and receive antenna.

[0056] In this embodiment, both the signal transceiver chip 7 and the signal transceiver antenna 8 are encapsulated within the plastic package 3. In other embodiments, the signal transceiver antenna 8 is encapsulated within the plastic package 3, while the signal transceiver chip 7 is exposed outside the plastic package 3, which is also acceptable.

[0057] Optionally, the molding compound 3 includes a first part 31 and a second part 32 connected together. The first part 31 covers the signal transceiver module and a portion of the top surface of the mounting component 1, and the second part 32 covers a portion of the waveguide locking component 2.

[0058] In this embodiment, the mounting component 1 is a frame base island, and the area of ​​the frame base island exposed outside the plastic casing 3 is configured as a pin 11 electrically connected to the signal transceiver module.

[0059] The process of manufacturing the AIP structure with waveguide locking element in this embodiment is briefly described below:

[0060] like Figure 5 As shown, installer 1 with the signal transceiver module installed is obtained;

[0061] like Figure 6 As shown, the first molding process is performed, and the first part 31 of the molding body 3 is formed on the mounting part 1;

[0062] like Figure 7 As shown, the waveguide locking member 2 is placed at a preset position on the first part 31;

[0063] like Figure 8 As shown, a second molding process is performed to obtain a complete molded body 3. When the mounting component 1 is a frame base island, the area of ​​the frame base island exposed outside the molded body 3 is bent to form the pin 11, as shown. Figure 3 and Figure 4 As shown.

[0064] like Figure 4As shown, this embodiment also provides a waveguide and AIP structure interlocking structure, which includes a dielectric waveguide 6 and the aforementioned AIP structure with a waveguide locking member. The dielectric waveguide 6 is fixed to the AIP structure with the waveguide locking member by the waveguide locking member 2.

[0065] Specifically, after the dielectric waveguide 6 is placed at a preset position on the AIP structure with the waveguide locking member, bending the area of ​​the waveguide locking member 2 exposed in the encapsulation 3 will lock the locking part 21 with the dielectric waveguide 6. In this embodiment, the dielectric waveguide 6 is provided with mating teeth 61 that cooperate with the locking teeth 211.

[0066] It should be noted that since this embodiment uses a flat dielectric waveguide 6, the locking part 21 on the waveguide locking member 2 will have an adaptive design. Specifically, the waveguide locking member 2 roughly forms an effect of surrounding the dielectric waveguide 6.

[0067] Example 2

[0068] Please refer to Figures 9 to 11 The second embodiment of this utility model is a parallel technical solution to the first embodiment. The difference between the two embodiments is that the AIP structure with waveguide locking member in this embodiment can cooperate with the columnar dielectric waveguide 6. In the interlocking structure of the waveguide and AIP structure based on the AIP structure with waveguide locking member in this embodiment, both sides of the dielectric waveguide 6 are locked by the locking part 21 of the waveguide locking member 2.

[0069] Example 3

[0070] Please refer to Figure 12 and Figure 13 Embodiment 3 of this utility model is a parallel technical solution to Embodiment 1, the difference being that: the mounting component 1 is a substrate, and the bottom surface of the substrate is provided with BGA ball bearings 12. The material of the substrate includes, but is not limited to, BT (bismaleimide triazine resin), ABF (Ajinomoto Build-up Film), ceramics, etc.

[0071] Example 4

[0072] Please refer to Figure 14 and Figure 15 Embodiment 4 of this utility model is a parallel technical solution to Embodiment 3, the difference being that the signal transceiver chip 7 is bonded to the bottom of the substrate and is in communication with the signal transceiver antenna 8 inside the plastic package 3. Compared to Embodiment 3, this embodiment essentially only encapsulates the signal transceiver antenna 8 in the signal transceiver module within the first part 31 of the plastic package 3, without encapsulating the signal transceiver chip 7.

[0073] The above are merely optional embodiments of this utility model and do not limit the patent scope of this utility model. All equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. An AIP structure with a waveguide locking element, characterized in that, include The mounting component is equipped with a signal transceiver module. A waveguide locking component, wherein the waveguide locking component is used to lock the dielectric waveguide that cooperates with the signal transceiver module; A molding compound that encapsulates a portion of the mounting component, a portion of the waveguide locking component, and the signal transceiver module.

2. The AIP structure with waveguide locking element according to claim 1, characterized in that, The area of ​​the waveguide locking member exposed outside the encapsulation is provided with a locking part for locking the dielectric waveguide.

3. The AIP structure with waveguide locking element according to claim 2, characterized in that, The locking part includes a number of locking teeth.

4. The AIP structure with waveguide locking element according to claim 2, characterized in that, The signal transceiver module includes an electrically connected signal transceiver chip and a signal transceiver antenna, and the locking part is set corresponding to the signal transceiver antenna.

5. The AIP structure with waveguide locking element according to claim 4, characterized in that, The signal transceiver chip is encapsulated within the plastic package, or the signal transceiver chip is exposed outside the plastic package.

6. The AIP structure with waveguide locking element according to claim 4, characterized in that, The signal transceiver chip includes a signal receiving chip and a signal transmitting chip, and the signal transceiver antenna includes a signal receiving antenna and a signal transmitting antenna. The signal receiving chip and the signal receiving antenna are electrically connected to form a signal receiving unit, and the signal transmitting chip and the signal transmitting antenna are electrically connected to form a signal transmitting unit.

7. The AIP structure with waveguide locking element according to claim 1, characterized in that, The encapsulation includes a first part and a second part connected together. The first part covers the signal transceiver module and a portion of the top surface of the mounting component, and the second part covers a portion of the waveguide locking component.

8. The AIP structure with waveguide locking element according to claim 1, characterized in that, The mounting component is a frame base island, and the area of ​​the frame base island exposed outside the plastic casing is configured as a pin that is electrically connected to the signal transceiver module.

9. The AIP structure with waveguide locking element according to claim 1, characterized in that, The mounting component is a substrate, and the bottom surface of the substrate is provided with BGA ball bearings.

10. A waveguide and AIP structure interlocking structure, characterized in that, The invention includes a dielectric waveguide and an AIP structure with a waveguide locking element as described in any one of claims 1-9, wherein the dielectric waveguide is fixed to the AIP structure with the waveguide locking element by the waveguide locking element.

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