A composite antenna 4G / LoRa dual-frequency transceiver system for pump body

CN224804944UActive Publication Date: 2026-09-25XIANYANG TANGANCHANG TECH CO LTD
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Patent Information

Application Number
CN202522407984.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-13
Publication Date
2026-09-25
Estimated Expiration
2035-11-13

AI Technical Summary

Technical Problem

[0004]目前市场上的泵体通信设备通常采用单一通信技术方案,如仅支持4G或仅支持Lora,导致设备需要额外增加通信模块或采用多设备协同工作,这不仅增加了系统复杂度和成本,也降低了设备的集成度和可靠性

Benefits of technology

[0020]1、本实用新型结构简单,集成度高;本实用新型采用复合天线单元和复合天线PCB控制板单元的集成设计,简化了系统结构,提高了系统集成度。本实用新型通过四层PCB复合天线设计(顶层为4G天线,第二层为隔离层,第三层为LoRa天线,底层为接地层),将传统方案中的两个独立天线集成在一个复合天线单元中。通过板载分频电路将信号分频为两个输出口,避免了传统方案中需要额外的滤波器和隔离电路。复合天线PCB控制板单元采用四层PCB设计,将主控芯片、4G模块和LoRa模块集成在单一电路板上,减少了外部连接和接口数量。

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Abstract

The utility model belongs to composite antenna technical field relates to a pump body's composite antenna 4G / LoRa dual -frequency transceiver system, include: composite antenna, frequency -splitting circuit, composite antenna PCB control panel, composite antenna is used as 4G frequency band's main radiating unit and LoRa frequency band's main radiating unit, frequency -splitting circuit is used through SMA radio frequency connector and is connected with composite antenna PCB control panel electricity of composite antenna, composite antenna PCB control panel is used through main control chip scheduling 4G module and LoRa module's working mode realizes 4G signal and LoRa signal's cooperative processing, the utility model integrates two independent antennas in traditional scheme in a composite antenna unit, through the on -board frequency -splitting circuit and signal frequency division are two output ports, avoid the additional filter and isolation circuit in traditional scheme, satisfy the miniaturization, low power consumption, low cost demand of underwater pump body wireless communication integrated 4G signal and Lora signal processing receiving sending.
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Description

Technical Field

[0001] This utility model belongs to the field of composite antenna technology, specifically relating to a composite antenna 4G / LoRa dual-band transceiver system for a pump body. Background Technology

[0002] With the rapid development of IoT technology, various wireless communication technologies are being widely used in different application scenarios. 4G communication technology, with its high speed and low latency, is widely used in scenarios requiring real-time data transmission; while LoRa technology, with its advantages of low power consumption and long-distance transmission, has become the preferred communication solution for IoT sensor networks.

[0003] The wireless communication technology used in the pump body, through its anti-interference design and low power consumption, is adapted to the complex environment of downhole drilling, characterized by high pressure, high humidity, and metallic interference. This enables real-time monitoring and control of the pump body, emergency communication support, efficient data transmission, and system compatibility.

[0004] Currently, pump communication equipment on the market typically employs a single communication technology solution, such as supporting only 4G or only LoRa. This necessitates the addition of extra communication modules or the use of multiple devices working together, which not only increases system complexity and cost but also reduces the integration and reliability of the equipment. While some antenna designs support multiple frequency bands, these designs generally cannot simultaneously support the significantly different frequency bands of 4G and LoRa. Communication protocols with different characteristics mostly use signals in similar frequency bands and lack effective signal frequency division processing mechanisms.

[0005] Furthermore, existing technologies typically require separate receiving and transmitting circuits for processing 4G and LoRa signals, resulting in high system power consumption, large size, and high cost, which cannot meet the stringent requirements of IoT devices for miniaturization, low power consumption, and low cost.

[0006] Therefore, there is a need for a method or apparatus that integrates 4G and LoRa signals for processing, receiving, and transmitting, in order to solve the aforementioned technical problems. Utility Model Content

[0007] This utility model provides the following technical solution: a composite antenna 4G / LoRa dual-band transceiver system for a pump body, comprising: a composite antenna, a frequency division circuit, and a composite antenna PCB control board; the composite antenna is used as the main radiating unit of the 4G band and the main radiating unit of the LoRa band, the frequency division circuit is used to electrically connect the composite antenna to the composite antenna PCB control board through an SMA RF connector, and the composite antenna PCB control board is used to schedule the working modes of the 4G module and the LoRa module through the main control chip to achieve the coordinated processing of 4G signals and LoRa signals.

[0008] Preferably, the composite antenna is a PCB antenna, which includes: a top antenna layer, a second antenna layer, a third antenna layer, and a bottom antenna layer; the top antenna layer has a main radiating element for the 4G band, and the outer grounding portion of the top antenna layer is electrically connected to the bottom antenna layer through a via; the second antenna layer is an isolation layer used to isolate the mutual interference between 4G signals and LoRa signals through a metal shielding layer; the third antenna layer has a main radiating element for the LoRa band, and the outer grounding portion of the third antenna layer is electrically connected to the bottom antenna layer through a via; the bottom antenna layer is a grounding layer used to provide a stable reference potential and enhance the radiation efficiency of the antenna; the bottom antenna layer is electrically connected to the metal shielding layer of the second antenna layer.

[0009] More preferably, the frequency divider circuit is integrated into the bottom layer of the antenna, and the frequency divider circuit includes a bandpass filter and a coupler.

[0010] Preferably, the composite antenna PCB control board is equipped with a main control chip, which is used to communicate with the 4G module and the LoRa module through the UART interface; the main control chip is used to control the 4G module and the LoRa module to be in standby mode or intelligently switch at the same time; the main control chip is also used to provide power supply, overvoltage protection and overcurrent protection for each module.

[0011] More preferably, the composite antenna PCB control board includes: a top layer of the control board, a second layer of the control board, a third layer of the control board, and a bottom layer of the control board. The composite antenna PCB control board physically isolates the main control chip, the 4G module, the LoRa module, and the power signal through four layers of PCB.

[0012] More preferably, the composite antenna PCB control board is electrically connected to a waterproof terminal, which is electrically connected to a control box, control cabinet, or controlled device.

[0013] Preferably, the main control chip uses an ARM Cortex-M3 processor, the 4G module uses an EC801E module, and the LoRa module uses a Semtech SX1278 chip.

[0014] Preferably, the electrical connection method of the composite antenna, the frequency division circuit, and the composite antenna PCB control board includes: the composite antenna is wirelessly connected to the 4G base station and the LoRa signal source, the composite antenna is electrically connected to the frequency division circuit, and the 4G signal and the LoRa signal of the frequency division circuit are respectively connected to the composite antenna PCB control board through the radio frequency interface.

[0015] The MCU circuit connection method for the 4G / LoRa antenna includes: The MCU uses the GD32F103RCT6 from the GD32F103 series; MCU pin 3 is connected to ground via series capacitor C62, and pin 4 is connected to ground via series capacitor C61. Pins 3 and 4 are connected to the two ends of crystal oscillator X4, respectively. Pin 5 is connected to ground via series capacitor C63, and pin 6 is connected to ground via series capacitor C64. Pins 5 and 6 are connected to the two ends of crystal oscillator X3 and resistor R36, respectively. Pin 13 is connected to power supply VCC_3.3 via series inductor L3, and pin 13 is connected to ground via series capacitor C73. Capacitors C65 to C68 are connected in parallel in sequence, with one end connected to power supply VCC_3.3 and the other end grounded. Pin 58 of the MCU is connected to ground via resistor R43 and then to the VCC_3.3 power supply. Pin 58 of the MCU is connected to pin 3 of the temperature and humidity sensor U14. Pin 4 of the temperature and humidity sensor U14 is connected to pin 59 of the MCU. Pin 59 of the MCU is connected to ground via resistor R44 and then to the VCC_3.3 power supply. Pin 2 of the temperature and humidity sensor U14 is connected to ground via resistor R45 and capacitor C80 in series. The connection point of resistor R45 and capacitor C80 is connected to the VCC_3.3 power supply. Pin 5 of the temperature and humidity sensor U14 is grounded. Pin 7 of the MCU is connected to ground via resistor R46 and then to the VCC_3.3 power supply. Capacitor C74 is connected in parallel with the switch, with one end connected to pin 7 of the MCU and the other end grounded. Pin 2 of the MCU is connected to ground via resistor R47 and then to the VCC_3.3 power supply. Capacitor C75 is connected in parallel with the switch, with one end connected to pin 2 of the MCU and the other end grounded. Pin 8 of the MCU is connected in series with LED1 and resistor R10, then grounded, to indicate the 4G network status. Pin 9 of the MCU is connected in series with LED2 and resistor R9, then grounded, to indicate the TKM status. Pin 10 of the MCU is connected in series with LED3 and resistor R52, then grounded, to indicate the 4G network operating status. Pin 11 of the MCU is connected in series with LED4 and resistor R53, then grounded, to indicate the TKM operating status. Pin 51 of the MCU is connected to pin 2 of the RS-485 interface module U22 (model TD301M485). Pin 52 of the MCU is connected to pin 1 of the RS-485 interface module U22. Pin 3 of the RS-485 interface module U22 is grounded, pin 4 is connected to power supply VCC_3.3, pin 5 of the RS-485 interface module U22 is grounded, and the two ends of resistor R354 are connected to pins 6 and 8 of the RS-485 interface module U22, respectively. The two ends of resistor R355 are connected to pins 5 and 7 of RS-485 interface module U22, respectively. The two ends of TVS diode D58 are connected to pins 6 and 7 of RS-485 interface module U22, respectively. The two ends of TVS diode D57 are connected to pins 5 and 7 of RS-485 interface module U22, respectively. The two ends of TVS diode D56 are connected to pins 5 and 6 of RS-485 interface module U22, respectively. Pins 6 and 7 of RS-485 interface module U22 are connected to terminals AB, respectively.

[0016] The 4G / LoRa antenna 4G circuit includes a 4G communication module U30, model number EC801ECNLE-N01-SNNSA. Pin 14 of the 4G communication module U30 is connected to pin 2 of the surface-mount SIM card U3 after being connected in series with resistors R368, R366, and R375. Pin 11 of the 4G communication module U30 is connected to ground after being connected in series with an ESD protection diode U4. Pin 11 of the 4G communication module U30 is also connected to ground after being connected in series with capacitor C19. The connection point of resistors R366 and R375 is connected to pin 3 of the surface-mount SIM card U3 after being connected in series with resistor R374. Pin 1 of the surface-mount SIM card U3 is grounded. Pin 8 of the surface-mount SIM card U3 is connected to ground after being connected in series with a grounding resistor R369 and an ESD protection diode U5. Pin 7 of the surface-mount SIM card U3 is connected to ground after being connected in series. Resistor R370 and ESD protection diode U7 are connected to ground. Pin 6 of the surface-mount SIM card U3 is connected to ground in series with grounding resistor R371 and ESD protection diode U6. Capacitor C21 is connected in parallel across ESD protection diode U7, and capacitor C20 is connected in parallel across ESD protection diode U6. The connection node of resistor R370 and ESD protection diode U7 is connected to pin 12 of 4G communication module U30. The connection node of resistor R371 and ESD protection diode U6 is connected to pin 13 of 4G communication module U30. The connection node of resistor R369 and ESD protection diode U5 is connected to pin 14 of 4G communication module U30.

[0017] Preferably, the composite antenna, frequency division circuit, and composite antenna PCB control board are covered with a sealed shell, and the composite antenna PCB control board is equipped with a temperature and humidity sensor.

[0018] Preferably, the composite antenna and the composite antenna PCB control board are integrally fabricated on the same PCB board. Printing the composite antenna and the composite antenna PCB control board on the same PCB board can optimize the circuit and reduce signal loss. Furthermore, the interfaces or connectors between the composite antenna and the composite antenna PCB control board can be replaced by printed circuits, thus improving the integrity of the entire circuit, making the signal more stable, and improving the anti-interference performance.

[0019] The beneficial effects of this utility model are:

[0020] 1. This utility model features a simple structure and high integration. It employs an integrated design of a composite antenna unit and a composite antenna PCB control board unit, simplifying the system structure and improving system integration. This utility model integrates two independent antennas from traditional solutions into a single composite antenna unit through a four-layer PCB composite antenna design (top layer is the 4G antenna, second layer is the isolation layer, third layer is the LoRa antenna, and bottom layer is the ground layer). The onboard frequency divider circuit divides the signal into two output ports, avoiding the need for additional filters and isolation circuits required in traditional solutions. The composite antenna PCB control board unit uses a four-layer PCB design, integrating the main control chip, 4G module, and LoRa module onto a single circuit board, reducing the number of external connections and interfaces.

[0021] 2. This utility model is small in size, compact in structure, and securely installed. The overall installation space is controlled within 500×150×200mm. Under the same function and transmission power, the installation volume of this utility model is reduced by more than 70% compared to existing multi-band antennas and transceivers on the market. In existing technologies, independent multi-band solutions require two antennas and two modules, which are installed independently and occupy a large space. Furthermore, existing installation methods are mostly suction cups or magnetic attachments, which cannot meet the requirements of outdoor or industrial use. This utility model can be installed using slots + screws + double clamps, fully meeting the requirements of small-space industrial installation under harsh pump conditions.

[0022] 3. This invention features low signal interference and high communication quality. Specifically designed for remote areas with incomplete signal coverage and poor signal quality, this invention optimizes the 4G radio frequency section, reducing signal interference by 30% and significantly improving signal stability compared to common 4G antennas on the market. Utilizing a unique composite antenna design, this invention enables intelligent switching between 4G and LoRa, ensuring uninterrupted communication even in situations with incomplete 4G coverage, poor signal, and frequent dropped calls. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a composite antenna 4G / LoRa dual-band transceiver system for a pump body according to this utility model; wherein, Figure 1 a is a composite antenna. Figure 1 b represents the composite antenna PCB control board;

[0024] Figure 2 This is a schematic diagram of the power supply circuit of an embodiment of the present utility model;

[0025] Figure 3 This is a schematic diagram of the 4G / LoRa antenna MCU circuit according to an embodiment of the present invention;

[0026] Figure 4This is a schematic diagram of the 4G / LoRa antenna 4G circuit of an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the 4G / LoRa antenna TKM IoT LPWAN module circuit according to an embodiment of the present invention;

[0028] Figure 6 This is a schematic diagram illustrating the integrated fabrication of the composite antenna and control board of this utility model.

[0029] Figure 7 This is a schematic diagram of the integrated composite antenna and control board of this utility model. Detailed Implementation

[0030] The relevant technologies of this utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0031] like Figures 1-7 As shown, this embodiment provides a composite antenna 4G / LoRa dual-band transceiver system for a pump body, including a composite antenna unit and a composite antenna PCB control board unit, the specific structure and connection relationship of which are as follows:

[0032] 1. Composite antenna unit

[0033] The composite antenna unit is a PCB antenna, employing a four-layer PCB structure design, including a top layer, a second layer, a third layer, and a bottom layer. The layers are connected via vias, as detailed below:

[0034] Top layer of the antenna (L1): As the main radiating element for the 4G band, the outer grounding portion is connected to the bottom layer of the antenna via a via. Function of the top layer: As the radiating element of the 4G communication module, it is responsible for transmitting and receiving high-frequency signals (typically covering the 1.7-2.7GHz band). Placing the high-frequency antenna on the top layer reduces dielectric loss in the signal transmission path and facilitates coupling with external space.

[0035] The second antenna layer (L2) serves as an isolation layer, employing a metallic shielding layer to effectively isolate mutual interference between 4G and LoRa signals. Ideally, the isolation layer should be entirely copper-clad and connected to the antenna's underlying ground plane via vias, creating a continuous Faraday cage effect. The layouts of the 4G and LoRa antennas should be staggered to avoid coupling. This prevents the downward coupling of high-frequency 4G signals to the LoRa antenna, thus preventing a decrease in receiver sensitivity; and suppresses interference from low-frequency LoRa signals (433 / 868 / 915MHz) on the 4G antenna.

[0036] The third layer (L3) of the antenna serves as the main radiating element for the LoRa band. Its outer ground layer is connected to the bottom layer of the antenna via vias. LoRa is used for long-distance, low-power communication and operates in the Sub-1GHz band (e.g., 433MHz, 868MHz). Placing the LoRa layer below the isolation layer avoids direct interference from the 4G high-frequency radiation from the top layer of the antenna. Simultaneously, the ground layer (bottom layer of the antenna) provides a reflective surface, enhancing radiation efficiency. Due to the long wavelength of LoRa, a larger clearance area or serpentine routing can be used to reduce its size.

[0037] The antenna bottom layer (L4) serves as the ground plane, connecting to the second layer of metal shielding to provide a stable reference potential and enhance the antenna's radiation efficiency. It provides a low-impedance return path for the entire composite antenna unit, reducing signal loop area; it also acts as the reflecting ground plane for the LoRa antenna, improving antenna gain and directivity; and together with the isolation layer, it forms a complete electromagnetic shielding structure. As a ground plane, it must remain intact and uninterrupted to avoid resonance or radiation caused by gaps in the ground plane.

[0038] Structural advantages of composite antenna elements:

[0039] Frequency band isolation: The frequency bands of 4G (GHz level) and LoRa (MHz level) are very different, and the isolation layer can prevent intermodulation interference and resonant coupling.

[0040] Space optimization: Vertical stacking saves PCB area and is suitable for compact IoT devices (such as trackers and sensors).

[0041] Performance assurance: The grounding layer stabilizes the RF ground potential and reduces common-mode noise; the isolation layer reduces the isolation between antennas.

[0042] 2. Frequency divider circuit

[0043] The frequency divider circuit is integrated in Layer 4 (L4) and consists of a bandpass filter and a coupler, connected to the PCB control board unit via an SMA RF connector. The bandpass filter allows only one 4G / LoRa signal to pass through at a time, while attenuating or blocking the other signal. The coupler extracts a small portion of the signal energy from the line without interrupting the main signal transmission and directs it to another port for signal sampling and monitoring, signal distribution, connection, and matching.

[0044] 3. Composite antenna PCB control board unit

[0045] The composite antenna PCB control board unit adopts a four-layer PCB structure design, including the top layer (L1), the second layer (L2), the third layer (L3), and the bottom layer (L4). The layers are connected by vias, and the specific relationships are as follows:

[0046] Main control chip: Employs a low-power ARM Cortex-M3 processor with a working frequency of 72MHz, an operating voltage of 3.3V, and a static power consumption of 12μA. This chip communicates with the 4G module and LoRa module via a UART interface.

[0047] 4G Module: Quectel EC801E module, operating in the B5 / B8 frequency band, with a receiver sensitivity of -115dBm and a transmit power of 20dBm±2dB (5V).

[0048] LoRa module: Uses Semtech SX1278 chip, operates in the 433MHz / 470MHz frequency band, has a receiver sensitivity of -140dBm and a transmit power of 20dBm±2dB (5V).

[0049] The composite antenna PCB control board unit is used to achieve coordinated processing of 4G and LoRa signals. Its core functions include: scheduling the working modes of the 4G and LoRa modules through the main control chip, supporting simultaneous standby or intelligent switching between dual modes; integrating power management circuitry to provide stable 3.3V / 5V power supply to each module, and having overvoltage and overcurrent protection functions; designing an RF signal matching network to optimize impedance matching between 4G (1.7-2.7GHz) and LoRa (433 / 470MHz), reducing VSWR (VSWR<1.5); and being equipped with debugging interfaces (such as JTAG, SWD) and status indicator lights for easy production testing and field maintenance. This unit uses a four-layer PCB design to physically isolate high-speed digital signals (main control chip), RF signals (4G / LoRa modules), and power signals (L2 / L4), significantly improving the system's anti-interference capability. The top layer of the control board typically contains the main control chip, 4G / LoRa module interfaces, and high-speed signal lines (such as UA RT bus). The second layer of the control board can serve as a power layer or internal ground layer, providing a stable 3.3V / 5V power distribution for the system. The third layer of the control board can serve as a dedicated RF ground layer to reduce electromagnetic interference between 4G / LoRa antennas. The bottom layer of the control board houses low-frequency circuits, debugging interfaces, and a large grounding area to enhance the system's anti-interference capability. The TK M IoT LPWAN module for the 4G / LoRa antennas supports AT command control (via UART / USB interface 15). It features a built-in protocol stack (such as LoRaWAN and MQTT), supports data encryption (AES-128 hardware acceleration), and edge computing capabilities (such as data caching and preprocessing on the eFish-SBC-RK3576 platform).

[0050] 4. External connection terminals

[0051] The antenna is connected to the control box / control cabinet / controlled equipment, etc. via an M86 waterproof terminal. The specific connections include: PIN1 ground, PIN2 ground, PIN3 connected to Modbus RTU B, PIN4 connected to Modbus RTU A, PIN5 connected to the 12-24Vdc power input, and PIN6 connected to the 12-24Vdc power input.

[0052] Example

[0053] Example 1: In this example, the composite antenna 4G / LoRa dual-band transceiver includes a composite antenna and a composite antenna PCB control board. The composite antenna is fabricated on one PCB board, and the composite antenna PCB control board is fabricated on another PCB board. The frequency divider circuit is integrated on the composite antenna PCB board. The composite antenna circuit is connected to the frequency divider circuit, and the frequency divider circuit is electrically connected to the PCB board containing the composite antenna PCB control board via an RF interface on the PCB board. A sealed housing is installed around both PCB boards, allowing them to be installed in a pump body or underground for use, meeting the communication needs of pumps in complex environments with high pressure, high humidity, and metal interference, or in remote areas with unstable signals.

[0054] Composite antennas such as Figure 1 As shown in Figure a, it includes: A1 - LoRa output, B2 - 4G output, and C3 frequency divider circuit. The PCB board of the composite antenna is shown below. Figure 1 As shown in b, it includes: A1-M86 waterproof terminal, B2-485 communication module, C3-temperature and humidity sensor, D4-backup battery interface, E5-button 1, F6-button 2, G7-LoRa module, H8-main control chip, I9-24V to 5V output power supply module, J10-SIM card, K11-4G module, L12-matching circuit, and M13-SMA RF interface. The power supply circuit, MCU circuit, 4G circuit, and TKM IoT LPWAN module circuit are respectively as follows: Figures 2 to 5 As shown, they are distributed across different antenna layers and control board layers.

[0055] The signaling flow is as follows: After receiving external 4G and LoRa wireless information, the composite antenna divides the signal into two paths via the C3 frequency divider circuit: A1-Lora output and B2-4G output. The outputs are sent to the composite antenna PCB control board and connected via the M13-SMA RF interface. The 4G signal is transmitted to the K11-4G module via the L12 matching circuit. The K11-4G module communicates with the J10-SIM card to achieve internet access. The LoRa signal is transmitted to the G7-Lora module. The K11-4G module and the G7-Lora module communicate with the H8-main control chip via the UART serial port. When connected to an external device via the A1-M86 waterproof terminal, the composite antenna PCB control board obtains power and data through the A1-M86 waterproof terminal. The power is converted to the required 5V power for each module via the I9-24V to 5V output power module. The communication signal is converted to UART serial port data that the H8-main control chip can recognize via the B2-485 communication module for communication.

[0056] In addition, the control board also has a C3 temperature and humidity sensor, which can monitor the temperature and humidity changes inside the antenna housing in real time, and implement overheat protection and over-humidity alarm functions through software to ensure service life.

[0057] Example 2: The 4G / LoRa dual-band transceiver of this embodiment includes a composite antenna and a composite antenna PCB control board, which is the same as in Example 1. The difference is that in this embodiment, the composite antenna and the composite antenna PCB control board are fabricated together on a single PCB board, and the frequency division circuit is still integrated into the composite antenna PCB board. Figure 6 As shown, in this embodiment, the PCB board integrates the functions of antenna, gateway, control, and drive. Since the antenna and control board are combined into one PCB board, the connectors or interfaces between the antenna and control board can be replaced with printed circuits. This reduces the number of connection interfaces or connectors between the composite antenna and the composite antenna PCB control board, improves the reliability and stability of the dual-band transceiver system, increases the 4G / LoRa switching speed, reduces the hardware size of the transceiver system, and lowers the production, installation, and usage costs. A comparison of this embodiment with the split design of Embodiment 1 is shown in Table 1.

[0058] Table 1

[0059]

[0060] This implementation uses an M8 aviation socket to connect to the 485 module, and then connects the 4G module and LoRa module through the 485 module. Finally, the 4G module and LoRa module are each connected to the transmitting antenna.

[0061] This embodiment integrates the antenna, gateway, control, and drive functions by fabricating the composite antenna and its PCB control board on a single PCB. This significantly reduces hardware size and production costs, while also improving system reliability and stability, accelerating 4G / LoRa switching, and simplifying installation and usage. This integrated design is particularly suitable for pump communication scenarios with strict space requirements, cost sensitivity, and high communication quality requirements, such as complex environments with high pressure, high humidity, and metal interference in underground wells, or pump communication needs in remote areas with unstable signals. Through optimized design, this embodiment achieves higher performance and broader application potential while maintaining the original functionality.

[0062] In summary, this utility model adopts an integrated solution of a composite antenna unit and a composite antenna PCB control board unit, integrating the two independent antennas in the traditional solution into a single composite antenna unit; the signal is divided into two output ports by an onboard frequency divider circuit, avoiding the need for additional filters and isolation circuits in the traditional solution, and meeting the miniaturization, low power consumption, and low cost requirements of underwater pump body wireless communication integration of 4G signal and LoRa signal processing, reception and transmission.

[0063] It should be emphasized that the above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model in any way. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A composite antenna 4G / LoRa dual-band transceiver system for a pump body, characterized in that, include: Composite antenna, frequency divider circuit, and composite antenna PCB control board; the composite antenna is used as the main radiating unit of the 4G band and the main radiating unit of the LoRa band, the frequency divider circuit is used to electrically connect the composite antenna to the composite antenna PCB control board through an SMA RF connector, and the composite antenna PCB control board is used to schedule the working modes of the 4G module and the LoRa module through the main control chip to achieve coordinated processing of 4G signals and LoRa signals.

2. The composite antenna 4G / LoRa dual-band transceiver system for a pump body according to claim 1, characterized in that, The composite antenna is a PCB antenna, which includes: a top antenna layer, a second antenna layer, a third antenna layer, and a bottom antenna layer. The top layer of the antenna is provided with the main radiating element of the 4G frequency band, and the outer grounding part of the top layer of the antenna is electrically connected to the bottom layer of the antenna through a via. The second layer of the antenna is set as an isolation layer, which is used to isolate the mutual interference between 4G signals and LoRa signals through a metal shielding layer; The third layer of the antenna is provided with the main radiating element of the LoRa band, and the outer grounding part of the third layer of the antenna is electrically connected to the bottom layer of the antenna through a via; The bottom layer of the antenna is set as a ground layer, which is used to provide a stable reference potential and enhance the radiation efficiency of the antenna; the bottom layer of the antenna is electrically connected to the metal shielding layer of the second layer of the antenna.

3. The composite antenna 4G / LoRa dual-band transceiver system for a pump body according to claim 2, characterized in that, The frequency divider circuit is integrated into the bottom layer of the antenna, and the frequency divider circuit includes a bandpass filter and a coupler.

4. The composite antenna 4G / LoRa dual-band transceiver system for a pump body according to claim 1, characterized in that, The composite antenna PCB control board is equipped with the main control chip, which is used to communicate with the 4G module and the LoRa module through the UART interface; the main control chip is used to control the 4G module and the LoRa module to be in standby mode or intelligently switch between them at the same time; the main control chip is also used to provide power supply, overvoltage protection and overcurrent protection for each module.

5. A composite antenna 4G / LoRa dual-band transceiver system for a pump body according to claim 4, characterized in that, The composite antenna PCB control board includes: a top layer, a second layer, a third layer, and a bottom layer. The composite antenna PCB control board physically isolates the main control chip, 4G module, LoRa module, and power signal through four PCB layers.

6. A composite antenna 4G / LoRa dual-band transceiver system for a pump body according to claim 4, characterized in that, The composite antenna PCB control board is electrically connected to a waterproof terminal, which is electrically connected to a control box, control cabinet, or controlled equipment.

7. A composite antenna 4G / LoRa dual-band transceiver system for a pump body according to claim 1, characterized in that, The main control chip uses an ARM Cortex-M3 processor, the 4G module uses an EC801E module, and the LoRa module uses a Semtech SX1278 chip.

8. A composite antenna 4G / LoRa dual-band transceiver system for a pump body according to claim 1, characterized in that, The electrical connection method of the composite antenna, frequency division circuit, and composite antenna PCB control board includes: the composite antenna is wirelessly connected to the 4G base station and the LoRa signal source; the composite antenna is electrically connected to the frequency division circuit; and the 4G signal and LoRa signal of the frequency division circuit are respectively connected to the composite antenna PCB control board through radio frequency interfaces.

9. A composite antenna 4G / LoRa dual-band transceiver system for a pump body according to claim 1, characterized in that, The composite antenna, frequency division circuit, and composite antenna PCB control board are all covered with a sealed shell, and the composite antenna PCB control board is equipped with a temperature and humidity sensor.

10. A composite antenna 4G / LoRa dual-band transceiver system for a pump body according to claim 1, characterized in that, The composite antenna and the composite antenna PCB control board are integrated and manufactured on the same PCB board.