Electronic device

Abstract

The application discloses an electronic device, and relates to the field of electronic products. The electronic device comprises a decoration piece, a support and a first conductive piece; the support is arranged on one side of the decoration piece; the first conductive piece comprises a first connecting part and a second connecting part which are opposite to each other; the first conductive piece is arranged between the decoration piece and the support, the first connecting part is connected to the side of the decoration piece which faces the support, and the second connecting part is connected to the side of the support which faces the decoration piece. The application can solve the problems of complex assembly, high cost and large space occupation of the grounding structure.

Description

Technical Field

[0001] This application belongs to the technical field of electronic products, specifically relating to an electronic device. Background Technology

[0002] Currently, some electronic devices (such as mobile phones) use horizontally arranged camera modules. However, this layout occupies a significant amount of horizontal space, especially the rear camera surround. To improve the appearance and reliability of the surround, it is often made of metal. However, the rear camera surround is relatively close to the antenna at the top of the phone, requiring careful electrical connection design to avoid affecting antenna performance and causing electrostatic discharge (ESD) problems.

[0003] In related technologies, the decorative ring is grounded through multiple adapters. However, this grounding method involves many structural components, leading to problems such as complex assembly, high cost, and large space occupation. Utility Model Content

[0004] The purpose of this application is to provide an electronic device that can solve the problems of complex assembly, high cost, and large space occupation of grounding structure components.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows: This application provides an electronic device, including: a decorative element, a bracket, and a first conductive element; The bracket is disposed on one side of the decorative component; The first conductive element includes a first connecting portion and a second connecting portion that are opposite to each other; The first conductive element is disposed between the decorative element and the bracket, and the first connecting portion is connected to the side of the decorative element facing the bracket, and the second connecting portion is connected to the side of the bracket facing the decorative element.

[0006] In this embodiment, the decorative element and the bracket can be electrically connected through the first conductive element to achieve good grounding of the decorative element, which helps to reduce the interference of the decorative element on the antenna performance and ensure the good performance of the antenna. Furthermore, the first conductive element in this embodiment is an integrated conductive element. Compared with the method of multiple conductive elements connected in series to achieve signal transmission, the first conductive element in this embodiment is smaller in size, reducing its space occupation in the electronic device. Moreover, the structure of the first conductive element is simpler, avoiding the complex interconnection of multiple conductive elements, making the arrangement of the first conductive element more flexible. In addition, due to its simple structure and convenient installation, it helps to reduce manufacturing and installation costs. Attached Figure Description

[0007] Figure 1This is a partial schematic diagram of an electronic device employing a first conductive element of the first form disclosed in an embodiment of this application; Figure 2 This is a cross-sectional view of an electronic device employing a first conductive element of the first form disclosed in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the first conductive element in the first form disclosed in the embodiments of this application; Figure 4 This is a partial schematic diagram of an electronic device employing a second type of first conductive element as disclosed in an embodiment of this application; Figure 5 This is a cross-sectional view of an electronic device employing a first conductive element of a second form and a second conductive element of a first form, as disclosed in an embodiment of this application. Figure 6 This is a cross-sectional view of an electronic device employing a first conductive element of a second form and a second conductive element of a second form, as disclosed in an embodiment of this application. Figure 7 This is a schematic diagram of the structure of the first conductive element in the second form disclosed in the embodiments of this application; Figure 8 This is a partial schematic diagram of an electronic device employing a third type of first conductive element as disclosed in an embodiment of this application; Figure 9 This is a cross-sectional view of an electronic device employing a third type of first conductive element and a first type of second conductive element as disclosed in an embodiment of this application. Figure 10 This is a cross-sectional view of an electronic device employing a first conductive element of a third form and a second conductive element of a second form, as disclosed in an embodiment of this application. Figure 11 This is a schematic diagram of the structure of the third form of the first conductive element disclosed in the embodiments of this application.

[0008] Explanation of reference numerals in the attached figures: 10-Shell; 11-Through hole; 20-Decorative parts; 30-Staff; 40-First conductive element; 41-First connecting segment; 42-Second connecting segment; 43-First inclined segment; 44-Gold plating layer; 45-Third connecting segment; 46-Second inclined segment; 47-Concave segment; 471-Fourth connecting segment; 472-Fifth connecting segment; 473-Sixth connecting segment; 48-Gold finger; 49-Solder joint; 50 - Second conductive element; 60 - First conductive foam; 70-Double-sided tape. Detailed Implementation

[0009] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0010] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0011] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0012] refer to Figures 1 to 11 This application discloses an electronic device, which can be a mobile phone, tablet computer, e-book, wearable device, etc. The disclosed electronic device includes a decorative part 20, a bracket 30 and a first conductive part 40.

[0013] The electronic device may include a camera module, and a decorative element 20 may be provided around the camera module. This serves both a protective function for the camera module and a decorative function to improve the appearance of the electronic device. Optionally, the decorative element 20 may be provided on the back cover of the electronic device. In this case, the decorative element 20 can provide both protection and decoration for the rear camera module of the electronic device.

[0014] The bracket 30 is a load-bearing component that provides a support and mounting base for the motherboard of an electronic device. In some embodiments, components such as the motherboard can be mounted to the bracket 30 to ensure the stability of the mounting. Therefore, the bracket 30 can also be referred to as a motherboard bracket.

[0015] In addition, the bracket 30 can be grounded to ground the interference signal and reduce the adverse effects of the interference signal on the normal operation of the electronic equipment.

[0016] In some embodiments, the bracket 30 is disposed on one side of the decorative element 20. Alternatively, the decorative element 20 may be disposed on the back cover of the electronic device housing 10, and the bracket 30 may be disposed inside the electronic device housing 10.

[0017] Considering that some decorative parts 20 are metal components and that the decorative parts 20 are close to the antenna of electronic devices, the decorative parts 20 may interfere with the antenna signal, affect the antenna performance, and easily cause problems such as electrostatic discharge (ESD).

[0018] Based on the above, in this embodiment of the application, the decorative element 20 and the bracket 30 can be connected in series by the first conductive element 40 so that the decorative element 20 and the bracket 30 can be connected and grounded, thereby reducing the adverse effect of the first conductive element 40 on the antenna performance.

[0019] The first conductive element 40 may include a first connecting part and a second connecting part disposed opposite to each other. The first connecting part is connected to the side of the decorative element 20 facing the bracket 30, and the second connecting part is connected to the side of the bracket 30 facing the decorative element 20.

[0020] It is understandable that the first direction can be the thickness direction of the electronic device.

[0021] Optionally, the first conductive element 40 can be a sheet-like structure, a block-like structure, a strip-like structure, etc., as long as it can achieve a stable connection between the decorative element 20 and the bracket 30, and the specific form is not limited.

[0022] Based on the above settings, in this embodiment, the decorative element 20 and the bracket 30 can be electrically connected through the first conductive element 40 to achieve good grounding of the decorative element 20, which helps to reduce the interference of the decorative element 20 on the antenna performance and ensure the good performance of the antenna. Furthermore, the first conductive element 40 in this embodiment is an integrated conductive element. Compared with the method of multiple conductive elements connected in series to achieve signal transmission, the first conductive element 40 in this embodiment is smaller in size, reducing its space occupation in the electronic device. Moreover, the structure of the first conductive element 40 is simpler, avoiding the complex docking of multiple conductive elements, making the arrangement of the first conductive element 40 more flexible. In addition, due to its simple structure and convenient installation, it helps to reduce manufacturing and installation costs.

[0023] refer to Figures 8 to 11 In some embodiments, the first conductive element 40 of the first form may include a first connecting segment 41, a second connecting segment 42, and a first inclined segment 43. The first connecting segment 41 and the second connecting segment 42 are spaced apart along a first direction, and the first inclined segment 43 connects the first connecting segment 41 and the second connecting segment 42.

[0024] Furthermore, the first connecting part is located on the side of the first connecting segment 41 facing the decorative element 20, and the second connecting part is located on the side of the second connecting segment 42 facing the bracket 30, so that the first connecting segment 41 is connected to the decorative element 20 through the first connecting part, and the second connecting segment 42 is connected to the bracket 30 through the second connecting part. In this way, the decorative element 20 and the bracket 30 can be electrically connected together through the first conductive element 40, so that the decorative element 20 and the bracket 30 can transmit signals through the first conductive element 40, so as to ground the decorative element 20 and reduce interference to the antenna performance.

[0025] Optionally, the connection points of the decorative element 20 and the bracket 30 are staggered in the width or length direction of the electronic device, and spaced apart in the thickness direction of the electronic device. To achieve a stable connection between the decorative element 20 and the bracket 30, the projections of the first connecting segment 41 and the second connecting segment 42 in a first plane can be staggered, wherein the first plane is perpendicular to the first direction. Based on this, the position of the first connecting part can be adapted to the decorative element 20, and the position of the second connecting part can be adapted to the bracket 30, thereby ensuring a stable connection between the decorative element 20 and the bracket 30 through the first conductive element 40, guaranteeing smooth signal transmission, and helping to reduce the interference of the decorative element 20 on the antenna performance.

[0026] Optionally, the first connecting segment 41, the second connecting segment 42, and the first inclined segment 43 can all be sheet-like or plate-like structures, so that when the three are connected, they can form a Z-shaped conductive structure.

[0027] refer to Figures 1 to 3 In other embodiments, the second type of first conductive element 40 may include a third connecting segment 45, a second inclined segment 46, and a concave segment 47. The second inclined segment 46 connects the third connecting segment 45 and the concave segment 47, and the third connecting segment 45 can be connected to the decorative element 20 via a first connecting portion, while the concave segment 47 can be connected to the bracket 30 via a second connecting portion, thereby achieving a stable connection between the decorative element 20 and the bracket 30.

[0028] The concave segment 47 may include a fourth connecting segment 471, a fifth connecting segment 472, and a sixth connecting segment 473, with the sixth connecting segment 473 connecting between the fifth connecting segment 472 and the sixth connecting segment 473. Along a first direction, the fourth connecting segment 471 and the fifth connecting segment 472 are spaced apart, and at least a portion of the fourth connecting segment 471 is positioned opposite to the fifth connecting segment 472. Therefore, the fourth connecting segment 471, the sixth connecting segment 473, and the fifth connecting segment 472 are concave to form the concave segment 47.

[0029] For example, the fourth connecting segment 471 and the fifth connecting segment 472 are arranged parallel to each other along the first direction, and the sixth connecting segment 473 is perpendicular to the fourth connecting segment 471 and the fifth connecting segment 472 respectively.

[0030] In addition, along the first direction, the third connecting segment 45, the fourth connecting segment 471 and the fifth connecting segment 472 are respectively spaced apart, and the second inclined segment 46 is connected between the third connecting segment 45 and the fourth connecting segment 471 to connect the third connecting segment 45 and the concave segment 47 together. In this way, the third connecting segment 45, the fourth connecting segment 471, the sixth connecting segment 473 and the fifth connecting segment 472 can be connected in sequence to form a P-type conductive structure.

[0031] The first connecting portion is located on the side of the third connecting segment 45 facing the decorative element 20, allowing the third connecting segment 45 to be connected to the decorative element 20 via the first connecting portion; the second connecting portion is located on the side of the fifth connecting segment 472 facing the bracket 30, allowing the fifth connecting segment 472 to be connected to the bracket 30 via the second connecting portion. Based on this, a stable connection can be achieved between the decorative element 20 and the bracket 30 using the second type of first conductive element 40.

[0032] refer to Figure 3 In some embodiments, the electronic device may further include a first conductive foam 60, which is filled between the fourth connecting segment 471 and the fifth connecting segment 472. In this way, the first conductive foam 60 can improve the conductivity between the fourth connecting segment 471 and the fifth connecting segment 472, and can also play a supporting role between the fourth connecting segment 471 and the fifth connecting segment 472 to ensure the stable connection of the first conductive element 40 between the decorative element 20 and the bracket 30.

[0033] In some embodiments, the first conductive element 40 can be a spring sheet structure, which can generate elastic force so that the first connecting part elastically abuts against the decorative element 20 and the second connecting part elastically abuts against the bracket 30, thereby ensuring the reliability and stability of the connection between the first conductive element 40 and the decorative element 20 and the bracket 30 respectively.

[0034] For example, the first conductive element 40 can be a steel sheet.

[0035] refer to Figures 4 to 7 In other embodiments, the first conductive element 40 can be a flexible conductive element, so that the first conductive element 40 can adapt to the complex arrangement between the decorative element 20 and the bracket 30, which helps to reduce the installation difficulty of the first conductive element 40 and improve the applicability of the first conductive element 40.

[0036] For example, the first conductive element 40 can be a flexible circuit board, i.e., an FPC.

[0037] refer to Figure 5 , Figure 6 , Figure 9 and Figure 10 In some embodiments, the electronic device may further include a second conductive element 50 disposed on the bracket 30, and the first conductive element 40 elastically abutting against the second conductive element 50 through a second connecting portion. Based on this, a stable connection between the decorative element 20 and the bracket 30 can be achieved through the cooperative action of the first conductive element 40 and the second conductive element 50.

[0038] Optionally, the second conductive element 50 and the bracket 30 can be integrated, or the second conductive element 50 can be fixed to the bracket 30 to ensure stable signal transmission between the second conductive element 50 and the bracket 30, thereby achieving good grounding of the decorative element 20.

[0039] In some more specific embodiments, the second conductive element 50 can be a spring sheet or a second conductive foam, thus ensuring stable contact between the first conductive element 40 and the second conductive element 50, as well as stable contact between the second conductive element 50 and the bracket 30.

[0040] In some embodiments, the electronic device may further include a housing 10 and a connector. The housing 10 can serve as a base component, providing a mounting base and space for components such as the decorative element 20 and the bracket 30. The decorative element 20 is disposed on the back cover of the housing 10, and the bracket 30 is disposed inside the housing 10. Optionally, the back of the housing 10 is the back cover, which has a through hole 11. The decorative element 20 can be disposed on the back cover to provide protection and decoration for the camera module located on the back cover.

[0041] The first conductive element 40 may further include a third connecting portion, which is disposed facing the housing 10 and is disposed opposite to the second connecting portion on the first conductive element 40; and a connector is disposed between the third connecting portion and the housing 10, and the third connecting portion is connected to the housing 10 through the connector.

[0042] Based on the above configuration, the first conductive element 40 can be fixed to the housing 10 using connectors to ensure the installation stability of the first conductive element 40.

[0043] For example, the connector can be double-sided adhesive 70.

[0044] In the first embodiment, the first conductive element 40 and the first conductive foam 60 can form a P-type laser-welded conductive foam structure, such as... Figures 1 to 3As shown. The first conductive element 40 can be a conductive copper foil, which can be formed by laser welding and surface gold plating to form a gold plating layer 44; the first conductive foam 60 fills the concave space of the first conductive element 40; in addition, the outer surface of the first conductive element 40 can also be provided with double-sided adhesive 70.

[0045] like Figure 3 As shown, the P-type laser-welded conductive foam structure can be divided into two areas: the laser welding area and the elastomer conductive area. The laser welding area can have multiple weld points 49, which are used to weld the first conductive element 40 to the decorative ring (specifically, a metal component of the decorative ring) to achieve reliable conductivity. The number of weld points 49 can be determined based on the width of the first conductive foam 60 and the decorative ring boss.

[0046] The elastomer conductive area can provide a certain rebound force through the first conductive foam 60, so that the first conductive element 40 and the main board form an interference fit, thereby ensuring reliable contact between the first conductive element 40 and the bracket 30 and guaranteeing the reliability of grounding. In addition, the length of the elastomer conductive area can be adjusted to accommodate the requirements of lateral grounding width.

[0047] The third connecting part of the first conductive component 40 is provided with double-sided adhesive 70, which is used to bond the third connecting part to the welding before welding, so as to achieve pre-welding positioning and subsequent bonding and fixing.

[0048] To further improve the reliability of the electrical connection, the first conductive element 40 can be gold-plated on one side, that is, a gold-plated layer 44 is formed at the first connection part; in addition, a gold-plated layer 44 can also be formed in a local area of ​​the second connection part, thereby minimizing the grounding cost while meeting the reliability of the electrical connection.

[0049] In the above-mentioned P-type laser-welded conductive foam structure, the charge flow path of the decorative part 20 is as follows: Figure 2 As indicated by the arrow, the charge of the decorative element 20 is transferred to the bracket 30 via the P-type laser-welded conductive foam structure to reduce the interference of the decorative element 20 to the antenna and ESD problems.

[0050] In the second embodiment, the first conductive element 40 can be an ultrasonically welded FPC structure, such as... Figures 4 to 7As shown in the diagram, double-sided adhesive tape 70 is applied to the bottom surface of both ends of the FPC for bonding and fixation. Additionally, one end of the FPC is fixed and connected to the decorative component 20 via ultrasonic welding using 3×3 ultrasonic welding points 49 (the number and type of welding points 49 can be adjusted as needed); the other end of the FPC is designed with gold fingers 48 (partial copper exposure or surface gold plating), which are electrically connected to the bracket 30. The length and width of the FPC can be flexibly adjusted according to requirements, adapting well to horizontal structural stacking layouts. Furthermore, the FPC can be bent and extended arbitrarily, better adapting to complex and tight stacking spaces and increasing the flexibility of the design scheme.

[0051] In this embodiment, the super-welded FPC is first attached to the decorative part 20 and pre-bonded by the double-sided adhesive 70 at the bottom of both ends of the FPC; then, the end of the FPC connected to the decorative ring is fixed and connected by ultrasonic welding; the gold finger 48 at the other end of the FPC is made to contact and connect with the welding spring (i.e., the second conductive part 50) on the bracket 30, thereby realizing the grounding of the decorative part 20.

[0052] In the above-mentioned ultrasonically welded FPC structure, the charge flow path of the decorative part 20 is as follows: Figure 5 and Figure 6 As indicated by the arrow, the charge of the decorative element 20 is transferred to the bracket 30 via the ultrasonically welded FPC structure to reduce the interference of the decorative element 20 to the antenna and ESD problems.

[0053] In the third embodiment, the first conductive element 40 can be a Z-shaped laser welding structure, such as... Figures 8 to 11 As shown, double-sided adhesive tape 70 is attached to the bottom of one end of the first conductive component 40 for bonding and fixing it to the decorative component 20. Multiple rows of solder points 49 (the number and form can be adjusted as needed) are provided at the other end of the first conductive component 40 to fix and conduct electricity to the decorative component 20 via laser welding. Additionally, a flat surface is designed at the other end of the first conductive component 40, which can be partially gold-plated to improve the reliability of the electrical connection. This surface and the bracket 30 can be electrically connected via a second conductive component 50. Furthermore, the design parameters such as the length, width, and angle of the Z-shaped laser welding structure can be flexibly adjusted as needed, allowing for excellent adaptation to horizontal structural stacking layouts.

[0054] In this embodiment, the Z-shaped laser-welded structure is first attached to the decorative ring, pre-bonded by double-sided adhesive 70 at one end. Then, one end of the Z-shaped laser-welded structure is fixed and connected to the decorative ring via laser welding, while the other end of the Z-shaped laser-welded structure contacts and connects to the second conductive element 50 on the bracket 30, thus achieving grounding of the decorative ring. The entire electrical connection scheme employs two laser welds and one hard connection, resulting in better overall electrical connection reliability.

[0055] In the aforementioned Z-shaped laser welding structure, the charge flow path of the decorative part 20 is as follows: Figure 9 and Figure 10 As indicated by the arrow, the charge of the decorative element 20 is transferred to the bracket 30 via the Z-shaped laser welding structure to reduce the interference of the decorative element 20 to the antenna and ESD problems.

[0056] It should be noted that in ultrasonic welding FPC structures and Z-type laser welding structures, the second conductive element 50 can be a welding spring or a second conductive foam. Both welding springs and second conductive foams can achieve an interference fit between the first conductive element 40 and the bracket 30, thereby achieving stable contact and conductivity.

[0057] When using a second conductive foam, by adjusting the thickness of the second conductive foam and the stiffness of the core, sufficient contact force between the second conductive foam and the two contacting objects is ensured to guarantee reliable conductivity. This electrical connection method can reduce welding processes and costs, and prevent the spring contacts from being damaged during transportation.

[0058] In summary, this application proposes three electrical connection schemes to address the issue of electrical connection methods for horizontally arranged decorative rings for large cameras in related technologies: The first implementation method is to design a P-type laser-welded conductive foam structure, one end of which is directly welded to the decorative part 20, and the other end is interference-fitted with the bracket 30, with the first conductive foam 60 serving as the electrical connection medium.

[0059] The second implementation method is to design an ultrasonically welded FPC structure, which fixes and connects one end to the decorative part 20 through ultrasonic welding, and designs a gold finger 48 at the other end, which is connected to the bracket 30 through the second conductive part 50.

[0060] The third implementation method is to design a Z-shaped laser welding structure, one end of which is fixed and connected to the decorative part 20 by laser welding, and the other end is connected to the bracket 30 by the second conductive part 50.

[0061] The electrical connection method in this application has the following technical advantages: The electrical connection schemes are simple, involve fewer structural components, have relatively simple production processes, and lower material and assembly costs; they occupy less space and offer more flexible lateral layouts; the three electrical connection schemes avoid the interlocking and overlapping of steel sheets, making the contact more reliable and improving the stability and consistency of the electrical connection; the first conductive component 40 is fixed and connected to the decorative component 20 by welding, making the overall conductivity more reliable; the three electrical connection schemes significantly reduce the overlap interface, reducing or even avoiding problems such as PIM and RSE caused by the overlap interface; the structure and dimensions of the three electrical connection schemes can be freely adjusted as needed, which helps to improve the flexibility of the grounding point layout.

[0062] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: Decorative components, brackets, and the first conductive component; The bracket is disposed on one side of the decorative piece; The first conductive element includes a first connecting portion and a second connecting portion that are opposite to each other; The first conductive element is disposed between the decorative element and the bracket, and the first connecting portion is connected to the side of the decorative element facing the bracket, and the second connecting portion is connected to the side of the bracket facing the decorative element.

2. The electronic device according to claim 1, characterized in that, The first conductive element includes a first connecting segment, a second connecting segment, and a first inclined segment; Along a first direction, the first connecting segment and the second connecting segment are spaced apart, and the first inclined segment connects between the first connecting segment and the second connecting segment; The first connecting portion is located on the side of the first connecting segment facing the decorative piece, and the second connecting portion is located on the side of the second connecting segment facing the bracket; The first connecting segment is connected to the decorative piece via the first connecting part, and the second connecting segment is connected to the bracket via the second connecting part.

3. The electronic device according to claim 2, characterized in that, The projections of the first connecting segment and the second connecting segment in a first plane are staggered, wherein the first plane is perpendicular to the first direction.

4. The electronic device according to claim 1, characterized in that, The first conductive element includes a third connecting segment, a second inclined segment, and a concave segment; The concave segment includes a fourth connecting segment, a fifth connecting segment, and a sixth connecting segment connecting the fourth connecting segment and the fifth connecting segment; The second inclined segment connects the third connecting segment and the fourth connecting segment; The first connecting portion is located on the side of the third connecting segment facing the decorative piece, and the second connecting portion is located on the side of the fifth connecting segment facing the bracket; The third connecting segment is connected to the decorative piece via the first connecting part, and the fifth connecting segment is connected to the bracket via the second connecting part; Along the first direction, the third connecting segment, the fourth connecting segment, and the fifth connecting segment are respectively spaced apart, and at least a portion of the fourth connecting segment is arranged opposite to the fifth connecting segment.

5. The electronic device according to claim 4, characterized in that, The electronic device further includes a first conductive foam, which is filled between the fourth connecting segment and the fifth connecting segment.

6. The electronic device according to claim 1, characterized in that, The first conductive element is a spring-loaded structure.

7. The electronic device according to claim 1, characterized in that, The first conductive element is a flexible conductive element.

8. The electronic device according to claim 1, characterized in that, The electronic device further includes a second conductive element, which is disposed on the bracket; The first conductive element is elastically abutted against the second conductive element through the second connecting portion.

9. The electronic device according to claim 8, characterized in that, The second conductive element is a spring sheet or a second conductive foam.

10. The electronic device according to claim 1, characterized in that, The electronic device further includes a housing and a connector. The decorative component is disposed on the housing. The first conductive component further includes a third connecting portion. The third connecting portion is disposed facing the housing. The connector is disposed between the third connecting portion and the housing. The third connecting portion is connected to the housing through the connector. The third connecting portion and the second connecting portion are disposed opposite to each other on the first conductive component.

Images