A heat equalization damping ground integrated camera built-in module

Abstract

The utility model discloses a kind of heat soaking shock absorption integrated camera built-in module, including built-in module, the uppermost layer of built-in module and middle part are provided with buffer layer, and are bonded by adhesive layer, built-in module bottom layer is provided with polyester silicon oil film, by silver-plated conductive fiber adhesive tape and high-conductivity metal foil bonding, the high-conductivity metal foil is bonded with middle part buffer layer.The utility model can better dissipate heat generated when product is used in the use process of 3C electronic product, especially mobile phone, tablet computer, game machine, so that product use is more smooth;It can reduce the vibration damage caused to lens module when falling to ground, and eliminate the abnormal sound interference of electromagnetic wave to earpiece, so that the tone quality effect when man-machine conversation is more soft, clear, realistic.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and in particular to a heat-equalizing, vibration-damping, grounded integrated camera module. Background Technology

[0002] With the growing consumer preference for miniaturized and lightweight 3C electronic products, the demand for functional integration and low cost in electronic products is increasing. The need to achieve diverse functions within limited local space, while also reducing manual processing costs, is driving the market for electronic product components towards multi-functional integration and miniaturization. This product is designed to solve the problem of multi-functional integration in the heat dissipation grounding of electronic product lens modules. Utility Model Content

[0003] To address the aforementioned technical issues, a heat-equalizing, vibration-damping, and grounded integrated camera module is provided.

[0004] To achieve the above objectives, in a preferred embodiment of the present invention, the module includes a built-in module, wherein the uppermost and middle layers of the built-in module are provided with buffer layers and are bonded together by adhesive layers, and the bottom layer of the built-in module is provided with a polyester silicone oil film and is bonded to a highly conductive metal foil by silver-plated conductive fiber tape, wherein the highly conductive metal foil is bonded to the middle buffer layer.

[0005] In a preferred embodiment, the present invention may be further configured such that the uppermost buffer layer is a high molecular weight polyurethane buffer and the middle buffer layer is a polyimide foam.

[0006] In a preferred embodiment, the present invention may be further configured such that the thickness of the polymer polyurethane buffer is 145-155 μm.

[0007] In a preferred embodiment, the polyimide foam of this invention may be further configured such that the thickness is 3.5-4.5 μm.

[0008] In a preferred embodiment, the present invention may be further configured such that the adhesive layer comprises a polyester tape layer one and a polyester tape layer two, each with a thickness of 5 μm. The polyester tape layer one is located between the polymer polyurethane buffer and the polyimide foam, and the polyester tape layer two is located between the polyimide foam and the highly conductive metal foil.

[0009] In a preferred embodiment, the present invention may be further configured such that the thickness of the highly conductive metal foil is 1.8-2.2 μm.

[0010] In a preferred embodiment, the present invention may be further configured such that the thickness of the polyester silicone oil film is 48-52 μm.

[0011] Beneficial effects: This utility model's integrated camera module with heat dissipation, vibration reduction, and grounding can better dissipate the heat generated during the use of 3C electronic products, especially mobile phones, tablets, and game consoles, making the product use smoother; it can reduce the vibration damage to the lens module when dropped on the ground, and eliminate electromagnetic interference to the earpiece, making the sound quality of human-computer interaction softer, clearer, and more realistic. Attached Figure Description

[0012] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0013] Figure 1 This is a schematic diagram of the structure of this utility model.

[0014] Figure 2 This is a top view diagram of the built-in module of this utility.

[0015] In the diagram, 1 is the built-in module; 2 is the buffer; 3 is the first layer of polyester tape; 4 is the polyimide foam; 5 is the second layer of polyester tape; 6 is the highly conductive metal foil; 7 is the silver-plated conductive fiber tape; and 8 is the polyester silicone oil film. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] like Figure 1 and Figure 2 As shown, an integrated camera module with heat dissipation, vibration damping, and grounding includes a built-in module 1. The uppermost and middle layers of the built-in module 1 are provided with buffer layers, which are bonded together by adhesive layers. The bottom layer of the built-in module 1 is provided with a polyester silicone oil film 8, which is bonded to a highly conductive metal foil 6 by silver-plated conductive fiber tape 7. The highly conductive metal foil 6 is bonded to the middle buffer layer. The buffer layers reduce damage to the internal module during drops.

[0018] The uppermost buffer layer is a high-molecular-weight polyurethane buffer 2, and the middle buffer layer is a polyimide foam 4. This further enhances the buffering effect.

[0019] The thickness of the polymer polyurethane buffer 2 is 145-155 μm, and the thickness of the polyimide foam 4 is 3.5-4.5 μm, ensuring that the thickness can be accommodated in a small gap.

[0020] The adhesive layer includes a polyester tape layer 3 and a polyester tape layer 5, both with a thickness of 5 μm. The polyester tape layer 3 is located between the high-molecular polyurethane buffer 2 and the polyimide foam 4, and the polyester tape layer 5 is located between the polyimide foam 4 and the highly conductive metal foil 6. The bonding of the polyester tape ensures the strong bond between them.

[0021] The thickness of the highly conductive metal foil 6 is 1.8-2.2 μm.

[0022] The thickness of the polyester silicone oil film 8 is 48-52 μm.

[0023] It should be noted that in this article, relational terms such as first and second are used only to distinguish one entity from another, and do not necessarily require or imply any such actual relationship or order between these entities.

[0024] The above examples are merely illustrative of this utility model and do not constitute a limitation on the scope of protection of this utility model. All designs that are the same as or similar to this utility model are within the scope of protection of this utility model.

Claims

1. A heat-equalizing, vibration-damping, grounded integrated camera module, characterized in that, The built-in module (1) includes a buffer layer at the top and middle, which is bonded by an adhesive layer. The bottom layer of the built-in module (1) is provided with a polyester silicone oil film (8), which is bonded to a high-conductivity metal foil (6) by a silver-plated conductive fiber tape (7). The high-conductivity metal foil (6) is bonded to the middle buffer layer.

2. The integrated camera module with heat dissipation, vibration damping, and grounding as described in claim 1, characterized in that, The uppermost buffer layer is a high molecular weight polyurethane buffer (2), and the middle buffer layer is a polyimide foam (4).

3. The integrated camera module with heat dissipation, vibration damping, and grounding as described in claim 2, characterized in that, The thickness of the polymer polyurethane buffer (2) is 145-155 μm.

4. The integrated camera module with heat dissipation, vibration damping, and grounding as described in claim 3, characterized in that, The polyimide foam (4) has a thickness of 3.5-4.5 μm.

5. The integrated camera module with heat dissipation, vibration damping, and grounding as described in claim 4, characterized in that, The adhesive layer includes a polyester tape layer one (3) and a polyester tape layer two (5) both with a thickness of 5 μm. The polyester tape layer one (3) is located between the polymer polyurethane buffer (2) and the polyimide foam (4), and the polyester tape layer two (5) is located between the polyimide foam (4) and the highly conductive metal foil (6).

6. The integrated camera module with heat dissipation, vibration damping, and grounding as described in claim 5, characterized in that, The thickness of the highly conductive metal foil (6) is 1.8-2.2 μm.

7. The integrated camera module with heat dissipation, vibration damping, and grounding as described in claim 6, characterized in that, The thickness of the polyester silicone oil film (8) is 48-52 μm.

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