Three moving coil wireless earphone

Abstract

The utility model relates to earphone technical field discloses a kind of three moving coil wireless earphones including earphone shell, its inside is provided with mounting cavity, and it includes sound outlet;Moving coil support is set in mounting cavity, and moving coil support includes front side mounting position and rear side mounting position, high-frequency moving coil unit is set in front side mounting position, medium-frequency moving coil unit and low-frequency moving coil unit are set in rear side mounting position, and third moving coil unit is located below second moving coil unit;High-frequency moving coil unit is set in the position closest to sound outlet position shortens the propagation path of high-frequency sound wave, effectively reduces the energy loss caused by its short wavelength, easy to attenuate characteristics;This kind of "low frequency subsidence, high frequency front" layout, combined with the physical separation of moving coil support, effectively cut off the main path of "acoustic feedback" and "airflow disturbance" of low-frequency unit to high-frequency unit, greatly reduce the harmonic distortion and sound dyeing caused by cavity coupling and airflow disturbance.

Description

Technical Field

[0001] This utility model relates to the field of headphone technology, and in particular to a three-dynamic-coil wireless headphone. Background Technology

[0002] As mainstream electroacoustic conversion devices, the sound quality of dynamic headphones largely depends on the performance and structural design of the dynamic driver unit. With users' ever-increasing demands for high-fidelity sound, a single dynamic driver unit can hardly achieve optimal performance across all frequency bands. Therefore, multi-driver headphones, employing multiple dynamic drivers to handle different frequency bands, have emerged, aiming to achieve a wider frequency response, higher resolution, and lower distortion through specialized division of labor among the drivers.

[0003] Among them, the three-dynamic-coil architecture, which uses three independent dynamic drivers specializing in low, mid, and high frequencies respectively, is considered an effective way to achieve high-fidelity reproduction across the entire frequency range. However, integrating the three drivers reasonably into an extremely limited headphone housing and ensuring they work together without interfering with each other has long been a core technical challenge in this field.

[0004] Existing triple-dynamic-driver headphones suffer from numerous inherent flaws in the spatial layout of their drivers, severely limiting their potential for sound quality. Specifically: (1) Disordered or stacked layouts lead to severe phase distortion and acoustic interference: Many existing designs, in order to reduce housing size or simplify structure, simply place three dynamic drivers side-by-side or stacked vertically. This layout ignores the differences in the physical characteristics of sound waves at different frequency bands. Because high-frequency sound waves have short wavelengths, strong directivity, and are easily attenuated, when the high-frequency driver is placed far from the sound outlet, its sound waves need to travel a longer acoustic path or a complex conduit to reach the ear canal. This leads to two main problems: first, high-frequency energy is significantly attenuated during propagation, resulting in a dull sound, lack of detail, and a lack of "airiness"; second, the sound emitted by different drivers reaches the eardrum at different times, causing severe phase distortion, disrupting the spatiotemporal consistency of the sound signal, and ultimately leading to blurred sound field positioning, diffuse imaging, and a significant decrease in sound clarity and layering.

[0005] (2) The blocking and interference of low-frequency unit pre-positioning on mid-to-high frequencies: Some early designs failed to adequately prioritize the acoustic characteristics of the drivers, with some even placing large low-frequency drivers close to the sound outlet. Low-frequency drivers operate with large amplitudes, and the strong sound pressure generated behind them can cause strong "acoustic feedback" and "airflow disturbance" to nearby mid- and high-frequency drivers through the shared cavity or air medium. This not only introduces additional harmonic distortion, resulting in muddy mid-range vocals and hoarse high-range sounds, but also severely encroaches on the most valuable near-ear canal space that should belong to the mid- and high-frequency drivers, thus creating a dilemma for their acoustic design. Utility Model Content

[0006] Based on the above, the purpose of this utility model is to provide a three-dynamic-coil wireless earphone that solves problems such as high-frequency attenuation, phase distortion, and inter-unit interference by arranging the dynamic-coil units.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: This utility model provides a three-dynamic-coil wireless earphone, comprising: The earphone shell has an internal mounting cavity, which includes a sound outlet; A dynamic coil bracket is disposed within the mounting cavity. The dynamic coil bracket includes a front mounting position and a rear mounting position. A high-frequency dynamic coil unit, a mid-frequency dynamic coil unit, and a low-frequency dynamic coil unit are disposed on the dynamic coil bracket. The high-frequency dynamic coil unit is disposed at the front mounting position, which is close to the sound outlet. The mid-frequency dynamic coil unit and the low-frequency dynamic coil unit are disposed at the rear mounting position, with the low-frequency dynamic coil unit located below the mid-frequency dynamic coil unit. A control module is disposed within the mounting cavity, and the control module is electrically connected to the high-frequency moving coil unit, the mid-frequency moving coil unit, and the low-frequency moving coil unit, respectively.

[0008] Preferably, the front mounting position includes a first mounting groove, and the high-frequency moving coil unit is disposed in the first mounting groove.

[0009] Preferably, the rear mounting position includes a second mounting slot and a third mounting slot, the third mounting slot being located below the second mounting slot, the mid-frequency moving coil unit being disposed in the second mounting slot, and the low-frequency moving coil unit being disposed in the third mounting slot.

[0010] Preferably, the earphone housing includes a front cover and a rear cover, the sound outlet is disposed on the front cover, and the front cover is on the side closest to the ear.

[0011] Preferably, a positioning post is also provided on the front mounting position, and a positioning hole is provided on the side of the front cover facing the moving coil bracket.

[0012] Preferably, the front cover is further provided with a positioning cavity on the side facing the moving coil bracket, and the high-frequency moving coil unit is located in the positioning cavity.

[0013] Preferably, the moving coil bracket is provided with a first connecting half hole on its side, and the rear cover is provided with a second connecting hole on the side facing the moving coil bracket. The moving coil bracket can be connected to the rear cover by passing a screw through the first connecting half hole and the second connecting hole.

[0014] Preferably, the control module includes a PCB board, and the rear cover has two opposing slots on the side facing the moving coil bracket, with both sides of the PCB board inserted into the slots.

[0015] Preferably, the control module is located below the moving coil bracket, the bottom of the rear cover has an clearance groove, and the bottom of the PCB board corresponds to the clearance groove.

[0016] Preferably, the PCB board integrates a main control chip, a power module, an audio processing chip, a Bluetooth module, and a charging interface module.

[0017] The beneficial effects of this utility model are as follows: (1) By placing the high-frequency dynamic unit closest to the sound outlet, this utility model shortens the propagation path of high-frequency sound waves, effectively reducing energy loss caused by their short wavelength and easy attenuation characteristics, thereby significantly improving the overall resolution and sound brightness of the headphones.

[0018] (2) Since the high-frequency dynamic driver is closest to the ear, the sound signal it generates can be better aligned in time with the sound from the mid-frequency and low-frequency dynamic drivers that arrive later. This layout with high frequency as the timing reference reduces phase distortion caused by the difference in propagation paths of different frequency bands, making the phase of the sound more consistent, the imaging of the sound clearer and more stable, the sound field positioning more accurate, and the sense of layering and space greatly enhanced.

[0019] (3) In this invention, the low-frequency dynamic coil unit with large amplitude and strong rearward sound pressure during operation is placed at the bottom of the rear mounting position, so that it is physically far away from the high-frequency dynamic coil unit that is easily interfered with. This "low-frequency sinking and high-frequency fronting" layout, combined with the physical separation of the dynamic coil bracket, effectively cuts off the main path of "acoustic feedback" and "airflow disturbance" of the low-frequency unit to the high-frequency unit, and greatly reduces the harmonic distortion and sound coloration introduced by cavity coupling and airflow disturbance.

[0020] (4) By using a dynamic driver bracket to arrange the three units in a three-dimensional manner, layering them front and back and top and bottom, a high-density and rational integration of the three dynamic driver units is achieved within the extremely limited earphone shell. This layout not only solves the acoustic problems caused by unit stacking, but also effectively controls the overall size of the earphone and ensures wearing comfort.

[0021] (5) The precise fit between the positioning post on the front mounting position and the positioning hole on the front cover ensures that the relative position between the high-frequency dynamic driver unit and the sound outlet remains accurate. At the same time, the screw locking structure between the first connecting half hole on the side of the dynamic driver bracket and the second connecting hole on the rear cover, as well as the board groove on the rear cover for fixing the PCB board, achieves a stable connection of the entire internal structure of the earphone. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0023] Figure 1 A schematic diagram of the structure of a three-dynamic-coil wireless earphone provided in an embodiment of this utility model; Figure 2 A cross-sectional structural schematic diagram of a three-dynamic-coil wireless earphone provided for an embodiment of this utility model; Figure 3 An exploded view of a three-dynamic-coil wireless earphone provided for an embodiment of this utility model; Figure 4 This is a schematic diagram of the structure of the moving coil support provided in an embodiment of the present utility model; Figure 5 This is a structural schematic diagram of the moving coil bracket provided in an embodiment of the present utility model from another perspective; Figure 6 A schematic diagram of the structure of the front cover provided in an embodiment of this utility model; Figure 7 This is a schematic diagram of the structure of the back cover provided in an embodiment of the present utility model.

[0024] In the picture: 1. Earphone shell; 11. Mounting cavity; 12. Front cover; 121. Sound outlet; 122. Positioning hole; 123. Positioning cavity; 13. Rear cover; 131. Plate groove; 132. Clearance groove; 133. Second connecting hole; 2. Dynamic driver bracket; 21. Front mounting position; 211. First mounting groove; 212. Positioning post; 22. Rear mounting position; 221. Second mounting groove; 222. Third mounting groove; 23. First connecting half hole; 3. High-frequency dynamic driver unit; 4. Mid-frequency dynamic driver unit; 5. Low-frequency dynamic driver unit; 6. Control module. Detailed Implementation

[0025] To make the technical problems solved by this utility model, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0026] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0028] In the description of this embodiment, the terms "upper," "lower," "left," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0029] like Figures 1 to 7 As shown, this utility model provides a three-dynamic-driver wireless earphone, including: an earphone shell 1, which has an internal mounting cavity 11. The earphone shell 1 includes a front cover 12 and a rear cover 13. The front cover 12 is the side closest to the ear, and the shape of the side of the front cover 12 closest to the ear is ergonomically designed. The front cover 12 and the rear cover 13 can be connected by welding, gluing, or other methods. It includes a sound outlet 121, which is disposed on the front cover 12; a dynamic driver bracket 2, disposed in the mounting cavity 11. The dynamic driver bracket 2 includes a front mounting position 21 and a rear mounting position 22. The dynamic driver bracket 2 is provided with a high-frequency dynamic driver unit 3, a mid-frequency dynamic driver unit 4, and a low-frequency dynamic driver unit 5. Typically, the frequency band of the high-frequency dynamic driver unit 3 is from 4kHz to 20kHz, and the frequency band of the mid-frequency dynamic driver unit 4 is from 30kHz to 40kHz. The frequency range of the low-frequency dynamic unit 5 is 20Hz to 300Hz, while the frequency range of the high-frequency dynamic unit 3 is located at the front mounting position 21, which is close to the sound outlet 121. The mid-frequency dynamic unit 4 and the low-frequency dynamic unit 5 are located at the rear mounting position 22, with the low-frequency dynamic unit positioned below the mid-frequency dynamic unit. A control module 6 is located within the mounting cavity 11. Preferably, the control module 6 includes a PCB board, on which a main control chip, a power module, an audio processing chip, a Bluetooth module, and a charging interface module are integrated. The principle of headphone control is existing technology and will not be elaborated here. The control module 6 is electrically connected to the high-frequency dynamic unit 3, the mid-frequency dynamic unit 4, and the low-frequency dynamic unit 5, respectively.

[0030] In this embodiment, by placing the high-frequency dynamic driver unit 3 closest to the sound outlet 121, the propagation path of high-frequency sound waves is shortened, effectively reducing energy loss caused by their short wavelength and easy attenuation characteristics, thereby significantly improving the overall resolution and sound brightness of the headphones. Since the high-frequency dynamic driver unit 3 is closest to the ear, the sound signal it generates can be better aligned in time with the sound arriving slightly later from the rear mid-frequency dynamic driver unit 4 and low-frequency dynamic driver unit 5. This layout, based on high frequency timing, reduces phase distortion caused by differences in the propagation paths of different frequency bands, resulting in more consistent sound phase, clearer and more stable sound imaging, more accurate sound field positioning, and significantly enhanced sense of layering and space. This invention places the low-frequency dynamic driver unit 5, which has a large amplitude and strong rearward sound pressure during operation, at the lowest point of the rear mounting position 22, physically distancing it from the easily interfered high-frequency dynamic driver unit 3. This "low-frequency sinking and high-frequency fronting" layout, combined with the physical separation of the dynamic driver bracket 2, effectively cuts off the main paths of "acoustic feedback" and "airflow disturbance" from the low-frequency unit to the high-frequency unit, greatly reducing harmonic distortion and sound coloration introduced by cavity coupling and airflow disturbance. By arranging the three units in a three-dimensional, front-to-back and top-to-bottom layered configuration using the dynamic driver bracket 2, high-density and rational integration of the three dynamic drivers is achieved within the extremely limited earphone shell 1. This layout not only solves the acoustic problems caused by unit stacking but also effectively controls the overall size of the earphone, ensuring wearing comfort.

[0031] In some embodiments, such as Figures 2 to 4 As shown, in order to fix the high-frequency moving coil unit 3, the front mounting position 21 includes a first mounting groove 211, the high-frequency moving coil unit 3 is disposed in the first mounting groove 211, and the high-frequency moving coil unit 3 can be glued to the first mounting groove 211 by means of adhesive.

[0032] In some embodiments, such as Figures 2 to 4 As shown, to securely mount the intermediate frequency moving coil unit 4 and the low-frequency moving coil unit 5, the rear mounting position 22 includes a second mounting groove 221 and a third mounting groove 222. The third mounting groove 222 is located below the second mounting groove 221. The intermediate frequency moving coil unit 4 is disposed within the second mounting groove 221, and the low-frequency moving coil unit 5 is disposed within the third mounting groove 222. The intermediate frequency moving coil unit 4 can be glued to the second mounting groove 221, and the low-frequency moving coil unit 5 can be glued to the third mounting groove 222.

[0033] In some embodiments, such as Figures 4 to 6As shown, a positioning post 212 is also provided on the front mounting position 21, and a positioning hole 122 is provided on the side of the front cover 12 facing the moving coil bracket 2. The precise fit between the positioning post 212 on the front mounting position 21 and the positioning hole 122 on the front cover 12 ensures that the relative position between the high-frequency moving coil unit 3 and the sound outlet 121 remains accurate at all times.

[0034] In some embodiments, such as Figure 2 and 7 As shown, to further ensure that the sound outlet 121 and the moving coil unit are always precisely aligned, the front cover 12 is also provided with a positioning cavity 123 on the side facing the moving coil bracket 2, and the high-frequency moving coil unit 3 is located in the positioning cavity 123. In some embodiments, such as Figure 4 , 5 As shown in Figure 7, the moving coil bracket 2 also has a first connecting half-hole 23 on its side, and the rear cover 13 has a second connecting hole 133 on one side facing the moving coil bracket 2. The moving coil bracket 2 can be connected to the rear cover 13 by screws passing through the first connecting half-hole 23 and the second connecting hole 133. The screw locking structure between the first connecting half-hole 23 on the side of the moving coil bracket 2 and the second connecting hole 133 on the rear cover 13 fixes the entire moving coil bracket 2 in the mounting cavity 11. It should be noted that the installation sequence is as follows: first, install each moving coil unit on the moving coil bracket 2, then lock the moving coil bracket 2 to the rear cover 13, and then connect the front cover 12 and the rear cover 13. When the front cover 12 is connected to the rear cover 13, positioning can also be achieved through the cooperation of the positioning pin 212, the positioning hole 122 and the positioning cavity 123, so that the front cover 12 and the rear cover 13 are fitted and positioned.

[0035] In some embodiments, such as Figure 7 As shown, in order to fix the control module 6, the rear cover 13 is provided with two opposing board slots 131 on one side of the moving coil bracket 2, and the two sides of the PCB board are inserted into the board slots 131.

[0036] In some embodiments, such as Figure 7 As shown, the control module 6 is located below the moving coil bracket 2, and the bottom of the rear cover 13 has a clearance groove 132, with the bottom of the PCB board corresponding to the clearance groove 132. Specifically, the charging interface on the PCB board can correspond to the clearance groove 132 for convenient charging.

[0037] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A three-dynamic-coil wireless earphone, characterized in that, include: The earphone housing (1) has an internal mounting cavity (11) which includes a sound outlet (121). A moving coil bracket (2) is disposed in the mounting cavity (11). The moving coil bracket (2) includes a front mounting position (21) and a rear mounting position (22). A high-frequency moving coil unit (3), a mid-frequency moving coil unit (4) and a low-frequency moving coil unit (5) are disposed on the moving coil bracket (2). The high-frequency moving coil unit (3) is disposed in the front mounting position (21), which is close to the sound outlet (121). The mid-frequency moving coil unit (4) and the low-frequency moving coil unit (5) are disposed in the rear mounting position (22). The low-frequency moving coil unit is located below the mid-frequency moving coil unit. The control module (6) is disposed in the mounting cavity (11) and is electrically connected to the high-frequency moving coil unit (3), the medium-frequency moving coil unit (4) and the low-frequency moving coil unit (5).

2. The three-dynamic-coil wireless earphone according to claim 1, characterized in that, The front mounting position (21) includes a first mounting groove (211), and the high-frequency moving coil unit (3) is disposed in the first mounting groove (211).

3. A three-dynamic-coil wireless earphone according to claim 1, characterized in that, The rear mounting position (22) includes a second mounting slot (221) and a third mounting slot (222). The third mounting slot (222) is located below the second mounting slot (221). The mid-frequency moving coil unit (4) is disposed in the second mounting slot (221), and the low-frequency moving coil unit (5) is disposed in the third mounting slot (222).

4. A three-dynamic-coil wireless earphone according to claim 1, characterized in that, The earphone housing (1) includes a front cover (12) and a rear cover (13), and the sound outlet (121) is disposed on the front cover (12), which is the side close to the ear.

5. A three-dynamic-coil wireless earphone according to claim 4, characterized in that, A positioning post (212) is also provided on the front mounting position (21), and a positioning hole (122) is provided on the front cover (12) facing the moving coil bracket (2).

6. A three-dynamic-coil wireless earphone according to claim 5, characterized in that, The front cover (12) is also provided with a positioning cavity (123) on the side facing the moving coil bracket (2), and the high-frequency moving coil unit (3) is located in the positioning cavity (123).

7. A three-dynamic-coil wireless earphone according to claim 4, characterized in that, The moving coil bracket (2) is provided with a first connecting half hole (23) on its side. The rear cover (13) is provided with a second connecting hole (133) on one side of the moving coil bracket (2). The moving coil bracket (2) can be connected to the rear cover (13) by passing screws through the first connecting half hole (23) and the second connecting hole (133).

8. A three-dynamic-coil wireless earphone according to claim 4, characterized in that, The control module (6) includes a PCB board, and the rear cover (13) is provided with two opposing slots (131) on one side of the moving coil bracket (2), and the two sides of the PCB board are inserted into the slots (131).

9. A three-dynamic-coil wireless earphone according to claim 8, characterized in that, The control module (6) is located below the moving coil bracket (2), and the bottom of the rear cover (13) is provided with a relief groove (132), and the bottom of the PCB board corresponds to the relief groove (132).

10. A three-dynamic-coil wireless earphone according to claim 8, characterized in that, The PCB board integrates a main control chip, a power module, an audio processing chip, a Bluetooth module, and a charging interface module.

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