Transducer device and electronic device

Abstract

Embodiments of the present application provide a transducing device and an electronic device, which are used to reduce the resonant frequency of the transducing device and improve the communication effect of the electronic device. The transducing device comprises a shell and a piezoelectric structure. The piezoelectric structure is arranged on a first surface of the shell and is stacked with at least part of the shell along a first direction. The piezoelectric structure comprises a first electrode layer, a piezoelectric layer and a second electrode layer stacked along the first direction. The piezoelectric layer is located between the first electrode layer and the second electrode layer. At least part of the first electrode layer is located between the shell and the piezoelectric layer. The ratio of the connection area of the piezoelectric layer and the first surface to the area of the first surface is greater than or equal to 0.5. Since the longitudinal vibration of the piezoelectric structure can drive the bending vibration of the shell, the resonant frequency of the transducing device is reduced, which is conducive to the communication effect of the electronic device.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to a transducer and an electronic device. Background Technology

[0002] To meet the needs of underwater communication scenarios, wearable devices in related technologies typically use acoustic communication devices for communication. For example, piezoelectric ceramic transducers are often incorporated into smart wearable watches to achieve energy conversion between electrical and acoustic energy. However, the resonant frequency of piezoelectric ceramic transducers in these technologies is relatively high, resulting in a short propagation distance of high-frequency sound waves in water and poor communication performance. Utility Model Content

[0003] This application provides a transducer and an electronic device to improve the communication performance of the electronic device.

[0004] To achieve the above objectives, the embodiments of this application provide the following solutions:

[0005] On one hand, a transducer is provided. The transducer includes a housing and a piezoelectric structure. The piezoelectric structure is disposed on a first surface of the housing and is stacked with at least a portion of the housing along a first direction. The piezoelectric structure includes a first electrode layer, a piezoelectric layer, and a second electrode layer stacked along the first direction, with the piezoelectric layer located between the first electrode layer and the second electrode layer. At least a portion of the first electrode layer is located between the housing and the piezoelectric layer. The ratio of the area of ​​the connection between the piezoelectric layer and the first surface to the area of ​​the first surface is greater than or equal to 0.5.

[0006] In summary, when applied in underwater scenarios, the piezoelectric structure can induce bending vibrations in the housing. These vibrations, in turn, drive the vibration of the liquid medium, thereby emitting sound waves and / or ultrasonic signals within the liquid. Conversely, the emitted sound waves and / or ultrasonic signals from the liquid medium can be received by the housing and transmitted to the piezoelectric structure, whereby electronic devices convert them into electrical signals.

[0007] Furthermore, since the longitudinal vibration of the piezoelectric structure can drive the bending vibration of the shell, the bending vibration mode size increases, and the resonant frequency of the transducer decreases. This helps to reduce the attenuation of sound waves in the liquid medium and increase the propagation distance of sound waves in the liquid medium. Moreover, because the resonant frequency of the transducer is lower, the sampling rate required for sound wave signal analysis is reduced, thus reducing the performance and computing resource requirements of electronic devices and increasing the battery life of electronic devices.

[0008] In some embodiments, the ratio of the thickness of the piezoelectric layer to the thickness of the housing in the first direction ranges from 0.5 to 1.5. With the above configuration, when alternating current is applied to the first electrode layer and the second electrode layer, the longitudinal vibration of the piezoelectric layer can cause the housing to bend and deform, so that the piezoelectric structure and the housing together constitute a transducer.

[0009] In some embodiments, the Vickers hardness of the housing ranges from 500 HV to 3000 HV. This configuration ensures that the housing possesses both structural strength and bending deformation capability, allowing it to bend and deform in response to the longitudinal vibrations of the piezoelectric layer.

[0010] In some embodiments, the housing includes at least one of a zirconia ceramic layer, a sapphire layer, a microcrystalline glass layer, an aluminum-magnesium alloy layer, a stainless steel layer, a titanium alloy layer, and a titanium metal layer. This configuration allows the housing to maintain a certain structural strength while also possessing a certain degree of bending deformation capability.

[0011] In some embodiments, the piezoelectric layer includes at least one of a PZT4 material layer, a PZT5 material layer, a textured ceramic layer, a piezoelectric single crystal layer, and a piezoelectric layer. This configuration allows the piezoelectric layer to maintain a certain structural strength while also possessing a certain degree of bending deformation capability.

[0012] In some embodiments, the piezoelectric layer has a first through-hole, and the housing has a second through-hole communicating with the first through-hole. In a first direction, the first through-hole and at least a portion of the second through-hole overlap. With this arrangement, external light can sequentially enter the energy-generating device through the second through-hole and the first through-hole.

[0013] In some embodiments, a portion of the piezoelectric layer shields a portion of the second through-hole in the direction the piezoelectric layer points toward the housing. With this configuration, when viewed from the outside, the piezoelectric layer can partially shield the devices placed within the housing space, thereby improving the aesthetics of the electronic device. Alternatively, a portion of the housing shields a portion of the first through-hole in the direction the housing points toward the piezoelectric layer. This configuration increases the area of ​​the housing exposed within the housing space, which is beneficial for increasing the number of devices placed within the housing space, improving the device density within the housing space, and enhancing the utilization rate of the housing space.

[0014] In some embodiments, the size of the first through hole is smaller or larger than the size of the second through hole.

[0015] In some embodiments, the transducer further includes a bonding adhesive layer located between the first electrode layer and the first surface. This arrangement helps to improve the connection strength between the piezoelectric layer and the first surface.

[0016] In some embodiments, the piezoelectric layer includes a first sub-surface and a second sub-surface disposed opposite to each other along a first direction, a sidewall of the piezoelectric layer connecting the first and second sub-surfaces, and the first sub-surface located on the side of the second sub-surface facing away from the first surface; a first electrode layer is disposed on at least a portion of the second sub-surface, at least a portion of the sidewall of the piezoelectric layer, and a portion of the first sub-surface. With the above arrangement, the first electrode layer can extend from the side of the piezoelectric layer near the housing to the side of the piezoelectric layer facing away from the housing, so that the first electrode layer can be electrically connected to a processing device located within the receiving space, facilitating the extraction of electrical signals from the first electrode layer.

[0017] In some embodiments, the second electrode layer is disposed on a portion of the first sub-surface, and the second electrode layer and the first electrode layer are spaced apart. This arrangement achieves electrical isolation between the first electrode layer and the second electrode layer, preventing short circuits between them.

[0018] In some embodiments, the first electrode layer is disposed on the first surface; the transducer further includes a bonding adhesive layer located between the first electrode layer and the piezoelectric layer. This arrangement helps to improve the connection strength between the piezoelectric layer and the first surface.

[0019] In some embodiments, in the first direction, a portion of the first electrode layer does not overlap with the piezoelectric layer. With this arrangement, the exposed portion of the first electrode layer can be electrically connected to a processing device located within the receiving space, facilitating the extraction of electrical signals from the first electrode layer.

[0020] In some embodiments, the adhesive layer includes a conductive adhesive layer. With the above configuration, the stacked first electrode layer, adhesive layer, piezoelectric layer, and second electrode layer together constitute a piezoelectric structure.

[0021] In some embodiments, the Shore hardness of the adhesive layer is greater than or equal to 60 HD. This configuration allows the adhesive layer to possess both structural strength and bending deformation capability.

[0022] In some embodiments, the thickness of the adhesive layer ranges from 10 micrometers to 50 micrometers. This configuration allows the adhesive layer to possess both structural strength and bending deformation capability.

[0023] In some embodiments, the housing includes a protrusion extending away from the piezoelectric structure. The size of the protrusion is smaller than the size of the piezoelectric layer, and the protrusion and the piezoelectric layer together enclose a cavity. With the above arrangement, the cavity enclosed by the protrusion and the piezoelectric layer can be used to place devices, which is beneficial to increasing the number of devices disposed within the accommodating space.

[0024] In some embodiments, the dimension of the piezoelectric layer in the second direction is not equal to the dimension of the piezoelectric layer in the third direction. Both the second and third directions are perpendicular to the first direction, and the second and third directions intersect. With the above arrangement, in the direction where the piezoelectric layer has a smaller dimension, the piezoelectric layer can make room for more space, thereby increasing the area of ​​the housing exposed in the receiving space, which is beneficial for increasing the number of devices disposed in the receiving space.

[0025] On the other hand, an electronic device is also provided. The electronic device includes a housing and a transducer as described in the above embodiments. The housing and the housing of the transducer together enclose a receiving space, and the piezoelectric structure of the transducer is located within the receiving space.

[0026] The electronic device provided in the embodiments of this application includes the transducer as described above, and therefore has all the above-described beneficial effects, which will not be repeated here.

[0027] In some embodiments, the piezoelectric structure is used to drive the housing to vibrate along a first direction. The electronic device can send or receive communication signals. With the above configuration, since the piezoelectric structure is connected to the housing, the piezoelectric structure can drive the housing to vibrate together. The transducer can receive acoustic signals, convert the acoustic signals into electrical signals, and transmit them to the processing device so that the electronic device can receive communication signals. Conversely, the electronic device can send electrical signals through the processing device, and the transducer can convert the electrical signals sent by the processing device into acoustic signals and emit the acoustic signals so that the electronic device can send communication signals.

[0028] In some embodiments, the electronic device further includes a functional device and a processing device, both located within a housing space. The processing device is electrically connected to a first electrode layer and a second electrode layer of the piezoelectric structure, respectively, and is also electrically connected to the functional device.

[0029] In some embodiments, the electronic device includes a wearable device.

[0030] In some embodiments, the functional device further includes a photoelectric sensor, wherein in a first direction, at least a portion of the first through-hole of the piezoelectric layer of the transducer and at least a portion of the second through-hole of the housing of the transducer overlap. With this configuration, during the operation of the photoelectric sensor, light from outside the electronic device can sequentially enter the receiving space through the second through-hole and the first through-hole, and be received by the photoelectric sensor. The photoelectric sensor can then acquire corresponding information based on the received external light.

[0031] In some embodiments, the functional device includes a charging coil and / or a pressure sensor, which are disposed within a cavity enclosed by the piezoelectric layer and the protrusion of the housing. This arrangement, when the electronic device is charged using a charging device, allows for an effective charging distance between the charging coil and the charging device by placing the charging coil within the cavity, enabling the charging device to charge the electronic device. Furthermore, when the electronic device is worn, the pressure sensor comes into contact with the user's skin; placing the pressure sensor within the cavity shortens the distance between the pressure sensor and the user's skin, thus improving the detection accuracy of the pressure sensor.

[0032] In some embodiments, the functional device includes at least one of a temperature sensor, a flow rate sensor, a depth sensor, a barometric pressure sensor, a salinity sensor, a light-emitting device, a smoke-generating device, and a positioning device. Attached Figure Description

[0033] Figure 1 A structural diagram of an electronic device provided in an embodiment of this application;

[0034] Figure 2 Structural diagrams of a transducer device provided in this application, in a flat state, a recessed state, and a convex state;

[0035] Figure 3 A top view of a transducer provided in an embodiment of this application in a first direction;

[0036] Figure 4 A top view of another transducer provided in an embodiment of this application in a first direction;

[0037] Figure 5 A top view of another transducer provided in an embodiment of this application in a first direction;

[0038] Figure 6 This is a partial structural cross-sectional view of an electronic device provided in an embodiment of this application;

[0039] Figure 7 A partial structural cross-sectional view of another electronic device provided in an embodiment of this application;

[0040] Figure 8 A top view of another transducer provided in an embodiment of this application in a first direction;

[0041] Figure 9 A cross-sectional view of a transducer provided in an embodiment of this application;

[0042] Figure 10 A top view of another transducer provided in an embodiment of this application in a first direction;

[0043] Figure 11 A top view of another transducer provided in an embodiment of this application in a first direction;

[0044] Figure 12 A top view of another transducer provided in an embodiment of this application in a first direction;

[0045] Figure 13 for Figure 12 A cross-sectional view of the transducer along section line AA;

[0046] Figure 14 A top view of another transducer provided in an embodiment of this application in a first direction;

[0047] Figure 15 for Figure 14 A cross-sectional view of the transducer along the BB section line;

[0048] Figure 16 A structural diagram of another electronic device provided in an embodiment of this application;

[0049] Figure 17 An assembly structure diagram of a transducer device disposed in an electronic device according to an embodiment of this application;

[0050] Figure 18 An assembly structure diagram of another transducer device provided in an embodiment of this application, disposed in an electronic device;

[0051] Figure 19 A structural diagram of another electronic device provided in an embodiment of this application;

[0052] Figure 20 This is a structural diagram of another electronic device provided in an embodiment of this application. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0054] In the following description, the terms "first," "second," etc., are used for ease of description only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0055] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0056] In the embodiments of this application, the directional indications used to explain the structure and movement of different components, such as up, down, left, right, front, and back, are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component positions changes, these directional indications will also change accordingly.

[0057] This application provides an electronic device, such as a mobile phone, tablet, laptop, smart home device, smart wearable device (e.g., smartwatch, smart bracelet, smart glasses, smart helmet), virtual reality (VR) electronic device, augmented reality (AR) electronic device, etc. The electronic device can also be a handheld device with wireless communication capabilities, a computing device or other processing device connected to a wireless modem, an in-vehicle device, an electronic device in a 5G network, or an electronic device in a future evolved public land mobile network (PLMN), etc. This application does not limit the type of electronic device. In some embodiments, the electronic device may include a wearable device. The wearable device may be in the form of a watch or other forms. In addition to the usual time display function, the wearable communication device provided in this application can perform information exchange between devices. Figure 1 This is a structural diagram of an electronic device provided in an embodiment of this application. The following refers to... Figure 1 The structure of electronic devices will be explained using a watch as an example.

[0058] The electronic device 01 may include a body 50 and a fixing part 30. The fixing part 30 may be connected to the body 50. For example, the body 50 may include a housing 20 for enclosing at least a partial receiving space P, which can be used to house electronic components in the electronic device 01. For example, the electronic components may include a speaker, a battery, etc.

[0059] The fixing part 30 can be a flexible strip structure. The fixing part 30 may include a first strip body and a second strip body, and the main body 50 can be connected between the first strip body and the second strip body. The end of the first strip body away from the main body 50 and the end of the second strip body away from the main body 50 are detachably connected.

[0060] Furthermore, the electronic device 01 may also include a transducer 10. The electronic device 01 provided in this application embodiment can be applied to underwater scenarios. The transducer 10 can emit sound waves and / or ultrasonic signals in a liquid medium, or receive emitted sound waves and / or ultrasonic signals from a liquid medium and convert them into electrical signals to realize information interaction between devices.

[0061] Furthermore, the wearable device in this application embodiment can also be applied to various other scenarios. For example, it can emit sound waves and / or ultrasound underwater to drive away dangerous creatures such as sharks; it can emit sound waves and / or ultrasound in the air to repel mosquitoes, insects, rodents, etc.; in addition to realizing information transmission and reception across water and underwater, it can also be used to assist in signal enhancement; it can be located by sound waves, allowing users to find the device using a mobile phone.

[0062] The electronic device 01 may further include a processing device (not shown in the figure), which may be disposed in the receiving space P, and the transducer 10 may be electrically connected to the processing device. The transducer 10 may receive a first acoustic signal, convert the first acoustic signal into a first electrical signal and transmit it to the processing device; and may convert a second electrical signal sent by the processing device into a second acoustic signal and transmit the second acoustic signal.

[0063] Furthermore, the electronic device 01 may also include functional components, which may be disposed within the accommodating space P and electrically connected to the processing device. For example, the functional components may include detection devices. These detection devices may include, for example, at least one of a temperature sensor, flow rate sensor, depth sensor, air pressure sensor, salinity sensor, light-emitting device, smoke-emitting device, and positioning device. For instance, when the functional component is a detection device such as a temperature sensor, flow rate sensor, depth sensor, air pressure sensor, or salinity sensor, the electronic device 01 can acquire corresponding temperature, flow rate, depth, pressure, and salinity information through the detection device. Since the functional component is electrically connected to the transducer 10 through the processing device, the transducer 10 can exchange the aforementioned information with other electronic devices 01 using sound waves and / or ultrasonic signals as carriers. When the functional component is a positioning device, the electronic device 01 can acquire corresponding location information through the positioning device, thereby achieving positioning of the electronic device 01. When the functional component is a light-emitting device, smoke-emitting device, or similar device, the electronic device 01 can emit alarm signals through the light-emitting or smoke-emitting device so that the user can promptly detect the electronic device 01.

[0064] In some examples, electronic device 01 may include a housing and a motherboard, with the motherboard located within a receiving space enclosed by the housing. A transducer 10 may be disposed on the motherboard, and the transducer 10 may be spaced apart from the housing. When the transducer 10 operates, it vibrates longitudinally along the thickness direction of electronic device 01, generating a high resonant frequency. Since high-frequency sound waves attenuate strongly in water, their propagation distance in water is limited, leading to a decrease in the communication performance of electronic device 01. Furthermore, since the resolution of high-frequency sound waves requires a higher sampling rate, the performance and computing resource requirements for electronic device 01 are higher, resulting in a shorter battery life. In view of this, the transducer 10 provided in this embodiment includes a piezoelectric structure 200 and a housing 100. The piezoelectric structure 200 and at least a portion of the housing 100 are stacked along a first direction X.

[0065] The shape of the housing 100 is not limited in this application embodiment. In some embodiments, the housing 100 may be generally plate-shaped. For example, the housing 100 may be a circular plate, a rectangular plate, or a polygonal plate, etc. The piezoelectric structure 200 is stacked with at least a portion of the housing 100, which can be understood as the piezoelectric structure 200 being stacked with a plate-shaped structure. In some other embodiments, reference continues to be made. Figure 1 The housing 100 may be generally cylindrical. For example, the housing 100 may include a base plate 110 and side plates 120 disposed around the base plate 110. The piezoelectric structure 200 is stacked with at least a portion of the housing 100, which can be understood as the piezoelectric structure 200 being stacked with the base plate 110 of the housing 100.

[0066] Continue to refer to Figure 1 The housing 100 may include a first surface M. For example, the inner surface of the housing 100 may include the first surface M. When the housing 100 is a cylindrical structure, the bottom plate 110 of the cylindrical structure may include the first surface M.

[0067] The piezoelectric structure 200 can be disposed on the first surface M of the housing 100. For example, the piezoelectric structure 200 can be adhered to the first surface M. Of course, the piezoelectric structure 200 can also be disposed on the first surface M in other ways, which are not limited in this embodiment. With the above arrangement, the piezoelectric structure 200 can be located within the receiving space P enclosed by the housing 100 and the outer shell 20 of the electronic device 01.

[0068] In some embodiments, the housing 100 of the transducer 10 can be reused as part of the housing 20 of the electronic device 01. Continuing to refer to... Figure 1The outer casing 20 may include a middle frame 21, a top shell 23, and a bottom shell 22. The top shell 23 and bottom shell 22 may be respectively disposed on opposite sides of the middle frame 21, forming a receiving space P with the middle frame 21. Furthermore, the top shell 23 may have an opening, within which the display module 40 may be disposed. The bottom shell 22 may be used for contact with the user's skin. For example, the housing 100 of the transducer 10 may be reused as the bottom shell 22 of the outer casing 20. Exemplarily, the housing 100 of the transducer 10 and the bottom shell 22 of the outer casing 20 may be integrally formed, with the bottom shell 22 serving as part of the transducer 10. With the above configuration, the piezoelectric structure 200 can be disposed on the bottom shell 22 of the electronic device 01. For example, the piezoelectric structure 200 may be attached to the bottom shell 22 of the electronic device 01, which improves the assembly compactness of the piezoelectric structure 200 and increases the space utilization of the electronic device 01. Alternatively, with the above configuration, the transducer can be disposed within the limited space of the electronic device 01, enabling underwater communication scenarios for the electronic device 01. Furthermore, when the transducer 10 is installed in the electronic device 01, the first direction X can also be the thickness direction of the electronic device 01.

[0069] Continue to refer to Figure 1 The piezoelectric structure 200 includes a first electrode layer 210, a piezoelectric layer 220, and a second electrode layer 230 stacked along a first direction X. The piezoelectric layer 220 is located between the first electrode layer 210 and the second electrode layer 230, and at least a portion of the first electrode layer 210 is located between the housing 100 and the piezoelectric layer 220.

[0070] In some embodiments, the ratio of the connection area between the piezoelectric layer 220 and the first surface M to the area of ​​the first surface M is greater than or equal to 0.5. For example, the ratio of the connection area between the piezoelectric layer 220 and the first surface M to the area of ​​the first surface M can be 0.5, 0.6, or 0.8.

[0071] Furthermore, since the piezoelectric layer 220 is located within the accommodating space P enclosed by the housing 100 and the outer casing 20 of the electronic device 01, the ratio of the connection area between the piezoelectric layer 220 and the first surface M to the area of ​​the first surface M is less than or equal to 1. That is, the connection area between the piezoelectric layer 220 and the first surface M is less than or equal to the area of ​​the first surface M.

[0072] In some embodiments, the base plate 110 of the housing 100 may have a through hole. For example, a first surface M may be disposed around the through hole. Here, the connection area between the piezoelectric layer 220 and the first surface M can be understood as the overlapping area of ​​the piezoelectric layer 220 and the first surface M disposed around the through hole in the first direction X. Alternatively, in some embodiments, the base plate 110 of the housing 100 may also have a protrusion that protrudes away from the piezoelectric layer 220. For example, the first surface M may be disposed around the protrusion. Here, the connection area between the piezoelectric layer 220 and the first surface M can be understood as the overlapping area of ​​the piezoelectric layer 220 and the first surface M disposed around the protrusion in the first direction X. In some examples, the processing device of the electronic device 01 may be electrically connected to the first electrode layer 210 and the second electrode layer 230 of the piezoelectric structure 200, respectively. During the operation of the transducer 10, the processing device of the electronic device 01 can apply an AC voltage to the first electrode layer 210 and the second electrode layer 230 respectively, so that the piezoelectric structure 200 vibrates longitudinally, or in other words, the piezoelectric structure 200 vibrates in the first direction X.

[0073] In some embodiments, the piezoelectric structure 200 can be used to drive the housing 100 to vibrate along a first direction X. The electronic device 01 can send or receive communication signals. Since the piezoelectric structure 200 is connected to the housing 100, the piezoelectric structure 200 can drive the housing 100 to vibrate together. The transducer 10 can receive acoustic signals, convert the acoustic signals into electrical signals, and transmit them to the processing device so that the electronic device 01 can receive communication signals. Conversely, the electronic device 01 can send electrical signals through the processing device. The transducer 10 can convert the electrical signals sent by the processing device into acoustic signals and emit acoustic signals so that the electronic device 01 can send communication signals.

[0074] Figure 2 The diagram shows the structure of a transducer in a flat, recessed, and convex state, as provided in the embodiments of this application.

[0075] Combination Figure 2 As shown, during the vibration of the piezoelectric structure 200, the piezoelectric structure 200 can exist in at least three states: the piezoelectric structure 200 can be in a flat state, the piezoelectric structure 200 can be in a concave state, and the piezoelectric structure 200 can also be in a convex state.

[0076] When the piezoelectric structure 200 is in a flat state, at least a portion of the housing 100 that is stacked with the piezoelectric structure 200 is also in a flat state. For example, the base plate 110 of the housing 100 is in a flat state.

[0077] As the piezoelectric structure 200 transitions from a flat state to a recessed state, the piezoelectric layer 220 contracts perpendicular to the first direction X (when the piezoelectric layer 220 is circular, it may contract radially, for example). The piezoelectric structure 200 bulges downward, and driven by the piezoelectric structure 200, at least a portion of the housing 100, which is stacked with the piezoelectric structure 200, also bulges downward. For example, the bottom plate 110 of the housing 100 bulges downward.

[0078] As the piezoelectric structure 200 transitions from a flat to a convex state, the piezoelectric layer 220 is stretched in a direction perpendicular to the first direction X (when the piezoelectric layer 220 is circular, it can, for example, expand radially). The piezoelectric structure 200 convexes upward, and driven by the piezoelectric structure 200, at least a portion of the housing 100, which is stacked with the piezoelectric structure 200, also convexes upward. For example, the bottom plate 110 of the housing 100 convexes upward.

[0079] In summary, through the above configuration, the piezoelectric structure 200 can drive the housing 100 to bend and vibrate. When applied in an underwater environment, the bending vibration of the housing 100 can drive the liquid medium to vibrate, thereby emitting sound waves and / or ultrasonic signals in the liquid medium. Conversely, the emitted sound waves and / or ultrasonic signals from the liquid medium can be received by the housing 100, which transmits them to the piezoelectric structure 200 so that the electronic device 01 can convert them into electrical signals and amplify and enhance them.

[0080] Furthermore, since the longitudinal vibration of the piezoelectric structure 200 can drive the bending vibration of the shell 100, the bending vibration mode size increases, the resonant frequency of the transducer 10 decreases, and the resonant frequency remains relatively stable. This helps to reduce the attenuation of sound waves in the liquid medium, allowing sound waves to penetrate deeper into the liquid medium, thereby increasing the propagation distance of sound waves in the liquid medium. At the same time, sound waves with lower resonant frequencies exhibit weaker scattering when encountering smaller obstacles, which helps to improve the clarity and quality of the sound wave signal.

[0081] In one application scenario, the transducer 10 with a lower resonant frequency can be used for lower frequency electrical signals. For example, when the transducer 10 is electrically connected to a processing device in an electronic device, the processing device can send a lower frequency electrical signal to the transducer 10, which then converts the lower frequency electrical signal into an acoustic signal. Alternatively, the transducer 10 can convert a received acoustic signal into a lower frequency electrical signal and then send the lower frequency electrical signal to the processing device. The frequency of the electrical signal can range from 3kHz to 15kHz.

[0082] Furthermore, since the resonant frequency of the transducer 10 is low, the sampling rate required for acoustic signal analysis is reduced, thus reducing the performance and computing resource requirements of the electronic device 01 and increasing the battery life of the electronic device 01.

[0083] In some embodiments, the ratio of the thickness of the piezoelectric layer 220 to the thickness of the housing 100 in the first direction X can range from 0.5 to 1.5. For example, the ratio of the thickness of the piezoelectric layer 220 to the thickness of the housing 100 can be 0.5, 0.8, 1, 1.2, or 1.5. With the above configuration, when alternating current is applied to the first electrode layer 210 and the second electrode layer 230, the longitudinal vibration of the piezoelectric layer 220 can cause the housing 100 to bend and deform, so that the piezoelectric structure 200 and the housing 100 together constitute the transducer 10.

[0084] In some embodiments, the Vickers hardness of the housing 100 can range from 500 HV to 3000 HV. For example, the Vickers hardness of the housing 100 can be 500 HV, 1000 HV, 1500 HV, 2000 HV, 25000 HV, or 3000 HV. With the above settings, the housing 100 can maintain a certain structural strength while also having a certain bending deformation capability, so that the housing 100 can bend and deform in response to the longitudinal vibration of the piezoelectric layer 220.

[0085] In some embodiments, the housing 100 may include at least one of a zirconia ceramic layer, a sapphire layer, a microcrystalline glass layer, an aluminum-magnesium alloy layer, a stainless steel layer, a titanium alloy layer, and a titanium metal layer. This configuration allows the housing 100 to maintain a certain structural strength while also possessing a certain degree of bending deformation capability.

[0086] In some embodiments, the housing 100 may include a ceramic housing. The material of the ceramic housing may be, for example, zirconia ceramic.

[0087] In some embodiments, the piezoelectric layer 220 may include at least one of the following: a PZT (Piezoelectric Ceramics) 4 material layer, a PZT5 material layer, a textured ceramic layer, a piezoelectric single crystal layer, and a piezoelectric ceramic layer. The different doping ratios of the PZT4 and PZT5 materials result in different properties for each material, meeting various application requirements. This configuration allows the piezoelectric layer 220 to maintain structural strength while also possessing a certain degree of bending deformation capability. In some embodiments, the piezoelectric layer 220 may include piezoelectric ceramics, which can be electronic ceramic materials with piezoelectric properties.

[0088] In some embodiments, the first electrode layer 210 may include at least one of a metal layer and a graphene layer. Similarly, the second electrode layer 230 may include at least one of a metal layer and a graphene layer. The metal layer may include one or a combination of gold, silver, copper, iron, aluminum, and alloy layers.

[0089] Figure 3 A top view of a transducer provided in an embodiment of this application in a first direction; Figure 4 A top view of another transducer provided in an embodiment of this application in a first direction; Figure 5 This is a top view of another transducer provided in an embodiment of this application, taken in a first direction. The piezoelectric layer shape is shown for easy observation. Figure 3 , Figure 4 as well as Figure 5 The transducer in the diagram omits the first and second electrode layers.

[0090] In some embodiments, refer to Figure 3 and Figure 4 The piezoelectric layer 220 may have a first through-hole 209, and the housing 100 may have a second through-hole 109 communicating with the first through-hole 209. In the first direction X, the first through-hole 209 and at least a portion of the second through-hole 109 overlap. The embodiments of this application do not limit the shape of the first through-hole 209 and the second through-hole 109. For example, both the first through-hole 209 and the second through-hole 109 may be circular holes.

[0091] Figure 6 This is a partial structural cross-sectional view of an electronic device provided in an embodiment of this application. Figure 6 The structure shown in the figures illustrates the positional relationship between the transducer and some functional components in an electronic device. Of course, the electronic device may also include other functional components. This application only briefly illustrates some functional components in the electronic device, and the accompanying drawings are simplified. This application does not strictly limit the functional components in the electronic device.

[0092] In addition, refer to Figure 6 As shown, when the piezoelectric layer 220 has a first through-hole 209 and the housing 100 has a second through-hole 109, the first electrode layer 210 may also have a through-hole, and the through-hole of the first electrode layer 210 may be disposed opposite to the first through-hole 209. For example, the shape of the first electrode layer 210 may be approximately annular. The second electrode layer 230 may also have a through-hole, and the through-hole of the second electrode layer 230 may also be disposed opposite to the first through-hole 209. For example, the shape of the second electrode layer 230 may also be approximately annular. This application embodiment does not specifically limit the shapes of the first electrode layer 210 and the second electrode layer 230.

[0093] As described in the above embodiments, the electronic device may include functional components. When a transducer is disposed in the electronic device, the first through-hole 209 and the second through-hole 109 may be disposed opposite to some of the functional components in the electronic device. For example, referring to... Figure 6 The functional device may further include a photoelectric sensor 61, in which at least a portion of the photoelectric sensor 61, at least a portion of the first through hole 209, and at least a portion of the second through hole 109 overlap in the first direction X. In some embodiments, the photoelectric sensor 61 may be disposed on the circuit board 70, and at least a portion of the photoelectric sensor 61 may extend into the first through hole 209.

[0094] During the operation of the photoelectric sensor 61, the photoelectric sensor 61 can emit light to the outside of the electronic device 01 through the first through hole 209 and the second through hole 109 in sequence. The reflected external light can enter the accommodating space P through the second through hole 109 and the first through hole 209 in sequence, and be received by the photoelectric sensor 61. The photoelectric sensor 61 can obtain corresponding information based on the received external light. For example, the photoelectric sensor 61 can be a PPG (Photoplethysmograph) sensor. The PPG sensor can receive light reflected from human tissue to detect functions such as blood oxygen or heart rate.

[0095] In some embodiments, continue to refer to Figures 3 to 6 In the direction from the housing 100 to the piezoelectric layer 220, a portion of the housing 100 may shield a portion of the first through-hole 209. For example, the orthographic projection of a portion of the housing 100 onto the reference plane may be within the orthographic projection of the first through-hole 209 onto the reference plane, and the reference plane may be perpendicular to the first direction X.

[0096] By configuring the device within the first through-hole 209, the device density within the accommodating space P can be increased, thereby improving the utilization rate of the accommodating space P. For example, the orthographic projection of some devices within the accommodating space P onto the reference plane can be located between the orthographic projections of the first through-hole 209 and the second through-hole 109 onto the reference plane.

[0097] Furthermore, through the above-mentioned configuration, when viewed from the outside, part of the housing 100 can obscure the devices placed in the housing space P, thereby improving the aesthetics of the electronic device 01.

[0098] For example, the size of the first through-hole 209 can be larger than the size of the second through-hole 109. The orthographic projection of the second through-hole 109 onto the reference plane can be located within the orthographic projection of the first through-hole 209 onto the reference plane, and the reference plane can be perpendicular to the first direction X. This arrangement allows for the placement of devices within the first through-hole 209, increasing the number of devices that can be placed within the receiving space P.

[0099] In some embodiments, continue to refer to Figure 6 The base plate 110 of the housing 100 can be generally plate-shaped. Here, the first surface M is the surface of the base plate 110 of the housing 100, and the first surface M can be an annular surface. The connection area between the piezoelectric layer 220 and the first surface M can be equal to the area of ​​the orthographic projection of the piezoelectric layer 220 onto the annular surface.

[0100] Figure 7 This is a partial structural cross-sectional view of another electronic device provided in an embodiment of this application. Figure 7 The structure shown in the figures illustrates the positional relationship between the transducer and some functional components in an electronic device. Of course, the electronic device may also include other functional components. This application only briefly illustrates some functional components in the electronic device, and the accompanying drawings are simplified. This application does not strictly limit the functional components in the electronic device.

[0101] Figure 7 In the housing 100 shown, in the direction of the housing 100 pointing towards the piezoelectric layer 220, a portion of the housing 100 can partially shield the first through-hole 209. Furthermore, the dimensional relationship between the first through-hole 209 and the second through-hole 109 can be found in [reference needed]. Figure 6 The descriptions of some of the embodiments in the text will not be repeated here.

[0102] In some embodiments, continue to refer to Figure 7 The housing 100 may also include a protrusion 180 protruding away from the piezoelectric structure 200. The size of the protrusion 180 is smaller than the size of the piezoelectric layer 220. The protrusion 180 and the piezoelectric layer 220 together enclose the cavity Q.

[0103] For example, the orthographic projection of the protrusion 180 onto the reference plane can be located within the outer edge of the orthographic projection of the piezoelectric layer 220 onto the reference plane. The first portion of the piezoelectric layer 220 can be disposed on the first surface M of the housing 100, and the second portion of the piezoelectric layer 220 can be suspended on one side of the protrusion 180, so that the second portion of the piezoelectric layer 220 and the protrusion 180 together enclose the cavity Q.

[0104] The first surface M can be a surface surrounding the protrusion 180 of the housing 100, and the first surface M can be an annular surface. The connection area between the piezoelectric layer 220 and the first surface M can be equal to the overlap area of ​​a portion of the piezoelectric layer 220 and the annular surface in the first direction X.

[0105] Furthermore, the first through hole 209 can penetrate the piezoelectric layer 220, which can be suspended on one side of the protrusion 180. The second through hole 109 can penetrate the protrusion 180 so that the first through hole 209 can overlap with at least a portion of the second through hole 109 in the first direction X.

[0106] With the above configuration, the cavity Q enclosed by the protrusion 180 and the piezoelectric layer 220 can be used to place devices, which is beneficial to increasing the number of devices placed in the accommodating space P.

[0107] As described in the above embodiments, the electronic device may include functional components. When a transducer is disposed in the electronic device, some of the functional components in the electronic device may be disposed within the cavity Q enclosed by the protrusion 180 and the piezoelectric layer 220. For example, in one implementation, the functional component located within the accommodating space P may further include a charging coil 62. The charging coil 62 may be disposed within the cavity Q jointly enclosed by the piezoelectric layer 220 and the protrusion 180 of the housing 100.

[0108] As described in the above embodiments, the housing 100 can be reused as the bottom shell 22 of the outer shell 20 of the electronic device 01. When the electronic device 01 is charged using a charging device, by setting the charging coil 62 inside the cavity Q, the distance between the charging coil 62 and the charging device can reach an effective charging distance, so that the charging device can charge the electronic device 01.

[0109] In one implementation, the functional device located within the accommodating space P may further include a pressure sensor 63. The pressure sensor 63 may be disposed within the cavity Q enclosed by the piezoelectric layer 220 and the protrusion 180 of the housing 100.

[0110] As described in the above embodiments, the housing 100 can be reused as the bottom shell 22 of the outer shell 20 of the electronic device 01. When the electronic device 01 is worn, the pressure sensor 63 is in contact with the user's skin. By placing the pressure sensor 63 inside the cavity Q, the distance between the pressure sensor 63 and the user's skin can be shortened, which is beneficial to improving the detection accuracy of the pressure sensor 63. For example, the pressure sensor 63 can be used to obtain pressure information on the user's wrist. The pressure information can reflect the user's exercise status, sleep quality, and other aspects.

[0111] Furthermore, in the embodiment where the housing 100 may have a protrusion 180, a photoelectric sensor 61 may also be provided within the accommodating space P. The position and connection relationship of the photoelectric sensor 61 can be as described in the above embodiments, and will not be repeated here. Figure 8 A top view of another transducer provided in an embodiment of this application in a first direction; Figure 9This is a cross-sectional view of a transducer provided in an embodiment of this application. The view is shown to facilitate observation of the positional relationship between the piezoelectric layer 220 and the housing 100. Figure 8 The transducer in the diagram omits the first and second electrode layers.

[0112] Reference Figure 8 and Figure 9 In some embodiments, in the direction of the piezoelectric layer 220 pointing towards the housing 100, a portion of the piezoelectric layer 220 may shield a portion of the second through-hole 109. For example, the orthographic projection of the portion of the piezoelectric layer 220 onto the reference plane may be located within the orthographic projection of the second through-hole 109 onto the reference plane, and the reference plane may be perpendicular to the first direction X. With the above arrangement, when viewed from the exterior, the portion of the piezoelectric layer 220 can shield the devices placed within the accommodating space P, thereby improving the aesthetics of the electronic device 01.

[0113] For example, the size of the first through-hole 209 can be smaller than the size of the second through-hole 109. The orthographic projection of the first through-hole 209 onto the reference plane can be located within the orthographic projection of the second through-hole 109 onto the reference plane, and the reference plane can be perpendicular to the first direction X. With the above configuration, when viewed from the external surface, a portion of the piezoelectric layer 220 can shield a portion of the second through-hole 109, and a portion of the piezoelectric layer 220 can shield the devices placed within the accommodating space P, thereby improving the aesthetics of the electronic device 01.

[0114] Of course, different Figures 6 to 9 In some other embodiments, the dimensions of the first through hole 209 and the second through hole 109 may be equal. Here, "equal" can be understood as "absolutely equal" and "approximately equal." The approximation range is within an acceptable deviation range; for example, an acceptable deviation range for approximate equality could be within 5 percent. This application does not specifically limit the dimensions of the first through hole 209 and the second through hole 109.

[0115] In addition, refer to Figures 6 to 9 In some embodiments, the central axis of the first through hole 209 and the central axis of the second through hole 109 may coincide to improve the structural regularity of the transducer 10. When the size of the first through hole 209 is smaller than the size of the second through hole 109, it is beneficial to further improve the aesthetics of the appearance. When the size of the first through hole 209 is larger than the size of the second through hole 109, it is beneficial to improve the regularity of the accommodating space P, making it easier to place the device in the accommodating space P. Of course, in some other embodiments, the central axis of the first through hole 209 and the central axis of the second through hole 109 may not coincide, and this application does not limit this.

[0116] Figure 10A top view of another transducer provided in an embodiment of this application in a first direction; Figure 11 This is a top view of another transducer provided in an embodiment of this application, taken in a first direction. The view is provided to facilitate observation of the positional relationship between the piezoelectric layer 220 and the housing 100. Figure 10 and Figure 11 The transducer in the diagram omits the first and second electrode layers.

[0117] Furthermore, in some other embodiments, reference is made to... Figure 10 The piezoelectric layer 220 may have a first through-hole 209, while the housing 100 may not have a through-hole. Alternatively, in some other embodiments, refer to... Figure 11 Neither the piezoelectric layer 220 nor the housing 100 may have through holes. Here, the first surface M is the surface of the bottom plate 110 of the housing 100, and the first surface M can be, for example, a circular surface. The connection area between the piezoelectric layer 220 and the first surface M can be equal to the area of ​​the orthographic projection of the piezoelectric layer 220 onto the housing 100. The shape of the orthographic projection of the piezoelectric layer 220 onto the housing 100 can be, for example, annular or circular.

[0118] The shape of the piezoelectric layer 220 is not limited in the embodiments of this application. In some examples, the shape of the piezoelectric layer 220 can be a symmetrical pattern. For example, refer to... Figure 3 The piezoelectric layer 220 can be a centrally symmetrical shape. For example, the piezoelectric layer 220 can be an arc, a circle, a regular polygon, etc.

[0119] For example, refer to Figure 4 The piezoelectric layer 220 can be symmetrically arranged along the first reference line and the second reference plane. Both the first and second reference lines can be perpendicular to the first direction X, and the first reference line can be perpendicular to the second reference line. The extension direction of the first reference line can be the second direction Y, and the extension direction of the second reference line can be the third direction Z. That is, both the second direction Y and the third direction Z can be perpendicular to the first direction X, and the second direction Y can be perpendicular to the third direction Z.

[0120] Reference Figure 4 The dimension of the piezoelectric layer 220 along the second direction Y is not equal to the dimension of the piezoelectric layer 220 along the third direction Z. For example, the outer edge of the piezoelectric layer 220 can be elliptical, and the dimension of the piezoelectric layer 220 along the second direction Y can be smaller than the dimension of the piezoelectric layer 220 along the third direction Z.

[0121] With the above arrangement, in the direction where the piezoelectric layer 220 has a smaller size, the piezoelectric layer 220 can make room for more space, so as to increase the area of ​​the housing 100 exposed in the receiving space P, which is beneficial to increasing the number of devices disposed in the receiving space P.

[0122] In some examples, refer to Figure 5 The piezoelectric layer 220 can also be asymmetrical. For example, the piezoelectric layer 220 can also have a lug 208. Exemplarily, the lug 208 can extend away from the first through hole 209. The embodiments of this application do not specifically limit the shape of the lug 208. By providing the lug 208, when the second electrode layer 230 is provided on the piezoelectric layer 220, the second electrode layer 230 can cover the lug 208, which is beneficial to increase the area of ​​the second electrode layer 230 and facilitate the electrical connection between the second electrode layer 230 and the processing device of the electronic device 01.

[0123] Figure 12 A top view of another transducer provided in an embodiment of this application in a first direction; Figure 13 for Figure 12 A cross-sectional view of the transducer along section line AA; Figure 14 A top view of another transducer provided in an embodiment of this application in a first direction; Figure 15 for Figure 14 A cross-sectional view of the transducer along the BB section line.

[0124] As described in the above embodiments, at least a portion of the first electrode layer 210 is located between the housing 100 and the piezoelectric layer 220. In some embodiments, refer to Figure 12 and Figure 13 The first electrode layer 210 may be formed on the surface of the piezoelectric layer 220. Alternatively, in some embodiments, refer to... Figure 14 and Figure 15 The first electrode layer 210 can be formed on the surface of the housing 100.

[0125] Reference Figure 12 and Figure 13 As shown, an embodiment is described in which a first electrode layer 210 is formed on the surface of a piezoelectric layer 220. Exemplarily, the piezoelectric layer 220 may include a first sub-surface 221 and a second sub-surface 222 disposed opposite to each other along a first direction X. The sidewalls of the piezoelectric layer 220 are connected between the first sub-surface 221 and the second sub-surface 222, and the second sub-surface 222 is located between the first sub-surface 221 and the first surface M. For example, the first sub-surface 221 may be... Figure 13 The surface of the intermediate piezoelectric layer 220 away from the first surface M, and the second sub-surface 222 can be Figure 13 The medium piezoelectric layer 220 is located on the side of the first surface M.

[0126] The first electrode layer 210 may be disposed on at least a portion of the second sub-surface 222, at least a portion of the sidewalls of the piezoelectric layer 220, and a portion of the first sub-surface 221. For example, the first electrode layer 210 may be coated on at least a portion of the second sub-surface 222, at least a portion of the sidewalls of the piezoelectric layer 220, and a portion of the first sub-surface 221. For example, the first electrode layer 210 may cover at least a portion of the second sub-surface 222, and the first electrode layer 210 may extend from the second sub-surface 222 through the sidewalls of the piezoelectric layer 220 to the first sub-surface 221.

[0127] With the above configuration, the first electrode layer 210 can extend from the side of the piezoelectric layer 220 near the housing 100 to the side of the piezoelectric layer 220 away from the housing 100, so that the first electrode layer 210 can be electrically connected to the processing device located in the accommodating space P, which facilitates the extraction of the electrical signal of the first electrode layer 210.

[0128] Furthermore, the second electrode layer 230 may be disposed on a portion of the first sub-surface 221. For example, the second electrode layer 230 may be coated on a portion of the first sub-surface 221. The second electrode layer 230 and the first electrode layer 210 may be disposed alternately. For example, in a direction parallel to the piezoelectric layer 220, the first electrode layer 210 disposed on the first sub-surface 221 and the second electrode layer 230 disposed on the first sub-surface 221 may be disposed alternately. Through the above arrangement, electrical isolation can be achieved between the first electrode layer 210 and the second electrode layer 230, preventing short circuits between the first electrode layer 210 and the second electrode layer 230.

[0129] Based on the above structure, the transducer 10 may further include a connecting adhesive layer 240, which may be located between the first electrode layer 210 and the first surface M. During the assembly process of the transducer 10, the first electrode layer 210 and the second electrode layer 230 may be formed on the surface of the piezoelectric layer 220 to form a piezoelectric structure 200. After the piezoelectric structure 200 is formed, it can be connected to the housing 100 via the connecting adhesive layer 240. The connection area between the piezoelectric layer 220 and the first surface M can be understood as the area of ​​the connecting adhesive layer 240. This arrangement helps to improve the connection strength between the piezoelectric layer 220 and the first surface M.

[0130] Reference Figure 14 and Figure 15 As shown, an embodiment is illustrated in which a first electrode layer 210 is formed on a first surface M of the housing 100. Exemplarily, the first electrode layer 210 may be disposed on the first surface M. For example, the first electrode layer 210 may be coated on the first surface M.

[0131] In the first direction X, a portion of the first electrode layer 210 does not overlap with the piezoelectric layer 220. In some examples, the orthographic projection of the piezoelectric layer 220 onto the reference plane may lie within the orthographic projection of the first electrode layer 210 onto the reference plane, and the reference plane may be perpendicular to the first direction. The area of ​​the first electrode layer 210 may be larger than the area of ​​the piezoelectric layer 220. Alternatively, in some examples, the first electrode layer 210 may protrude beyond the piezoelectric layer 220 in the direction intersecting the first direction X. The area of ​​the first electrode layer 210 may be greater than, equal to, or smaller than the area of ​​the piezoelectric layer 220.

[0132] With the above configuration, the exposed portion of the first electrode layer 210 can be electrically connected to the processing device located in the accommodating space P, which facilitates the extraction of electrical signals from the first electrode layer 210.

[0133] Based on the above structure, the transducer 10 may further include a connecting adhesive layer 240, which may be located between the first electrode layer 210 and the piezoelectric layer 220. During the assembly of the transducer 10, a second electrode layer 230 may be formed on the surface of the piezoelectric layer 220, and a first electrode layer 210 may be formed on the first surface M of the housing 100. After forming the first electrode layer 210 and the second electrode layer 230, the piezoelectric layer 220 can be bonded to the first electrode layer 210 using the connecting adhesive layer 240. The connection area between the piezoelectric layer 220 and the first surface M can be understood as the area of ​​the connecting adhesive layer 240. This arrangement helps to improve the connection strength between the piezoelectric layer 220 and the first surface M.

[0134] Furthermore, the connecting adhesive layer 240 may include a conductive adhesive layer. For example, the conductive adhesive layer may be intermittently disposed between the piezoelectric layer 220 and the first electrode layer 210. Alternatively, the conductive adhesive layer may be continuously disposed between the piezoelectric layer 220 and the first electrode layer 210. With the above configuration, the stacked first electrode layer 210, connecting adhesive layer 240, piezoelectric layer 220, and second electrode layer 230 together constitute a piezoelectric structure 200. When an alternating current is applied to the first electrode layer 210 and the second electrode layer 230, the piezoelectric layer 220 can achieve longitudinal vibration.

[0135] In some embodiments, the adhesive layer 240 may include an insulating adhesive layer in addition to a conductive adhesive layer. The insulating adhesive layer may be adjacent to the conductive adhesive layer in a direction parallel to the piezoelectric layer 220.

[0136] In some embodiments, the Shore hardness of the adhesive layer 240 may be greater than or equal to 60 HD. For example, the Shore hardness of the adhesive layer 240 may be 60 HD, 70 HD, or 80 HD. This configuration allows the adhesive layer 240 to possess both structural strength and bending deformation capability.

[0137] In some embodiments, the thickness of the adhesive layer 240 can range from 10 micrometers to 150 micrometers. For example, the thickness of the adhesive layer 240 can be 10 micrometers, 40 micrometers, 70 micrometers, 100 micrometers, 130 micrometers, or 150 micrometers. This configuration allows the adhesive layer 240 to possess both structural strength and bending deformation capability.

[0138] Figure 16 This is a structural diagram of another electronic device provided in an embodiment of this application. Figure 17 An assembly structure diagram of a transducer device disposed in an electronic device according to an embodiment of this application; Figure 18 This is an assembly structure diagram of another transducer device provided in an embodiment of this application, disposed in an electronic device. Figure 16 and Figure 17 In this process, the assembly structure drawing may include a side view from one perspective and a top view from another perspective.

[0139] In some embodiments, combined with Figures 16 to 18 As shown, the electronic device 01 can also be a mobile terminal such as a mobile phone. Accordingly, the casing 20 of the mobile phone can include a middle frame 21 and a back cover 24. The display module 40 and the bottom cover 22 can be respectively disposed on both sides of the middle frame 21, and together with the middle frame 21, form an accommodating space P.

[0140] For example, refer to Figure 17 The housing 100 of the transducer 10 can be reused as the back cover 24 of a mobile phone; that is, the piezoelectric structure 200 of the transducer 10 can be disposed on the inner surface of the back cover 24 of the mobile phone. When the transducer 10 is working, the piezoelectric layer 220 can cause the back cover 24 of the mobile phone to bend and deform. When applied to underwater scenarios, the vibration of the back cover 24 of the mobile phone can drive the liquid medium to vibrate, thereby emitting sound waves and / or ultrasonic signals in the liquid medium.

[0141] For example, refer to Figure 18 The back cover 24 of the mobile phone may also include a camera appearance component 246, and the rear camera module of the mobile phone may be disposed within the camera appearance component 246. The housing 100 of the transducer 10 may be reused as the camera appearance component 246, that is, the piezoelectric structure 200 of the transducer 10 may be disposed within the inner surface of the camera appearance component 246. When the piezoelectric layer has a first through hole and the housing 100 includes a second through hole 109, the second through hole 109 may be reused as a camera hole on the camera appearance component 246. Alternatively, a through hole spaced apart from the camera hole may be formed on the camera appearance component 246 as the second through hole 109.

[0142] In some embodiments, when the electronic device 01 is a mobile terminal such as a mobile phone, the electronic device 01 may also include the functional devices and processing devices described in the above embodiments. For example, the functional devices may include at least one of a temperature sensor, a flow rate sensor, a depth sensor, a barometric pressure sensor, a salinity sensor, a light-emitting device, a smoke-generating device, and a positioning device. The usage scenarios of the functional devices and processing devices can be as described in the above embodiments, and will not be repeated here.

[0143] Figure 19 This is a structural diagram of another electronic device provided in an embodiment of this application. In some embodiments, the functional device 90 in the electronic device 01 may further include at least one of a temperature sensor, a flow rate sensor, a depth sensor, a barometric pressure sensor, a salinity sensor, a light-emitting device, a smoke-generating device, and a positioning device.

[0144] For example, when the functional device 90 is a detection device such as a temperature sensor, flow rate sensor, depth sensor, air pressure sensor, or salinity sensor, the electronic device 01 can obtain corresponding temperature information, flow rate information, depth information, pressure information, salinity information, etc. through the detection device. Since the functional device 90 is electrically connected to the transducer 10 through the processing device, the transducer 10 can use the above information as a carrier of sound waves and / or ultrasonic signals to realize information interaction with other electronic devices 01.

[0145] For example, electronic device 01 can be installed on an underwater accessory. When installed on an oxygen cylinder, electronic device 01 can monitor the equipment status and underwater conditions during a dive.

[0146] For example, when the functional device 90 is a positioning device, the electronic device 01 can obtain the corresponding position information through the positioning device, thereby realizing the positioning of the electronic device 01. In some embodiments, refer to Figure 20 As shown, the electronic device 01 can also be equipped with a buoyancy structure 80 such as a balloon, so that the electronic device 01 can be made into a buoy or other device to float on the water surface, and the position of the buoy can be positioned by a positioning device. Alternatively, the electronic device 01 can also be installed on a ship. Alternatively, the electronic device 01 can also be installed on a tower.

[0147] For example, when the functional device 90 is a light-emitting device, a smoke-emitting device, or the like, the electronic device 01 can be a distress signal device. The electronic device 01 can emit alarm signals through the light-emitting device or the smoke-emitting device so that the user can promptly detect the electronic device 01.

[0148] In some embodiments, the housing 100 of the electronic device may also have a second through-hole 109. Correspondingly, the piezoelectric layer 220 may have a first through-hole 209.

[0149] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A transducer, characterized in that, include: case; A piezoelectric structure is disposed on a first surface of the housing and is stacked with at least a portion of the housing along a first direction. The piezoelectric structure includes a first electrode layer, a piezoelectric layer, and a second electrode layer stacked along the first direction. The piezoelectric layer is located between the first electrode layer and the second electrode layer, and at least a portion of the first electrode layer is located between the housing and the piezoelectric layer. Wherein, the ratio of the connection area between the piezoelectric layer and the first surface to the area of ​​the first surface is greater than or equal to 0.

5.

2. The transducer according to claim 1, characterized in that, Along the first direction, the ratio of the thickness of the piezoelectric layer to the thickness of the shell ranges from 0.5 to 1.

5.

3. The transducer according to claim 1 or 2, characterized in that, The Vickers hardness of the shell ranges from 500HV to 3000HV.

4. The transducer according to any one of claims 1-3, characterized in that, The housing includes at least one of the following: a zirconia ceramic layer, a sapphire layer, a microcrystalline glass layer, an aluminum-magnesium alloy layer, a stainless steel layer, a titanium alloy layer, and a titanium metal layer.

5. The transducer according to any one of claims 1-4, characterized in that, The piezoelectric layer includes at least one of the following: a PZT4 material layer, a PZT5 material layer, a textured ceramic layer, a piezoelectric single crystal layer, and a piezoelectric layer.

6. The transducer according to any one of claims 1-5, characterized in that, The piezoelectric layer has a first through hole, and the housing has a second through hole communicating with the first through hole. In the first direction, the first through hole and at least a portion of the second through hole overlap.

7. The transducer according to claim 6, characterized in that, In the direction from the piezoelectric layer to the housing, a portion of the piezoelectric layer shields a portion of the second through-hole; or, in the direction from the housing to the piezoelectric layer, a portion of the housing shields a portion of the first through-hole.

8. The transducer according to claim 6 or 7, characterized in that, The size of the first through hole is smaller or larger than the size of the second through hole.

9. The transducer according to any one of claims 1-8, characterized in that, The transducer further includes a connecting adhesive layer located between the first electrode layer and the first surface.

10. The transducer according to claim 9, characterized in that, The piezoelectric layer includes a first sub-surface and a second sub-surface disposed opposite to each other along the first direction, the sidewall of the piezoelectric layer is connected between the first sub-surface and the second sub-surface, and the second sub-surface is located between the first sub-surface and the first surface; The first electrode layer is disposed on at least a portion of the second sub-surface, at least a portion of the sidewall of the piezoelectric layer, and a portion of the first sub-surface.

11. The transducer according to claim 10, characterized in that, The second electrode layer is disposed on a portion of the first sub-surface, and the second electrode layer and the first electrode layer are disposed at intervals.

12. The transducer according to any one of claims 1-8, characterized in that, The first electrode layer is disposed on the first surface; The transducer further includes a connecting adhesive layer located between the first electrode layer and the piezoelectric layer.

13. The transducer according to claim 12, characterized in that, In the first direction, a portion of the first electrode layer does not overlap with the piezoelectric layer.

14. The transducer according to claim 12 or 13, characterized in that, The connecting adhesive layer includes a conductive adhesive layer.

15. The transducer according to claim 9 or 12, characterized in that, The Shore hardness of the adhesive layer is greater than or equal to 60HD.

16. The transducer according to claim 9 or 12, characterized in that, The thickness of the adhesive layer ranges from 10 micrometers to 150 micrometers.

17. The transducer according to any one of claims 1-16, characterized in that, The housing includes a protrusion that protrudes away from the piezoelectric structure. The size of the protrusion is smaller than the size of the piezoelectric layer. The protrusion and the piezoelectric structure together enclose a cavity.

18. The transducer according to any one of claims 1-16, characterized in that, The dimensions of the piezoelectric layer in the second direction are not equal to those in the third direction. Both the second direction and the third direction are perpendicular to the first direction, and the second direction intersects the third direction.

19. An electronic device, characterized in that, It includes a housing and a transducer as described in any one of claims 1-18, wherein the housing and the housing of the transducer together enclose a receiving space, and the piezoelectric structure of the transducer is located within the receiving space.

20. The electronic device according to claim 19, characterized in that, The piezoelectric structure is used to drive the housing of the transducer to vibrate along a first direction, and the electronic device is used to send or receive communication signals, wherein the first direction is the stacking direction of the housing and the piezoelectric structure.

21. The electronic device according to claim 19 or 20, characterized in that, The electronic device further includes a functional device and a processing device, both of which are located within the accommodating space. The processing device is electrically connected to the first electrode layer and the second electrode layer of the piezoelectric structure, respectively, and is also electrically connected to the functional device.

22. The electronic device according to claim 21, characterized in that, The electronic devices include wearable devices.

23. The electronic device according to any one of claims 19-22, characterized in that, The functional device further includes a photoelectric sensor, wherein in the first direction, at least a portion of the photoelectric sensor, at least a portion of the first through-hole of the piezoelectric layer of the transducer, and at least a portion of the second through-hole of the housing of the transducer overlap.

24. The electronic device according to any one of claims 19-23, characterized in that, The functional device includes a charging coil and / or a pressure sensor, which are disposed in the cavity enclosed by the piezoelectric layer and the protrusion of the housing.

25. The electronic device according to any one of claims 19-24, characterized in that, The functional devices include at least one of the following: temperature sensor, flow rate sensor, depth sensor, air pressure sensor, salinity sensor, light-emitting device, smoke-generating device, and positioning device.

Images