Loudspeaker module and electronic device

Abstract

The utility model belongs to electroacoustic conversion technical field, and relates to a kind of loudspeaker module and electronic equipment, and loudspeaker module includes shell and sounding single body, shell is formed with the accommodation cavity having opening;Electrical conducting piece is arranged on the spider of sounding single body, and electrical conducting piece includes two first pads with voice coil of sounding single body conducting and two second pads with two first pads conducting and extending to the outside of spider;Wherein, sounding single body and electrical conducting piece are accommodated in accommodation cavity, and two second pads are set towards opening, and second pad is used to the opening end assembly of shell is connected with the electrical connection device of electronic equipment to realize electrical signal conduction when being connected to electronic equipment.The above structure can reduce the overall thickness of loudspeaker module, and then electronic equipment can be adapted to the requirement of light and thin, while it can also reduce the material cost of loudspeaker module, labor cost, improve the assembly efficiency of product, improve the assembly yield of product.

Description

Technical Field

[0001] This utility model belongs to the field of electroacoustic conversion technology, and specifically relates to a loudspeaker module and electronic equipment. Background Technology

[0002] A loudspeaker module is an electroacoustic conversion device that is commonly used as a sound-generating structure in electronic devices.

[0003] With technological advancements, electronic products are not only demanding higher performance but also becoming increasingly thinner and lighter. Correspondingly, speaker modules must not only adapt to reduced space but also achieve improved performance. Therefore, ensuring speaker module performance within a limited space is a critical issue that urgently needs to be addressed.

[0004] Therefore, in view of the above shortcomings, this utility model is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a speaker module and electronic device to at least partially solve the above-mentioned technical problems.

[0006] The first aspect of this utility model provides a speaker module, comprising:

[0007] A housing having a receiving cavity with an opening;

[0008] A sound-generating unit, wherein an electrical conductive element is provided on the frame of the sound-generating unit, the electrical conductive element including two first pads connected to the voice coil of the sound-generating unit and two second pads respectively connected to the two first pads and extending to the outside of the frame;

[0009] The sound-generating unit and the electrical conductive component are both housed within the receiving cavity, and the two second pads are arranged facing the opening. The second pads are used to connect with the electrical connection devices of the electronic device when the housing is assembled to the electronic device to achieve electrical signal conduction.

[0010] The speaker module provided by this utility model can also have the following additional technical effects:

[0011] In one specific embodiment of this utility model, the electrical conductive component is a steel sheet, a PCB, or a laser-engraved circuit board;

[0012] And / or, the electrical connection device of the electronic device abuts against the second pad to achieve electrical connection.

[0013] In one specific embodiment of this utility model, an annular baffle wall protrudes from the inner wall of the housing, and the baffle wall defines the mounting position of the sound-generating unit.

[0014] In one specific embodiment of this utility model, the outer periphery of the retaining wall is further provided with a boss, which is correspondingly provided with the second pad and adapted to support the second pad.

[0015] In one specific embodiment of this utility model, the electrical conductive component includes an inner connecting part and an outer connecting part. The inner connecting part is a centering support plate, which is connected between the frame and the voice coil. The end of the centering support plate that is connected to the voice coil is provided with the first solder pad, and the end of the outer connecting part that is away from the inner connecting part is provided with the second solder pad.

[0016] In one specific embodiment of this utility model, an annular sealing ring is further included, which is disposed between the housing and the electronic device.

[0017] In one specific embodiment of this utility model, the sound-emitting unit and the shell enclose to form a front cavity, and the sound-emitting unit, the shell, and the outer shell enclose to form a rear cavity.

[0018] In one specific embodiment of this utility model, a sound outlet is also formed on the housing, and the sound outlet communicates with the front cavity.

[0019] A second aspect of this utility model also provides an electronic device, including a housing and a speaker module as described in any one of the above, wherein the speaker module is adapted to be installed in the housing and is elastically connected to the electrical connection device of the electronic device through a second solder pad.

[0020] In one specific embodiment of this utility model, the electrical connection device includes a spring, a spring pin, a probe, a connector, a cable wire, or a flying wire.

[0021] The speaker module provided by this utility model includes a housing and a sound-generating unit. The housing has an open receiving cavity, which, during assembly, adapts to the outer casing of the electronic device to form a complete cavity. Compared to the full-cavity speaker modules in related technologies, the semi-cavity housing used in this utility model reduces the overall thickness of the speaker module without affecting its acoustic performance, thus meeting the increasingly thinner and lighter requirements of electronic devices. Simultaneously, by making the second solder pad extending from the frame on the sound-generating unit electrically connected to the electronic device, one FPCB material is eliminated compared to existing technologies, thereby reducing material costs. Correspondingly, this not only reduces the two soldering processes required to connect the FPCB material in existing technologies, thus improving product assembly yield and enhancing the quality stability of the speaker module, but also reduces the number of FPCB assembly stations, decreasing direct manpower for assembly and inspection, reducing labor costs, and improving production efficiency. Attached Figure Description

[0022] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the speaker module in one embodiment of the present invention;

[0024] Figure 2 for Figure 1 Schematic diagram of the middle shell structure;

[0025] Figure 3 This is a schematic diagram of the connection structure between the speaker module and the motherboard of an electronic product in one embodiment;

[0026] Figure 4 for Figure 3 Schematic diagram of the middle section;

[0027] Figures 5-6 These are top and bottom views of the sound-emitting unit, respectively.

[0028] Figure 7 This is an exploded structural diagram of the sound-producing monomer.

[0029] Explanation of reference numerals in the attached figures:

[0030] 100-Speaker Module;

[0031] 10-Housing shell, 11-Receiving cavity, 12-Mounting hole, 13-Baffle, 14-Boss, 15-Sound outlet, 16-Mounting position;

[0032] 20-Sound-generating unit, 201-Magnetic yoke, 202-Magnet, 203-Voice coil, 204-Diaphragm; 21-Basin frame, 22-Electrical conduction component, 23-Inner connection part, 24-Outer connection part, 25-First solder pad, 26-Second solder pad;

[0033] 30 - Sealing ring, 40 - Dustproof mesh;

[0034] 200 - Mainboard, 210 - Electrical connection device. Detailed Implementation

[0035] Exemplary embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0036] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0037] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0038] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented as "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0039] This utility model proposes a speaker module 100, which can be used as a sound-generating component of electronic devices. The speaker module 100 can not only maintain its sound performance while reducing its thickness, but also reduce its material cost, thereby adapting to the trend of increasingly thinner and lighter electronic devices and meeting the performance requirements of electronic devices.

[0040] Reference Figures 1-7 The first aspect of this utility model provides a loudspeaker module 100, including a housing 10 and a sound-emitting unit 20. The housing 10 forms a receiving cavity 11 with an opening. An electrical conductive element 22 is provided on the frame 21 of the sound-emitting unit 20. The electrical conductive element 22 includes two first pads 25 that are conductive to the voice coil of the sound-emitting unit 20 and two second pads 26 that are conductive to the two first pads 25 and extend to the outside of the frame 21. The sound-emitting unit 20 and the electrical conductive element 22 are both housed in the receiving cavity 11, and the two second pads 26 are arranged facing the opening. The second pads 26 are used to connect with the electrical connection device 210 of the electronic device when the housing 10 is assembled to the outer shell of the electronic device to realize the conduction of electrical signals.

[0041] Specifically, the sound-generating unit 20 has a sound-generating function and typically includes a frame 21, an electrical conductor 22, a magnetic circuit system, and a vibration system. The frame 21 is formed as a hollow frame structure. The magnetic circuit system includes a magnetic yoke 201 and multiple magnets 202 disposed on the same side of the magnetic yoke and forming a magnetic gap. The magnetic circuit system is connected to one side of the frame through the magnetic yoke 201 and / or the magnets 202. The vibration system includes a diaphragm 204 and a voice coil 203 connected to the side of the diaphragm. The diaphragm is connected to the other side of the frame 21 opposite to the magnetic circuit system, and the end of the voice coil 203 away from the diaphragm 204 is inserted into the magnetic gap. The electrical conductive element 22 is connected to the frame 21 and includes two first pads 25 and two second pads 26. The two first pads 25 are located inside the frame 21, and each first pad 25 is electrically connected to one second pad 26. One first pad 25 is connected to the input terminal of the voice coil, and the other first pad 25 is connected to the output terminal of the voice coil. The two second pads 26 are located outside the frame 21, and each second pad 26 is electrically connected to the two first pads 25. The two second pads 26 are used to connect to an external power supply circuit, so that an external electrical signal can be introduced into the voice coil. When energized, the voice coil can vibrate in the magnetic gap, thereby driving the diaphragm to vibrate and produce sound.

[0042] The housing 10 includes a base plate and side plates, wherein the side plates are connected to the outer periphery of the base plate, thus forming a receiving cavity 11 with an opening. The sound-generating unit 20 and the electrical conductive element 22 are both fixed in the receiving cavity 11, and the two second pads 26 are both arranged facing the opening.

[0043] When assembling the speaker module 100, the open side of the housing 10 is sealed and installed onto the outer shell of the electronic device, that is, the housing 10 of the speaker module 100 and the outer shell of the electronic device are adapted to form a complete cavity. At the same time, the two second solder pads 26 of the electrical conductive component 22 are electrically connected to the electrical connection device 210 of the electronic device, thereby realizing the electrical signal conduction between the speaker module 100 and the electronic device. The electrical connection method between the electrical conductive component 22 and the electrical connection device 210 can be contact connection, welding connection, elastic contact connection, etc.

[0044] The speaker module 100 provided in this embodiment includes a housing 10 and a sound-emitting unit 20. The housing 10 has an open receiving cavity 11, which, during assembly, adapts to the outer casing of the electronic device to form a complete cavity. Compared to the full-cavity speaker module 100 in related technologies, the semi-cavity housing 10 used in this embodiment reduces the overall thickness of the speaker module 100 without affecting its acoustic performance, thus meeting the increasingly thinner and lighter requirements of electronic devices. Simultaneously, by making the second solder pad 26 extending from the frame 21 on the sound-emitting unit 20 electrically connected to the electronic device, one FPCB material is reduced compared to the prior art, thereby reducing material costs. Correspondingly, this not only reduces the two soldering processes required to connect the FPCB material in the prior art, thus improving product assembly yield and enhancing the quality stability of the speaker module 100, but also reduces the number of FPCB assembly stations, decreasing direct manpower for assembly and inspection, reducing labor costs, and improving production efficiency.

[0045] In some embodiments, the conductive element 22 is a steel sheet, a PCB, or a laser-engraved circuit board.

[0046] Specifically, the conductive component 22 can be a steel sheet, a PCB, or a laser-engraved circuit board. The specific choice can be made according to the actual application requirements.

[0047] In some embodiments, the electrical connection device of the electronic device abuts against a second pad to achieve electrical connection.

[0048] Specifically, the electrical connector is positioned corresponding to the second solder pad. Thus, when the speaker module is fixedly connected to the electronic device housing, the electrical connector abuts against the second solder pad to achieve electrical connection. This arrangement simplifies the assembly process between the speaker module and the electronic device, thereby improving assembly efficiency.

[0049] In some embodiments, the electrical conductor 22 includes an inner connection portion 23 and an outer connection portion 24. The inner connection portion 23 is a centering support piece connected between the frame 21 and the voice coil. The end of the centering support piece that is connected to the voice coil is provided with a first pad 25. The end of the outer connection portion 24 that is away from the inner connection portion 23 is provided with a second pad 26.

[0050] Specifically, in this embodiment, the electrical conductive component 22 and the basin frame 21 are separate structures. The inner connecting part 23 can be a centering support plate, which is connected to the basin frame 21 by bonding or clamping. The outer connecting part 24 is integrally formed with the centering support plate, thereby realizing the connection between the electrical conductive component 22 and the basin frame 21.

[0051] The centering support is connected to the voice coil and is adapted to reduce the polarization of the voice coil. At the same time, the end of the centering support connected to the voice coil is also provided with a first pad 25, and is electrically connected to the lead of the voice coil through the first pad 25. The external connection part 24 is provided with a second pad 26, which is used for electrical connection with the electrical connection device 210, thus realizing the conduction of the voice coil with the external power supply.

[0052] In some embodiments, the inner wall of the housing 10 opposite to the opening is provided with an annular baffle 13, which defines the mounting position 16 of the sound-emitting unit 20.

[0053] Specifically, the baffle 13 is formed on the bottom plate of the housing 10, and the shape of the mounting position 16 is approximately the same as that of the sound-generating unit 20. The sound-generating unit 20 is placed in the mounting position 16 with the vibration system side facing the bottom plate, and is fixedly connected to the housing 10 by adhesive. The side of the sound-generating unit 20 is adapted to and limited by the baffle 13.

[0054] In this embodiment, by setting a barrier wall 13 that defines the mounting position 16, it is possible to facilitate the relative positioning of the housing 10 and the sound-generating unit 20, thereby improving the positioning accuracy. On the other hand, the barrier wall 13 can also block the splashing of adhesive, thereby improving the aesthetics of the speaker module 100.

[0055] In some embodiments, the outer periphery of the retaining wall 13 is also provided with a boss 14, which is correspondingly provided with the second pad 26 and is adapted to support the second pad 26.

[0056] In this embodiment, by providing a boss 14 to support the second pad 26, it is possible to prevent the second pad 26 with contact connection or elastic contact connection from breaking the circuit with the electrical connection device 210 due to the deformation of the second pad 26, thereby ensuring the reliability of the connection between the two.

[0057] In some embodiments, the outer periphery of the housing 10 is further provided with a plurality of mounting holes 12, and the housing 10 is connected to the electronic device by screws passing through the mounting holes 12. By using screws to connect the speaker module 100 to the housing of the electronic device, the reliability of the connection between the two can be improved.

[0058] In some embodiments, an annular sealing ring 30 is also included, which is disposed between the housing 10 and the electronic device. Specifically, the sealing ring 30 has a shape that is substantially the same as that of the housing 10 and is clamped between the housing 10 and the outer casing of the electronic device during assembly, thereby ensuring the sealing of the housing 10 and thus ensuring the performance of the speaker module 100.

[0059] In some embodiments, the sound-emitting unit 20 and the housing 10 enclose a front cavity, and the sound-emitting unit 20, the housing 10, and the outer shell enclose a rear cavity; a sound outlet 15 is also formed on the housing 10, and the sound outlet 15 communicates with the front cavity. The sound waves generated by the vibration system in the sound-emitting unit 20 are transmitted from the front cavity to the outside of the speaker module 100 through the sound outlet 15. Optionally, a dustproof mesh 40 is also provided at the sound outlet 15 to improve the dustproof performance of the speaker module 100.

[0060] A second aspect of this utility model also provides an electronic device, including a housing and a speaker module 100 as described above. The speaker module 100 is adapted to be installed in the housing and is elastically connected to the electrical connection device 210 of the electronic device via a second solder pad 26. Specifically, the structure of the speaker module 100 refers to the above embodiments. Since the electronic device includes the speaker module 100 in all the above embodiments, it also includes at least all the beneficial effects of the above embodiments, which will not be elaborated here.

[0061] In some embodiments, the electrical connection device 210 includes a spring, a spring pin, a probe, a connector, a cable wire, or a flying wire. Specifically, the spring, spring pin, or probe can be elastically connected to the second pad 26, the connector can be plugged into the second pad 26, and the cable wire or flying wire can be soldered to the second pad 26. In practical applications, any of the above-mentioned electrical connection devices 210 can be selected as needed.

[0062] In this embodiment, the electrical connection device 210 is connected to the motherboard 200 of the electronic device. When the electrical connection device 210 is connected to the second pad 26, the motherboard 200 is connected to the voice coil of the sound-generating unit 20, thereby enabling control of the voice coil current to control the sound generation of the sound-generating unit 20.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A speaker module, characterized in that, include: A housing having a receiving cavity with an opening; A sound-generating unit, wherein an electrical conductive element is provided on the frame of the sound-generating unit, the electrical conductive element including two first pads connected to the voice coil of the sound-generating unit and two second pads respectively connected to the two first pads and extending to the outside of the frame; The sound-generating unit and the electrical conductive component are both housed within the housing cavity, and the two second pads are positioned facing the opening. The second pads are used to connect with the electrical connection devices of the electronic device when the opening end of the housing is assembled to the electronic device to achieve electrical signal conduction.

2. The speaker module according to claim 1, characterized in that, The electrical conductive component is a steel sheet, PCB, or laser-engraved circuit board; And / or, the electrical connection device of the electronic device abuts against the second pad to achieve electrical connection.

3. The speaker module according to claim 1, characterized in that, The inner wall of the housing is provided with an annular baffle, which defines the mounting position of the sound-generating unit.

4. The speaker module according to claim 3, characterized in that, The outer periphery of the retaining wall is also provided with a boss, which is correspondingly provided with the second pad and is adapted to support the second pad.

5. The speaker module according to claim 1, characterized in that, The electrical conductive component includes an inner connection portion and an outer connection portion. The inner connection portion is a centering support plate, which is connected between the frame and the voice coil. The end of the centering support plate that is connected to the voice coil is provided with the first pad, and the end of the outer connection portion that is away from the inner connection portion is provided with the second pad.

6. The speaker module according to claim 1, characterized in that, It also includes an annular sealing ring disposed between the housing and the electronic device.

7. The speaker module according to claim 1, characterized in that, The sound-emitting unit and the housing together form a front cavity, and the sound-emitting unit, the housing, and the outer shell of the electronic device together form a rear cavity.

8. The speaker module according to claim 7, characterized in that, The housing also has a sound outlet, which is connected to the front cavity.

9. An electronic device, characterized in that, The device includes a housing and a speaker module as described in any one of claims 1-8, wherein the speaker module is adapted to be installed in the housing and is elastically connected to the electrical connection device of the electronic device via the second pad.

10. The electronic device according to claim 9, characterized in that, The electrical connection devices include spring contacts, spring pins, probes, connectors, cable wires, or flying wires.

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