A wireless transmission device and a computer device

Abstract

The application relates to a wireless transmission device and a computer device. The wireless transmission device comprises a packaging substrate and at least two data interaction modules, each of the data interaction modules is connected with a wireless communication unit, and the data interaction modules and the wireless communication units are arranged on the packaging substrate; each of the data interaction modules communicates with other data interaction modules through the corresponding connected wireless communication unit. By adopting the wireless transmission device, wiring complexity can be reduced, signal interference can be reduced, and the flexibility and expandability of the overall device can be improved.

Description

Technical Field

[0001] This application relates to the field of computer technology, and in particular to a wireless transmission device and a computer equipment. Background Technology

[0002] With the rapid development of information technology, the demand for data processing is increasing day by day, and traditional wired communication systems face many challenges in intra-module communication.

[0003] Large-scale integration (LMI) technology, as an advanced packaging method, integrates key components of computer devices into a single package, effectively improving system integration and performance. However, communication between the individual modules within the package primarily relies on wired connections, which not only limits system flexibility and scalability but also increases signal interference and power consumption issues. Utility Model Content

[0004] Therefore, it is necessary to provide a wireless transmission device and computer equipment that can reduce wiring complexity, reduce signal interference, and improve the overall flexibility and scalability of the device.

[0005] In a first aspect, this application provides a wireless transmission device, the device comprising:

[0006] The package substrate and at least two data interaction modules, each of the data interaction modules being connected to a wireless communication unit, the data interaction modules and the wireless communication units being disposed on the package substrate;

[0007] Each of the data interaction modules communicates with other data interaction modules through a corresponding connected wireless communication unit.

[0008] In some embodiments of the device, the wireless communication unit includes a transmitting module, a receiving module, a transmitting antenna, and a receiving antenna.

[0009] In some embodiments of the device, the transmitting module includes a digital-to-analog converter, a first filter, a first mixer, and a first radio frequency signal amplifier.

[0010] In some embodiments of the device, the receiving module includes an analog-to-digital converter, a second filter, a second mixer, and a second radio frequency signal amplifier.

[0011] In some embodiments of the device, the transmitting antenna includes multiple first antenna elements in different frequency bands, and the receiving antenna includes multiple second antenna elements in different frequency bands.

[0012] In some embodiments of the device, each of the data interaction modules is connected to the corresponding wireless communication unit via a metal interconnect layer of the packaging substrate.

[0013] In some embodiments of the device, the device further includes a silicon interposer, each of the data interaction modules and the corresponding wireless communication unit are connected via traces in the silicon interposer, each of the data interaction modules and the corresponding wireless communication unit are arranged on the same side of the silicon interposer, and the other side of the silicon interposer is connected to the packaging substrate.

[0014] In some embodiments of the device, a first microbump is also included, through which the wireless communication unit is connected to the corresponding data interaction module.

[0015] In some embodiments of the device, a second microbump is also included, through which the data interaction module is connected to the packaging substrate.

[0016] In some embodiments of the device, the wireless communication unit is positioned directly above the data interaction module.

[0017] According to a second aspect of the present disclosure, a computer device is provided, the computer device including the wireless transmission device described above.

[0018] The wireless transmission device and computer equipment provided in this application embodiment enable efficient wireless data transmission between data interaction modules through corresponding wireless communication units. Compared to traditional wired connections, this eliminates the need for laying a large number of metal traces within the substrate, reducing circuit complexity. The wireless communication unit and data interaction module can be connected via short-distance substrate traces or other methods, with negligible trace loss. Compared to traditional long-distance trace substrate designs, this reduces signal loss. Furthermore, wireless data transmission allows for improved signal quality and transmission distance through beamforming technology, making it applicable in high-interference environments.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A wireless transmission device according to one embodiment is shown;

[0022] Figure 2 Show Figure 1A structure of a wireless communication unit;

[0023] Figure 3 Show Figure 1 Another structure for wireless communication units;

[0024] Figure 4 The diagram illustrates the specific communication interaction between the data interaction module and the wireless communication unit.

[0025] Figure 5 A schematic diagram showing the connection structure of the data interaction module and the wireless communication unit using a substrate wiring method is shown.

[0026] Figure 6 A schematic diagram showing the connection structure of the data interaction module and the wireless communication unit using a silicon interposer is provided.

[0027] Figure 7 The diagram shows a connection structure using micro-bumps between the data interaction module and the wireless communication unit.

[0028] Explanation of reference numerals in the attached figures: 100, packaging substrate; 200, data interaction module; 300, wireless communication unit; 310, transmitting module; 311, digital-to-analog converter; 312, first filter; 313, first mixer; 314, first radio frequency signal amplifier; 320, receiving module; 321, analog-to-digital converter; 322, second filter; 323, second mixer; 324, second radio frequency signal amplifier; 330, transmitting antenna; 340, receiving antenna; 400, metal interconnect layer; 500, silicon interposer; 600, first microbump; 700, second microbump. Detailed Implementation

[0029] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0031] It is understood that the terms "first," "second," etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first filter may be referred to as a second filter, and similarly, a second filter may be referred to as a first filter. Both the first filter and the second filter are filters, but they are not the same filter.

[0032] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0033] It is understandable that "at least one" refers to one or more, and "multiple" refers to two or more. "At least a part of an element" refers to part or all of an element.

[0034] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0035] like Figure 1 As shown, one embodiment of the wireless transmission device includes a packaging substrate 100 and at least two data interaction modules 200. Each data interaction module 200 is connected to a wireless communication unit 300, and the data interaction modules 200 and the wireless communication units 300 are disposed on the packaging substrate 100. Each data interaction module 200 communicates with other data interaction modules 200 through its corresponding connected wireless communication unit 300.

[0036] In some embodiments, the packaging substrate 100 typically refers to the core carrier and interconnect structure in a semiconductor package, and is a high-density, multi-layered, precision-manufactured circuit board. The data interaction module 200 typically refers to a set of core functional units in a server responsible for the efficient and reliable transmission of data and control signals between different components, subsystems, or devices. The data interaction module 200 may include chip-level interaction modules or board-level interaction modules. Chip-level interaction modules may include memory controllers, PCIe (peripheral component interconnect express, high-speed serial computer expansion bus standard) controllers, etc. Board-level interaction modules may include storage controllers, network interface controllers, and board management controllers, etc. The wireless communication unit 300 typically refers to a hardware device integrating wireless communication protocols, radio frequency circuits, antenna interfaces, and a main control chip. The wireless communication unit 300 is connected to the data interaction module 200, and can achieve efficient data transmission and low-power operation between the corresponding data interaction module 200 and other data interaction modules 200. The wireless communication unit 300 can be responsible for wireless data transmission and reception, realizing wireless data transmission between modules and devices.

[0037] In some embodiments provided in this disclosure, data interaction modules 200 and data interaction modules 200 can achieve efficient wireless data transmission through corresponding wireless communication units 300. Compared with traditional wired connections, it is not necessary to lay a large number of metal traces in the substrate, which can reduce the complexity of the circuit. The wireless communication unit 300 and the data interaction module 200 can be connected through short-distance substrate traces or other means, and the trace loss is negligible. Compared with the traditional long-distance trace substrate design, signal loss can be reduced. In addition, through wireless data transmission, beamforming technology can be used to improve signal quality and transmission distance, which can be applied in high interference environments.

[0038] In some embodiments, the wireless communication unit 300 includes a transmitting module 310, a receiving module 320, a transmitting antenna 330, and a receiving antenna 340.

[0039] In some examples, the wireless communication unit 300 can be a wireless communication module, which includes a TX module (i.e., the aforementioned transmitting module 310), an RX module (i.e., the aforementioned receiving module 320), a TX antenna (i.e., the aforementioned transmitting antenna 330), an RX antenna (i.e., the aforementioned receiving antenna 340), and a substrate. Figure 2 As shown, the wireless communication module can be connected to the transmitting module 310, the receiving module 320, the transmitting antenna 330, and the receiving antenna 340 via substrate traces. In other examples, such as Figure 3 As shown, the wireless communication unit 300 can also be integrated onto the same silicon chip to form an on-chip wireless communication module.

[0040] In some embodiments provided in this disclosure, the substrate wiring wireless communication module can be used as a form of wireless communication unit 300. The modular design combined with the substrate wiring reduces the technical threshold while retaining the flexibility of antenna layout and frequency band switching. Alternatively, it can be integrated as an on-chip wireless communication module as another form of wireless communication unit 300, achieving low-latency and low-power wireless communication through monolithic integration.

[0041] In some embodiments, such as Figure 4 As shown, the transmitting module 310 includes a digital-to-analog converter 311, a first filter 312, a first mixer 313, and a first radio frequency signal amplifier 314.

[0042] In some embodiments provided in this disclosure, the digital-to-analog converter 311 typically refers to a D / A converter, or DAC for short, an electronic component that converts discrete digital signals into continuously varying analog signals. The D / A converter 311 may include a weighted resistor network, an operational amplifier, a reference power supply, and analog switches. The first filter 312 typically refers to a transmitter filter. The transmitter filter's main function is to filter out high-frequency harmonic noise from the D / A converter output, prevent intermodulation interference introduced by the first mixer 313, protect the first mixer 313, and maintain system stability. The first mixer 313 converts the baseband signal to radio frequency, enabling it to be transmitted through a wireless transmission system. The first radio frequency signal amplifier 314 typically refers to a component that amplifies the modulated radio frequency signal to sufficient power, ensuring that the signal can be transmitted over long distances through an antenna. After the signal from the data interaction module 200 passes through the digital-to-analog converter 311, the first filter 312, the first mixer 313, and the first radio frequency signal amplifier 314 in sequence, it can be converted into electromagnetic waves propagating in free space through the transmitting antenna 330, realizing the physical form conversion of electrical signals into radio waves and transmitting radio waves.

[0043] In some embodiments provided in this disclosure, the transmitting module 310 can realize the conversion from electrical signals to radio electromagnetic waves through the transmission link of digital-to-analog converter 311, first filter 312, first mixer 313, first radio frequency signal amplifier 314, and transmitting antenna 330, ensuring the integrity of data in wireless transmission. This can solve the problems of signal attenuation and poor anti-interference ability in traditional wired connections. It can also achieve long-distance communication with low power consumption through dynamic amplification and directional radiation.

[0044] In some embodiments, such as Figure 4 As shown, the receiving module 320 includes an analog-to-digital converter 321, a second filter 322, a second mixer 323, and a second radio frequency signal amplifier 324.

[0045] In some embodiments provided in this disclosure, the analog-to-digital converter 321 typically refers to an A / D converter, or simply ADC, which is an electronic component that converts analog signals into digital signals. The analog-to-digital converter 321 typically converts an input voltage signal into an output digital signal. Since digital signals themselves do not have practical meaning, but only represent a relative magnitude, any analog-to-digital converter 321 needs a reference analog quantity as a conversion standard. A common reference standard is the maximum convertible signal size. The output digital quantity represents the magnitude of the input signal relative to the reference signal. The receiving antenna 340 typically refers to an antenna structure that captures electromagnetic wave energy in space through its physical structure (such as a dipole, microstrip patch, etc.) and converts it into a high-frequency current or guided wave signal. The second radio frequency signal amplifier 324, as the first stage of the receiving link, is responsible for amplifying the weak radio frequency signal captured by the antenna to a processable level, providing a sufficiently strong input signal for subsequent circuits such as the second mixer 323 and demodulation circuits. The second mixer 323 in the receiving module 320 nonlinearly mixes the received high-frequency radio frequency signal with the local oscillator signal to generate a new frequency component containing the intermediate frequency (IF), realizing the conversion of the high-frequency signal to the low-frequency signal, which facilitates subsequent filtering, amplification, and demodulation. The signal output by the second mixer 323 contains interference components such as the target IF, the image frequency, and mixing products. The second filter 322 filters out spurious signals from non-target frequency bands through its bandpass characteristics, ensuring that only the effective IF or baseband signal enters the analog-to-digital converter 321, preventing interference signals from entering subsequent processing links. The analog-to-digital converter 321 converts the filtered and amplified analog signal (such as the IF or baseband signal) into a digital signal, providing a programmable and storable digital data stream for subsequent digital signal processing. The phase-locked loop (PLL) can generate a high-precision, tunable carrier frequency to meet the requirements of different communication standards. In frequency modulation and demodulation, the PLL extracts the modulation signal from the voltage-controlled oscillator control voltage by tracking the frequency changes of the input signal.

[0046] In some embodiments provided in this disclosure, the receiving module 320 can achieve high-precision conversion from radio electromagnetic waves to digital signals through the transmission link of the receiving antenna 340, the second radio frequency signal amplifier 324, the second mixer 323, the second filter 322 and the analog-to-digital converter 321, ensuring the integrity of data in wireless transmission and solving problems such as signal attenuation and poor anti-interference ability in traditional wired connections. Through frequency synchronization and dynamic power consumption control, the wireless transmission system achieves low power consumption and high efficiency operation, realizing long-distance communication under the premise of low power consumption.

[0047] In some embodiments, the transmitting antenna 330 includes a plurality of first antenna elements in different frequency bands, and the receiving antenna 340 includes a plurality of second antenna elements in different frequency bands.

[0048] Some embodiments provided in this disclosure allow for the selection of different frequency bands for wireless communication transmission based on application scenarios, transmission distances, and bandwidth requirements. The first antenna element typically refers to the antenna element used for transmitting signals, and the second antenna element typically refers to the antenna element used for receiving signals. Frequency bands can include low-frequency bands, mid-frequency bands, millimeter-wave bands, and other frequency bands. Low-frequency bands can include the Sub-1GHz low-frequency band, which can be applied to long-distance transmission and low-power scenarios; mid-frequency bands can include 1-6GHz, which can be applied to transmission scenarios balancing coverage and capacity; millimeter-wave bands can include, for example, 24GHz, 60GHz, 77GHz, 28GHz, and 39GHz, which can be applied to high-transmission-rate and short-distance scenarios. In some examples, the low-frequency array can employ dipole or patch antennas to enhance penetration; the high-frequency array can employ compact antennas or microstrip antennas to support high-density integration. In some examples, dynamic frequency selection technology can be used to automatically select the optimal communication frequency based on channel quality, reducing interference. By integrating antenna elements of multiple frequency bands, a single physical structure can support parallel operation of different communication frequency bands. Beamforming can also be achieved using antenna arrays, which is essentially spatial filtering. It utilizes the coherent superposition characteristics of electromagnetic waves to enhance the signal strength in the target direction while suppressing interference or noise from other directions. This can improve signal quality and transmission distance, especially in high-interference environments.

[0049] In some embodiments provided in this disclosure, an antenna array integrating different frequency bands can enable the wireless transmission device to support multiple communication standards simultaneously, improving compatibility and flexibility; and dynamic frequency selection technology can be used to automatically select the optimal communication frequency based on channel quality, reducing signal interference.

[0050] In some embodiments, such as Figure 5 As shown, each of the data interaction modules 200 and the corresponding wireless communication unit 300 are connected through the metal interconnect layer 400 of the packaging substrate 100.

[0051] In some examples, the data interaction module 200 and the wireless communication unit 300 can be directly connected through the metal interconnect layer 400 of the packaging substrate 100; that is, the data interaction module 200 and the wireless communication unit 300 can be directly interconnected through traces on the packaging substrate 100. In other examples, the traces between the data interaction module 200 and the wireless communication unit 300 can be very short, allowing them to be approximately grouped into a single module. This provides greater flexibility in the layout of the different data interaction modules 200 on the packaging substrate 100, eliminating limitations on spatial density and layout distance compared to traditional substrate wiring methods.

[0052] In some embodiments of this disclosure, by connecting the data interaction module 200 and the wireless communication unit 300 through the metal interconnect layer 400 of the packaging substrate 100, compared with the traditional substrate wiring connection method, the data interaction module 200 and the wireless communication unit 300 can be approximately formed into a module, so that the limitations of spatial layout density and layout distance do not need to be considered, and the layout freedom of the data interaction module 200 on the packaging substrate 100 can be improved.

[0053] In some embodiments, such as Figure 6 As shown, the device also includes a silicon interposer 500. Each data interaction module 200 and the corresponding wireless communication unit 300 are connected through a trace in the silicon interposer 500. Each data interaction module 200 and the corresponding wireless communication unit 300 are arranged on the same side of the silicon interposer 500. The other side of the silicon interposer 500 is connected to the packaging substrate 100.

[0054] In some embodiments of this disclosure, the silicon interposer 500 typically refers to a high-end interconnect substrate manufactured based on a single-crystal silicon wafer, primarily used in 2.5D / 3D packaging to achieve high-density electrical connections between multiple chips. Through micron-level wiring and through-silicon via (TSV) technology, it overcomes the interconnect density limitations of traditional PCB (Printed Circuit Board) substrates, providing a low-latency, high-bandwidth integration solution for high-performance chips. TSV technology typically refers to the technique of forming micro-holes with a diameter of 5-20 μm and a depth of 50-100 μm on a silicon substrate using deep reactive ion etching, filling them with copper to form vertical interconnect channels, and achieving three-dimensional electrical connections between chips. In some examples, the data interaction module 200 and the corresponding wireless communication unit 300 can be connected first through traces in the silicon interposer 500; that is, the data interaction module 200 and the corresponding wireless communication unit 300 can be grouped into a module using the silicon interposer 500, and then the silicon interposer 500 is soldered to the packaging substrate 100. In other examples, when applied to connection scenarios of different data interaction modules 200, the corresponding pin order or configuration may also be different. The silicon interposer 500 can be used to rationally plan the pin positions based on the characteristics of inter-chip data transmission, shorten signal transmission paths, reduce transmission delays, and achieve a reasonable substrate connection layout.

[0055] In some embodiments of this disclosure, the data interaction module 200 and the corresponding wireless communication unit 300 can be combined into a module by using a silicon interposer 500, thereby achieving high-density electrical connection between multiple modules. It can also be applied to different connection scenarios, rationally planning pin positions, shortening signal transmission paths, reducing transmission delays, achieving a reasonable substrate connection layout, and improving the flexibility and freedom of the layout.

[0056] In some embodiments, such as Figure 7 As shown, it also includes a first micro-bump 600, and the wireless communication unit 300 is connected to the corresponding data interaction module 200 through the first micro-bump.

[0057] In some embodiments of this disclosure, microbumps generally refer to tiny bump structures used in semiconductor packaging technology to connect chips to external circuits, playing a significant role in reducing chip size and improving performance. Microbumps are tiny bumps formed or installed at predetermined locations on a wafer before it is diced into individual chips, serving as interfaces for connecting chips to PCBs, substrates, or other chips. Their structural shapes, such as mushroom, straight, cylindrical, and spherical, can meet different packaging requirements.

[0058] In some embodiments of this disclosure, the connection between the wireless communication unit 300 and the data interaction module 200 can be achieved by using a first microbump 600. Since the microbump is small in size, it can form a high density of bumps on the wafer, which can improve the packaging integration of the module formed by the data interaction module 200 and the wireless communication unit 300. The first microbump 600 can achieve more I / O (Input / Output) connections per unit area, far exceeding the limit of traditional wire bonding, and meeting the needs of large-scale data transmission.

[0059] In some embodiments, such as Figure 7 As shown, it also includes a second microbump 700, through which the data interaction module 200 and the packaging substrate 100 are connected. In some embodiments of this disclosure, the connection between the data interaction module 200 and the packaging substrate 100 is achieved by using the second microbump 700. Since the microbump is small in size, it can form a high density of bumps on the wafer, which can improve the overall package integration with the packaging substrate 100. The second microbump can achieve more I / O connections per unit area, far exceeding the limit of traditional wire bonding, and meeting the needs of large-scale data transmission.

[0060] In some embodiments, the wireless communication unit 300 is disposed directly above the data interaction module 200.

[0061] In some embodiments of this disclosure, the wireless communication unit 300 can be positioned directly above the data interaction module 200, and the module consisting of the wireless communication unit 300 and the data interaction module 200 can be positioned directly above the packaging substrate 100. The wireless communication unit 300, the data interaction module 200, and the packaging substrate 100 are vertically connected via microbumps 600, which can further improve the integration of the package. At the same time, due to the vertical interconnection method, the area occupied by the module consisting of a single data interaction module 200 can be reduced, improving the overall layout freedom and flexibility of the packaging substrate 100.

[0062] The wireless transmission device and computer equipment provided in this application embodiment enable efficient wireless data transmission between data interaction modules 200 and corresponding wireless communication units 300. Compared to traditional wired connections, this eliminates the need for laying a large number of metal traces within the substrate, reducing circuit complexity. The wireless communication unit 300 and the data interaction module 200 can be connected via short-distance substrate traces or other methods, with negligible trace loss. Compared to traditional long-distance trace substrate designs, this reduces signal loss. Furthermore, wireless data transmission allows for improved signal quality and transmission distance through beamforming technology, making it applicable in high-interference environments.

[0063] In some embodiments provided in this disclosure, a computer device is also provided, which includes the wireless transmission device described above. The computer device may be a terminal or a server.

[0064] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A wireless transmission device, characterized in that, The device includes: The package substrate and at least two data interaction modules, each of the data interaction modules being connected to a wireless communication unit, the data interaction modules and the wireless communication units being disposed on the package substrate; Each of the data interaction modules communicates with other data interaction modules through a corresponding connected wireless communication unit.

2. The wireless transmission device according to claim 1, characterized in that, The wireless communication unit includes a transmitting module, a receiving module, a transmitting antenna, and a receiving antenna.

3. The wireless transmission device according to claim 2, characterized in that, The transmitting module includes a digital-to-analog converter, a first filter, a first mixer, and a first radio frequency signal amplifier.

4. The wireless transmission device according to claim 2, characterized in that, The receiving module includes an analog-to-digital converter, a second filter, a second mixer, and a second radio frequency signal amplifier.

5. The wireless transmission device according to claim 2, characterized in that, The transmitting antenna includes multiple first antenna elements in different frequency bands, and the receiving antenna includes multiple second antenna elements in different frequency bands.

6. The wireless transmission device according to claim 1, characterized in that, Each of the data interaction modules is connected to the corresponding wireless communication unit through the metal interconnect layer of the packaging substrate.

7. The wireless transmission device according to claim 1, characterized in that, The device further includes a silicon interposer, each of the data interaction modules and the corresponding wireless communication unit are connected through traces in the silicon interposer, each of the data interaction modules and the corresponding wireless communication unit are arranged on the same side of the silicon interposer, and the other side of the silicon interposer is connected to the packaging substrate.

8. The wireless transmission device according to claim 1, characterized in that, It also includes a first micro-bump, through which the wireless communication unit is connected to the corresponding data interaction module.

9. The wireless transmission device according to claim 1, characterized in that, It also includes a second microbump, through which the data interaction module is connected to the packaging substrate.

10. The wireless transmission device according to claim 8, characterized in that, The wireless communication unit is positioned directly above the data interaction module.

11. A computer device, characterized in that, Includes the wireless transmission device according to any one of claims 1-10.

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