A heat uniform heating plate

CN224805109UActive Publication Date: 2026-09-25DONGGUAN CHUANZE ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202522179056.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-14
Publication Date
2026-09-25
Estimated Expiration
2035-10-14

AI Technical Summary

Technical Problem

[0004]本实用新型的目的是解决以上缺陷,提供一种热均匀发热板,利用载体储存分布热量,能够均匀的对电极片进行加热,解决了现有技术发热材料分布不均,会出现过热不均的现象的技术问题

Benefits of technology

[0011]本实用新型所产生的有益效果是:通过发热层能够产生的热量,通过第一导热层能够将发热层产生的热量快速传导出去,且第一导热管与第二导热管相配合能够均匀的铺满于第一导热层的表面,第一导热管与第二导热管相互之间能够进行热量的传递,实现第一导热管与第二导热管中的流体热量同步,同时发热条波浪设计增加了流体与发热条之间的接触面积,能够更加均匀的对热量进行分布,使得电极片受热一致,避免出现过热不均的现象。

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Abstract

The utility model relates to a kind of even heat heating plate in the field of heating plate, including substrate, the surface of the substrate is equipped with heating layer, the surface of the heating layer is equipped with heating strip, the heating strip is wavy, the upper surface of the heating layer is paved with heat conduction layer, the inside of the first heat conduction layer is equipped with recess, and groove is paved with first heat conduction pipe, the lower portion of the first heat conduction pipe is crossed with second heat conduction pipe, the first heat conduction pipe and second heat conduction pipe are both serpentine design, and the inner cavity of first heat conduction pipe and second heat conduction pipe is communicated. First heat conduction pipe and second heat conduction pipe can be evenly spread on the surface of first heat conduction layer, and heat can be transferred between first heat conduction pipe and second heat conduction pipe, to realize the fluid heat synchronization in first heat conduction pipe and second heat conduction pipe, more evenly distribute heat, so that electrode sheet is heated uniformly, avoid the phenomenon of uneven overheating.
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Description

Technical Field

[0001] This utility model relates to the field of heating plates, specifically to a heating plate with uniform heat distribution. Background Technology

[0002] In the field of heating plate technology, thermal uniformity has always been a key issue in research and development. To achieve uniform heating throughout the entire flat heating plate, traditional planar heating plates typically require heating materials such as heating wires to be distributed on one side of the heat-conducting surface.

[0003] In the production process of a stacking machine, the performance of the heating plate is crucial. Currently, traditional stacking machine heating plates have many problems. During the stacking operation, the heating plate is generally only in contact with the heat-conducting plate, and the heat emitted by the heating plate is stored through a carrier. However, the heat in the carrier is not circulating, and the heat emitted from different parts of the heating plate varies, resulting in inconsistent heating of the electrode sheets and uneven distribution of the heating material, which can lead to overheating. Utility Model Content

[0004] The purpose of this invention is to address the above-mentioned deficiencies and provide a uniformly heated plate that utilizes a carrier to store and distribute heat, enabling uniform heating of the electrode sheets. This solves the technical problem of uneven distribution of heating materials in existing technologies, which can lead to uneven heating.

[0005] The objective of this utility model is achieved through the following means:

[0006] A uniformly heated plate includes a substrate, a heating layer on the surface of the substrate, heating strips on the surface of the heating layer, the heating strips being wavy, a first heat-conducting layer on the upper surface of the heating layer, a groove inside the first heat-conducting layer, and a first heat-conducting pipe inside the groove, a second heat-conducting pipe arranged at a 90-degree angle at the lower part of the first heat-conducting pipe, both the first and second heat-conducting pipes being serpentine in design, and the inner cavities of the first and second heat-conducting pipes being connected, the second heat-conducting layer tightly covering the upper part of the first heat-conducting layer.

[0007] Furthermore, the outer surface of the substrate is covered with an insulating protective sleeve, which can isolate the heating element from the outside world, prevent leakage, and ensure the safety of the heating plate.

[0008] Furthermore, the heating layer has a square design and is arranged in a rectangular array on the surface of the substrate. The uniformly distributed heating layer array can be easily expanded and upgraded to meet different power requirements, while reducing temperature gradients and hot spots, thereby improving the temperature stability and reliability of the entire system.

[0009] Furthermore, the first thermally conductive layer and the heating layer are tightly bonded together using an adhesive to ensure efficient heat conduction.

[0010] Furthermore, a heat insulation protective layer is installed between the substrate and the second heat-conducting layer. The heat insulation protective layer is made of ceramic fiber material to prevent heat loss from the edges and ensure that heat is evenly transferred to the working surface. The gap between the heat insulation protective layer and the substrate and the second heat-conducting layer is filled with high-temperature resistant sealant to prevent heat leakage.

[0011] The beneficial effects of this invention are as follows: the heat generated by the heating layer can be quickly conducted away through the first heat-conducting layer, and the first and second heat-conducting pipes can be evenly spread on the surface of the first heat-conducting layer. The first and second heat-conducting pipes can transfer heat to each other, achieving synchronous heat transfer of the fluid in the first and second heat-conducting pipes. At the same time, the wave design of the heating strip increases the contact area between the fluid and the heating strip, which can distribute the heat more evenly, making the electrode sheet heatd uniformly and avoiding uneven overheating. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the exploded three-dimensional structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the outer surface structure of the present invention;

[0014] Figure 3 This is a cross-sectional structural diagram of the present invention;

[0015] Figure 4 This is a schematic diagram of the heating layer of this utility model;

[0016] Figure 5 This is a schematic diagram of the structure of the heat-conducting pipe of this utility model.

[0017] In the figure, 1 is the substrate; 2 is the heating layer; 3 is the heating strip; 4 is the first heat-conducting layer; 5 is the first heat-conducting pipe; 6 is the second heat-conducting pipe; 7 is the second heat-conducting layer; 8 is the insulating protective sleeve; and 9 is the heat insulation protective layer. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0019] In this embodiment, refer to Figures 1-5The specific implementation of the uniform heating plate includes a substrate 1, a heating layer 2 is mounted on the surface of the substrate 1, a heating strip 3 is mounted on the surface of the heating layer 2, the heating strip 3 is wavy, a first heat-conducting layer 4 is laid on the upper surface of the heating layer 2, a groove is provided inside the first heat-conducting layer 4, and a first heat-conducting pipe 5 is laid in the groove, and a second heat-conducting pipe 6 is arranged at a 90-degree angle at the lower part of the first heat-conducting pipe 5. Both the first heat-conducting pipe 5 and the second heat-conducting pipe 6 are serpentine in design, and the inner cavities of the first heat-conducting pipe 5 and the second heat-conducting pipe 6 are connected. The upper part of the first heat-conducting layer 4 is tightly covered with a second heat-conducting layer 7.

[0020] The heat generated by the heating layer 2 can be quickly conducted away through the first heat-conducting layer 4. The first heat-conducting pipe 5 and the second heat-conducting pipe 6 work together to evenly cover the surface of the first heat-conducting layer 4. The first heat-conducting pipe 5 and the second heat-conducting pipe 6 can transfer heat to each other, so that the fluid heat in the first heat-conducting pipe 5 and the second heat-conducting pipe 6 is synchronized. At the same time, the wave design of the heating strip 3 increases the contact area between the fluid and the heating strip 3, which can distribute the heat more evenly, so that the electrode sheet is heated evenly and avoids the phenomenon of uneven overheating.

[0021] The outer surface of the substrate 1 is covered with an insulating protective sleeve 8, which can isolate the heating element from the outside world, prevent leakage and ensure the safety of the heating plate.

[0022] The heating layer 2 has a square design and is arranged in a rectangular array on the surface of the substrate 1. The uniformly distributed array of heating layers 2 can be easily expanded and upgraded to meet different power requirements, while reducing temperature gradients and hot spots, thereby improving the temperature stability and reliability of the entire system.

[0023] The first heat-conducting layer 4 and the heating layer 2 are tightly bonded together with an adhesive to ensure efficient heat conduction.

[0024] A heat insulation layer 9 is installed between the substrate 1 and the second heat-conducting layer 7. The heat insulation layer 9 is made of ceramic fiber material to prevent heat loss from the edges and ensure uniform heat transfer to the working surface. The gaps between the heat insulation layer 9 and the substrate 1 and the second heat-conducting layer 7 are filled with high-temperature resistant sealant. The high-temperature resistant sealant is polymerized from high-performance heat-resistant resin and various heat-resistant materials, and is widely used for bonding, repairing and sealing various machine parts under high-temperature conditions. It has the characteristics of high bonding strength, good sealing performance, high temperature resistance (300-1730℃), and corrosion resistance, and can prevent heat leakage.

[0025] In this embodiment, the heating layer 2 of a uniformly heated plate is arranged in a rectangular array on the surface of the substrate 1. The uniformly distributed array of heating layers 2 can be easily expanded and upgraded to meet different power requirements, while reducing temperature gradients and hot spots, thereby improving the temperature stability and reliability of the entire system. The heat insulation layer 9 is made of ceramic fiber material to prevent heat loss from the edges and ensure uniform heat transfer to the working plane. The gaps between the heat insulation layer 9 and the substrate 1 and the second heat-conducting layer 7 are filled with high-temperature resistant sealant to prevent heat leakage. Finally, the heat generated by the heating layer 2... Heat can be quickly conducted away from the heating layer 2 through the first heat-conducting layer 4. The first heat-conducting pipe 5 and the second heat-conducting pipe 6 work together to evenly cover the surface of the first heat-conducting layer 4. The first heat-conducting pipe 5 and the second heat-conducting pipe 6 can transfer heat to each other, so that the fluid heat in the first heat-conducting pipe 5 and the second heat-conducting pipe 6 is synchronized. Heat can be evenly transferred to the surface of the second heat-conducting layer 7. At the same time, the wave design of the heating strip 3 increases the contact area between the fluid and the heating strip 3, which can distribute heat more evenly, so that the electrode sheet is heated evenly and avoids the phenomenon of uneven overheating.

[0026] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A uniformly heated plate, comprising a substrate, wherein a heating layer is disposed on the surface of the substrate, and heating strips are disposed on the surface of the heating layer, characterized in that: The heating strip is wavy. The upper surface of the heating layer is covered with a first heat-conducting layer. The interior of the first heat-conducting layer has a groove, and a first heat-conducting pipe is laid in the groove. The lower part of the first heat-conducting pipe is arranged with a second heat-conducting pipe at a 90-degree angle. Both the first and second heat-conducting pipes are serpentine in design, and the inner cavities of the first and second heat-conducting pipes are connected. The upper part of the first heat-conducting layer is tightly covered with the second heat-conducting layer.

2. The uniform heating plate according to claim 1, characterized in that: The outer surface of the substrate is covered with an insulating protective sleeve.

3. The uniform heating plate according to claim 1, characterized in that: The heating layer has a square design and is arranged in a rectangular array on the surface of the substrate.

4. The uniform heating plate according to claim 1, characterized in that: The first thermally conductive layer and the heating layer are tightly bonded together using an adhesive.

5. The uniform heating plate according to claim 1, characterized in that: A heat insulation protective layer is installed between the substrate and the second heat-conducting layer, and the gap between the heat insulation protective layer and the substrate and the second heat-conducting layer is filled with high-temperature resistant sealant.