A high temperature hot plate for a semiconductor chip tester

Abstract

The utility model discloses a high temperature heating disc of semiconductor chip testing machine, including heating and placing round plate, be provided with T type connecting rod on the heating and placing round plate, still be provided with the placing plate on the heating and placing round plate, be provided with the connecting portion on the placing plate, the T type slot is opened in the connecting portion, T type connecting rod and T type slot are adapted, still be provided with the positioning portion on the placing plate, be provided with the positioning assembly on the heating and placing round plate, the positioning assembly is cooperated with the positioning portion, makes T type connecting rod be in T type slot, drives the placing plate and heating and placing round plate connection complete assembly, the utility model discloses beneficial effect is: the adaptation structure of T type connecting rod and T type slot, cooperation placing board direction placing round plate axle core direction's displacement assembly mode, has simplified the connection operation process of placing board and heating and placing round plate, can complete assembly without complex tool, significantly reduces assembly difficulty, shortens assembly time -consuming.

Description

Technical Field

[0001] This utility model relates to a high-temperature heating plate for a semiconductor chip testing machine. Background Technology

[0002] In the semiconductor chip manufacturing process, high-temperature environment testing is a key step in verifying the stability of chip performance. As the core component of the chip testing machine, the ease of assembly, the firmness of connection, and the testing efficiency of the high-temperature heating plate directly affect the overall quality and progress of chip testing.

[0003] Existing high-temperature heating plates for semiconductor chip testing machines have an unreasonable connection structure between the placement plate and the heated circular plate. They typically require multiple sets of bolts, clips, and other complex connectors, along with specialized tools, to complete the assembly. This not only makes the operation process cumbersome and difficult, but also results in long assembly times, affecting test preparation efficiency. Furthermore, traditional heating plates often feature a single or small number of placement plates, allowing only a small number of chips to be tested at a time. This is insufficient to meet the high-efficiency testing requirements of mass production scenarios, resulting in low test throughput and hindering the improvement of chip production efficiency. Therefore, this invention proposes a high-temperature heating plate for a semiconductor chip testing machine to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a high-temperature heating plate for a semiconductor chip testing machine to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A high-temperature heating plate for a semiconductor chip testing machine includes a heating placement circular plate, wherein a T-shaped connecting rod is provided on the heating placement circular plate; The heated placement circular plate is also provided with a placement plate, and the placement plate is provided with a connecting part. A T-shaped groove is opened in the connecting part. The T-shaped connecting rod is adapted to the T-shaped groove. The placement plate is also provided with a positioning part, and the heated placement circular plate is provided with a positioning component. The positioning component cooperates with the positioning part, so that the T-shaped connecting rod is placed in the T-shaped groove, thereby driving the placement plate to connect with the heated placement circular plate to complete the assembly.

[0006] As an improvement to the above technical solution, multiple sets of the T-shaped connecting rods are provided, and the multiple sets of the T-shaped connecting rods are arranged in a ring array around the axis of the heated circular plate. The placement plate is provided in multiple sets, and the positions of the multiple sets of placement plates are matched with the positions of the multiple sets of T-shaped connecting rods.

[0007] As an improvement to the above technical solution, the placement plate is provided with multiple sets of placement and fixing slots, and the multiple sets of placement and fixing slots are evenly arranged on the placement plate.

[0008] As an improvement to the above technical solution, the positioning part is provided with a positioning through groove, which cooperates with the positioning component to connect the placement plate to the heated placement circular plate.

[0009] As an improvement to the above technical solution, the positioning component includes a positioning plate, which is connected to a heated circular plate. The positioning plate is provided with two sets of elastic rods, which cooperate with the inner wall of the positioning through groove.

[0010] As an improvement to the above technical solution, the positioning groove is provided with two sets of contact walls, and the two sets of elastic rods respectively cooperate with the two sets of contact walls; The contact wall is provided with a first contact slope and a second contact slope, and the elastic rod is provided with a first elastic slope and a second elastic slope. The first elastic slope is in contact with the first contact slope, and the second elastic slope is in contact with the second contact slope.

[0011] As an improvement to the above technical solution, multiple sets of mounting grooves are evenly opened on the outer wall of the heating and placement circular plate, and the multiple sets of mounting grooves are matched with the positions of multiple sets of T-shaped connecting rods; The bottom of the mounting groove is provided with mounting holes, and the positioning plate is provided with positioning holes. The positioning holes and mounting holes are matched in position, and the positioning holes and mounting holes are connected by bolts.

[0012] Compared with the prior art, the beneficial effects of this utility model are: By utilizing the matching structure of the T-shaped connecting rod and the T-shaped groove, and the displacement assembly method of the placement plate towards the axis of the placement circular plate, the connection operation process between the placement plate and the heated placement circular plate is simplified. Assembly can be completed without complicated tools, significantly reducing assembly difficulty and shortening assembly time. By cooperating with the positioning part and the positioning component, the assembly position of the T-shaped connecting rod in the T-slot can be effectively limited, avoiding relative displacement of the placement plate after assembly. This further enhances the firmness of the connection between the placement plate and the heated placement disc, ensuring the stability of the chip load during the heating test. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a front view of the present invention; Figure 3 This utility model Figure 2 Sectional view of AA; Figure 4 This utility model Figure 3 Enlarged structural diagram at point B; Figure 5 This is a schematic diagram of the structure of the placement plate of this utility model; Figure 6 This is a structural schematic diagram of the placement plate of this utility model from another angle; Figure 7 This is a schematic diagram of the structure of the heating and placing circular plate of this utility model; Figure 8 This is a schematic diagram of the elastic rod of this utility model; Figure 9 This is a schematic diagram of the positioning through groove of this utility model.

[0014] In the diagram: 10. Heating and placing circular plate; 11. Mounting and fixing hole; 12. Mounting groove; 13. T-shaped connecting rod; 20. Placing plate; 21. Placing and fixing groove; 22. Connecting part; 23. T-shaped groove; 24. Positioning part; 25. Positioning through groove; 26. Contact wall; 261. First contact slope; 262. Second contact slope; 30. Positioning assembly; 31. Positioning and fixing hole; 32. Positioning plate; 33. Elastic rod; 34. First elastic slope; 35. Second elastic slope. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Example: like Figure 1-9 As shown, this embodiment proposes a high-temperature heating plate for a semiconductor chip testing machine, including a heating placement circular plate 10, on which a T-shaped connecting rod 13 is provided; The heated placement circular plate 10 is also provided with a placement plate 20, and the placement plate 20 is provided with a connecting part 22. A T-shaped groove 23 is opened in the connecting part 22. The T-shaped connecting rod 13 is adapted to the T-shaped groove 23. The placement plate 20 is also provided with a positioning part 24. The heated placement circular plate 10 is provided with a positioning component 30. The positioning component 30 cooperates with the positioning part 24 so that the T-shaped connecting rod 13 is placed in the T-shaped groove 23, thereby driving the placement plate 20 to connect with the heated placement circular plate 10 to complete the assembly.

[0017] In this embodiment, when performing a heating test on the chip, the chip to be tested is placed on the placement plate 20, and then the T-shaped groove 23 on the placement plate 20 is aligned with the T-shaped connecting rod 13. Then, the placement plate 20 is manually moved toward the axial direction of the heated placement circular plate 10 until the positioning part 24 contacts and engages with the positioning component 30, thereby completing the connection between the placement plate 20 and the heated placement circular plate 10. Then, the heating test can be performed by the chip testing machine. By utilizing the matching structure of the T-shaped connecting rod 13 and the T-shaped groove 23, and in conjunction with the displacement assembly method of the placement plate 20 toward the axis of the placement circular plate, the connection operation process between the placement plate 20 and the heated placement circular plate 10 is simplified, and the assembly can be completed without complicated tools, significantly reducing the assembly difficulty and shortening the assembly time. By cooperating with the positioning part 24 and the positioning component 30, the assembly position of the T-shaped connecting rod 13 in the T-shaped groove 23 can be effectively limited, avoiding relative displacement of the placement plate 20 after assembly, further enhancing the firmness of the connection between the placement plate 20 and the heated placement disc 10, and ensuring the stability of the chip load during the heating test.

[0018] Specifically, multiple sets of the T-shaped connecting rods 13 are provided, and the multiple sets of the T-shaped connecting rods 13 are arranged in a ring array around the axis of the heated and placed circular plate 10; The placement plate 20 is provided in multiple sets, and the multiple sets of placement plates 20 are matched with the positions of the multiple sets of T-shaped connecting rods 13.

[0019] In this embodiment, the array layout and position matching design enable the heating placement disc 10 to assemble multiple sets of placement plates 20 at the same time. Each set of placement plates 20 can independently carry the chip to be tested, thereby realizing synchronous heating and testing of multiple chips. Compared with a single-set carrying structure, it greatly increases the number of chips tested at one time, significantly improves the throughput of chip testing, and effectively meets the high-efficiency testing requirements in mass production scenarios. Multiple sets of T-shaped connecting rods 13 are evenly distributed in a ring around the axis of the heated placement circular plate 10, driving multiple sets of placement plates 20 to form a symmetrical and uniform layout on the heated placement circular plate 10. This layout can ensure that the chips on each placement plate 20 are in the same heating area, temperature field and test environment, avoiding problems such as uneven heating and test parameter differences caused by position offset, and improving the accuracy and consistency of multi-chip parallel test results.

[0020] Specifically, the placement plate 20 has multiple sets of placement and fixing slots 21, which are evenly arranged on the placement plate 20.

[0021] In this embodiment, the placement and fixing slot 21 can be set according to the specifications of the chip to be tested, so that different chips can be tested at the same time for comparison.

[0022] Specifically, the positioning part 24 has a positioning through groove 25, which cooperates with the positioning component 30 to connect the placement plate 20 to the heated placement circular plate 10.

[0023] Specifically, the positioning component 30 includes a positioning plate 32, which is connected to the heated placement circular plate 10. The positioning plate 32 is provided with two sets of elastic rods 33, which cooperate with the inner wall of the positioning through groove 25.

[0024] In this embodiment, the positioning slot 25, through its adaptation and cooperation with the positioning component 30, can effectively limit the assembly position of the placement plate 20 on the heated placement circular plate 10, preventing the placement plate 20 from undergoing radial or circumferential relative displacement due to vibration, temperature changes, or external force during the heating test. This ensures a stable connection between the placement plate 20 and the heated placement circular plate 10, thereby guaranteeing the positional stability of the chip under test during the test and providing structural support for the accuracy of the test results.

[0025] Specifically, the positioning slot 25 is provided with two sets of contact walls 26, and the two sets of elastic rods 33 respectively cooperate with the two sets of contact walls 26; The contact wall 26 is provided with a first contact slope 261 and a second contact slope 262, and the elastic rod 33 is provided with a first elastic slope 34 and a second elastic slope 35. The first elastic slope 34 is in contact with the first contact slope 261, and the second elastic slope 35 is in contact with the second contact slope 262.

[0026] In this embodiment, the one-to-one correspondence between the two sets of contact walls 26 and the elastic rods 33, combined with the bidirectional inclined surfaces, namely the first contact inclined surface 261 and the first elastic inclined surface 34, and the second contact inclined surface 262 and the second elastic inclined surface 35, can form precise mechanical limits in the radial and circumferential dimensions of the placement plate 20 assembly. This effectively constrains the displacement freedom of the placement plate 20 relative to the heated placement circular plate 10. Even if thermal expansion and contraction stress is generated due to temperature changes during the heating test, or if vibration is generated due to equipment operation, this bidirectional inclined surface cooperation structure can still maintain the stable connection state between the placement plate 20 and the heated placement circular plate 10, avoiding the displacement of the placement plate 20 and causing the chip test position deviation, thus providing structural protection for the accuracy of the test results. Of course, when the placement plate 20 is pulled out, the two sets of elastic rods 33 will retract inward so that the placement plate 20 can be disengaged from the positioning component 30 so that other placement plate 20 assembly processes can be carried out in the future.

[0027] Specifically, the outer wall of the heated circular plate 10 is evenly provided with multiple sets of mounting grooves 12, and the multiple sets of mounting grooves 12 are matched with the positions of multiple sets of T-shaped connecting rods 13; The bottom of the mounting groove 12 is provided with mounting holes 11, and the positioning plate 32 is provided with positioning holes 31. The positioning holes 31 and the mounting holes 11 are matched in position, and the positioning holes 31 and the mounting holes 11 are connected by bolts.

[0028] In this embodiment, the position matching design of multiple sets of mounting slots 12 and T-shaped connecting rods 13 provides a clear mechanical limiting reference for the installation of the positioning plate 32. The installation position of the positioning plate 32 on the heated and placed circular plate 10 can be quickly determined directly by the position of the mounting slots 12, without the need for additional radial and circumferential position calibration of the positioning plate 32, effectively avoiding manual alignment errors. At the same time, the position matching of the positioning fixing hole 31 and the mounting fixing hole 11 enables the rapid insertion of bolts, simplifies the assembly operation process of the positioning plate 32, shortens the assembly time, and improves the overall assembly efficiency of the positioning assembly 30.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-temperature heating plate for a semiconductor chip testing machine, characterized in that: Includes a heated placement circular plate (10), on which a T-shaped connecting rod (13) is provided; The heated placement circular plate (10) is also provided with a placement plate (20), the placement plate (20) is provided with a connecting part (22), the connecting part (22) is provided with a T-shaped groove (23), the T-shaped connecting rod (13) is adapted to the T-shaped groove (23), the placement plate (20) is also provided with a positioning part (24), the heated placement circular plate (10) is provided with a positioning component (30), the positioning component (30) cooperates with the positioning part (24) so ​​that the T-shaped connecting rod (13) is placed in the T-shaped groove (23), thereby driving the placement plate (20) to connect with the heated placement circular plate (10) to complete the assembly.

2. The high-temperature heating plate of a semiconductor chip testing machine according to claim 1, characterized in that: The T-shaped connecting rod (13) is provided in multiple sets, and the multiple sets of the T-shaped connecting rod (13) are arranged in a ring array with the axis of the heated circular plate (10) as the center; The placement plate (20) is provided in multiple sets, and the multiple sets of placement plates (20) are matched with the multiple sets of T-shaped connecting rods (13).

3. The high-temperature heating plate of a semiconductor chip testing machine according to claim 1, characterized in that: The placement plate (20) has multiple sets of placement fixing slots (21), and the multiple sets of placement fixing slots (21) are evenly arranged on the placement plate (20).

4. The high-temperature heating plate of a semiconductor chip testing machine according to claim 1, characterized in that: The positioning part (24) has a positioning through groove (25), which cooperates with the positioning component (30) to connect the placement plate (20) to the heated placement circular plate (10).

5. The high-temperature heating plate of a semiconductor chip testing machine according to claim 2, characterized in that: The positioning component (30) includes a positioning plate (32), which is connected to the heated placement circular plate (10). The positioning plate (32) is provided with two sets of elastic rods (33), which cooperate with the inner wall of the positioning through groove (25).

6. The high-temperature heating plate of a semiconductor chip testing machine according to claim 5, characterized in that: The positioning slot (25) is provided with two sets of contact walls (26), and the two sets of elastic rods (33) respectively cooperate with the two sets of contact walls (26); The contact wall (26) is provided with a first contact slope (261) and a second contact slope (262), and the elastic rod (33) is provided with a first elastic slope (34) and a second elastic slope (35). The first elastic slope (34) is in contact with the first contact slope (261), and the second elastic slope (35) is in contact with the second contact slope (262).

7. The high-temperature heating plate of a semiconductor chip testing machine according to claim 5, characterized in that: The outer wall of the heated circular plate (10) is evenly provided with multiple sets of mounting grooves (12), and the multiple sets of mounting grooves (12) are matched with the positions of multiple sets of T-shaped connecting rods (13); The bottom of the mounting groove (12) is provided with mounting fixing holes (11), and the positioning plate (32) is provided with positioning fixing holes (31). The positioning fixing holes (31) and the mounting fixing holes (11) are matched in position, and the positioning fixing holes (31) and the mounting fixing holes (11) are connected by bolts.

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