Circuit board and electronic device

Abstract

The present disclosure provides a circuit board and an electronic device, and belongs to the technical field of electronics. The circuit board comprises a circuit board body and a thermal sensitive device; the circuit board body is provided with a heat blocking part, wherein the heat blocking part is a groove or a through hole extending along a direction perpendicular to the circuit board body; the thermal sensitive device is located on one side of the circuit board body and is electrically connected with the circuit board body, and the orthographic projection of the thermal sensitive device on the circuit board body at least partially overlaps with the orthographic projection of the heat blocking part on the circuit board body. By using the present disclosure, the heat conducted to the thermal sensitive device from the circuit board body is reduced, and the influence of the heat dissipation of the heat generating device on the thermal sensitive device is reduced, so that the normal operation of the thermal sensitive device is ensured, and the operation stability of the electronic device is improved.

Description

Technical Field

[0001] This disclosure relates to the field of electronic technology, specifically to a circuit board and an electronic device. Background Technology

[0002] As electronic devices such as mobile phones, tablets, and computers become increasingly complex, their chips have higher computing power, and products are developing towards miniaturization and precision. Consequently, circuit boards are also moving towards higher integration, resulting in various components being arranged more closely on the circuit board substrate.

[0003] However, circuit boards contain heat-generating devices such as clock chips / crystal oscillators, A+G sensors (accelerometer+gyroscope sensors, a combination of accelerometer and gyroscope sensors), and charging chips. When the components on the circuit board are arranged closely together, the heat generated by the heat-generating devices will be conducted to the heat-generating devices through the substrate and other structures, which will cause the heat-generating devices to malfunction and affect the normal operation of electronic devices. Utility Model Content

[0004] This disclosure provides a circuit board and an electronic device that can reduce the impact of heat dissipation from heat-generating devices on thermistors, ensuring the normal operation of thermistors and improving the operational stability of the electronic device. The technical solution is as follows:

[0005] In a first aspect, embodiments of this disclosure provide a circuit board, the circuit board including a circuit board body and a thermal device;

[0006] The circuit board body has a heat-insulating part, wherein the heat-insulating part is a groove or through hole extending along a direction perpendicular to the circuit board body;

[0007] The thermistor is located on one side of the circuit board body and is electrically connected to the circuit board body. The orthographic projection of the thermistor on the circuit board body at least partially overlaps with the orthographic projection of the heat-insulating part on the circuit board body.

[0008] In one possible implementation, the thermistor has multiple pins;

[0009] The target area A on the circuit board body includes at least a heat-resistant part and multiple connection areas B, which are electrically connected to different pins respectively. The target area A is the area projected by the orthographic projection of the thermistor on the circuit board body.

[0010] In one possible implementation, the circuit board body also has at least one heat-resistant channel located between the thermistor and other devices on the circuit board.

[0011] In one possible implementation, the at least one heat-resistant channel is arranged along a direction surrounding the thermistor.

[0012] In one possible implementation, the opening of the heat-resistant portion is located on the surface of the circuit board body near the thermistor.

[0013] In one possible implementation, the circuit board body includes at least one substrate and at least one conductive layer stacked alternately, wherein the total thickness of the at least one substrate and the at least one conductive layer is greater than or equal to the depth of the heat-resistant portion;

[0014] The thermistor is electrically connected to a conductive layer located on the outer side of the circuit board body.

[0015] In one possible implementation, the heat-resistant portion has a similar shape on each conductive layer or substrate.

[0016] In one possible implementation, the target orthographic projection of the portion of the heat-resistant part on each conductive layer or substrate falls within the target orthographic projection of the portion of the heat-resistant part on the upper substrate or conductive layer, wherein the target orthographic projection is an orthographic projection on the circuit board body.

[0017] In one possible implementation, both sides of the circuit board body are the conductive layers.

[0018] In one possible implementation, the depth of the heat-resistant portion is less than or equal to the difference between the total thickness and the thickness of one of the conductive layers, or the depth of the heat-resistant portion is equal to the total thickness.

[0019] In one possible implementation, when the circuit board body has the heat-blocking channel, the heat-blocking channel penetrates one or more layers of the conductive layer and the substrate.

[0020] Secondly, embodiments of this disclosure provide an electronic device, the electronic device including a circuit board as described in any of the preceding claims.

[0021] The technical solutions provided by the embodiments of this disclosure have at least the following beneficial effects:

[0022] This disclosure provides a circuit board with a heat-insulating part on the circuit board body. The orthographic projection of the heat-insulating part on the circuit board body at least partially overlaps with the orthographic projection of the thermistor on the circuit board body. In this way, by setting the heat-insulating part, the heat conducted from the circuit board body to the thermistor is reduced, thereby reducing the impact of heat dissipation from the heat-generating device on the thermistor, thus ensuring the normal operation of the thermistor and improving the operational stability of the electronic device.

[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a circuit board shown in an embodiment of this disclosure;

[0026] Figure 2 This is a schematic diagram of the structure of a circuit board shown in an embodiment of this disclosure;

[0027] Figure 3 This is a schematic diagram of the structure of a circuit board shown in an embodiment of this disclosure;

[0028] Figure 4 This is a schematic diagram of the structure of a thermistor according to an embodiment of the present disclosure;

[0029] Figure 5 This is a schematic diagram of the structure of a circuit board body shown in an embodiment of this disclosure;

[0030] Figure 6 This is a schematic diagram of the structure of a circuit board shown in an embodiment of this disclosure;

[0031] Figure 7 This is a top view schematic diagram of a circuit board body and a thermal device according to an embodiment of the present disclosure;

[0032] Figure 8 This is a schematic diagram of the structure of a circuit board shown in an embodiment of this disclosure;

[0033] Figure 9 This is a schematic diagram of the structure of a circuit board shown in an embodiment of this disclosure;

[0034] Figure 10 This is a schematic diagram of the structure of a circuit board shown in an embodiment of this disclosure;

[0035] Figure 11 This is a schematic diagram of the structure of a circuit board shown in an embodiment of this disclosure.

[0036] Legend

[0037] 1. Circuit board body;

[0038] 11. Heat-insulating part; 12. Heat-insulating channel; 13. Substrate; 14. Conductive layer;

[0039] 2. Thermistors;

[0040] 21. Pins;

[0041] A. Target area; B. Connecting area. Detailed Implementation

[0042] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the element or object preceding “comprising” or “including” encompasses the element or object listed following “comprising” or “including” and its equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0043] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0044] This disclosure provides a circuit board, see [link to relevant documentation] Figure 1 The circuit board includes a circuit board body 1 and a thermal device 2; the circuit board body 1 has a heat-insulating part 11, wherein the heat-insulating part 11 is a groove or through hole extending along a direction perpendicular to the circuit board body 1; the thermal device 2 is located on one side of the circuit board body 1 and is electrically connected to the circuit board body 1, and the orthographic projection of the thermal device 2 on the circuit board body 1 at least partially overlaps with the orthographic projection of the heat-insulating part 11 on the circuit board body 1.

[0045] In practice, the circuit board body 1 has a plate-like structure, which is usually rectangular in shape and plays a supporting role in the circuit board.

[0046] The thermal device 2 is located on one side of the circuit board body 1 and is electrically connected to the circuit board body 1 so as to achieve electrical connection with other devices on the circuit board through the circuit board body 1.

[0047] The orthographic projection of the thermistor 1 on the circuit board body 1 at least partially overlaps with the orthographic projection of the heat-insulating part 11 on the circuit board body 1. That is, when manufacturing the circuit board body 1, without affecting the electrical connection between the thermistor 2 and other devices, a groove or hole can be cut in the area on the circuit board body 1 that at least partially overlaps with the orthographic projection of the thermistor 2 on the circuit board body 1. This reduces the heat conducted from the circuit board body 1 to the thermistor 2, thereby reducing the impact of heat dissipation from the heat-generating device on the thermistor 2, thus ensuring the normal operation of the thermistor 2 and improving the operational stability of the electronic equipment.

[0048] The heat-insulating part 11 can be a groove or a through hole, see [reference]. Figure 1 and Figure 3 , Figure 1 This is an illustration of the heat-insulating part 11 being a groove. Figure 3 This is a diagram showing the heat-insulating part 11 as a through hole. In the embodiments of this disclosure, the structure of the heat-insulating part 11 can be configured according to the heat insulation requirements and the actual structure of the circuit board, and this disclosure does not limit this.

[0049] In this embodiment, the shape and size of the heat-insulating part 11 can be set according to requirements. That is, without affecting the electrical connection between the thermal device 2 and other devices through the circuit board body 1, the heat-insulating part 11 can be designed according to the strength of the circuit board and the electrical connection requirements of other devices.

[0050] In this embodiment of the disclosure, the thermal device 2 may be a clock chip / crystal oscillator, an A+G sensor, or other such device, and this embodiment of the disclosure does not limit it.

[0051] In one possible implementation, the position of the thermistor 2 on the circuit board body 1 can be as far away as possible from the heat-generating devices on the circuit board, and can be arranged according to the actual situation.

[0052] In one possible implementation, the opening of the heat-insulating part 11 can be located on the surface of the circuit board body 1 away from the thermistor 2, see [reference]. Figure 2In this way, the heat conducted from the circuit board body 1 to the thermistor 2 can be reduced by setting the heat insulation part 11, thereby reducing the impact of heat dissipation from the heat-generating device on the thermistor 2, ensuring the normal operation of the thermistor 2, and improving the operational stability of the electronic device. At the same time, the circuit board body 1 also provides sufficient area for electrical connection with the thermistor 2 or other devices.

[0053] In another possible implementation, the opening of the heat-insulating part 11 can be located on the surface of the circuit board body 1 near the thermistor 2, see [reference]. Figure 1 This directly reduces the contact area between the thermal device 2 and the circuit board body 1, thereby reducing the heat conducted from the circuit board body 1 to the thermal device 2, reducing the impact of heat dissipation from the heat-generating device on the thermal device 2, ensuring the normal operation of the thermal device 2, and improving the operational stability of the electronic equipment.

[0054] The location of the openings of the two types of heat-insulating parts 11 can be selected according to the requirements, and this embodiment does not limit this.

[0055] In one possible implementation, the thermal device 2 has multiple pins 21, for example, see [link to relevant documentation]. Figure 4 The thermistor 2 has four pins 21, which are distributed at the four corners of the thermistor 2.

[0056] See Figure 4 and Figure 5 The circuit board body 1 has a target area A. The target area A on the circuit board body 1 is the area projected by the orthogonal projection of the thermal device 2 on the circuit board body 1. That is, the target area A on the circuit board body 1 is the area corresponding to the orthogonal projection of the thermal device 2 on the circuit board body 1 in the direction perpendicular to the circuit board body 1.

[0057] The target area A includes at least a portion of the heat-insulating part 11 and multiple connection areas B, which are electrically connected to different pins 21 respectively. This ensures that the presence of the heat-insulating part 11 does not affect the electrical connection between the thermistor 2 and the circuit board body 1.

[0058] Furthermore, the heat-insulating part 11 can be located in other areas of the target area A besides the connection area B, or the heat-insulating part 11 can be all areas of the target area A except for the connection area B. That is, when manufacturing the circuit board, grooves or holes can be drilled in all areas of the target area A except for the connection area B that needs to be electrically connected, thereby forming the heat-insulating part 11, thereby minimizing the impact of heat on the thermistor 2.

[0059] In one possible implementation, see Figure 6 and Figure 7The circuit board body 1 also has at least one heat-resistant channel 12, which is located between the thermistor 2 and other devices on the circuit board.

[0060] In practice, considering the strength of the circuit board and the fact that the circuit board body 1 provides sufficient support for the device, grooves or holes can be made in the circuit board body 1 to obtain the heat-insulating channel 12. While the heat-insulating part 11 can reduce the heat conducted to the thermistor 2, the heat-insulating channel 12 further reduces the heat conducted to the thermistor 2.

[0061] Meanwhile, the heat-blocking channel 12 is set between the thermistor 2 and other devices on the circuit board, effectively blocking the heat conduction from other devices to the thermistor 2.

[0062] Further, see Figure 7 At least one heat-blocking channel 12 can be arranged along the direction surrounding the thermistor 2, thereby effectively blocking the heat conduction from other devices located in various directions to the thermistor 2.

[0063] The shape of the heat-insulating channel 12 can be strip-shaped, round, etc., and this embodiment does not limit it.

[0064] Of course, the heat-insulating channel 12 is designed without affecting the electrical connection between the thermal device 2 and the circuit board body 1, and its position, shape and size can be set according to the actual situation.

[0065] In one possible implementation, see Figure 8 The circuit board body 1 may include at least one substrate 13 and at least one conductive layer 14 stacked alternately, the total thickness of the at least one substrate 13 and at least one conductive layer 14 being greater than or equal to the depth of the heat-insulating portion 11. The thermal device 2 is electrically connected to one of the conductive layers 14 located on the outer side of the circuit board body 1.

[0066] In implementation, the substrate 13 may have a plate-like structure, typically rectangular in shape, serving a supporting function in the circuit board. The substrate 13 may be made of ceramic, metal, or polymer materials, etc., and this disclosure does not limit this aspect.

[0067] The conductive layer 14 has a plate-like structure and is used to make electrical connections between devices on the circuit board. The conductive layer 14 can be made of copper or other conductive metals, etc.

[0068] The circuit board body 1 has a heat-insulating part 11. The depth of the heat-insulating part 11 is less than or equal to the total thickness of the substrate 13 and the conductive layer 14. That is, when the heat-insulating part 11 is a groove, the depth of the heat-insulating part 11 is less than the total thickness of the substrate 13 and the conductive layer 14; when the heat-insulating part 11 is a through hole, the depth of the heat-insulating part 11 is equal to the total thickness of the substrate 13 and the conductive layer 14.

[0069] The specific depth of the heat-insulating part 11 can be set according to the heat-insulating requirements and the support strength requirements of the circuit board body 1. The number of substrate 13 and conductive layer 14 can also be set according to the electrical connection requirements. This embodiment does not limit these aspects.

[0070] In this embodiment, the heat-insulating part 11 can be any reasonable shape. In one possible implementation, see [link to relevant documentation]. Figure 8 The heat-insulating portion 11 has a similar shape on each conductive layer 14 or substrate 13.

[0071] In practice, the shape of the heat-insulating part 11 on each conductive layer 14 or substrate 13 can be the same or have a certain range of deviation, thereby minimizing the volume or area of ​​the part of the thermistor 2 that contacts the circuit board body 1, thereby reducing the impact of heat dissipation of the heat-generating device on the circuit board on the thermistor 2.

[0072] In another possible implementation, see Figure 9 The target orthographic projection of the portion of the heat-insulating part 11 on each conductive layer 14 or substrate 13 falls within the target orthographic projection of the portion of the heat-insulating part 11 on the upper substrate 13 or conductive layer 14, wherein the target orthographic projection is the orthographic projection on the circuit board body 1.

[0073] That is, the heat-insulating portion 11 can be located on one or more conductive layers 14 and one or more substrates 13. For each conductive layer 14 having a portion of heat-insulating portion 11, the target orthographic projection of the portion of heat-insulating portion 11 on the conductive layer 14 will fall within the target orthographic projection of the portion of heat-insulating portion 11 on the substrate 13 above the conductive layer 14.

[0074] Similarly, for each substrate 14 having a heat-insulating portion 11, the target orthographic projection of the portion of the heat-insulating portion 11 on the substrate 13 will fall within the target orthographic projection of the portion of the heat-insulating portion 11 on the upper conductive layer 14 of the substrate 13.

[0075] Thus, the above structure is formed Figure 9 The stepped heat-insulating portion 11 shown has the shape to effectively insulate the thermal device 2 while leaving more area for electrical connection between the substrate 13 and the conductive layer 14.

[0076] The shape of the heat-insulating part 11 can be selected according to the requirements. Of course, the heat-insulating part 11 can also be any other reasonable shape. This embodiment does not specifically limit this.

[0077] In one possible implementation, see Figure 10 Both sides of the circuit board body 1 can be conductive layers 14.

[0078] In this way, conductive layers 14 for electrical connection are respectively provided on both sides of the circuit board body 1, thereby increasing the area of ​​the conductive layers 14 on the circuit board that can achieve electrical connection, thereby increasing the number of devices installed on the circuit board, which is suitable for more complex circuit boards.

[0079] In one possible implementation, for the structure where both sides of the circuit board body 1 are conductive layers 14, the heat-insulating portion 11 can be configured such that the depth of the heat-insulating portion 11 is less than or equal to the difference between the total thickness and the thickness of one conductive layer 14, or the depth of the heat-insulating portion 11 is equal to the total thickness. Here, the total thickness refers to the total thickness of the substrate 13 and the conductive layer 14 included in the circuit board body 1.

[0080] In practice, the depth of the heat-insulating part 11 is less than or equal to the difference between the total thickness and the thickness of a conductive layer 14. This ensures that when the heat-insulating part 11 is a groove, there is enough substrate 13 on the circuit board body 1 at the position corresponding to the heat-insulating part 11 to support the conductive layer 14. This avoids the situation where only one conductive layer 14 remains in the area corresponding to the heat-insulating part 11, thus ensuring the strength and stability of the circuit board.

[0081] Alternatively, the depth of the heat-insulating part 11 can be set to be equal to the total thickness, i.e., the heat-insulating part 11 is a through hole.

[0082] The depth of the heat-insulating part 11 can be set according to requirements, and this embodiment does not limit it.

[0083] In one possible implementation, when the circuit board body 1 has a heat-blocking channel 12, the heat-blocking channel 12 penetrates one or more layers of the conductive layer 14 and the substrate 13.

[0084] See Figure 10 The heat-blocking channel 12 can penetrate multiple layers in the conductive layer 14 and the substrate 13, thereby reducing the heat conducted from the circuit board body 1 to the thermistor 2.

[0085] Or see Figure 11 The heat-blocking channel 12 can penetrate only one of the conductive layer 14 and the substrate 13, which reduces the heat conducted from the circuit board body 1 to the thermistor 2, while leaving more area for electrical connection between the substrate 13 and the conductive layer 14.

[0086] The specific depth of the heat-insulating channel 12 can be set according to requirements, and this embodiment does not limit this.

[0087] This disclosure also provides an electronic device that includes the circuit board described in any of the foregoing embodiments. For example, the electronic device may be a mobile phone, a laptop computer, etc., and this disclosure does not limit this to such devices.

[0088] The technical solutions provided by the embodiments of this disclosure have at least the following beneficial effects:

[0089] This disclosure provides a circuit board in which a heat-insulating part 11 is provided on the circuit board body 1, and the orthographic projection of the heat-insulating part 11 on the circuit board body 1 at least partially overlaps with the orthographic projection of the thermistor 2 on the circuit board body 1. In this way, by providing the heat-insulating part 11, the heat conducted from the circuit board body 1 to the thermistor 2 is reduced, thereby reducing the impact of heat dissipation of the heat-generating device on the thermistor 2, thus ensuring the normal operation of the thermistor 2 and improving the operational stability of the electronic device.

[0090] Understandable, Figures 1 to 11 The dimensions of the circuit board body 1, thermistor 2, substrate 13, and conductive layer 14 in the figure may be the same as or different from those of the actual product. The dimensions in the figure are for reference only and have no practical significance.

[0091] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A circuit board, characterized in that, The circuit board includes a circuit board body (1) and a thermal device (2); The circuit board body (1) has a heat-insulating part (11), wherein the heat-insulating part (11) is a groove or through hole extending along a direction perpendicular to the circuit board body (1); The thermal device (2) is located on one side of the circuit board body (1) and is electrically connected to the circuit board body (1). The orthographic projection of the thermal device (2) on the circuit board body (1) at least partially overlaps with the orthographic projection of the heat-insulating part (11) on the circuit board body (1).

2. The circuit board according to claim 1, characterized in that, The thermistor (2) has multiple pins (21); The target area (A) on the circuit board body (1) includes at least a partial heat-insulating part (11) and a plurality of connection areas (B), which are electrically connected to different pins (21), wherein the target area (A) is the area projected by the orthographic projection of the thermistor (2) on the circuit board body (1).

3. The circuit board according to claim 1, characterized in that, The circuit board body (1) also has at least one heat-resistant channel (12), which is located between the thermistor (2) and other devices on the circuit board.

4. The circuit board according to claim 3, characterized in that, The at least one heat-resistant channel (12) is arranged along the direction surrounding the thermistor (2).

5. The circuit board according to claim 1, characterized in that, The opening of the heat-insulating part (11) is located on the surface of the circuit board body (1) near the thermistor (2).

6. The circuit board according to any one of claims 1-5, characterized in that, The circuit board body (1) includes at least one substrate (13) and at least one conductive layer (14) stacked alternately, the total thickness of the at least one substrate (13) and the at least one conductive layer (14) being greater than or equal to the depth of the heat-insulating part (11). The thermal device (2) is electrically connected to a conductive layer (14) located on the outer side of the circuit board body (1).

7. The circuit board according to claim 6, characterized in that, The heat-resistant portion (11) has a similar shape on each conductive layer (14) or substrate (13).

8. The circuit board according to claim 6, characterized in that, The target orthographic projection of the portion of the heat-insulating part (11) on each conductive layer (14) or substrate (13) falls within the target orthographic projection of the portion of the heat-insulating part (11) on the upper substrate (13) or conductive layer (14), wherein the target orthographic projection is the orthographic projection on the circuit board body (1).

9. The circuit board according to claim 6, characterized in that, The conductive layer (14) is located on both sides of the circuit board body (1).

10. The circuit board according to claim 9, characterized in that, The depth of the heat-resistant portion (11) is less than or equal to the difference between the total thickness and the thickness of one of the conductive layers (14), or the depth of the heat-resistant portion (11) is equal to the total thickness.

11. The circuit board according to claim 6, characterized in that, When the circuit board body (1) has a heat-resistant channel (12), the heat-resistant channel (12) penetrates one or more layers of the conductive layer (14) and the substrate (13).

12. An electronic device, characterized in that, The electronic device includes a circuit board as described in any one of claims 1-11.

Images