FPC structure with mesh anti-disassembly wire

Abstract

The utility model discloses a kind of FPC structure with MESH anti-disassembly wire, comprising: module FPC body and MESH sheet, the MESH sheet includes substrate film layer and silver paste circuit layer being set on substrate film layer, the silver paste circuit layer includes MESH circuit, the MESH sheet is fixed on the module FPC body and the MESH circuit is electrically connected with module FPC body, the MESH circuit corresponds to cover the circuit needing shielding on the module FPC body.The utility model passes through by being set on substrate film layer by the MESH circuit of conductive silver paste, so that module FPC can adopt double-layer board, solve the problem of three-layer board design, high manufacturing cost, and effectively avoid the inflexibility of three-layer board, bonding unstable and other defects.

Description

Technical Field

[0001] This utility model relates to the field of display module technology, and in particular to an FPC structure with MESH anti-tampering line. Background Technology

[0002] To ensure security, some display modules require MESH anti-tamper circuitry on the FPC module for protection. Conventional FPC modules have a double-layer board structure, but to install MESH anti-tamper circuitry, an additional layer is needed, making the FPC module a triple-layer board structure. This triple-layer board structure has high manufacturing costs and increases overall thickness, making the bending area thicker and more difficult to bend. At the same time, the increased thickness makes it difficult to control the scaling factor of the bonding area, resulting in unstable bonding quality.

[0003] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide an FPC structure with a MESH anti-tamper line.

[0005] The technical solution of this utility model is as follows: This utility model provides an FPC structure with MESH anti-tamper lines, including: a module FPC body and a MESH sheet. The MESH sheet includes a substrate film layer and a silver paste circuit layer disposed on the substrate film layer. The silver paste circuit layer includes MESH circuits. The MESH sheet is fixed on the module FPC body and the MESH circuits are electrically connected to the module FPC body. The MESH circuits cover the circuits on the module FPC body that need to be shielded.

[0006] Furthermore, one side of the silver paste circuit layer faces the module FPC body.

[0007] Furthermore, double-sided adhesive tape is used to fix the MESH sheet to the module FPC body.

[0008] Furthermore, the MESH sheet and the module FPC are electrically connected by bonding.

[0009] Furthermore, the silver paste circuit layer is set on the substrate film layer by screen printing.

[0010] The beneficial effects of this utility model by adopting the above solution are as follows: by setting a MESH circuit composed of conductive silver paste on the substrate film layer, the module FPC can be used as a double-layer board, which solves the problems of high design and manufacturing cost of three-layer boards, and effectively avoids the defects of three-layer boards such as difficulty in bending and unstable bonding. Attached Figure Description

[0011] Figure 1 This is a structural schematic diagram of an embodiment of the present utility model.

[0012] Figure 2 This is an exploded view of an embodiment of the present invention. Detailed Implementation

[0013] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0014] Please refer to the following: Figure 1 and Figure 2 In this embodiment, the present invention provides an FPC structure with MESH anti-tamper lines, including: a module FPC body 1 and a MESH sheet 2. The MESH sheet 2 includes a substrate film layer and a silver paste circuit layer disposed on the substrate film layer. The substrate film layer is made of PET. The silver paste circuit layer includes MESH lines 21 formed by screen printing conductive silver paste. The MESH sheet 2 is fixed on the module FPC body 1 and the MESH lines 21 are electrically connected to the module FPC body 1. The MESH lines 21 cover the lines on the module FPC body 1 that need to be shielded, thereby realizing the corresponding function of the MESH lines 21.

[0015] Furthermore, one side of the silver paste circuit layer faces the module FPC body 1, and double-sided adhesive is placed between the MESH sheet 2 and the module FPC body 1 to fix the MESH sheet 2 and the module FPC body 1.

[0016] Furthermore, the MESH sheet 2 and the module FPC are electrically connected via bonding. Specifically, a bonding connector 11 for bonding with the connector of the MESH line 21 is provided at a corresponding position on the module FPC body 1.

[0017] In this solution, the silver paste circuit has high conductivity and excellent shielding performance, which can effectively meet the corresponding MESH anti-tamper design requirements. The structure of placing the silver paste on the PET film has the advantages of simple processing, good conductivity, strong anti-interference and simple design.

[0018] In summary, this solution, by using a MESH circuit 21 composed of conductive silver paste on the substrate film layer, enables the module FPC to be a double-layer board, solving the problems of high design and manufacturing cost of three-layer boards, and effectively avoiding the defects of three-layer boards such as difficulty in bending and unstable bonding.

[0019] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An FPC structure with a MESH anti-tamper wire, characterized in that, include: The module FPC body and the MESH sheet, wherein the MESH sheet includes a substrate film layer and a silver paste circuit layer disposed on the substrate film layer, the silver paste circuit layer includes MESH circuits, the MESH sheet is fixed on the module FPC body and the MESH circuits are electrically connected to the module FPC body, and the MESH circuits cover the circuits on the module FPC body that need to be shielded.

2. The FPC structure with MESH anti-tampering line according to claim 1, characterized in that, One side of the silver paste circuit layer faces the module FPC body.

3. The FPC structure with MESH anti-tampering line according to claim 1 or 2, characterized in that, The MESH sheet is fixed to the module FPC body using double-sided adhesive tape.

4. The FPC structure with MESH anti-tampering line according to claim 2, characterized in that, The MESH sheet and the module FPC are electrically connected by bonding.

5. The FPC structure with MESH anti-tampering line according to claim 1 or 2, characterized in that, The silver paste lines are set on the substrate film layer by screen printing.

6. The FPC structure with MESH anti-tampering line according to claim 1 or 2, characterized in that, The substrate film is made of PET.

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